Silicon wafer laser processing equipment

Abstract

The utility model discloses silicon wafer laser processing equipment. The silicon wafer laser processing equipment comprises a material taking device, a conveying device and a laser processing device, the material taking device is used for picking up double-layer silicon wafers to be subjected to laser processing, and the conveying device is used for conveying the double-layer silicon wafers picked up by the material taking device. The laser processing device comprises a first laser processor, an overturning structure and a second laser processor which are sequentially arranged in the conveying direction of the conveying device, the first laser processor is used for conducting laser processing on the upper surface of the double-layer silicon wafer, and the overturning structure is used for overturning the double-layer silicon wafer with the upper surface subjected to laser processing. And the second laser processor is used for carrying out laser treatment on the lower surface of the double-layer silicon wafer. According to the silicon wafer laser processing equipment disclosed by the utility model, laser processing on the surfaces of one sides of the two silicon wafers is realized on the premise that wafer separation is not needed, so that steps in the silicon wafer production process are reduced, and the production efficiency is favorably improved.

Description

Technical Field

[0001] The utility model relates to the field of solar energy, in particular to a silicon wafer laser processing device. Background Art

[0002] In the related art, the silicon wafer needs to be passivated by laser after the diffusion process. Since the silicon wafer is bonded together when the diffusion process is carried out in the quartz boat, the two bonded silicon wafers need to be separated when the silicon wafer is subsequently subjected to the laser passivation process, and then the two silicon wafers need to be bonded again when other processes are carried out.

[0003] During the process of wafer separation and wafer assembly before and after laser treatment, the wafer needs to contact with multiple wafer separation and assembly devices, which may easily cause damage to the wafer, such as bumps and scratches, and may affect the performance of solar cells made from the wafer. In addition, during the process of wafer separation and assembly, the wafer is easily contaminated with dust, which is not conducive to subsequent process processing and affects the production yield of solar cells. Utility Model Content

[0004] The utility model discloses a silicon wafer laser processing device, which is used for reducing the steps of silicon wafer laser processing and improving production efficiency.

[0005] In order to achieve the above-mentioned purpose, the utility model discloses a silicon wafer laser processing device, comprising:

[0006] A material picking device, the material picking device is used to pick up a double-layer silicon wafer to be laser processed, the double-layer silicon wafer includes an upper surface and a lower surface along the thickness direction;

[0007] A transport device, the transport device is used to transport the double-layer silicon wafer picked up by the material taking device;

[0008] A laser processing device, the laser processing device comprising a first laser processor, a flip structure and a second laser processor which are sequentially arranged along the transport direction of the transport device, the first laser processor being used for laser processing the upper surface of the double-layer silicon wafer, the flip structure being used for flipping the double-layer silicon wafer after the laser processing on the upper surface to exchange the orientations of the upper surface and the lower surface, and the second laser processor being used for laser processing the lower surface of the double-layer silicon wafer.

[0009] As an optional embodiment, the flipping structure includes a driving member, a rotating shaft and a clamping assembly, the rotating shaft is connected to the driving member to rotate under the drive of the driving member, the clamping assembly is arranged on the rotating shaft, and the clamping assembly is used to clamp the double-layer silicon wafer.

[0010] As an optional implementation, the clamping assembly includes a plurality of clamping rods, and the plurality of clamping rods are arranged around the outer circumference of the rotating shaft, and a clamping space is formed between two adjacent clamping rods.

[0011] As an optional implementation, a buffer is provided at one end of the clamping rod away from the rotating shaft.

[0012] As an optional embodiment, the clamping assembly further includes a sensor, which is provided on any one of the clamping rods and located in the clamping space, and the sensor is used to detect a clamping state in the clamping space.

[0013] As an optional implementation, there are two clamping assemblies, and the two clamping assemblies are respectively arranged at two ends of the rotating shaft, and the two clamping assemblies are configured to clamp at two ends of the double-layer silicon wafer.

