Wet etching machine

Abstract

The utility model discloses a wet etching machine which comprises an etching cavity, a roller group, an upper spraying device and a lower spraying device, the roller group, the upper spraying device and the lower spraying device are arranged in the etching cavity, and the upper spraying device and the lower spraying device are oppositely arranged on the upper side and the lower side of the roller group; wherein the roller group is used for driving a substrate to be etched to be conveyed along a first horizontal direction; the top of the etching cavity is provided with a high-position point area and a low-position point area, the orthographic projection of the low-position point area on the horizontal plane is located outside the side edge of the substrate to be etched in the second horizontal direction, and the high-position point area and the low-position point area are connected through a flow guide slope; the first horizontal direction is perpendicular to the second horizontal direction. The wet etching machine can prevent the etching liquid gathered at the top of the etching cavity from dropping on the substrate to be etched.

Description

Technical Field

[0001] The utility model relates to etching equipment, in particular to a wet etching machine. Background Art

[0002] Microcircuits such as TFT-LCD are formed on a substrate with a conductive metal film such as aluminum, aluminum alloy, copper and copper alloy, or an insulating film such as silicon dioxide film, silicon nitride film, etc., and then photoresist is evenly coated on the surface. The photoresist is exposed and developed through a mask with a corresponding pattern to form the desired pattern. Next, wet or dry etching is used to etch away the metal or non-metal film not covered by the photoresist. Finally, the unnecessary photoresist is removed, and a series of photolithography processes are performed to complete the desired circuit.

[0003] For example, a Chinese patent with patent number CN201810802738.8 discloses a wet etcher, comprising: an etching chamber, wherein a plurality of rollers are arranged in the etching chamber, wherein the rollers are used to carry a substrate to be etched and drive the substrate to move by rotation; a first spray device, arranged in the etching chamber opposite to the rollers, and used to spray etching liquid onto the surface of the substrate so that a thin film layer on the surface of the substrate forms a preset pattern; a second spray device, arranged at the etching outlet of the etching chamber, and used to spray a cleaning liquid onto the etching outlet to dissolve the etching liquid attached to the etching outlet; a baffle, arranged between the first spray device and the second spray device and close to the etching outlet, and used to shield the cleaning liquid from being sprayed into the etching liquid on one side of the first spray device; wherein the second spray device is respectively located inside and outside the etching chamber, and used to spray the cleaning liquid onto the etching outlet from both inside and outside the etching chamber.

[0004] However, the top of the etching chamber of the existing wet etcher is in a horizontal state. During the continuous movement of the substrate, when there is no substrate above the lower spray device, the etching liquid sprayed by the lower spray device will gather on the top of the etching chamber. When the etching liquid on the top of the etching chamber gathers from small droplets into large droplets, it will drip back onto the substrate. The etching liquid dripping from the top of the etching chamber and the etching liquid sprayed by the upper spray device will jointly etch the upper surface of the substrate, thereby affecting the etching accuracy and etching uniformity of the upper surface of the substrate, resulting in quality problems such as discoloration of the etched circuit. Utility Model Content

[0005] In order to solve the above-mentioned deficiencies in the prior art, the utility model provides a wet etcher, which can prevent the etching liquid gathered on the top of the etching chamber from dripping onto the substrate to be etched.

[0006] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0007] A wet etching machine comprises an etching chamber and a roller group, an upper spray device and a lower spray device arranged in the etching chamber, wherein the upper spray device and the lower spray device are arranged on the upper and lower sides of the roller group relatively; wherein:

[0008] The roller group is used to drive the substrate to be etched to be transported along a first horizontal direction;

[0009] The top of the etching chamber has a high site area and a low site area, the orthographic projection of the low site area on the horizontal plane is located outside the side of the substrate to be etched in the second horizontal direction, and the high site area and the low site area are connected by a guide slope;

[0010] The first horizontal direction is perpendicular to the second horizontal direction.

[0011] Furthermore, the low point region is located on an edge of the top of the etching cavity in the second horizontal direction.

[0012] Furthermore, the number of the low point area is one, and its orthographic projection on the horizontal plane is located outside one side edge of the substrate to be etched in the second horizontal direction; the orthographic projection of the high point area on the horizontal plane is located outside the other side edge of the substrate to be etched in the second horizontal direction, and is arranged opposite to the low point area.

