Semiconductor quartz ring processing device
By designing a semiconductor quartz ring machining device, the processing powerful dust removal structure is used to solve the problem that the debris and dust are difficult to clean up in the processing process of the quartz ring, and the safety and efficiency of workers can be improved.
Patent Information
- Application Number
- CN202420553319.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2025-01-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
During the processing of quartz rings, the debris and dust generated are difficult to effectively clean up, resulting in workers being labor-intensive and vulnerable to damage from debris splashes.
A semiconductor quartz ring processing device is designed, which uses a powerful dust removal structure, including sealing lids, power warehouses, processing motors, processing knives, hand -in -hand operation frameworks, side -layer drumming layers, top tumors, top drum winding outlets , The inner operation table, bottom negative pressure layer, bottom dust hole, negative pressure fan, and fly dandruff collection room. The device blows debris through the top drum fan, combined with the function of the negative pressure fan, and collects the debris to the fly dander to collect the room for cleaning.
Effectively avoid the risk of workers' contact with processing dust and debris, significantly reduce labor intensity and improve work efficiency and security.
Smart Images
Figure CN222406536U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of quartz ring processing, in particular to a semiconductor quartz ring processing device. Background Art
[0002] Quartz ring for semiconductor is a special material component used in semiconductor manufacturing process. It is usually made of high-purity quartz glass, with excellent high temperature resistance, corrosion resistance and mechanical strength, and is suitable for harsh environments such as high temperature, high vacuum and chemical corrosion in semiconductor production process; Quartz ring for semiconductor plays an important role in semiconductor manufacturing process, and its excellent performance and stable reliability make it one of the indispensable key materials in the semiconductor industry; In the prior art, quartz ring is usually exposed during processing, and a lot of waste will be generated during the processing, resulting in debris splashing and difficult to clean up, and manual cleaning is required, which has high labor intensity for workers, and debris splashing can easily hurt workers; for example, "Utility Model CN218196092U A semiconductor etching quartz ring processing device, when processing, first starts two cylinders to drive the mounting plate to move upward, thereby opening the mounting plate, placing the workpiece to be processed into the processing box, and then closing the mounting plate. Then the worker can put his hands into the processing box through two hand holes, cooperate with the cutting equipment, so as to facilitate operation and processing. The front, back, left and right sides of the processing box are transparent tempered glass, and the worker can clearly observe the internal situation of the processing box from the outside, so that the workpiece processing is completed inside the processing box, which can play a protective role to avoid debris splashing, and at the same time can isolate the debris, so that the debris is isolated inside the processing box. When the debris needs to be cleaned, the fan is started, and the fan blows through the air nozzle to blow the debris from the right to the left. At the same time, the vacuum cleaner is started, and the vacuum cleaner absorbs and collects the debris through the vacuum head and the vacuum pipe, so that the debris can be automatically cleaned, which is convenient to clean, reduces labor intensity, and is easy to use. "For the above problems, there may be technical means to solve them in the prior art, but this case wants to provide an alternative or replacement technical solution. Utility Model Content
[0003] To achieve the above objectives, the utility model is implemented through the following technical solutions: a semiconductor quartz ring processing device, comprising: a device frame, a frame base and a seat operation box, the frame base is installed on the device frame, the seat operation box is installed on the frame base, a processing strong dust removal structure is installed on the seat operation box, and a combined lifting drive assembly is installed on the device frame;
[0004] The processing powerful dust removal structure includes: a sealed box cover, a power compartment, a processing motor, a processing tool, a pair of hand-operated frames, a pair of side shadowless lamps, a top blast layer, a top blower, a plurality of top blast ports, an operating table in the box, a bottom negative pressure layer, a plurality of bottom dust removal holes, a negative pressure blower and a flying debris collection chamber;
[0005] The power bin is mounted on the sealed box cover, the processing motor is mounted in the power bin, the processing tool is inserted into the sealed box cover, and the processing tool is connected to the processing motor, a pair of the hand operation frames are respectively mounted on the operating box body on the seat, a pair of the side shadowless lamps are respectively mounted on the inner side walls of the operating box body on the seat, the top blast layer is mounted on the sealed box cover, and the top blast layer is connected to the top blast layer through a pipeline, the top blower is mounted on the sealed box cover, and a plurality of the top blast The openings are respectively installed on the top blast layer, the in-box operating table is installed in the operating box on the seat, and the bottom negative pressure layer is opened in the in-box operating table, a plurality of bottom dust removal holes are respectively installed on the bottom negative pressure layer, and a plurality of bottom dust removal holes are respectively connected to the operating box on the seat, the flying chip collection chamber is installed on the base on the frame, and the flying chip collection chamber is connected to the negative pressure fan through a pipeline, the negative pressure fan is installed on the base on the frame, and the negative pressure fan is connected to the bottom negative pressure layer through a pipeline.
