Semiconductor chilling plate for ion beam etching cooling

Abstract

The utility model relates to the technical field of ion beam etching, and provides a semiconductor chilling plate for ion beam etching cooling, which comprises two groups of chilling plates, and is characterized by further comprising a refrigeration box, a workbench, a partition plate, a heat dissipation mechanism, a diffusion mechanism and a buffer mechanism, the working table is fixedly connected into the refrigeration box, a heat dissipation groove and an air outlet groove are formed in the working table, the partition plate is fixedly connected into the refrigeration box, two through holes are formed in the partition plate, the two sets of refrigeration pieces are arranged at the two through holes respectively, and the heat dissipation mechanism is arranged between the partition plate and the working table. The problems that in the prior art, due to the fact that the positions of existing refrigeration pieces are mostly fixed, cold air emitted by the refrigeration pieces is difficult to make complete contact with a substrate, the heat dissipation effect of the substrate is poor, and the etching effect of the substrate is easily affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of ion beam etching, in particular to a semiconductor refrigeration sheet used for ion beam etching cooling. Background Art

[0002] Ion beam etching uses the principle of glow discharge to decompose argon gas into argon ions. The argon ions are accelerated by the anode electric field to physically bombard the sample surface to achieve the etching effect. The etching process is to fill Ar gas into the ion source discharge chamber and ionize it to form plasma. The ions are then drawn out and accelerated by the grid in beam form. The ion beam with a certain energy enters the studio and is fired at the solid surface to bombard the atoms on the solid surface, causing the material atoms to sputter to achieve the etching purpose. It is pure physical etching.

[0003] When an ion beam etcher etches a substrate, it is easy to generate heat on the substrate. Therefore, a cooling plate is provided on the ion beam etcher to dissipate heat from the substrate. However, the position of existing cooling plates is mostly fixed, and the cold air emitted by the cooling plate is difficult to completely contact the substrate, resulting in poor heat dissipation effect of the substrate, which is easy to affect the etching effect of the substrate. Utility Model Content

[0004] The utility model proposes a semiconductor refrigeration plate for ion beam etching cooling, which solves the problem that the existing refrigeration plates in the prior art are mostly fixed in position, and the cold air emitted by the refrigeration plates is difficult to completely contact the substrate, which leads to poor heat dissipation effect of the substrate, and thus easily affects the etching effect of the substrate.

[0005] The technical solution of the utility model is as follows: a semiconductor refrigeration sheet for ion beam etching cooling, comprising: refrigeration sheets, the refrigeration sheets are provided in two groups, characterized in that it also comprises: a refrigeration box, a workbench, a partition, a heat dissipation mechanism, a diffusion mechanism and a buffer mechanism;

[0006] The refrigeration box is provided with a heat dissipation port and an operation port;

[0007] The workbench is fixedly connected in the refrigeration box, and is provided with a heat dissipation slot and an air outlet slot;

[0008] The partition is fixedly connected in the refrigeration box, and two through holes are provided on the partition, and two groups of refrigeration fins are respectively arranged at the two through holes;

[0009] The heat dissipation mechanism is arranged between the partition plate and the workbench, and is used to conduct heat away from the substrate;

[0010] There are two diffusion mechanisms, and the two diffusion mechanisms are respectively arranged at two through holes;

[0011] The buffer mechanism is arranged in the refrigeration box and is used for buffering the diffused cold air.

[0012] Preferably, the heat dissipation mechanism comprises: a heat dissipation plate, a heat dissipation barrel and a heat dissipation fan;

[0013] There are multiple heat sinks, and the multiple heat sinks are fixedly connected to the heat sink;

[0014] The heat dissipation barrel is fixedly connected between the workbench and the partition;

[0015] The heat dissipation fan is arranged in the heat dissipation barrel, and the output end of the heat dissipation fan faces outside the heat dissipation barrel.