[0013] Further, the low site area is located on one side edge of the top of the etching cavity in the second horizontal direction, and the high site area is located on the other side edge of the top of the etching cavity in the second horizontal direction.

[0014] Furthermore, there are two low site areas, and their orthographic projections on the horizontal plane are respectively located outside the two side edges of the substrate to be etched in the second horizontal direction; the high site area is located between the two low site areas, and is connected to the two low site areas through a guide slope.

[0015] Furthermore, the etching chamber further includes a bottom and a side portion, the bottom and the top are arranged opposite to each other in vertical direction, and the side portion is connected between the top and the bottom.

[0016] Furthermore, the etching chamber is provided with an etching inlet on one side in the first horizontal direction, and an etching outlet on the other side in the first horizontal direction; the etching inlet and the etching outlet are respectively aligned with two ends of the roller group.

[0017] Furthermore, a drainage port is provided at the bottom.

[0018] Furthermore, the bottom is provided with a liquid collecting trough, and the liquid discharge port is opened in the liquid collecting trough.

[0019] Furthermore, the upper spray device includes a plurality of upper spray nozzles, the lower spray device includes a plurality of lower spray nozzles, and the upper spray nozzles and the lower spray nozzles are staggered with each other in a first horizontal direction.

[0020] The utility model has the following beneficial effects: the wet etcher of the utility model arranges the high point area and the low point area on the top of the etching chamber, and uses the guide slope to separate the high point area and the low point area. In the process in which the roller group drives the substrate to be etched to be transported in the first horizontal direction, when there is no substrate to be etched above the lower spray device, the etching liquid sprayed by the lower spray device gathers on the top of the etching chamber, flows from the high point area to the low point area along the guide slope, and finally drips from the low point area to the side of the substrate to be etched in the second horizontal direction, thereby finally avoiding the etching liquid gathered on the top of the etching chamber from dripping onto the substrate to be etched. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of the wet etcher provided by the utility model in the first horizontal direction.

[0022] Figure 2 This is a schematic structural diagram of the wet etcher provided by the utility model in the second horizontal direction.

[0023] Figure 3 This is a schematic structural diagram of another wet etching machine provided by the utility model in the second horizontal direction. DETAILED DESCRIPTION

[0024] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0025] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Embodiment 1

[0028] like Figure 1-3 As shown, a wet etching machine comprises an etching chamber 1 and a roller group 2, an upper spray device 3 and a lower spray device 4 arranged in the etching chamber 1, wherein the upper spray device 3 and the lower spray device 4 are arranged on the upper and lower sides of the roller group 2 relatively; wherein,

[0029] The roller group 2 is used to drive the substrate 6 to be etched to be transported along the first horizontal direction X;

[0030] The upper spray device 3 is used to spray etching liquid onto the upper surface of the substrate 6 to be etched;

[0031] The lower spray device 4 is used to spray etching liquid onto the lower surface of the substrate 6 to be etched;

[0032] The top 11 of the etching chamber 1 has a high site area 111 and a low site area 112, the orthographic projection of the low site area 112 on the horizontal plane is located outside the side of the substrate 6 to be etched in the second horizontal direction Y, and the high site area 111 and the low site area 112 are connected by a guide slope 113;

[0033] The first horizontal direction X is perpendicular to the second horizontal direction Y.

[0034] The wet etcher of the utility model arranges the high site area 111 and the low site area 112 on the top 11 of the etching chamber 1, and uses the guide slope 113 to separate the high site area 111 and the low site area 112. In the process of the roller group 2 driving the substrate 6 to be etched to be transported in the first horizontal direction X, when there is no substrate 6 to be etched above the lower spray device 4, the etching liquid sprayed by the lower spray device 4 gathers on the top 11 of the etching chamber 1, and flows from the high site area 111 to the low site area 112 along the guide slope 113, and finally drips from the low site area 112 to the side of the substrate 6 to be etched in the second horizontal direction Y, thereby finally preventing the etching liquid gathered on the top 11 of the etching chamber 1 from dripping on the substrate 6 to be etched.

[0035] The etching chamber 1 further includes a bottom 12 and a side 13 . The bottom 12 is disposed vertically opposite to the top 11 , and the side 13 is connected between the top 11 and the bottom 12 .

