Gold removing and tin coating device for high-density three-dimensional component

Abstract

The utility model provides a high-density three-dimensional component gold-removing tin-coating device, which comprises a machine body, a joint and a collection box, the middle part of the front surface of the machine body is fixedly connected with the joint, the front surface of the machine body is detachably connected with the collection box, the front surface of the joint is fixedly connected with a slot, the slot is composed of an upper plug board and a lower plug board, and the upper plug board and the lower plug board are fixedly connected with the machine body. A slot is formed in the machine body, the end part and the two sides of the slot are open, a plurality of components are inserted into the inner side of the slot, the end parts of the components abut against each other, a baffle plate is inserted into a point position of the slot, one side of the baffle plate is movably connected with the component on the outermost side, and a track is fixedly connected to the front surface of the machine body. Compared with the prior art, the device has the advantages that the collecting box, the inserting groove, the baffle, the track, the servo motor, the lead screw, the sliding block, the fixing arm, the wiping plate and the inner layer are arranged in a matched mode, the device is of a novel structure, pins of a plurality of components can be located and wiped in batches at the same time, and the gold removing and tin coating processing efficiency of the components is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field, in particular to a device for removing gold and tin from high-density three-dimensional components. Background Art

[0002] The application fields of 3D-PLUS devices are quite extensive, mainly covering several key areas in the high-tech industry. Specifically, it is mainly used in the following fields:

[0003] Space applications: As the only aerospace-grade 3D stacking technology supplier certified by the European Space Agency (ESA) and the French Space Agency (CNES) in the world, 3D-PLUS devices have significant applications in the aerospace field. Its high performance, high reliability and compact size make it an ideal choice for aerospace devices and systems, and are widely used in aerospace telecommunications, earth observation, navigation, launchers, manned spacecraft and other fields.

[0004] Defense and Security: The high performance and reliability of 3D-PLUS devices also make them widely used in the defense and security fields. These devices can be applied to various defense systems to provide technical support for national security.

[0005] Industrial and embedded systems: In the field of industrial and embedded systems, the high integration and excellent performance of 3D-PLUS devices provide great convenience for industrial production and embedded system design. They are used in various industrial control, automation systems and embedded devices to improve production efficiency and optimize system performance.

[0006] The steps for removing the gold and tin from the pin surface of this component are as follows: 1. Preparation: prepare the necessary tools and materials, including special wiping materials (such as dust-free cloth, high-purity cotton paper, etc.), gold and tin removal agent, tweezers, magnifying glass or microscope, protective gloves, etc. 2. Pretreatment of the pins; 3. Apply the gold and tin removal agent; 4. Wait for the reaction; 5. Wipe and remove: Use the prepared wiping materials (such as dust-free cloth or high-purity cotton paper) to gently wipe the gold layer or solder on the pins; 6. Check.

[0007] In the wiping and removing step, the pins coated with the gold-removing and tin-plating agent need to be manually wiped one by one, and each component needs to be operated in this way. The batch processing efficiency of components is low. Therefore, a new high-density three-dimensional component gold-removing and tin-plating device is proposed, which is specifically for the wiping and removing step. It can realize the simultaneous processing of multiple components and improve the processing efficiency. Utility Model Content

[0008] The purpose of the present invention is to solve at least one of the above technical deficiencies.

[0009] Therefore, one purpose of the utility model is to provide a high-density three-dimensional component gold removal and tin plating device to solve the problems mentioned in the background technology and overcome the shortcomings of the prior art.

[0010] In order to achieve the above-mentioned purpose, an embodiment of one aspect of the utility model provides a high-density three-dimensional component de-golding and tinning device, comprising a body, a connector, and a collection box, wherein the middle part of the front of the body is fixedly connected with the connector, and the front of the body is detachably connected with the collection box;

[0011] The front side of the connector is fixedly connected with a slot, which is composed of two upper and lower plug-in boards;

[0012] The ends and both sides of the slot are open, a plurality of components are plugged into the inner side of the slot, and the ends of the components abut against each other;

[0013] A baffle is inserted at one point of the slot, and one side of the baffle is movably connected to the outermost component;

[0014] The front side of the machine body is fixedly connected to a track, the back side of the machine body is installed with a servo motor, and the output end of the servo motor is fixedly connected to a lead screw;

[0015] The outer surface of the screw rod is threadedly connected with a slider, and the slider is movably connected to the track. Fixed arms are detachably connected to both sides of the slider, and the fixed arms are bent. A wiper plate is fixedly connected to the bottom end of the fixed arm, and an inner layer is detachably connected to the inner side of the wiper plate. The inner layer is movably connected to the upper and lower surfaces and end surfaces of the pins on both sides of the component.