[0016] Furthermore, the diffusion mechanism includes: a rotating frame, an air outlet fan, a lever, a slide frame, a driving frame and a first motor;

[0017] The rotating frame is rotatably connected to the through hole;

[0018] The air outlet fan is arranged in the rotating frame;

[0019] The shifting rod is fixedly connected to the rotating frame;

[0020] The slide is slidably arranged on the lever;

[0021] The driving frame is rotatably connected to the partition plate, and one end of the driving frame is fixedly connected to the slide;

[0022] The first motor is arranged on the partition, and the output end of the first motor is fixedly connected to the driving frame.

[0023] Furthermore, the buffer mechanism includes: a buffer rod, a buffer plate and a driving assembly;

[0024] There are two buffer rods, and both buffer rods are rotatably connected in the refrigeration box;

[0025] The buffer plates are provided with two groups, and the two groups of buffer plates are respectively fixedly connected to the two buffer rods;

[0026] The driving assembly is arranged on the refrigeration box and is used for driving the two buffer rods to rotate.

[0027] As a further solution of the present application, the driving assembly includes: a rotating wheel, a transmission belt and a first motor;

[0028] There are two rotating wheels, which are respectively fixedly connected to the two buffer rods;

[0029] The transmission belt is connected between the two rotating wheels;

[0030] The second motor is arranged on the refrigeration box, and the output end of the second motor passes through the refrigeration box and is fixedly connected to one of the buffer rods.

[0031] As a further solution of the present application, two baffles are provided at the operating port.

[0032] The working principle and beneficial effects of the utility model are:

[0033] 1. In the present invention, heat is conducted into the heat dissipation barrel by means of the heat sink arranged on the heat dissipation slot, and the conducted heat is blown out of the heat dissipation barrel by means of the heat dissipation fan, thereby dissipating the heat spread on the substrate.

[0034] 2. In the utility model, the cold air is dissipated by the refrigeration fins arranged on the partition, and the air is blown to the refrigeration fins by the air blower arranged in the rotating frame. The driving frame and the slide frame are driven by the first motor arranged on the partition to slide on the lever, thereby driving the rotating frame and the air blower to swing at an angle, thereby blowing the cold air evenly into the refrigeration box, so that the substrate is in full contact with the cold air.

[0035] 3. In the utility model, one of the buffer rods is rotated by the second motor provided on the refrigeration box, and the buffer rod drives the buffer plate to rotate when rotating. When one of the buffer rods is rotated, it drives the rotating wheel and the transmission belt to rotate, thereby driving the two buffer rods and the buffer plate to rotate synchronously, thereby buffering the cold air blown into the refrigeration box, and further making the cold air evenly diffused in the refrigeration box.

[0036] 4. In the utility model, the cold air can be brought into uniform contact with the substrate through the cooperation among the refrigeration box, the workbench, the partition, the heat dissipation mechanism, the diffusion mechanism and the buffer mechanism, thereby improving the cooling effect of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0038] Figure 1 It is a schematic diagram of the structure of the utility model in partial section;

[0039] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0040] Figure 3 It is a schematic diagram of the structure of the utility model in cross section;

[0041] Figure 4 It is a structural schematic diagram of the buffer mechanism of the utility model.

[0042] In the figure: 1. Refrigeration plate; 2. Refrigeration box; 3. Workbench; 4. Partition; 5. Heat dissipation plate; 6. Heat dissipation barrel; 7. Heat dissipation fan; 8. Rotating frame; 9. Air outlet fan; 10. Push rod; 11. Slide; 12. Drive frame; 13. First motor; 14. Buffer rod; 15. Buffer plate; 16. Rotating wheel; 17. Transmission belt; 18. Second motor; 19. Baffle. DETAILED DESCRIPTION

