APO long-distance semiconductor inspection microscope

Abstract

The utility model discloses an APO long-distance semiconductor inspection microscope which comprises a microscope body, a controller is arranged on the microscope body, a [-shaped support is arranged on the microscope body, a moving plate is arranged in the [-shaped support in a sliding mode, the top of the moving plate is fixedly connected with an object placing ring, a placing disc is arranged on the object placing ring, and the moving plate is arranged on the placing disc. An adjusting mechanism is arranged on the microscope body; the adjusting mechanism comprises an adjusting box fixedly connected to the microscope body, a partition plate is fixedly connected to the interior of the adjusting box, and two first threaded rods are connected to the partition plate in a rotating and penetrating mode. According to the APO long-distance semiconductor inspection microscope, the position of the placing disc can be adjusted through the arranged adjusting mechanism, so that a semiconductor material placed above the placing disc can be driven to be finely adjusted, an operator can conveniently carry out full-range detection work on the semiconductor material, and the detection effect is better.

Description

Technical Field

[0001] The utility model relates to the technical field of microscopes, in particular to an APO long-distance semiconductor inspection microscope. Background Art

[0002] A semiconductor inspection microscope is a high-precision optical inspection tool specially used in the semiconductor industry. It can observe and analyze semiconductor materials and chips at the microscopic level. Semiconductor inspection microscopes usually use advanced optical systems and high-resolution lenses, which can present excellent image quality and help observe the tiny details of semiconductor materials and chips, such as surface morphology, crystal structure, defects, etc. The APO long-distance semiconductor inspection microscope uses an APO objective lens.

[0003] Publication number CN 210982194 U discloses an optical microscope for semiconductor detection, including a base, a column and a workbench for placing semiconductors fixed on the base, and the workbench is located on one side of the column. A light source cavity is recessed on the workbench, and a detection light source is arranged in the light source cavity. A refraction plate for fully scattering the light of the detection light source is arranged at the opening of the light source cavity. A number of fixing devices for pressing the semiconductor are arranged around the light source cavity. The fixing device includes a handle, a fixing seat, a connecting rod and a pressing block. The fixing seat can be detachably fixed on the workbench, and the connecting rod can be turned up and down relative to the fixing seat. One end of the connecting rod is connected to the handle, and the other end is fixed to the pressing block. A positioning frame that can slide up and down is arranged on the column, and an optical microscope is fixed on the positioning frame. The eyepiece of the optical microscope is threadedly connected to a CCD camera, and the objective lens of the optical microscope faces the refraction plate. The fixing device has a simple structure and can quickly position the semiconductor, which is convenient for semiconductor detection.

[0004] However, the microscope has the following shortcomings: the device can be used to fix the semiconductor for subsequent inspection, but due to the large size of some semiconductor materials, the object cannot cover the entire range of the semiconductor during inspection, resulting in blind spots in inspection and limited use effect.

[0005] Therefore, the utility model provides an APO long-distance semiconductor inspection microscope to solve the above problems. Utility Model Content

[0006] In view of the deficiencies in the prior art, the utility model provides an APO long-distance semiconductor inspection microscope to solve the above problems.

[0007] To achieve the above object, the utility model is realized by the following technical solutions: An APO long-distance semiconductor inspection microscope, including a microscope body, a controller is arranged on the microscope body, a U-shaped bracket is arranged on the microscope body, a moving plate is slidably arranged in the U-shaped bracket, a placing ring is fixedly connected to the top of the moving plate, a placing tray is arranged on the placing ring, and an adjusting mechanism is arranged on the microscope body;

[0008] The adjusting mechanism includes an adjusting box fixedly connected to the microscope body. A partition is fixedly connected in the adjusting box. Two first threaded rods are rotatably penetrated through the partition. L-shaped connecting blocks are threadedly sleeved on both of the first threaded rods. One side of the L-shaped connecting block slidably extends outside the adjusting box. The same support plate is fixedly connected to one sides of the two L-shaped connecting blocks. The top of the support plate is connected to the bottom of the U-shaped bracket.