[0014] As an optional implementation, the silicon wafer laser processing equipment further includes a first positioning platform and a second positioning platform, the first positioning platform and the second positioning platform are sequentially arranged along the transport direction of the transport device, the first positioning platform is arranged corresponding to the first laser processor, and the second positioning platform is arranged corresponding to the second laser processor;

[0015] The first positioning platform and the second positioning platform respectively have a first table top and a second table top, and the first table top and the second table top are used for placing the double-layer silicon wafer.

[0016] As an optional implementation, the first positioning platform and the second positioning platform can both move up and down relative to the transport plane of the transport device, and the first positioning platform and the second positioning platform both have a load-bearing state and a hidden state;

[0017] In the carrying state, the first positioning platform and the second positioning platform rise relative to the transport plane of the transport device to be flush with or protrude from the transport plane;

[0018] In the hidden state, the first positioning platform and the second positioning platform are lowered relative to the transport plane of the transport device to be hidden below the transport plane of the transport device.

[0019] As an optional embodiment, a first positioning portion is movably provided on the first table top, and the first positioning portion is configured to position the double-layer silicon wafer on the first table top. A second positioning portion is movably provided on the second table top, and the second positioning portion is configured to position the double-layer silicon wafer on the second table top.

[0020] As an optional implementation, a first mounting hole is provided on the first table, and the first positioning portion can be telescopically provided in the first mounting hole, and the first positioning portion can extend from the first mounting hole to the first table to move relative to the first table to position the double-layer silicon wafer, or the first positioning portion can be retracted into the first mounting hole;

[0021] The second table top is provided with a second mounting hole, and the second positioning portion can be retractably disposed in the second mounting hole. The second positioning portion can extend from the second mounting hole to the second table top to move relative to the second table top to position the double-layer silicon wafer, or the second positioning portion can be retracted into the second mounting hole.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] The silicon wafer laser processing equipment disclosed in the utility model can take out the double-layer silicon wafers placed in a quartz boat through a material taking device, and place them on a transport device to be transported to a first laser processor, perform laser processing on the upper surface of the double-layer silicon wafer, and then use the transport device to transport the double-layer silicon wafer to a flipping device to flip the double-layer silicon wafer. After flipping, the transport device transports the double-layer silicon wafer to a second laser processor, and performs laser processing on the lower surface of the double-layer silicon wafer. In this way, laser processing can be performed on one side of the two silicon wafers without the need to split the silicon wafers, which simplifies the processing procedures of solar cells and the structural design of the processing equipment for solar cells, which is beneficial to improving the production efficiency of solar cells and controlling the production cost of solar cells.

[0024] In addition, the use of the silicon wafer laser processing equipment of the present application can not only reduce the probability of silicon wafers colliding with instruments or equipment during the slicing and assembling process, but also avoid the situation where dust is caught between the two silicon wafers during the slicing and assembling process, which is beneficial to improving the product yield of solar cells. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is a schematic diagram of the structure of the silicon wafer laser processing equipment disclosed in the utility model;

[0027] Figure 2 It is a schematic diagram of the flip structure disclosed in the utility model;

[0028] Figure 3 It is a structural schematic diagram of the flip structure disclosed in the utility model;

[0029] Figure 4 It is a structural schematic diagram of the first positioning platform disclosed in the utility model;

[0030] Figure 5 It is a schematic diagram of the first positioning platform disclosed in the utility model;

[0031] Figure 6 It is a structural schematic diagram of the second positioning platform disclosed in the utility model.

[0032] Description of reference numerals:

[0033] 100. Silicon wafer laser processing equipment; 1. Material picking device; 2. Transport device; 2a. Transport plane; 3. First laser processor; 4. Flipping structure; 41. Driving member; 42. Rotating shaft; 43. Clamping assembly; 431. Clamping rod; 43a. Clamping space; 43b. Buffer member; 5. Second laser processor; 6. First positioning table; 6a. First table top; 61. First positioning portion; 61a. First mounting hole; 7. Second positioning table; 7a. Second table top; 71. Second positioning portion; 71a. Second mounting hole; 8. Lifting structure; 9. Double-layer silicon wafer; 9a. Upper surface; 9b. Lower surface. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] In the present invention, the terms "inside", "outside", "middle", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0036] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0037] In addition, the terms "disposed", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0038] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0039] In the related art, the silicon wafer needs to be passivated by laser after the diffusion process. Since the silicon wafer is bonded to each other during the diffusion process in the quartz boat, the two bonded silicon wafers need to be separated when the silicon wafer is subsequently subjected to the laser passivation process, and then the two silicon wafers need to be reassembled when other processes are performed. In the process of separation and assembling of the silicon wafer before and after the laser treatment, it is necessary to contact with multiple separation devices and assembly devices. For example, when loading the silicon wafer from the quartz boat into the flower basket, the two bonded silicon wafers need to be adsorbed by the suction cups and then separated, and finally inserted into the flower baskets respectively. In this process, it is easy to cause damage such as bumps and scratches to the silicon wafer, which may affect the performance of the solar cell prepared from the silicon wafer, and it is also easy to be contaminated with dust during the separation and assembly process, causing silicon wafer pollution, which is not conducive to subsequent process processing and affects the production yield of solar cells.

[0040] Based on this, the utility model provides a silicon wafer laser processing device, which can take out a double-layer silicon wafer from a quartz boat, and then perform laser processing on the upper surface of the double-layer silicon wafer. After the double-layer silicon wafer is turned over by a flip structure, the lower surface of the double-layer silicon wafer can be laser processed. In this way, there is no need to split the double-layer silicon wafer, and laser processing can be performed on one side of the two silicon wafers. The steps of splitting and then re-joining the silicon wafers during laser processing are reduced, thereby reducing the steps of the silicon wafer in the production process, and effectively improving the efficiency of the silicon wafer production line. On the other hand, it also reduces the occurrence of problems such as bumps, damage and contamination of silicon wafers during the splitting and joining process, thereby improving the yield of the product.

[0041] The technical solution of the utility model will be further described below in conjunction with embodiments and drawings.

[0042] Please also see Figure 1 and Figure 3The utility model discloses a silicon wafer laser processing device 100, comprising a material picking device 1, a transportation device 2 and a laser processing device. The material picking device 1 is used to pick up a double-layer silicon wafer 9 to be laser processed, and the double-layer silicon wafer 9 includes an upper surface 9a and a lower surface 9b along the thickness direction Y. The transportation device 2 is used to transport the double-layer silicon wafer 9 picked up by the material picking device 1. Among them, the laser processing device includes a first laser processor 3, a flip structure 4 and a second laser processor 5 arranged in sequence along the transportation direction X of the transportation device, the first laser processor 3 is used to perform laser processing on the upper surface 9a of the double-layer silicon wafer 9, the flip structure 4 is used to flip the double-layer silicon wafer 9 after the upper surface 9a is laser processed to exchange the orientation between the upper surface 9a and the lower surface 9b, and the second laser processor 5 is used to perform laser processing on the lower surface 9b of the double-layer silicon wafer 9.

[0043] Among them, the transport direction of the transport device is Figure 1 The direction indicated by X in the figure is the thickness direction of the double-layer silicon wafer. Figure 3 The above directions are only examples for facilitating understanding of the solution and do not limit the scope of this embodiment.

[0044] It is understandable that when the double-layer silicon wafer 9 is taken off the quartz boat by the material taking device 1, it will be placed on the transport device 2. The transport device 2 then transports the double-layer silicon wafer 9 to the bottom of the first laser processor 3, and uses the first laser processor 3 to perform laser processing on the upper surface 9a of the double-layer silicon wafer 9, that is, the laser processing of one of the double-layer silicon wafers 9 is completed. Then the transport device 2 transports it to the flip structure 4, and flips the other silicon wafer that was originally facing downward to face upward, that is, the lower surface 9b of the double-layer silicon wafer 9 faces upward. After the double-layer silicon wafer 9 is flipped, the double-layer silicon wafer 9 is transported by the transport device 2 to the bottom of the second laser processor 5 for laser processing of the lower surface 9b. In this way, laser processing of one side surface of two silicon wafers is achieved without the need for slicing, which not only reduces the steps in the silicon wafer production process, which is conducive to improving production efficiency, but also reduces the risk of damage and contamination of the silicon wafer during the production process, which is conducive to improving product yield.

