Wafer warping measuring device

Abstract

The utility model provides a wafer warpage measuring device, which comprises a contact sensing piece, a wafer warpage measuring device and a wafer warpage measuring device, and is characterized in that the contact sensing piece is used for being in contact with a lower convex position of the lower surface of a wafer to be measured; at least part of the lifting piece is arranged above the contact induction piece, the lifting piece is movably arranged in the vertical direction relative to the contact induction piece, and the upper end of the lifting piece is used for making contact with the peripheral position of the bottom of the wafer to be detected so as to support the wafer to be detected; the measuring scale is marked with size scales, and the measuring scale is arranged on the lifting part and is parallel to the lifting part in the vertical direction so as to move along with the lifting part, so that the problem that a device capable of accurately measuring the warping value of the ultrathin wafer is lacked in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer warpage measurement, in particular to a wafer warpage measurement device. Background Art

[0002] The thickness of the silicon carbide ultra-thin wafer used to produce wafers is relatively thin. When the warpage of the wafer is large, it is easy to break into pieces when entering the slot of the cassette used to place the ultra-thin wafer in the prior art. Therefore, it is necessary to measure the warpage value of the ultra-thin wafer.

[0003] The prior art method for measuring the warpage value of a wafer has the following disadvantages:

[0004] (1) The measurement method in the prior art specifically places the wafer on a horizontal platform and then measures it with a ruler. This makes it impossible to accurately find the lowest point of the wafer, resulting in errors in the measurement data.

[0005] (2) The horizontal platform used in the above-mentioned measurement method will exert a bearing force on the wafer, which may easily cause the measured warpage value of the ultra-thin wafer to be lower than the actual warpage value. Utility Model Content

[0006] The main purpose of the utility model is to provide a wafer warpage measurement device to solve the problem that there is a lack of a device capable of accurately measuring the warpage value of an ultra-thin wafer in the prior art.

[0007] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a wafer warpage measuring device is provided, which includes: a contact sensing member, which is used to contact the lower convex position of the lower surface of the wafer to be measured; a lifting member, at least a part of the lifting member is arranged above the contact sensing member, the lifting member is movably arranged in the vertical direction relative to the contact sensing member, and the upper end of the lifting member is used to contact the outer peripheral position of the bottom of the wafer to be measured to support the wafer to be measured; a measuring ruler, which is marked with size scales, and is arranged on the lifting member and is parallel to the lifting member in the vertical direction so as to move with the lifting member.

[0008] Furthermore, the base is arranged on the supporting base surface, and the contact sensing element is located above the base; the supporting component is arranged between the base and the contact sensing element, so that an escape space for evading the lifting element and the measuring ruler is formed between the base and the contact sensing element.

[0009] Furthermore, the supporting component includes a plurality of supporting members, and the plurality of supporting members are arranged at intervals between the base and the contact sensing member.

[0010] Furthermore, the plurality of support members include a main support member located in the middle of the base and a plurality of auxiliary support members spaced apart around the circumference of the main support member.

[0011] Furthermore, the lifting member includes a lifting plate and / or a lifting rod, and the contact sensing member is provided with an avoidance hole for avoiding the lifting member and the measuring ruler.

[0012] Furthermore, the wafer warpage measuring device also includes a driving component, a driving body of the driving component is arranged on the base, and a driving shaft of the driving component is drivingly connected to the lower end of the lifting member to drive the lifting member to move in a vertical direction.

[0013] Furthermore, the contact sensing element includes a support plate and a contact detection component, the support plate is connected to the support component, and a measuring point of the contact detection component is arranged on the upper surface of the support plate for contacting the wafer to be tested.

[0014] Furthermore, the contact detection component includes a plurality of pressure detection components, and the measurement points of the plurality of pressure detection components are arranged on the upper surface of the support plate to correspond to the lower surface of the wafer to be tested carried by the lifting member.

[0015] Further, the contact sensing element includes: a support plate and a plurality of pressure detection components, wherein the plurality of pressure detection components are spaced apart below the support plate and between the support plate and the support component; or a support plate, a mounting plate and a plurality of pressure detection components, wherein the support plate is located above the mounting plate, the mounting plate is used to be connected to the support component, and the plurality of pressure detection components are spaced apart between the support plate and the mounting plate.

[0016] Furthermore, there are multiple lifting members, which are arranged at intervals around the center line of the contact sensing member; wherein at least one of the multiple lifting members is provided with a measuring ruler.