[0009] Preferably, synchronous wheels are fixedly sleeved on both of the first threaded rods. The same synchronous belt is wound between the two synchronous wheels. A driven gear is fixedly sleeved on the corresponding first threaded rod. A first motor is fixedly connected to one side of the partition. A driving gear is fixedly connected to the output shaft of the first motor. The driving gear meshes with the driven gear. By using the synchronous wheels, synchronous belt, driven gear, first motor and driving gear in combination, it can conveniently control the synchronous rotation of the two first threaded rods and is convenient to operate and use.

[0010] Preferably, moving grooves are formed in the inner walls of both sides of the U-shaped bracket. Side plates are fixedly connected to both sides of the moving plate. One sides of the two side plates respectively slidably extend into the corresponding moving grooves. A second motor is fixedly connected in the corresponding moving groove. A second threaded rod is fixedly connected to the output shaft of the second motor. The second threaded rod threadedly penetrates through the corresponding side plate. By using the moving grooves, side plates, second motor and second threaded rod in combination, it can conveniently control the movement of the U-shaped bracket and is convenient to drive the semiconductor material to move longitudinally.

[0011] Preferably, a sliding rod is fixedly connected in the corresponding moving groove. The sliding rod slidably penetrates through the corresponding side plate. A limiting plate is fixedly sleeved on the sliding rod. By using the sliding rod and the limiting plate in combination, the side plate can be limited and its moving distance can be restricted.

[0012] Preferably, the outer wall of the storage ring is penetrated by four symmetrically distributed fixing cylinders, one end of the fixing cylinder is rotatably penetrated by a third threaded rod, a telescopic sleeve is threadedly provided on the third threaded rod, one end of the telescopic sleeve slides and extends into the storage ring, one end of the telescopic sleeve is fixedly connected to a splint, one side of the splint is in contact with the placement disk, and one end of the third threaded rod is fixedly connected to a handwheel, and the placement disk in the storage ring can be conveniently fixed by using the fixed cylinder, the third threaded rod, the telescopic sleeve, the splint and the handwheel in combination.

[0013] Preferably, two positioning rods are fixedly connected to one side of the partition, and the two positioning rods slide through the corresponding L-shaped connecting blocks respectively. The L-shaped connecting blocks can be limited by the arranged positioning rods, so that their movement is smoother.

[0014] Preferably, a sliding groove is provided on the inner wall of the fixed cylinder, and a clamping rod is fixedly connected to the outer wall of the telescopic sleeve. One end of the clamping rod slides and extends into the sliding groove. The telescopic sleeve can be conveniently limited by using the provided sliding groove and the clamping rod, making its movement smoother and preventing it from moving too far. Beneficial Effects

[0015] The utility model provides an APO long-distance semiconductor inspection microscope. Compared with the prior art, it has the following beneficial effects:

[0016] (1) The APO long-distance semiconductor inspection microscope can adjust the position of the placement plate through the adjustment mechanism, thereby enabling the semiconductor material placed above it to be fine-tuned, thereby facilitating the operator to perform full-range inspection of the semiconductor material, and achieving better inspection results.

[0017] (2) The APO long-distance semiconductor inspection microscope can conveniently fix the placement plate firmly in the placement ring by setting four movable clamps, thereby preventing the placement plate from shaking and affecting the inspection, and achieving better use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional diagram of the external structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the internal cross-sectional structure of the regulating box of the utility model;

[0020] Figure 3 It is a schematic diagram of the relevant structure of the movable plate in the utility model;

[0021] Figure 4 It is a relevant assembly drawing of the storage ring and the storage tray in the utility model.

[0022] In the figure: 1. Microscope body; 2. Controller; 3. C-shaped bracket; 4. Moving plate; 5. Placing ring; 6. Placing tray; 7. Adjusting box; 8. Partition board; 9. First threaded rod; 10. L-shaped connecting block; 11. Support plate; 12. Synchronous pulley; 13. Synchronous belt; 14. Driven gear; 15. First motor; 16. Driving gear; 17. Moving groove; 18. Side plate; 19. Second motor; 20. Second threaded rod; 21. Slide bar; 22. Limiting plate; 23. Fixed cylinder; 24. Third threaded rod; 25. Telescopic sleeve; 26. Clamping plate; 27. Handwheel; 28. Positioning rod; 29. Chute; 30. Clamping rod. Detailed implementation mode