[0045] Among them, the material picking device 1 may include but is not limited to a sheet picking robot, a sheet picking fork or a suction cup structure, and the transportation device 2 may include but is not limited to conveying devices such as belts and sprockets, and the utility model does not make specific limitations here.

[0046] In some embodiments, the flip structure 4 includes a driving member 41, a rotating shaft 42, and a clamping assembly 43. The rotating shaft 42 is connected to the driving member 41 to rotate under the drive of the driving member 41. The clamping assembly 43 is arranged on the rotating shaft 42, and the clamping assembly 43 is used to clamp the double-layer silicon wafer 9. Specifically, if the double-layer silicon wafer 9 is to be flipped, the double-layer silicon wafer 9 can be clamped by the clamping assembly 43 to prevent the silicon wafer from shaking and falling during the flipping process, and then the double-layer silicon wafer 9 is rotated with the rotating shaft 42 under the drive of the driving member 41 to flip the double-layer silicon wafer 9. Clamping the double-layer silicon wafer 9 with the clamping assembly 43 for flipping can effectively prevent the double-layer silicon wafer 9 from falling during flipping.

[0047] The driving component 41 may be, but is not limited to, a motor, a hydraulic driving component, and a pneumatic driving component, etc., and the present invention does not make any specific limitation here.

[0048] Optionally, the clamping assembly 43 may be, but is not limited to, a clamping mechanism such as a clamping rod 431, a clamping piece, etc. When the clamping assembly 43 is a clamping rod 431, the embodiment of the present application will be described in detail by taking the clamping rod 431 as an example.

[0049] like Figure 2 , Figure 3 As shown, the clamping assembly 43 includes a plurality of clamping rods 431, which are arranged around the outer circumference of the rotating shaft 42, and a clamping space 43a is formed between two adjacent clamping rods 431. It can be understood that a plurality of clamping rods 431 are arranged around the outer circumference of the rotating shaft 42, and each clamping rod 431 is arranged at intervals, so that a clamping space 43a is formed between two adjacent clamping rods 431. When the silicon wafer is transported to the clamping space 43a, the double-layer silicon wafer 9 will be confined in the clamping space 43a, thereby preventing the silicon wafer from escaping from the clamping space 43a.

[0050] In addition, by using a plurality of clamping rods, a plurality of double-layer silicon wafers 9 can be clamped, thereby enabling the flipping of the plurality of silicon wafers, which is beneficial to improving the flipping efficiency of the silicon wafers.

[0051] In some embodiments, considering that the double-layer silicon wafer 9 will turn over under the action of the flipping structure, in order to improve the clamping effect on the double-layer silicon wafer and prevent the double-layer silicon wafer 9 from escaping from the clamping space 43a during the flipping process, the clamping components 43 are two, and the two clamping components 43 are respectively arranged at the two ends of the rotating shaft 42, and the two clamping components 43 are configured to clamp the two ends of the double-layer silicon wafer 9. It can be seen that the two clamping components 43 are arranged to clamp both ends of the double-layer silicon wafer 9, so that the double-layer silicon wafer 9 is more stable when flipping, and can effectively prevent the silicon wafer from falling or bumping from the clamping space 43a during flipping.

[0052] In some embodiments, a buffer 43b is provided at one end of the clamping rod 431 away from the rotating shaft 42. Specifically, when the clamping rod 431 is clamping the double-layer silicon wafer 9 and flipping it, for the two clamping rods 431 forming the same clamping space 43a, the double-layer silicon wafer 9 is first supported by one of the clamping rods 431. When the rotating shaft 42 rotates to a position where one of the clamping rods 431 cannot support the double-layer silicon wafer 9, the double-layer silicon wafer 9 will fall onto the other clamping rod 431, thus realizing the flipping of the double-layer silicon wafer 9. Based on this, the setting of the buffer can effectively buffer the impact force that the double-layer silicon wafer 9 may receive when flipping, and prevent the double-layer silicon wafer 9 from being damaged.

[0053] Optionally, the buffer member 43b may be covered on the clamping rod 431, or the buffer member 43b may be sleeved on the outer periphery of the clamping rod 431. The buffer member 43b may be made of but not limited to soft materials such as rubber, silicone, etc., and the present invention does not make any specific limitation here.