[0017] By applying the technical solution of the utility model, the wafer warpage measuring device of the utility model includes: a contact sensing member, which is used to contact the lower convex position of the lower surface of the wafer to be measured; a lifting member, at least a part of the lifting member is arranged above the contact sensing member, the lifting member is movably arranged in the vertical direction relative to the contact sensing member, and the upper end of the lifting member is used to contact the outer peripheral position of the bottom of the wafer to be measured to support the wafer to be measured; a measuring ruler, which is marked with size scales, and the measuring ruler is arranged on the lifting member and is parallel to the lifting member in the vertical direction so as to move with the lifting member. In this way, the lifting member of the wafer warpage measuring device of the present invention can rise and fall relative to the contact sensing member, and the measuring ruler is marked with size scales. After the wafer to be measured is placed on the lifting member, under the support of the lifting member, the wafer to be measured presents a posture in which the peripheral position is warped upward and the middle position of the bottom is convex downward. It is only necessary to move the lifting member to lower the height of the wafer to be measured so that the convex position of the lower surface of the wafer to be measured contacts with the contact sensing member, so that the value measured by the contact sensing member changes, and the current value of the measuring ruler at the position corresponding to the upper surface of the contact sensing member can be recorded at this time, so as to obtain the warpage value of the wafer to be measured, which effectively solves the problem of lack of a device that can accurately measure the warpage value of ultra-thin wafers in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 A schematic structural diagram of an embodiment of a wafer warpage measurement device according to the utility model is shown.

[0020] The above drawings include the following reference numerals:

[0021] 1. Contact sensing part; 11. Support plate; 2. Lifting part; 3. Measuring ruler; 4. Base; 5. Support component; 51. Support part; 52. Main support part; 53. Auxiliary support part. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] like Figure 1As shown, the utility model provides a wafer warpage measuring device, which includes: a contact sensing member 1, which is used to contact the lower convex position of the lower surface of the wafer to be measured; a lifting member 2, which is at least partially arranged above the contact sensing member 1, and the lifting member 2 is movably arranged in the vertical direction relative to the contact sensing member 1, and the upper end of the lifting member 2 is used to contact the outer peripheral position of the bottom of the wafer to be measured to support the wafer to be measured, so that the wafer is suspended; a measuring ruler 3, which is marked with size scales, and the measuring ruler 3 is arranged on the lifting member 2 and is parallel to the lifting member 2 in the vertical direction to move with the lifting member 2.

[0024] In this way, the lifting member 2 of the wafer warpage measuring device of the present invention can rise and fall relative to the contact sensing member 1, and the measuring ruler 3 is marked with size scales. After the wafer to be measured is placed on the lifting member 2, under the support of the lifting member 2, the wafer to be measured presents a posture in which the peripheral position is warped upward and the middle position of the bottom is convex downward. It is only necessary to move the lifting member 2 to lower the height of the wafer to be measured so that the convex position of the lower surface of the wafer to be measured contacts with the contact sensing member 1, so that the value measured by the contact sensing member 1 changes, and the current value of the measuring ruler 3 at the position corresponding to the upper surface of the contact sensing member 1 can be recorded at this time, so that the warpage value of the wafer to be measured can be obtained, which effectively solves the problem of lack of a device that can accurately measure the warpage value of ultra-thin wafers in the prior art.

[0025] like Figure 1 As shown, the thin sheet located above the lifting member 2 is the wafer to be tested.

[0026] Specifically, the size scale of the measuring ruler 3 increases from "0" from top to bottom. When the wafer to be measured contacts the contact sensing element 1, the current value of the measuring ruler 3 at the position corresponding to the upper surface of the contact sensing element 1 is the difference between the bottom periphery of the wafer to be measured and the contact position between the wafer to be measured and the contact sensing element 1, that is, the warpage value of the wafer to be measured.

[0027] like Figure 1 As shown, the base 4 is arranged on the supporting base surface, and the contact sensing element 1 is located above the base 4; the supporting component 5 is arranged between the base 4 and the contact sensing element 1, so that an escape space for evading the lifting element 2 and the measuring ruler 3 is formed between the base 4 and the contact sensing element 1.

[0028] like Figure 1 As shown, the supporting component 5 includes a plurality of supporting members 51 , and the plurality of supporting members 51 are arranged at intervals between the base 4 and the contact sensing member 1 .