[0016] Preferably, any of the above solutions is that the machine body is connected to the collection box by means of hexagon socket bolts, and the collection box is located directly below the slot.

[0017] Adopting the above technical solution: This device is specially used for the gold removal and tin plating of high-density three-dimensional components. Specifically, after the gold removal and tin plating agent is applied to the surface of the component pins, the pins are wiped and removed to remove the gold layer or solder on the surface of the pins.

[0018] Preferably, in any of the above schemes, a vertical cross-section of a single plug-in board of the slot is U-shaped, and the components in the slot are locked in place.

[0019] Adopting the above technical solution: This device adopts a new structure, which can simultaneously locate and wipe the pins of several components in batches, greatly improving the efficiency of gold removal and tin plating of components.

[0020] Preferably, any of the above solutions is that the baffle is inserted into the slot from above, and the end of the track is fixedly connected with a fixing plate.

[0021] Adopting the above technical solution: the device can be divided into three parts: the first part: the collection part, which is composed of a collection box, which collects the solution residue or gold layer and solder residue dropped from the components;

[0022] The second part: component positioning part: It consists of connectors, slots, and baffles. Several components can be inserted from the ends of the slots. The ends of the components are butted against each other. Only the pins on both sides of the components are exposed. After the baffles are installed, all components are locked and cannot move forward, backward, left, or right.

[0023] The third part: the wiping part of components: it is composed of a track, a servo motor, a lead screw, a slider, a fixed arm, a wiping plate and an inner layer. The output end of the servo motor rotates back and forth, driving the slider to move forward and backward along the track. The inner layer of the wiping plate is movably connected with the upper and lower surfaces and end faces of the pins of all components during the movement. The inner layer is a dust-free cloth layer or a cotton paper layer. The inner layer is a consumable and can be replaced. After reciprocating wiping, the gold layer or solder on the surface of the pin is completely removed, exposing the metal substrate.

[0024] Preferably, any of the above schemes is that the servo motor is installed horizontally, the lead screw is located below the track, and the lead screw is located above the slot.

[0025] The core structure of the device is: a collecting box, a slot, a baffle, a track, a servo motor, a screw rod, a slider, a fixed arm, a wiper plate and an inner layer.

[0026] Preferably, any of the above solutions has a length of the screw rod greater than a length of the slot, and the fixed arm is connected to the slider via a screw.

[0027] Preferably, any of the above schemes has a bending angle of ninety degrees, the inner layer is a dust-free cloth layer or a cotton paper layer, and the inner layer is bonded to the wiper.

[0028] Adopting the above technical solution: Dust-free cloth is a highly efficient cleaning material with excellent adsorption and wear resistance. It can effectively remove metal residues and impurities on the surface of components without leaving any scratches or residues. In addition, dust-free cloth also has excellent chemical stability and can resist the erosion of most chemical solvents, ensuring safety during operation.

[0029] Cotton paper is a soft and absorbent wiping material. It can quickly absorb excess solder and metal residues produced during the tinning process to keep the surface of components clean. At the same time, the fiber structure of high-purity cotton paper is tight and not easy to fall off, which can effectively avoid secondary contamination during the wiping process.

[0030] Compared with the prior art, the advantages and beneficial effects of the utility model are:

[0031] The high-density three-dimensional component gold-removing and tin-plating device is configured through the cooperation of a collecting box, a slot, a baffle, a track, a servo motor, a lead screw, a slider, a fixed arm, a wiping plate and an inner layer. Several components can be inserted from the end of the slot, the ends of the components abut against each other, and only the pins on both sides of the components are exposed. After the baffle is installed, all the components are locked and cannot move forward, backward, left or right. The output end of the servo motor rotates back and forth to drive the slider to move forward and backward along the track. The inner layer of the wiping plate is movably connected with the upper and lower surfaces and end faces of the pins of all components during the movement. The inner layer is a dust-free cloth layer or a cotton paper layer, which is a consumable and replaceable. After reciprocating wiping, the gold layer or solder on the surface of the pin is completely removed to expose the metal substrate. The device adopts a new structure and can simultaneously locate and wipe the pins of several components in batches, greatly improving the processing efficiency of gold-removing and tin-plating of components.

[0032] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0034] Figure 1 It is a structural schematic diagram of the utility model from the first perspective;

[0035] Figure 2 It is a structural schematic diagram of the utility model from a second viewing angle;

[0036] Figure 3 It is a structural schematic diagram of the utility model from a third viewing angle;

[0037] Figure 4 For this utility model Figure 1 Schematic diagram of the enlarged structure at point A in the middle.

