Resistor disc with high through-flow charge transfer capability

Abstract

The utility model relates to the technical field of lightning arrester electronic accessories, in particular to a resistor disc with high through-flow charge transfer capacity, which comprises a stackable square resistor disc, the stackable square resistor disc comprises an aluminum oxide substrate, a surface electrode, a resistive film, a protective layer and a lead, the two sides of the top of the aluminum oxide substrate are fixedly connected with the bottom of the surface electrode, one side of the surface electrode is welded to the resistive film, the bottom of the protective layer is tightly attached to the top of the resistive film, and the lead is welded and fixed to one side of the surface electrode. Square resistance slurry consistent in length and width is adopted, in order to achieve the high-frequency charge transfer capacity of the device, a copper sheet can serve as a connecting line of the two square resistance slurry in the manufacturing process, the welding length is reserved to guarantee equal-interval welding, the thickness of the square resistance slurry is increased, the square resistance slurry and a surface electrode are sintered, then low-resistance slurry is achieved, and the high-frequency charge transfer capacity of the device is achieved. And the charge transfer capability of the device is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic accessories for lightning arresters, and in particular to a resistor with high current-carrying and charge-transferring capabilities. Background Art

[0002] At present, chip resistors are widely used in lightning arresters, computers, mobile phones, electronic dictionaries, medical electronic products, camcorders, electronic electricity meters and other fields due to their small size, light weight, adaptability to reflow soldering and wave soldering, stable electrical properties, high reliability, low assembly cost, and high mechanical strength.

[0003] After searching, the announcement number: CN214099297U announced a resistor with high current transfer charge capability, and the limit plates and connecting columns are used to prevent the water-cooling pipe from being squeezed by the vibration reduction device. Specifically, two limit plates are set at the upper and lower ends of the resistor, and the limit plates are fixed to the resistor through multiple connecting columns. The water-cooling pipe is located between the two limit plates, and the two vibration reduction devices are set outside the two limit plates. By setting two limit plates, the water-cooling pipe is prevented from being squeezed by the vibration reduction device. Four connecting columns are fixed at the four corners of each limit plate, and the four connecting columns are fixed to the resistor to support the connecting columns.

[0004] With respect to the above-mentioned related technologies, the inventor believes that there are the following technical defects that need to be improved:

[0005] Generally, resistors are soldered on circuit boards, and their stability is inherently high. However, the two limit plates are fixed to the resistors, and their surfaces will press down on a portion of the resistor's electrodes, thereby weakening the resistor's regulating circuit performance and reducing its practicality. Utility Model Content

[0006] The present application provides a resistor with high current transfer charge capability to improve the following technical problems:

[0007] Common resistors are soldered on circuit boards, and their stability is inherently high. However, the two limit plates are fixed to the resistor, and their surfaces will press on part of the resistor's electrodes, thereby weakening the resistor's regulation circuit performance and reducing its practicality.

[0008] The present application provides a resistor with high current transfer charge capability, which adopts the following technical solution:

[0009] A resistor with high current transfer charge capability comprises a stackable square resistor, the stackable square resistor comprises an aluminum oxide substrate, a surface electrode, a resistor film, a protective layer and a lead, the top two sides of the aluminum oxide substrate are fixedly connected to the bottom of the surface electrode, one side of the surface electrode is welded to the resistor film, the bottom of the protective layer is tightly fitted to the top of the resistor film, and the lead is welded and fixed to one side of the surface electrode.

[0010] In an achievable technical solution of the present application, the resistor film includes a square resistor paste and a copper sheet, the square resistor paste is fixedly connected to the top of the alumina substrate, and the copper sheet is welded to one side of the square resistor paste by a soldering iron.

[0011] In a feasible technical solution of the present application, a resistor screen printing is also provided on the outer side of the surface electrode.

[0012] In an achievable technical solution of the present application, the interior of the protective layer is filled with a metal covering layer, and the metal covering layer is made of stainless steel.

[0013] In a feasible technical solution of the present application, the square resistor slurry is a precious metal rear film resistor slurry, and the thickness of the square resistor slurry is 10 to 20 μm.