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0024] Please refer to Figure 1 and Figure 2 , an APO long-distance semiconductor inspection microscope, including a microscope body 1, the microscope body 1 is an APO long-distance semiconductor inspection microscope with the model MT40L, a controller 2 is arranged on the microscope body 1, the controller 2 is connected to a background computer, a C-shaped bracket 3 is arranged on the microscope body 1, a moving plate 4 is slidably arranged in the C-shaped bracket 3, a placing ring 5 is fixedly connected to the top of the moving plate 4, a placing tray 6 is arranged on the placing ring 5, and an adjusting mechanism is arranged on the microscope body 1;

[0025] The adjusting mechanism includes an adjusting box 7 fixedly connected to the microscope body 1, a partition board 8 is fixedly connected in the adjusting box 7, two first threaded rods 9 are rotatably penetrated through the partition board 8, L-shaped connecting blocks 10 are threadedly sleeved on both first threaded rods 9, one side of the L-shaped connecting block 10 slidably extends outside the adjusting box 7, and the same support plate 11 is fixedly connected to one side of the two L-shaped connecting blocks 10, and the top of the support plate 11 is connected to the bottom of the C-shaped bracket 3; Synchronous pulleys 12 are fixedly sleeved on both first threaded rods 9, the same synchronous belt 13 is wound between the two synchronous pulleys 12, a driven gear 14 is fixedly sleeved on the corresponding first threaded rod 9, a first motor 15 is fixedly connected to one side of the partition board 8, a driving gear 16 is fixedly connected to the output shaft of the first motor 15, and the driving gear 16 meshes with the driven gear 14. Embodiment

[0026] Please refer to Figures 1 to 4, on the basis of the first embodiment, this embodiment provides a technical solution: moving grooves 17 are formed in the inner walls on both sides of the U-shaped bracket 3, side plates 18 are fixedly connected to both sides of the moving plate 4, and one sides of the two side plates 18 respectively slide and extend into the corresponding moving grooves 17. A second motor 19 is fixedly connected in the corresponding moving groove 17. A second threaded rod 20 is fixedly connected to the output shaft of the second motor 19, and the second threaded rod 20 threadedly penetrates through the corresponding side plate 18; a sliding rod 21 is fixedly connected in the corresponding moving groove 17, the sliding rod 21 slidably penetrates through the corresponding side plate 18, and a limiting plate 22 is fixedly sleeved on the sliding rod 21. The limiting plate 22 is made of wear-resistant plastic material; four symmetrically distributed fixing cylinders 23 penetrate through the outer wall of the placing ring 5. One end of the fixing cylinder 23 rotatably penetrates through and is connected with a third threaded rod 24. A telescopic sleeve 25 is threadedly sleeved on the third threaded rod 24. One end of the telescopic sleeve 25 slides and extends into the placing ring 5. One end of the telescopic sleeve 25 is fixedly connected with a clamping plate 26. One side of the clamping plate 26 is in contact with the placing plate 6. A handwheel 27 is fixedly connected to one end of the third threaded rod 24; two positioning rods 28 are fixedly connected to one side of the partition plate 8, and the two positioning rods 28 respectively slide and penetrate through the corresponding L-shaped connecting blocks 10; a sliding groove 29 is formed in the inner wall of the fixing cylinder 23, and a clamping rod 30 is fixedly connected to the outer wall of the telescopic sleeve 25. One end of the clamping rod 30 slides and extends into the sliding groove 29.