[0029] When the lifting member 2 moves in the vertical direction, the lower end of the lifting member 2 passes through the contact sensing member 1 and reaches the avoidance space. At this time, each support member 51 in the support component 5 is spaced apart from the lifting member 2 to avoid interference.

[0030] In the first embodiment of the support component 5 of the present invention, the number of the support members 51 is two, and the two support members 51 are symmetrically arranged about the center line of the base 4 .

[0031] In the second embodiment of the support component 5 of the present invention, the number of the support members 51 is three, and the three support members 51 are arranged at intervals around the center line of the base 4 .

[0032] In the third embodiment of the support component 5 of the present invention, the number of the support members 51 is four, and the four support members 51 are arranged at intervals around the center line of the base 4 .

[0033] In the fourth embodiment of the support component 5 of the present invention, the number of the support members 51 is five, and the five support members 51 are arranged at intervals around the center line of the base 4 .

[0034] In the fifth embodiment of the support component 5 of the present invention, the number of the support members 51 is six, and the six support members 51 are arranged at intervals around the center line of the base 4 .

[0035] like Figure 1 As shown, the plurality of support members 51 include a main support member 52 located in the middle of the base 4 and a plurality of auxiliary support members 53 spaced around the circumference of the main support member 52 .

[0036] Optionally, the number of the auxiliary support members 53 may be two or more.

[0037] In the sixth embodiment of the support component 5 of the present invention, the plurality of support members 51 include a main support member 52 located in the middle of the base 4 and two auxiliary support members 53 located at opposite sides of the main support member 52 .

[0038] In the seventh embodiment of the support component 5 of the present invention, the plurality of support members 51 include a main support member 52 located in the middle of the base 4 and three auxiliary support members 53 evenly arranged around the circumference of the main support member 52 .

[0039] In the eighth embodiment of the support component 5 of the present invention, the plurality of support members 51 include a main support member 52 located in the middle of the base 4 and four auxiliary support members 53 evenly arranged around the circumference of the main support member 52 .

[0040] In the ninth embodiment of the support component 5 of the present invention, the plurality of support members 51 include a main support member 52 located in the middle of the base 4 and five auxiliary support members 53 evenly arranged around the circumference of the main support member 52 .

[0041] In the tenth embodiment of the support component 5 of the present invention, the plurality of support members 51 include a main support member 52 located in the middle of the base 4 and six auxiliary support members 53 evenly arranged around the circumference of the main support member 52 .

[0042] Optionally, the lifting member 2 includes a lifting plate and / or a lifting rod, and the contact sensing member 1 is provided with an avoidance hole for avoiding the lifting member 2 and the measuring ruler 3 .

[0043] When the lifting member 2 is set as a lifting plate, the contact sensing member 1 is provided with an avoidance hole for avoiding the lifting plate; when the lifting member 2 is set as a lifting rod, the contact sensing member 1 is provided with an avoidance hole for avoiding the lifting rod.

[0044] Specifically, the contact sensing element 1 may further include a support plate 11 and a sleeve disposed on the support plate 11 , and the lifting element 2 is slidably disposed in the sleeve along a vertical direction.

[0045] The warpage measuring device of the utility model also includes a driving component, a driving body of the driving component is arranged on the base 4, and a driving shaft of the driving component is connected to the lower end of the lifting member 2 to drive the lifting member 2 to perform a lifting movement, that is, the user can lift the lifting member 2 by manually operating the lifting member 2 or by driving the lifting member 2 to lift through the driving component.

[0046] Optionally, the driving component can be configured as any one or more of a cylinder and a motor.

[0047] In the first embodiment of the contact sensing element 1 of the present invention, the contact sensing element 1 includes a support plate 11 and a contact detection component. The support plate 11 is connected to the support component 5. The measuring point of the contact detection component is set on the upper surface of the support plate 11 for contacting the wafer to be tested.

[0048] The contact detection component includes a plurality of pressure detection components, and the measurement points of the plurality of pressure detection components are arranged on the upper surface of the support plate 11 to correspond to the lower surface of the wafer to be measured carried by the lifting member 2 .

[0049] Specifically, the measuring points of the multiple pressure detection components of the contact detection component can be arranged in various forms, and the measuring points of the multiple pressure detection components at least include one or more measuring points arranged near the geometric center of the support plate 11 and near the position corresponding to the geometric center of the wafer to be tested as the main measuring points. At the same time, the measuring points of the multiple pressure detection components also include auxiliary measuring points arranged on the peripheral side of the main measuring points. The arrangement of the auxiliary measuring points on the upper surface of the support plate 11 can be uniformly distributed on multiple concentric circles extending outward from the geometric center point of the support plate 11. The spacing between the above concentric circles can be the same, or can increase from the inside to the outside. In addition, the auxiliary measuring points can also be arranged in a uniform lattice.