[0006] It should be noted that, in the above, the quartz ring processing part is placed in the seat-mounted operating box on the base of the frame, and the driving combination lifts the driving component to couple and seal the sealed box cover with the seat-mounted operating box. The worker can extend his hands into the seat-mounted operating box through a pair of hand-entry operating frames to assist in processing operations. The processing motor in the power compartment is started to drive the processing tool to rotate. The processing tool can be extended and the processing position can be adjusted in conjunction with the extension gas rod set on the processing tool. The debris generated during processing is transmitted to several top-level air outlets through the top-level air blowing layer by the air generated by the top-level blower, and then blown to the operating table in the box below. A pair of side shadowless lamps can provide lighting during processing. The debris is sucked away by several bottom dust removal holes on the operating table in the box, and finally flows into the flying chip collection chamber through the bottom negative pressure layer. During the whole process, the negative pressure fan is responsible for providing negative pressure, and the debris blown from above is coordinated and collected, and then collected centrally through the cleaning cabin door set on the flying chip collection chamber.
[0007] Preferably, the combined lifting drive assembly comprises: a lifting coupling motor, a driving threaded rod, a pair of sliding modules, a pair of multi-linked triangular blocks, a pair of driving displacement bolts and a pair of pulling multi-links;
[0008] The lifting coupling motor is installed on the device frame, and the lifting coupling motor is connected to the driving threaded rod, a pair of the sliding modules are respectively installed on the driving threaded rod, a pair of the multi-link triangular blocks are respectively installed on a pair of the sliding modules through rotating shafts, and a pair of the multi-link triangular blocks are respectively connected to a pair of the driving displacement bolts, a pair of the driving displacement bolts are respectively installed on the device frame, a pair of the pulling multi-link rods are respectively installed on a pair of the multi-link triangular blocks through rotating shafts, and a pair of the pulling multi-link rods are respectively connected to the sealing box cover through rotating shafts;
[0009] It should be noted that, in the above, the lifting coupling motor drives the driving threaded rod to rotate. Because of the reverse double threads provided on the driving threaded rod, a pair of sliding modules will move in relative opposite directions when the driving threaded rod rotates. A pair of multi-linked triangular blocks are therefore involved and driven to rotate along a pair of driving displacement bolts, thereby pulling and pushing a pair of pulling multi-links, so that the sealing box cover and the operating box body on the seat are opened and closed and sealed.
[0010] Preferably, the machining tool is provided with an extended gas rod;
[0011] Preferably, an inspection port is provided on the power compartment;
[0012] Preferably, the driving threaded rod is provided with reverse double threads;
[0013] Preferably, the flying debris collection chamber is provided with a cleaning door. Beneficial Effects
[0014] The utility model provides a semiconductor quartz ring processing device. It has the following beneficial effects, compared with the prior art: the device processes a strong dust removal structure, so that the generated processing debris and dust are continuously washed from top to bottom by the flowing air in the operating box on the seat, and the processing debris and dust are collected in the flying debris collection room for centralized cleaning, so that the operating workers are prevented from contacting the processing dust, and the debris splashing during processing can be avoided to injure the processing workers, so that the work efficiency and work safety are greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The utility model is a schematic structural diagram of a semiconductor quartz ring processing device.
[0016] Figure 2 The utility model is a schematic structural diagram of a semiconductor quartz ring processing device.
[0017] In the figure: 1. Device frame; 2. Base on the frame; 3. Operating box on the base; 4. Sealed box cover; 5. Power compartment; 6. Processing motor; 7. Processing tool; 8. Hand-held operating frame; 9. Side shadowless lamp; 10. Top blast layer; 11. Top blower; 12. Top blast port; 13. Operating table in the box; 14. Bottom negative pressure layer; 15. Bottom dust removal hole; 16. Negative pressure fan; 17. Flying debris collection chamber; 18. Lifting coupling motor; 19. Driving threaded rod; 20. Sliding module; 21. Multi-link triangle block; 22. Driving displacement bolt; 23. Pulling multi-link. DETAILED DESCRIPTION
[0018] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.