[0036] Generally speaking, there are four side portions 13, which are respectively arranged on both sides of the etching chamber 1 along the first horizontal direction X and the two sides along the second horizontal direction Y, so as to connect the top 11 and the bottom 12 from four sides of the first horizontal direction X and the second horizontal direction Y, so as to enclose the space between the top 11 and the bottom 12. Of course, the number of the side portions 13 of the etching chamber 1 can also change according to the shape of the etching chamber 1, but the number of the side portions 13 of the etching chamber 1 should be at least four, which are respectively arranged on both sides of the etching chamber 1 along the first horizontal direction X and the two sides along the second horizontal direction Y.

[0037] The roller assembly 2 , the upper spray device 3 and the lower spray device 4 are arranged in a space enclosed by the top 11 , the bottom 12 and the side 13 of the etching chamber 1 .

[0038] Preferably, the low point area 112 is located on the edge of the top 11 of the etching chamber 1 in the second horizontal direction Y, so that the etching liquid gathered at the top 11 of the etching chamber 1 can flow through the low point area 112 along the side 13 of the etching chamber 1 in the second horizontal direction Y to the bottom 12 of the etching chamber 1.

[0039] The roller assembly 2 includes a plurality of conveying rollers 21 , and each of the conveying rollers 21 is sequentially arranged along a first horizontal direction X in the etching chamber 1 .

[0040] The upper spray device 3 includes an upper spray pipe 32, an upper liquid inlet pipe 33 and a plurality of upper spray nozzles 31. The upper spray pipe 32 is arranged above the roller group 2 in the etching chamber 1, and its axial direction is parallel to the first horizontal direction X; the plurality of upper spray nozzles 31 are arranged in sequence along the axial direction of the upper spray pipe 32 on the side wall of the upper spray pipe 32 facing the roller group 2; one end of the upper liquid inlet pipe 33 is connected to the upper spray pipe 32, and the other end passes through the top 11 of the etching chamber 1 and is connected to the external liquid supply device to obtain etching liquid from the liquid supply device.

[0041] The lower spray device 4 includes a lower spray pipe 42, a lower liquid inlet pipe 43 and a plurality of lower spray nozzles 41. The lower spray pipe 42 is arranged below the roller group 2 in the etching chamber 1, and its axial direction is parallel to the first horizontal direction X; the plurality of lower spray nozzles 41 are arranged in sequence along the axial direction of the lower spray pipe 42 on the side wall of the lower spray pipe 42 facing the roller group 2; one end of the lower liquid inlet pipe 43 is connected to the lower spray pipe 42, and the other end passes through the bottom 12 of the etching chamber 1 and is connected to an external liquid supply device to obtain etching liquid from the liquid supply device.

[0042] Preferably, the upper spray nozzle 31 and the lower spray nozzle 41 are staggered with each other in the first horizontal direction X.

[0043] The etching chamber 1 has an etching inlet 14 on one side 13 in the first horizontal direction X, and an etching outlet 15 on the other side 13 in the first horizontal direction X; the etching inlet 14 and the etching outlet 15 are aligned with two ends of the roller assembly 2 respectively.

[0044] The substrate 6 to be etched enters the etching chamber 1 through the etching inlet 14 and is sent to the roller group 2. The substrate 6 is driven by the roller group 2 to be transported along the first horizontal direction X so as to be sprayed with etching liquid on its upper and lower surfaces respectively through the upper spray device 3 and the lower spray device 4, and finally leaves the etching chamber 1 from the etching outlet 15.

[0045] The etching inlet 14 and the etching outlet 15 are distributed on both sides of the etching chamber 1 in the first horizontal direction X, and the low point area 112 of the top 11 of the etching chamber 1 is distributed on one side or both sides of the etching chamber 1 in the second horizontal direction Y. The etching liquid dripping from the low point area 112 does not pass through the etching inlet 14 and the etching outlet 15, which can prevent the substrate 6 to be etched from being stuck to the etching liquid dripping from the top 11 of the etching chamber 1 when entering and leaving the etching chamber 1.