[0054] In some embodiments, the clamping assembly 43 further includes a sensor, which is disposed on any clamping rod 431 and is located in the clamping space 43a, and the sensor is used to detect the clamping state in the clamping space 43a. That is, when the transport device 2 transports the double-layer silicon wafer 9 to the flipping structure 4, and when the double-layer silicon wafer 9 is transported into the clamping space 43a, the sensor can detect the clamping state of the clamping space 43a, that is, detect whether the double-layer silicon wafer 9 is located in the clamping space 43a. Exemplarily, when the sensor detects that the double-layer silicon wafer 9 is completely located in the clamping space 43a, that is, when the double-layer silicon wafer 9 is stably placed in the clamping space 43a, the sensor can send a signal, so that the driving member 41 can be started according to the signal to drive the rotating shaft 42 to rotate, so that the flipping structure 4 flips the double-layer silicon wafer 9. It can be seen that by setting a sensor in the clamping space, the clamping condition of the double-layer silicon wafer 9 in the clamping space can be detected in real time, effectively improving the accuracy of the flipping of the double-layer silicon wafer.

[0055] Optionally, the sensor may include but is not limited to position sensors, pressure sensors and other sensors, which are not specifically limited in the present invention.

[0056] Please also see Figure 4 and Figure 6In some embodiments, the silicon wafer laser processing equipment 100 further includes a first positioning table 6 and a second positioning table 7, which are sequentially arranged along the transport direction X of the transport device 2, the first positioning table 6 corresponding to the first laser processor 3, and the second positioning table 7 corresponding to the second laser processor 5. The first positioning table 6 and the second positioning table 7 respectively have a first table surface 6a and a second table surface 7a, and the first table surface 6a and the second table surface 7a are used to place the double-layer silicon wafer 9. In the actual setting, the double-layer silicon wafer 9 can be supported by the positioning table during laser processing. The double-layer silicon wafer 9 is supported by the positioning table, which facilitates the laser processor to locate the part of the silicon wafer surface that needs laser processing. It can be seen that positioning the laser part of the double-layer silicon wafer 9 by the positioning table is conducive to improving the accuracy of the laser processing of the double-layer silicon wafer 9, thereby improving the product yield of the double-layer silicon wafer 9 after laser processing.

[0057] In some embodiments, the first positioning platform 6 and the second positioning platform 7 can both move up and down relative to the transport plane 2a of the transport device 2, and the first positioning platform 6 and the second positioning platform 7 both have a load-bearing state and a hidden state. In the load-bearing state, the first positioning platform 6 and the second positioning platform 7 rise relative to the transport plane 2a of the transport device 2 to be level with or protrude from the transport plane 2a. In the hidden state, the first positioning platform 6 and the second positioning platform 7 descend relative to the transport plane 2a of the transport device 2 to be hidden under the transport plane 2a of the transport device 2. Specifically, the transport device 2 transports the double-layer silicon wafer 9 to the first laser processor 3 or the second laser processor 5 to the bottom of the laser processor, and when the double-layer silicon wafer 9 is transported to the bottom of the laser processor, the positioning platform rises to support the double-layer silicon wafer 9.

[0058] For details, please refer to Figure 5 It can be understood that the bottom of the first positioning platform 6 and the second positioning platform 7 can be provided with a lifting structure 8 so that the first positioning platform 6 and the second positioning platform 7 can be lifted and lowered relative to the transport plane 2a of the transport device 2 to achieve switching between the carrying state and the hidden state. The lifting structure 8 can be, but is not limited to, a telescopic rod, a scissor fork, and other structures. The power drive mode of the lifting structure can include, but is not limited to, for example, a cylinder, a motor, etc., and the utility model does not make specific limitations here.