[0019] Through the personnel in this field, all the electrical components in this case are connected to their corresponding power supplies through wires, and appropriate controllers and encoders should be selected according to actual conditions to meet the control requirements. The specific connection and control sequence should refer to the following working principle, and the electrical connection between the electrical components is completed in the order of working in sequence. The detailed connection means are well-known technologies in this field. The following mainly introduces the working principles and processes, and no longer explains the electrical control. Example
[0020] The present invention will be described in detail below in conjunction with the accompanying drawings. Figure 1-2As shown, a semiconductor quartz ring processing device comprises: a device frame 1, a frame base 2 and a base operating box 3, the frame base 2 is installed on the device frame 1, the base operating box 3 is installed on the frame base 2, a processing strong dust removal structure is installed on the base operating box 3, and a combined lifting drive component is installed on the device frame 1; the processing strong dust removal structure comprises: a sealed box cover 4, a power bin 5, a processing motor 6, a processing tool 7, a pair of hand-operated frames 8, a pair of side shadowless lamps 9, a top blast layer 10, a top blower 11, a plurality of top blast ports 12, an operating table 13 in the box, a bottom negative pressure layer 14, a plurality of bottom dust removal holes 15, a negative pressure fan 16 and a flying debris collection The power bin 5 is installed on the sealed box cover 4, the processing motor 6 is installed in the power bin 5, the processing tool 7 is inserted in the sealed box cover 4, and the processing tool 7 is connected to the processing motor 6, a pair of the hand-operated frames 8 are respectively installed on the operating box body 3 on the seat, a pair of the side shadowless lamps 9 are respectively installed on the inner side walls of the operating box body 3 on the seat, the top blast layer 10 is installed on the sealed box cover 4, and the top blast layer 10 is connected to the top blast layer 10 through a pipeline, the top blower 11 is installed on the sealed box cover 4, and a plurality of the top blast ports 12 are respectively installed on the top blast layer 10, and the operating table 13 in the box is installed In the operating box 3 on the seat, the bottom negative pressure layer 14 is opened in the operating table 13 in the box, a plurality of bottom dust removal holes 15 are respectively installed on the bottom negative pressure layer 14, and a plurality of bottom dust removal holes 15 are respectively connected to the operating box 3 on the seat, the flying debris collection chamber 17 is installed on the base 2 on the frame, and the flying debris collection chamber 17 is connected to the negative pressure fan 16 through a pipeline, the negative pressure fan 16 is installed on the base 2 on the frame, and the negative pressure fan 16 is connected to the bottom negative pressure layer 14 through a pipeline; the combined lifting drive component includes: a lifting coupling motor 18, a driving threaded rod 19, a pair of sliding modules 20, a pair of multi-connected triangular blocks 21, and a pair of Driving displacement bolt 22 and a pair of pulling multi-links 23; the lifting coupling motor 18 is installed on the device frame 1, and the lifting coupling motor 18 is connected to the driving threaded rod 19, a pair of the sliding modules 20 are respectively installed on the driving threaded rod 19, a pair of the multi-link triangular blocks 21 are respectively installed on a pair of the sliding modules 20 through rotating shafts, and a pair of the multi-link triangular blocks 21 are respectively connected to a pair of the driving displacement bolts 22, a pair of the driving displacement bolts 22 are respectively installed on the device frame 1, a pair of the pulling multi-links 23 are respectively installed on a pair of the multi-link triangular blocks 21 through rotating shafts, and a pair of the pulling multi-links 23 are respectively connected to the sealing box cover 4 through rotating shafts.
[0021] According to the attached Figure 1-2 It is concluded that the quartz ring processing part is placed in the seat operating box 3 on the frame base 2, and the driving combination lifts the driving component to couple and seal the sealing box cover 4 with the seat operating box 3. The worker's hands can be inserted into the seat operating box 3 through a pair of hand-operated frames 8 to assist in processing operations. The processing motor 6 in the power compartment 5 is started to drive the processing tool 7 to rotate. The extended gas rod set on the processing tool 7 can extend the processing tool 7 and adjust the processing position. The debris generated during processing is transmitted by the air generated by the top-level blower 11 through the top-level blowing layer 10 to several top-level blowing ports 12, and then blown to the operating table 13 in the box below. A pair of side shadowless lamps 9 can provide lighting function during processing, and the debris is blown by the operating table in the box The dust is sucked away by several bottom dust removal holes 15 on 13, passes through the bottom negative pressure layer 14 and finally flows into the flying chip collection chamber 17. During the whole process, the negative pressure fan 16 is responsible for providing negative pressure, and the debris blown from above is coordinated and collected and then collected centrally through the cleaning hatch arranged on the flying chip collection chamber 17; the lifting coupling motor 18 drives the driving threaded rod 19 to rotate. Because of the reverse double threads arranged on the driving threaded rod 19, a pair of sliding modules 20 will move in opposite directions when the driving threaded rod 19 rotates, and a pair of multi-linked triangular blocks 21 are therefore involved and driven to rotate along a pair of driving displacement bolts 22, thereby pulling and pushing a pair of pulling multi-links 23, so that the sealing box cover 4 and the operating box body 3 on the seat are opened and closed and sealed.