[0050] In the second embodiment of the contact sensing member 1 of the utility model, the contact sensing member 1 includes a support plate 11 and a plurality of pressure detection components, the plurality of pressure detection components are evenly arranged around the center line of the support plate 11, and the lifting member 2 is used to carry the wafer to be tested. In this way, when the lifting member 2 descends in the vertical direction to make the wafer to be tested contact with the support plate 11 of the contact sensing member 1, the support plate 11 will transmit the force change to the pressure detection component of the contact sensing member 1, and the pressure detection component will detect the pressure change, such as the moment when the pressure value changes from 0 to a non-zero state or suddenly exceeds the predetermined pressure value, at which time the lifting member 2 stops descending.

[0051] In the third embodiment of the contact sensing member 1 of the utility model, the contact sensing member 1 includes a support plate 11, a mounting plate and a plurality of pressure detection components, the support plate 11 is located above the mounting plate, the mounting plate is used to connect with the support component 5, and a plurality of pressure detection components are arranged between the support plate 11 and the mounting plate, and the plurality of pressure detection components are evenly arranged around the center line of the support plate 11. In this way, when the lifting member 2 descends in the vertical direction to make the wafer to be tested contact with the support plate 11 of the contact sensing member 1, the support plate 11 will transmit the force change to the pressure detection component of the contact sensing member 1, and the pressure detection component will detect the pressure change, such as the moment when the pressure value changes from 0 to a non-zero state or suddenly exceeds the predetermined pressure value, at which time the lifting member 2 stops descending.

[0052] Optionally, the contact detection component of the contact sensing element 1 of the present invention may include a mechanical contact sensor, a capacitive contact sensor, a piezoelectric contact sensor, a photoelectric contact sensor, a magnetic contact sensor or other components capable of detecting the contact between the wafer to be tested and the contact sensing element 1; wherein, the contact detection component of the present invention Figure 1 The pressure detection component used in the contact sensing element 1 of the illustrated embodiment is a piezoelectric contact sensor based on the weighing principle.

[0053] In an embodiment of the wafer warpage measuring device of the present invention, there are multiple lifting members 2 , which are arranged at intervals around the center line of the contact sensing member 1 ; wherein at least one of the multiple lifting members 2 is provided with a measuring ruler 3 .

[0054] Specifically, the working principle of the warpage measurement device of the present invention is as follows:

[0055] (1) First, place the wafer to be tested on the lifting member 2.

[0056] (2) Then, the lifting member 2 is moved downward until the wafer to be tested comes into contact with the contact sensing member 1. At this time, the pressure detection component in the contact sensing member 1 detects the pressure change and stops moving the lifting member 2.

[0057] (3) Next, the length of the portion of the measuring ruler 3 currently located above the contact sensing element 1 is read out, which is the warpage value of the wafer to be measured.

[0058] (4) Finally, remove the wafer to be tested and move the lifting member 2 upward to the initial position.

[0059] In summary, the wafer warpage measurement device of the present invention solves the problem in the prior art of the lack of a device that can accurately measure the warpage value of an ultra-thin wafer, and the corresponding relative positions and installation relationships between the lifting component 2, the contact sensing component 1 and the measuring scale 3 of the present invention can accurately measure the warpage value of the ultra-thin wafer. The structure is simple and easy to install and disassemble, which avoids the problem of ultra-thin wafers being fragile during the measurement process and greatly improves work efficiency.

[0060] From the above description, it can be seen that the above embodiments of the utility model achieve the following technical effects:

[0061] The wafer warpage measuring device of the utility model comprises: a contact sensing member 1, which is used to contact with a lower convex position of the lower surface of a wafer to be measured; a lifting member 2, which is at least partially arranged above the contact sensing member 1, and the lifting member 2 is movably arranged in a vertical direction relative to the contact sensing member 1, and the upper end of the lifting member 2 is used to contact with the outer peripheral position of the bottom of the wafer to be measured to support the wafer to be measured, so that the wafer is suspended; a measuring ruler 3, which is marked with size scales, and the measuring ruler 3 is arranged on the lifting member 2 and is parallel to the lifting member 2 in the vertical direction so as to move with the lifting member 2. In this way, the lifting member 2 of the wafer warpage measuring device of the present invention can rise and fall relative to the contact sensing member 1, and the measuring ruler 3 is marked with size scales. After the wafer to be measured is placed on the lifting member 2, under the support of the lifting member 2, the wafer to be measured presents a posture in which the peripheral position is warped upward and the middle position of the bottom is convex downward. It is only necessary to move the lifting member 2 to lower the height of the wafer to be measured so that the convex position of the lower surface of the wafer to be measured contacts with the contact sensing member 1, so that the value measured by the contact sensing member 1 changes, and the current value of the measuring ruler 3 at the position corresponding to the upper surface of the contact sensing member 1 can be recorded at this time, so that the warpage value of the wafer to be measured can be obtained, which effectively solves the problem of lack of a device that can accurately measure the warpage value of ultra-thin wafers in the prior art.

[0062] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0063] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0064] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0065] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0066] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0067] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A wafer warpage measurement device, characterized in that: include: A contact sensing element (1), the contact sensing element (1) being used to contact a lower convex position of the lower surface of a wafer to be tested; A lifting member (2), the lifting member (2) being at least partially disposed above the contact sensing member (1), the lifting member (2) being movably disposed in a vertical direction relative to the contact sensing member (1), the upper end of the lifting member (2) being used to contact a position close to the periphery of the lower surface of the wafer to be tested so as to support the wafer to be tested; A measuring ruler (3) is marked with size scales, and the measuring ruler (3) is arranged on the lifting member (2) and is parallel to the lifting member (2) in a vertical direction so as to move with the lifting member (2).

2. The wafer warpage measurement device according to claim 1, characterized in that: The warpage measuring device comprises: A base (4), wherein the base (4) is arranged on a supporting base surface, and the contact sensing element (1) is located above the base (4); A support component (5) is arranged between the base (4) and the contact sensing component (1) so that an escape space for evading the lifting component (2) and the measuring ruler (3) is formed between the base (4) and the contact sensing component (1).

3. The wafer warpage measurement device according to claim 2, characterized in that: The supporting component (5) comprises a plurality of supporting members (51), and the plurality of supporting members (51) are arranged at intervals between the base (4) and the contact sensing member (1).

4. The wafer warpage measurement device according to claim 3, characterized in that: The plurality of support members (51) include a main support member (52) located in the middle of the base (4) and a plurality of auxiliary support members (53) arranged at intervals around the circumference of the main support member (52).

5. The wafer warpage measurement device according to claim 1, characterized in that: The lifting member (2) comprises a lifting plate and / or a lifting rod, and the contact sensing member (1) is provided with an avoidance hole for avoiding the lifting member (2) and the measuring ruler (3).

6. The wafer warpage measurement device according to claim 2, characterized in that: The warpage measurement device further comprises a driving component, a driving body of the driving component is arranged on the base (4), and a driving shaft of the driving component is drivingly connected to the lower end of the lifting member (2) to drive the lifting member (2) to move in a vertical direction.

7. The wafer warpage measurement device according to claim 2, characterized in that: The contact sensing element (1) comprises a support plate (11) and a contact detection component, wherein the support plate (11) is connected to the support component (5), and a measuring point of the contact detection component is arranged on the upper surface of the support plate (11) for contacting the wafer to be tested.

8. The wafer warpage measurement device according to claim 7, characterized in that: The contact detection component comprises a plurality of pressure detection components, and the measurement points of the plurality of pressure detection components are arranged on the upper surface of the support plate (11) to correspond to the lower surface of the wafer to be tested carried by the lifting member (2).

9. The wafer warpage measurement device according to claim 2, characterized in that: The contact sensing element (1) comprises: A support plate (11) and a plurality of pressure detection components, wherein the plurality of pressure detection components are arranged at intervals below the support plate (11) and between the support plate (11) and the support component (5); or A support plate (11), a mounting plate and a plurality of pressure detection components, wherein the support plate (11) is located above the mounting plate, the mounting plate is used to be connected to the support component (5), and the plurality of pressure detection components are arranged at intervals between the support plate (11) and the mounting plate.

10. The wafer warpage measurement device according to claim 2, characterized in that: The number of the lifting members (2) is multiple, and the multiple lifting members (2) are arranged at intervals around the center line of the contact sensing member (1); wherein the measuring ruler (3) is arranged on at least one of the multiple lifting members (2).

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