[0038] In the figure: 1-body, 2-connector, 3-collection box, 4-slot, 5-components, 6-baffle, 7-track, 8-servo motor, 9-screw, 10-slider, 11-fixed arm, 12-wiping plate, 13-inner layer. DETAILED DESCRIPTION

[0039] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] like Figure 1-4 As shown, the high-density three-dimensional component de-golding and tinning device comprises a body 1, a connector 2, and a collection box 3. The middle of the front of the body 1 is fixedly connected with the connector 2, and the front of the body 1 is detachably connected with the collection box 3;

[0042] The front of the connector 2 is fixedly connected with a slot 4, which is composed of two upper and lower plug-in boards;

[0043] The ends and both sides of the slot 4 are open, and a plurality of components 5 are inserted into the inner side of the slot 4, and the ends of the components 5 abut against each other;

[0044] A baffle 6 is inserted at one point of the slot 4, and one side of the baffle 6 is movably connected to the outermost component 5;

[0045] A track 7 is fixedly connected to the front of the machine body 1, a servo motor 8 is installed on the back of the machine body 1, and a screw rod 9 is fixedly connected to the output end of the servo motor 8;

[0046] The outer surface of the screw rod 9 is threadedly connected to a slider 10, and the slider 10 is movably connected to the track 7. Fixed arms 11 are detachably connected to both sides of the slider 10. The fixed arms 11 are bent, and a wiper plate 12 is fixedly connected to the bottom end of the fixed arm 11. The inner side of the wiper plate 12 is detachably connected to an inner layer 13, and the inner layer 13 is movably connected to the upper and lower surfaces and end surfaces of the pins on both sides of the component 5.

[0047] Embodiment 1: The machine body 1 is connected to the collection box 3 by hexagon socket bolts, and the collection box 3 is located directly below the slot 4. This device is specially used for the de-golding and tinning of high-density three-dimensional components. Specifically, after the de-golding and tinning agent is applied to the surface of the pins of the component 5, the pins are wiped and removed to remove the gold layer or solder on the surface of the pins. The vertical cross-section of a single plug-in board of the slot 4 is U-shaped, and the component 5 in the slot 4 is locked. This device adopts a new structure, which can simultaneously locate and wipe the pins of several components 5 in batches, greatly improving the efficiency of the de-golding and tinning processing of components.

[0048] Embodiment 2: The baffle 6 is inserted into the slot 4 from above, and the end of the track 7 is fixedly connected with a fixing plate. The device can be divided into three parts: the first part: the collection part, which is composed of a collection box 3, which collects the solution residue or gold layer and solder residue dropped from the component 5;

[0049] The second part: the positioning part of the component 5: it is composed of the connector 2, the slot 4, and the baffle 6. Several components 5 can be inserted from the end of the slot 4. The ends of the components 5 are abutted against each other. Only the pins on both sides of the component 5 are exposed. After the baffle 6 is installed, all the components 5 are locked and cannot move forward, backward, left, or right.

[0050] Part 3: Wiping part of components 5: It consists of track 7, servo motor 8, screw 9, slider 10, fixed arm 11, wiper 12 and inner layer 13. The output end of servo motor 8 rotates back and forth, driving slider 10 to move forward and backward along track 7. The inner layer 13 of wiper 12 is movably connected with the upper and lower surfaces and end faces of the pins of all components 5 during the movement. The inner layer 13 is a dust-free cloth layer or cotton paper layer. The inner layer 13 is a consumable and can be replaced. After reciprocating wiping, the gold layer or solder on the surface of the pin is completely removed to expose the metal substrate. Servo motor 8 is installed horizontally, screw 9 is located below track 7, and screw 9 is located above slot 4.

[0051] Embodiment 3: The length of the screw rod 9 is greater than the length of the slot 4, and the fixed arm 11 is connected to the slider 10 by a screw. The bending angle of the fixed arm 11 is ninety degrees, and the inner layer 13 is a dust-free cloth layer or a cotton paper layer, and the inner layer 13 is bonded to the wiper 12. The dust-free cloth is a highly efficient cleaning material with excellent adsorption and wear resistance. It can effectively remove metal residues and impurities on the surface of components without leaving any scratches or residues. In addition, the dust-free cloth also has excellent chemical stability and can resist the erosion of most chemical solvents to ensure safety during operation.

[0052] Cotton paper is a soft and absorbent wiping material. It can quickly absorb excess solder and metal residues produced during the tinning process to keep the surface of components clean. At the same time, the fiber structure of high-purity cotton paper is tight and not easy to fall off, which can effectively avoid secondary contamination during the wiping process.