[0043] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] like Figure 1 to Figure 4 As shown, this embodiment proposes a semiconductor refrigeration plate 1 for ion beam etching cooling, comprising: a refrigeration plate 1, wherein the refrigeration plate 1 is provided with two groups, characterized in that it also comprises: a refrigeration box 2, a workbench 3, a partition 4, a heat dissipation mechanism, a diffusion mechanism and a buffer mechanism, a heat dissipation port and an operation port are provided on the refrigeration box 2, and two baffles 19 are provided at the operation port, the workbench 3 is fixedly connected in the refrigeration box 2, and a heat dissipation groove and an air outlet groove are provided on the workbench 3, the partition 4 is fixedly connected in the refrigeration box 2, and two through holes are provided on the partition 4, and the two groups of refrigeration plates 1 are respectively arranged at the two through holes, and through the cooperation between the refrigeration box 2, the workbench 3, the partition 4, the heat dissipation mechanism, the diffusion mechanism and the buffer mechanism, the cold air can be evenly contacted with the substrate, thereby improving the cooling effect of the substrate.

[0045] Among them, the heat dissipation mechanism is arranged between the partition 4 and the workbench 3, and is used for exporting the heat of the substrate. The heat dissipation mechanism includes: a heat dissipation plate 5, a heat dissipation barrel 6 and a heat dissipation fan 7. A plurality of heat dissipation plates 5 are provided, and the plurality of heat dissipation plates 5 are fixedly connected at the heat dissipation groove. The heat dissipation barrel 6 is fixedly connected between the workbench 3 and the partition 4. The heat dissipation fan 7 is arranged in the heat dissipation barrel 6, and the output end of the heat dissipation fan 7 faces the outside of the heat dissipation barrel 6. Specifically, the heat is exported to the heat dissipation barrel 6 through the heat sink arranged on the heat dissipation groove, and the exported heat is blown out of the heat dissipation barrel 6 through the heat dissipation fan 7, thereby dissipating the heat spread on the substrate.

[0046] Among them, there are two diffusion mechanisms, which are respectively arranged at two through holes. The diffusion mechanism includes: a rotating frame 8, an air outlet fan 9, a lever 10, a slide 11, a driving frame 12 and a first motor 13. The rotating frame 8 is rotatably connected to the through hole, the air outlet fan 9 is arranged in the rotating frame 8, the lever 10 is fixedly connected to the rotating frame 8, the slide 11 is slidably arranged on the lever 10, the driving frame 12 is rotatably connected to the partition 4, one end of the driving frame 12 is fixedly connected to the slide 11, and the first motor 13 is arranged on the partition. On the plate 4, the output end of the first motor 13 is fixedly connected to the driving frame 12. Specifically, the cold air is dissipated through the refrigeration plate 1 arranged on the partition 4, and the refrigeration plate 1 is blown by the air blower 9 arranged in the rotating frame 8. The driving frame 12 is driven by the first motor 13 arranged on the partition 4 to slide the driving frame 12 and the slide 11 on the lever 10, thereby driving the rotating frame 8 and the air blower 9 to swing at an angle, and then the cold air is evenly blown into the refrigeration box 2, so that the substrate is in full contact with the cold air.

[0047] Among them, the buffer mechanism is arranged in the refrigeration box 2, which is used to buffer the diffused cold air. The buffer mechanism includes: a buffer rod 14, a buffer plate 15 and a driving assembly. There are two buffer rods 14, and the two buffer rods 14 are rotatably connected in the refrigeration box 2. There are two groups of buffer plates 15, and the two groups of buffer plates 15 are respectively fixedly connected to the two buffer rods 14. The driving assembly is arranged on the refrigeration box 2, and is used to drive the two buffer rods 14 to rotate. The driving assembly includes: a rotating wheel 16, a transmission belt 17 and a second motor 18. There are two rotating wheels 16, and the two rotating wheels 16 are respectively fixedly connected to the two buffer rods 14. The transmission belt 17 is transmission connected between the two rotating wheels 16, the second motor 18 is arranged on the refrigeration box 2, the output end of the second motor 18 passes through the refrigeration box 2 and is fixedly connected to one of the buffer rods 14. Specifically, one of the buffer rods 14 is rotated by the second motor 18 arranged on the refrigeration box 2, and the buffer plate 15 is driven to rotate when the buffer rod 14 rotates. When one of the buffer rods 14 rotates, it drives the rotating wheel 16 and the transmission belt 17 to rotate, thereby driving the two buffer rods 14 and the buffer plate 15 to rotate synchronously, thereby buffering the cold air blown into the refrigeration box 2, and then making the cold air evenly diffuse in the refrigeration box 2.