[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor quartz ring processing device, comprising: The device frame (1), the frame base (2) and the seat operation box (3), characterized in that the frame base (2) is mounted on the device frame (1), the seat operation box (3) is mounted on the frame base (2), a processing strong dust removal structure is mounted on the seat operation box (3), and a combined lifting drive assembly is mounted on the device frame (1); The processing powerful dust removal structure comprises: a sealed box cover (4), a power compartment (5), a processing motor (6), a processing tool (7), a pair of hand-operated operation frames (8), a pair of side shadowless lamps (9), a top blast layer (10), a top blower (11), a plurality of top blast ports (12), an operating table in the box (13), a bottom negative pressure layer (14), a plurality of bottom dust removal holes (15), a negative pressure blower (16) and a flying debris collection chamber (17); The power bin (5) is mounted on the sealed box cover (4), the processing motor (6) is mounted in the power bin (5), the processing tool (7) is inserted into the sealed box cover (4), and the processing tool (7) is connected to the processing motor (6), a pair of hand-operated operation frames (8) are respectively mounted on the seat-mounted operating box body (3), a pair of side shadowless lamps (9) are respectively mounted on the inner side walls of the seat-mounted operating box body (3), the top blast layer (10) is mounted on the sealed box cover (4), and the top blast layer (10) is connected to the top blast layer (10) through a pipeline, the top blower (11) is mounted on the sealed box cover (4), and a plurality of top blast ports (12) are mounted on the sealed box cover (4). The plurality of bottom dust removal holes (15) are respectively installed on the top blast layer (10); the in-box operating table (13) is installed in the operating box body (3) on the seat; and the bottom negative pressure layer (14) is opened in the in-box operating table (13); a plurality of bottom dust removal holes (15) are respectively installed on the bottom negative pressure layer (14); and the plurality of bottom dust removal holes (15) are respectively connected to the operating box body (3) on the seat; the flying chip collection chamber (17) is installed on the frame base (2); and the flying chip collection chamber (17) is connected to the negative pressure fan (16) through a pipeline; and the negative pressure fan (16) is installed on the frame base (2); and the negative pressure fan (16) is connected to the bottom negative pressure layer (14) through a pipeline.
2. A semiconductor quartz ring processing device according to claim 1, characterized in that: The combined lifting drive assembly comprises: a lifting coupling motor (18), a driving threaded rod (19), a pair of sliding modules (20), a pair of multi-linked triangular blocks (21), a pair of driving displacement bolts (22), and a pair of pulling multi-links (23); The lifting coupling motor (18) is installed on the device frame (1), and the lifting coupling motor (18) is connected to the driving threaded rod (19), a pair of the sliding modules (20) are respectively installed on the driving threaded rod (19), a pair of the multi-linked triangular blocks (21) are respectively installed on a pair of the sliding modules (20) through a rotating shaft, and a pair of the multi-linked triangular blocks (21) are respectively connected to a pair of the driving displacement bolts (22), a pair of the driving displacement bolts (22) are respectively installed on the device frame (1), a pair of the pulling multi-link rods (23) are respectively installed on a pair of the multi-linked triangular blocks (21) through a rotating shaft, and a pair of the pulling multi-link rods (23) are respectively connected to the sealing box cover (4) through a rotating shaft.
3. A semiconductor quartz ring processing device according to claim 2, characterized in that: The machining tool (7) is provided with an extended gas rod.
4. A semiconductor quartz ring processing device according to claim 3, characterized in that: The power compartment (5) is provided with an inspection port.
5. A semiconductor quartz ring processing device according to claim 4, characterized in that: The driving threaded rod (19) is provided with reverse double threads.
6. A semiconductor quartz ring processing device according to claim 5, characterized in that: The flying debris collection chamber (17) is provided with a cleaning door.