[0027] At the same time, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0028] Working principle: When in use, only need to place the placing plate 6 containing semiconductor materials into the placing ring 5, and then turn the four handwheels 27 in sequence. The handwheel 27 drives the telescopic sleeve 25 threadedly connected thereto to move through the third threaded rod 24. The telescopic sleeve 25 drives the clamping plate 26 to move until it abuts against the placing plates 6 of different sizes. Then it can be detected. When adjustment is needed, only need to start the first motor 15. The first motor 15 drives the driven gear 14 meshed therewith to rotate through the driving gear 16. The driven gear 14 drives the connected first threaded rod 9 to rotate. The first threaded rod 9 drives the other first threaded rod 9 to rotate through the synchronous pulley 12 and the synchronous belt 13. At this time, the two first threaded rods 9 rotate synchronously. The first threaded rod 9 drives the L-shaped connecting block 10 threadedly connected thereto to move, so that the U-shaped bracket 3 moves horizontally, which is convenient for horizontally adjusting the position of the placing plate 6. At the same time, the second motor 19 can be started. The second motor 19 drives the side plate 18 threadedly connected thereto to move through the second threaded rod 20. The side plate 18 drives the moving plate 4 to move longitudinally, which is convenient for longitudinally adjusting the position of the placing plate 6 and is convenient for detecting semiconductor materials.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] In the description of this article, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, a mechanical connection, an electrical connection, a direct connection, or a connection through an intermediate medium, or the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An APO long-distance semiconductor inspection microscope, comprising a microscope body (1), characterized in that: A controller (2) is provided on the microscope body (1). A U-shaped bracket (3) is provided on the microscope body (1). A moving plate (4) is slidably arranged in the U-shaped bracket (3). A placing ring (5) is fixedly connected to the top of the moving plate (4). A placing tray (6) is arranged on the placing ring (5). An adjusting mechanism is provided on the microscope body (1). The adjusting mechanism includes an adjusting box (7) fixedly connected to the microscope body (1). A partition plate (8) is fixedly connected in the adjusting box (7). Two first threaded rods (9) are rotatably and penetratingly connected through the partition plate (8). L-shaped connecting blocks (10) are threadedly sleeved on both of the first threaded rods (9). One side of each L-shaped connecting block (10) slidably extends outside the adjusting box (7). One sides of the two L-shaped connecting blocks (10) are fixedly connected to the same supporting plate (11). The top of the supporting plate (11) is connected to the bottom of the U-shaped bracket (3).

2. The APO long-distance semiconductor inspection microscope according to claim 1, characterized in that: Synchronous wheels (12) are fixedly sleeved on both of the first threaded rods (9). A same synchronous belt (13) is wound between the two synchronous wheels (12). Driven gears (14) are fixedly sleeved on the corresponding first threaded rods (9). A first motor (15) is fixedly connected to one side of the partition plate (8). A driving gear (16) is fixedly connected to the output shaft of the first motor (15). The driving gear (16) meshes with the driven gear (14).

3. The APO long-distance semiconductor inspection microscope according to claim 2, characterized in that: Moving grooves (17) are formed in the inner walls of both sides of the U-shaped bracket (3). Side plates (18) are fixedly connected to both sides of the moving plate (4). One sides of the two side plates (18) respectively slidably extend into the corresponding moving grooves (17). A second motor (19) is fixedly connected in the corresponding moving groove (17). A second threaded rod (20) is fixedly connected to the output shaft of the second motor (19). The second threaded rod (20) threadedly penetrates through the corresponding side plate (18).

4. The APO long-distance semiconductor inspection microscope according to claim 3, characterized in that: A sliding rod (21) is fixedly connected in the corresponding moving groove (17). The sliding rod (21) slidably penetrates through the corresponding side plate (18). A limiting plate (22) is fixedly sleeved on the sliding rod (21).

5. The APO long-distance semiconductor inspection microscope according to claim 1, characterized in that: Four symmetrically distributed fixed cylinders (23) penetrate through the outer wall of the placing ring (5). A third threaded rod (24) is rotatably and penetratingly connected to one end of the fixed cylinder (23). A telescopic sleeve (25) is threadedly sleeved on the third threaded rod (24). One end of the telescopic sleeve (25) slidably extends into the placing ring (5). One end of the telescopic sleeve (25) is fixedly connected to a clamping plate (26). One side of the clamping plate (26) is in contact with the placing tray (6). A hand wheel (27) is fixedly connected to one end of the third threaded rod (24).

6. The APO long-distance semiconductor inspection microscope according to claim 1, characterized in that: Two positioning rods (28) are fixedly connected to one side of the partition plate (8). The two positioning rods (28) respectively slidably penetrate through the corresponding L-shaped connecting blocks (10).

7. The APO long-distance semiconductor inspection microscope according to claim 5, characterized in that: The inner wall of the fixed cylinder (23) is provided with a sliding groove (29), and the outer wall of the telescopic sleeve (25) is fixedly connected with a clamping rod (30), and one end of the clamping rod (30) slides and extends into the sliding groove (29).

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