[0053] The working principle of the utility model is as follows:

[0054] Apply an appropriate amount of gold-removing tin-plating agent to the gold layer or solder of the pins that need to be processed;

[0055] Several components 5 can be inserted from the ends of the slots 4, the ends of the components 5 are butted against each other, and only the pins on both sides of the components 5 are exposed. After the baffle 6 is installed, all the components 5 are locked and cannot move forward, backward, left or right. The components 5 are left still for a period of time;

[0056] The output end of the servo motor 8 rotates back and forth, driving the slider 10 to move forward and backward along the track 7. The inner layer 13 of the wiping plate 12 is movably connected with the upper and lower surfaces and end surfaces of the pins of all components 5 during the movement. The inner layer 13 is a dust-free cloth layer or a cotton paper layer. The inner layer 13 is a consumable and can be replaced. After reciprocating wiping, the gold layer or solder on the surface of the pin is completely removed, exposing the metal substrate, and finally the component 5 is inspected.

[0057] Compared with the prior art, the present invention has the following beneficial effects:

[0058] The high-density three-dimensional component gold-plating and tin-plating device is configured by the cooperation of a collecting box 3, a slot 4, a baffle 6, a track 7, a servo motor 8, a screw rod 9, a slider 10, a fixed arm 11, a wiper 12 and an inner layer 13. A plurality of components 5 can be inserted from the end of the slot 4, the ends of the components 5 abut against each other, and only the pins on two sides of the components 5 are exposed. After the baffle 6 is installed, all the components 5 are locked and cannot move forward, backward, left or right. The output end of the servo motor 8 reciprocates to drive the slider 10 to move forward and backward along the track 7. The inner layer 13 of the wiper 12 is movably connected with the upper and lower surfaces and end surfaces of the pins of all the components 5 during the movement. The inner layer 13 is a dust-free cloth layer or a cotton paper layer. The inner layer 13 is a consumable and can be replaced. After reciprocating wiping, the gold layer or solder on the surface of the pin is completely removed to expose the metal substrate. The device adopts a new structure and can simultaneously locate and wipe the pins of a plurality of components 5 in batches, thereby greatly improving the processing efficiency of gold-plating and tin-plating of components.

Claims

1. A device for removing gold and tin from high-density three-dimensional components, characterized in that: The machine comprises a body (1), a connector (2), and a collection box (3); the middle part of the front of the body (1) is fixedly connected to the connector (2); the front of the body (1) is detachably connected to the collection box (3); the front of the connector (2) is fixedly connected to a slot (4), and the slot (4) is composed of two upper and lower plug boards; The ends and both sides of the slot (4) are open, a plurality of components (5) are plugged into the inner side of the slot (4), and the ends of the components (5) are in contact with each other; A baffle (6) is inserted at one point of the slot (4), and one side of the baffle (6) is movably connected to the outermost component (5); a track (7) is fixedly connected to the front of the machine body (1), a servo motor (8) is installed on the back of the machine body (1), and a screw rod (9) is fixedly connected to the output end of the servo motor (8); The outer surface of the screw rod (9) is threadedly connected to a slider (10), the slider (10) is movably connected to the track (7), the two sides of the slider (10) are detachably connected to fixed arms (11), the fixed arms (11) are bent, the bottom end of the fixed arms (11) is fixedly connected to a wiper plate (12), the inner side surface of the wiper plate (12) is detachably connected to an inner layer (13), and the inner layer (13) is movably connected to the upper and lower surfaces and end surfaces of the pins on both sides of the component (5).

2. A high-density three-dimensional component de-golding and tinning device as claimed in claim 1, characterized in that: The machine body (1) and the collection box (3) are connected via hexagon socket bolts, and the collection box (3) is located directly below the slot (4).

3. A high-density three-dimensional component de-golding and tinning device as claimed in claim 2, characterized in that: The vertical cross-section of a single plugboard of the slot (4) is U-shaped, and the components (5) in the slot (4) are locked in place.

4. A high-density three-dimensional component de-golding and tinning device as claimed in claim 3, characterized in that: The baffle (6) is plugged into the slot (4) from above, and a fixing plate is fixedly connected to the end of the track (7).

5. The device for removing gold and tin from high-density three-dimensional components as claimed in claim 4, characterized in that: The servo motor (8) is installed transversely, the screw rod (9) is located below the track (7), and the screw rod (9) is located above the slot (4).

6. A high-density three-dimensional component de-golding and tinning device as claimed in claim 5, characterized in that: The length of the screw rod (9) is greater than the length of the slot (4), and the fixed arm (11) and the slider (10) are connected via screws.

7. A high-density three-dimensional component de-golding and tinning device as claimed in claim 6, characterized in that: The bending angle of the fixed arm (11) is ninety degrees, the inner layer (13) is a dust-free cloth layer or a cotton paper layer, and the inner layer (13) is bonded to the wiper (12).

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