[0014] In a feasible technical solution of the present application, the square resist slurry is provided in a plurality of groups, and the plurality of groups of the square resist slurry are arranged at equal intervals on opposite sides of the surface electrode.

[0015] In summary, the present application includes at least one of the following beneficial technical effects:

[0016] 1. The substrate of this device is made of alumina, a ceramic material, which provides relatively good thermal conductivity and mechanical strength of the resistor. Then, two surface electrodes are printed on both sides of the alumina substrate, and the lead is welded on one side of the surface electrode. Electrodes are formed by nickel plating and tin plating, and resistor silk screens are printed on both sides to complete the production of the chip resistor. According to the formula R=ρL / WH, different slurry components are matched with resistor films of different lengths, widths and thicknesses to achieve resistors of different resistance values. Therefore, this product uses square resistance slurry with the same length and width. In order to achieve the high-frequency charge transfer capability of this device, copper sheets can be used as connecting wires of two square resistance slurries during production, and the welding length is reserved to ensure equal spacing welding. By padding the thickness of the square resistance slurry and sintering it with the surface electrode, a low resistance slurry is achieved, thereby improving the charge transfer capability of this device.

[0017] 2. The square resistor paste in this product is made of precious metals such as silver, palladium, and ruthenium to make low-resistance precious metal paste, so that the stackable square resistor can reduce the total circuit resistance to a certain extent when in use, extend the service life of the component and stabilize the voltage; on the other hand, the protective film of this product is a metal covering layer. It can protect the resistor film from chemical corrosion and physical damage, and the stainless steel covering layer can provide the publicized anti-corrosion performance, thereby extending the service life of this product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a schematic diagram of the structure of a resistor with high current transfer charge capability according to an embodiment of the present application.

[0020] Figure 2 It is a distribution diagram of the protective layer of the embodiment of the present application.

[0021] Figure 3 This is a diagram showing the superposition effect of the resistance film in the embodiment of the present application.

[0022] Figure 4 It is a cross-sectional view of the protective layer of the embodiment of the present application.

[0023] Description of reference numerals:

[0024] 1. Stackable square resistor; 2. Resistor screen printing; 3. Metal covering layer; 11. Alumina substrate; 12. Surface electrode; 13. Resistor film; 14. Protective layer; 15. Lead; 131. Square resistor slurry; 132. Copper sheet. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] The following is combined with Figure 1-4 This application is described in further detail.

[0030] The present application embodiment discloses a resistor having a high current transfer charge capability. Figures 1 to 4 The resistor with high current transfer charge capability includes a stackable square resistor 1, which includes an aluminum oxide substrate 11, a surface electrode 12, a resistor film 13, a protective layer 14 and a lead 15. The top two sides of the aluminum oxide substrate 11 are fixedly connected to the bottom of the surface electrode 12, one side of the surface electrode 12 is welded to the resistor film 13, the bottom of the protective layer 14 is tightly fitted with the top of the resistor film 13, and the lead 15 is welded and fixed to one side of the surface electrode 12.

[0031] The resistor film 13 includes a square resistor paste 131 and a copper sheet 132 . The square resistor paste 131 is fixedly connected to the top of the alumina substrate 11 , and the copper sheet 132 is welded to one side of the square resistor paste 131 by a soldering iron.

[0032] A resistor screen 2 is also provided on the outer side of the surface electrode 12 .

[0033] The interior of the protective layer 14 is filled with a metal covering layer 3 , and the metal covering layer 3 is made of stainless steel.

[0034] The square resistor paste 131 is a noble metal rear film resistor paste, and the thickness of the square resistor paste 131 is 10-20 μm.

[0035] The square resist slurry 131 is provided in a plurality of groups, and the plurality of groups of square resist slurry 131 are arranged at equal intervals on opposite sides of the surface electrode 12 .