[0059] Considering that the positioning platform needs to facilitate the transportation of silicon wafers by the transport device 2 after processing the silicon wafers, in order to prevent the positioning platform from being bumped by the positioning platform when the double-layer silicon wafer 9 is transported, based on this, the positioning platform can be switched between the bearing state and the hidden state through the lifting structure 8. Exemplarily, when the positioning platform is lowered, the table surface of the positioning platform is lower than the transportation plane, and the positioning platform is hidden. When the positioning platform rises and rises to be basically flush with the transportation plane 2a or higher than the transportation plane 2a, the positioning platform can support the double-layer silicon wafer 9 and locate the laser processing position of the double-layer silicon wafer 9. Thereby, while improving the processing accuracy of the laser processor on the silicon wafer surface, it can also prevent the double-layer silicon wafer 9 from being damaged when being transported by the transport device 2.

[0060] In some embodiments, a first positioning portion 61 is movably provided on the first table 6a, and the first positioning portion 61 is configured to position the double-layer silicon wafer 9 on the first table 6a. A second positioning portion 71 is movably provided on the second table 7a, and the second positioning portion 71 is configured to position the double-layer silicon wafer 9 on the second table 7a. In an actual setting, in the bearing state of the positioning table, the positioning portion can be moved to different positions to adjust the posture of the double-layer silicon wafer 9. Exemplarily, when the double-layer silicon wafer 9 is placed on the positioning table, the placement posture of the double-layer silicon wafer 9 may be in a state of tilting or offset from the positioning table. At this time, the positioning portion can move on the table of the positioning table and can drive the double-layer silicon wafer 9 to move, so as to adjust the placement posture of the double-layer silicon wafer 9 so that the upper surface 9a or the lower surface 9b of the double-layer silicon wafer 9 is within the laser processing range of the laser processor.

[0061] Furthermore, when the first positioning portion 61 and the second positioning portion 71 are in the positioning state, a certain clamping force will be provided to the double-layer silicon wafer 9 to limit the displacement of the double-layer silicon wafer 9 and prevent the double-layer silicon wafer 9 from deviating during laser processing and causing the silicon wafer to become scrap after laser processing.

[0062] It can be seen that the positioning part translates on the table top of the positioning table through the mounting hole to move to the double-layer silicon wafer 9. The positioning part can drive the double-layer silicon wafer 9 to move so that the placement posture of the double-layer silicon wafer 9 on the table top can be adjusted, so that the upper surface 9a or the lower surface 9b of the double-layer silicon wafer 9 is better located in the laser area of ​​the laser processor, which is beneficial to improving the accuracy of laser processing.

[0063] Optionally, the first positioning portion 61 and the second positioning portion 71 may be in shapes such as but not limited to cylindrical or square, and the structures of the first positioning portion 61 and the second positioning portion 71 may be in structures such as but not limited to clamping blocks or clips, which are not specifically limited in the present invention.

[0064] Please see again Figure 4 and Figure 6In some embodiments, a first mounting hole 61a is provided on the first table 6a, and the first positioning portion 61 can be telescopically provided in the first mounting hole 61a. The first positioning portion 61 can extend from the first mounting hole 61a to the first table 6a to move relative to the first table 6a to position the double-layer silicon wafer 9, or the first positioning portion 61 can be retracted into the first mounting hole 61a. A second mounting hole 71a is provided on the second table 7a, and the second positioning portion 71 can be telescopically provided in the second mounting hole 71a. The second positioning portion 71 can extend from the second mounting hole 71a to the second table 7a to move relative to the second table 7a to position the double-layer silicon wafer 9, or the second positioning portion 71 can be retracted into the second mounting hole 71a. Specifically, when the positioning table is in a bearing state and supports the double-layer silicon wafer 9, the positioning portion extends from the mounting hole and then moves to the double-layer silicon wafer 9 to adjust the placement posture of the double-layer silicon wafer 9. It can be seen that when the positioning platform switches from the hidden state to the bearing state, the positioning part is hidden in the mounting hole, which can prevent the positioning part from hitting the double-layer silicon wafer 9 during the lifting of the positioning platform and causing damage to the double-layer silicon wafer 9.

[0065] Optionally, the first positioning portion 61 and the second positioning portion 71 can be telescopically extended within the mounting hole by providing a telescopic structure. For example, a telescopic rod can be installed or the positioning portion itself can be made into a telescopic component, and the positioning portion can be driven to extend and retract by pneumatic, hydraulic or electric means to achieve hiding or extension of the positioning portion.