[0046] The bottom 12 is provided with a drain port 16, and the drain port 16 is used to discharge the waste liquid of the etching liquid. Preferably, the bottom 12 is provided with a liquid collecting tank 17, and the drain port 16 is opened in the liquid collecting tank 17. The etching liquid dripping on the bottom 12 of the etching chamber 1 is collected by the liquid collecting tank 17, and then the collected etching liquid is discharged from the etching chamber 1 through the drain port 16, which can speed up the drainage speed of the etching liquid. Embodiment 2

[0047] As a specific implementation scheme of the first embodiment, in this embodiment, Figure 2 As shown, the number of the low point area 112 is one, and its orthographic projection on the horizontal plane is located outside one side edge of the substrate 6 to be etched in the second horizontal direction Y; the orthographic projection of the high point area 111 on the horizontal plane is located outside the other side edge of the substrate 6 to be etched in the second horizontal direction Y, and is arranged opposite to the low point area 112.

[0048] Preferably, the low site area 112 is located on one side edge of the top 11 of the etching chamber 1 in the second horizontal direction Y, and the high site area 111 is located on the other side edge of the top 11 of the etching chamber 1 in the second horizontal direction Y, so that the diversion slope 113 gathered at the top 11 of the etching chamber 1 can divert as much etching liquid as possible to the low site area 112. Embodiment 3

[0049] As another specific implementation scheme of the first embodiment, in this embodiment, Figure 3 As shown, there are two low site areas 112, and their orthographic projections on the horizontal plane are respectively located outside the two side edges of the substrate 6 to be etched in the second horizontal direction Y; the high site area 111 is located between the two low site areas, and is connected to the two low site areas 112 through a guide slope 113.

[0050] Preferably, the two low point areas 112 are respectively located on the two side edges of the top 11 of the etching chamber 1 in the second horizontal direction Y, so that the etching liquid gathered on the top 11 of the etching chamber 1 can drip from the low point areas 112 on both sides of the second horizontal direction Y to the bottom 12 of the etching chamber 1.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A wet etching machine, comprising an etching chamber and a roller group, an upper spray device and a lower spray device arranged in the etching chamber, wherein the upper spray device and the lower spray device are arranged on the upper and lower sides of the roller group; characterized in that: The roller group is used to drive the substrate to be etched to be transported along a first horizontal direction; The top of the etching chamber has a high site area and a low site area, the orthographic projection of the low site area on the horizontal plane is located outside the side of the substrate to be etched in the second horizontal direction, and the high site area and the low site area are connected by a guide slope; The first horizontal direction is perpendicular to the second horizontal direction.

2. The wet etching machine according to claim 1, characterized in that: The low point region is located on the edge of the top of the etching cavity in the second horizontal direction.

3. The wet etching machine according to claim 1 or 2, characterized in that: The number of the low point area is one, and its orthographic projection on the horizontal plane is located outside one side edge of the substrate to be etched in the second horizontal direction; the orthographic projection of the high point area on the horizontal plane is located outside the other side edge of the substrate to be etched in the second horizontal direction, and is arranged opposite to the low point area.

4. The wet etching machine according to claim 3, characterized in that: The low site area is located on one side edge of the top of the etching cavity in the second horizontal direction, and the high site area is located on the other side edge of the top of the etching cavity in the second horizontal direction.

5. The wet etching machine according to claim 1 or 2, characterized in that: There are two low site areas, and their orthographic projections on the horizontal plane are respectively located outside the two side edges of the substrate to be etched in the second horizontal direction; the high site area is located between the two low site areas, and is connected to the two low site areas through a guide slope.

6. The wet etching machine according to claim 1, characterized in that: The etching chamber further comprises a bottom and a side portion, wherein the bottom is arranged opposite to the top portion in vertical direction, and the side portion is connected between the top portion and the bottom portion.

7. The wet etching machine according to claim 6, characterized in that: The etching chamber is provided with an etching inlet on one side in the first horizontal direction, and an etching outlet on the other side in the first horizontal direction; the etching inlet and the etching outlet are respectively aligned with two ends of the roller group.

8. The wet etching machine according to claim 6, characterized in that: The bottom is provided with a liquid discharge port.

9. The wet etching machine according to claim 8, characterized in that: The bottom is provided with a liquid collecting trough, and the liquid discharge port is opened in the liquid collecting trough.

10. The wet etching machine according to claim 1, characterized in that: The upper spray device includes a plurality of upper spray nozzles, and the lower spray device includes a plurality of lower spray nozzles. The upper spray nozzles and the lower spray nozzles are staggered with each other in a first horizontal direction.

Images