[0036] The use process of the resistor with high current transfer charge capability in the embodiment of the present application is roughly as follows:

[0037] The two surface electrodes 12 are printed on both sides of the alumina substrate 11 respectively, and the lead 15 is welded on one side of the surface electrode 12. This product uses a square resistor paste 131 with the same length and width. In order to achieve the high-frequency charge transfer capability of the device, the copper sheet 132 can be used as the connecting line of the two square resistor pastes 131 during the production, and the welding length is reserved to ensure equal spacing welding. The thickness of the square resistor paste 131 is increased and sintered with the surface electrode 12 to achieve a low resistance paste. Electrodes are formed by nickel plating and tin plating, and resistor silk screen 2 is printed on both sides to complete the production of the chip resistor. The metal covering layer 3 can protect the resistor film 13 from chemical corrosion and physical damage, and the stainless steel covering layer can provide the announced corrosion resistance, thereby improving the service life of this product.

[0038] The beneficial technical effects of the resistor with high current transfer charge capability of the embodiment of the present application are roughly as follows:

[0039] The substrate of the device is made of alumina, a ceramic material, which provides good thermal conductivity and mechanical strength for the resistor. Then, two surface electrodes 12 are printed on both sides of the alumina substrate 11, and the lead 15 is welded on one side of the surface electrode 12. Electrodes are formed by nickel plating and tin plating, and resistor silk screen 2 is printed on both sides to complete the production of the chip resistor. According to the formula R=ρL / WH, different slurry components are matched with resistor films 13 of different lengths, widths and thicknesses to achieve resistors of different resistance values. Therefore, this product uses square resistor slurry 131 with the same length and width. In order to achieve the high-frequency conversion of this device, In order to improve the charge transfer capability of the device, the copper sheet 132 can be used as the connecting line of the two square resistor pastes 131 during production, and the welding length is reserved to ensure equal spacing welding. By increasing the thickness of the square resistor paste 131 and sintering it with the surface electrode 12, a low resistance paste is realized, thereby improving the charge transfer capability of the device; the square resistor paste 131 is used to make a low resistance precious metal paste through precious metals such as silver, palladium, and ruthenium, so that the stackable square resistor sheet 1 can reduce the total circuit resistance to a certain extent when in use, prolong the service life of the component and stabilize the voltage; on the other hand, the protective film of this product is a metal covering layer 3. It can protect the resistor film 13 from chemical corrosion and physical damage, and the stainless steel covering layer can provide the publicized corrosion resistance, thereby improving the service life of this product.

[0040] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the application should be included in the protection scope of the present application.

Claims

1. A resistor having high current transfer charge capability, characterized in that: The invention comprises a stackable square resistor (1), wherein the stackable square resistor (1) comprises an aluminum oxide substrate (11), a surface electrode (12), a resistor film (13), a protective layer (14) and a lead wire (15), wherein the top two sides of the aluminum oxide substrate (11) are fixedly connected to the bottom of the surface electrode (12), one side of the surface electrode (12) is welded to the resistor film (13), the bottom of the protective layer (14) is tightly fitted to the top of the resistor film (13), and the lead wire (15) is welded and fixed to one side of the surface electrode (12).

2. The resistor with high current transfer capability according to claim 1, characterized in that: The resistor film (13) comprises a square resistor paste (131) and a copper sheet (132); the square resistor paste (131) is fixedly connected to the top of the alumina substrate (11); and the copper sheet (132) is welded to one side of the square resistor paste (131) by a soldering iron.

3. The resistor with high current transfer capability according to claim 1, characterized in that: A resistor screen (2) is also provided on the outer side of the surface electrode (12).

4. The resistor with high current transfer capability according to claim 1, characterized in that: The interior of the protective layer (14) is filled with a metal covering layer (3), and the metal covering layer (3) is made of stainless steel.

5. The resistor with high current transfer capability according to claim 2, characterized in that: The square resistor slurry (131) is a noble metal rear film resistor slurry, and the thickness of the square resistor slurry (131) is 10 to 20 μm.

6. The resistor with high current transfer capability according to claim 5, characterized in that: The square resist slurry (131) is provided in a plurality of groups, and the plurality of groups of square resist slurry (131) are arranged at equal intervals on opposite sides of the surface electrode (12).

Images