[0066] The silicon wafer laser processing equipment disclosed in the embodiment of the utility model is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the utility model. The description of the above embodiments is only used to help understand the silicon wafer laser processing equipment of the utility model and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A silicon wafer laser processing device, characterized in that: include: A material picking device, the material picking device is used to pick up a double-layer silicon wafer to be laser processed, the double-layer silicon wafer includes an upper surface and a lower surface along the thickness direction; A transport device, the transport device is used to transport the double-layer silicon wafer picked up by the material taking device; A laser processing device, the laser processing device comprising a first laser processor, a flip structure and a second laser processor which are sequentially arranged along the transport direction of the transport device, the first laser processor being used for laser processing the upper surface of the double-layer silicon wafer, the flip structure being used for flipping the double-layer silicon wafer after the laser processing on the upper surface to exchange the orientations of the upper surface and the lower surface, and the second laser processor being used for laser processing the lower surface of the double-layer silicon wafer.

2. The silicon wafer laser processing equipment according to claim 1, characterized in that: The flip structure includes a driving member, a rotating shaft and a clamping assembly. The rotating shaft is connected to the driving member to rotate under the drive of the driving member. The clamping assembly is arranged on the rotating shaft and is used to clamp the double-layer silicon wafer.

3. The silicon wafer laser processing equipment according to claim 2, characterized in that: The clamping assembly comprises a plurality of clamping rods, which are arranged around the outer circumference of the rotating shaft, and a clamping space is formed between two adjacent clamping rods.

4. The silicon wafer laser processing equipment according to claim 3, characterized in that: A buffer is provided at one end of the clamping rod away from the rotating shaft.

5. The silicon wafer laser processing equipment according to claim 3, characterized in that: The clamping assembly further comprises a sensor, which is arranged on any one of the clamping rods and located in the clamping space, and is used to detect a clamping state in the clamping space.

6. The silicon wafer laser processing equipment according to any one of claims 2 to 5, characterized in that: There are two clamping assemblies, which are respectively arranged at two ends of the rotating shaft, and are configured to clamp at two ends of the double-layer silicon wafer.

7. The silicon wafer laser processing equipment according to any one of claims 1 to 5, characterized in that: The silicon wafer laser processing equipment further includes a first positioning platform and a second positioning platform, wherein the first positioning platform and the second positioning platform are sequentially arranged along the transport direction of the transport device, the first positioning platform is arranged corresponding to the first laser processor, and the second positioning platform is arranged corresponding to the second laser processor; The first positioning platform and the second positioning platform respectively have a first table top and a second table top, and the first table top and the second table top are used for placing the double-layer silicon wafer.

8. The silicon wafer laser processing equipment according to claim 7, characterized in that: The first positioning platform and the second positioning platform can both move up and down relative to the transport plane of the transport device, and the first positioning platform and the second positioning platform both have a load-bearing state and a hidden state; In the carrying state, the first positioning platform and the second positioning platform rise relative to the transport plane of the transport device to be flush with or protrude from the transport plane; In the hidden state, the first positioning platform and the second positioning platform are lowered relative to the transport plane of the transport device to be hidden below the transport plane of the transport device.

9. The silicon wafer laser processing equipment according to claim 7, characterized in that: A first positioning portion is movably provided on the first table top, and the first positioning portion is configured to position the double-layer silicon wafer on the first table top. A second positioning portion is movably provided on the second table top, and the second positioning portion is configured to position the double-layer silicon wafer on the second table top.

10. The silicon wafer laser processing equipment according to claim 9, characterized in that: A first mounting hole is provided on the first table, and the first positioning portion can be telescopically connected to the first mounting hole. The first positioning portion can extend from the first mounting hole to the first table to move relative to the first table to position the double-layer silicon wafer, or the first positioning portion can be retracted into the first mounting hole; The second table top is provided with a second mounting hole, and the second positioning portion can be telescopically connected to the second mounting hole. The second positioning portion can extend from the second mounting hole to the second table top to move relative to the second table top to position the double-layer silicon wafer, or the second positioning portion can be retracted into the second mounting hole.

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