[0048] In this embodiment, when the substrate is cooled, the heat is conducted to the heat dissipation barrel 6 through the heat dissipation fins arranged on the heat dissipation groove, and the conducted heat is blown out of the heat dissipation barrel 6 through the heat dissipation fan 7, thereby dissipating the heat on the substrate, dissipating the cold air through the cooling fins 1 arranged on the partition 4, and blowing the cooling fins 1 through the blower 9 arranged in the rotating frame 8, and the first motor 13 arranged on the partition 4 drives the driving frame 12 to drive the driving frame 12 and the slide 11 to slide on the lever 10, thereby driving the rotating frame 8 and the blower 9 to drive the rotating frame 8 and the slide 11 to slide on the lever 10. 9 is swung at an angle, and the cold air is evenly blown into the refrigeration box 2, so that the substrate is fully in contact with the cold air, and one of the buffer rods 14 is rotated by the second motor 18 provided on the refrigeration box 2, and the buffer rod 14 drives the buffer plate 15 to rotate when it rotates, and one of the buffer rods 14 drives the rotating wheel 16 and the transmission belt 17 to rotate when it rotates, thereby driving the two buffer rods 14 and the buffer plate 15 to rotate synchronously, so as to buffer the cold air blown into the refrigeration box 2, and then the cold air is evenly diffused in the refrigeration box 2.

[0049] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor refrigeration sheet (1) for ion beam etching cooling, comprising: A refrigeration fin (1), wherein the refrigeration fin (1) is provided with two groups, characterized in that it also comprises: A refrigeration box (2), wherein a heat dissipation port and an operation port are provided on the refrigeration box (2); A workbench (3), the workbench (3) being fixedly connected in the refrigeration box (2), and the workbench (3) being provided with a heat dissipation slot and an air outlet slot; A partition (4), the partition (4) being fixedly connected in the refrigeration box (2), the partition (4) being provided with two through holes, and the two groups of refrigeration fins (1) being respectively arranged at the two through holes; A heat dissipation mechanism, the heat dissipation mechanism being arranged between the partition plate (4) and the workbench (3) and being used for dissipating heat from the substrate; A diffusion mechanism, wherein two diffusion mechanisms are provided, and the two diffusion mechanisms are respectively arranged at the two through holes; A buffer mechanism is arranged in the refrigeration box (2) and is used to buffer the diffused cold air.

2. The semiconductor refrigeration sheet (1) for ion beam etching cooling according to claim 1, characterized in that: The heat dissipation mechanism comprises: A heat sink (5), wherein a plurality of heat sinks (5) are provided, and the plurality of heat sinks (5) are all fixedly connected to the heat sink; A heat dissipation barrel (6), wherein the heat dissipation barrel (6) is fixedly connected between the workbench (3) and the partition plate (4); A heat dissipation fan (7), wherein the heat dissipation fan (7) is arranged in the heat dissipation barrel (6), and an output end of the heat dissipation fan (7) faces outside the heat dissipation barrel (6).

3. The semiconductor refrigeration sheet (1) for ion beam etching cooling according to claim 2, characterized in that: The diffusion mechanism comprises: A rotating frame (8), the rotating frame (8) being rotatably connected to the through hole; An air outlet fan (9), wherein the air outlet fan (9) is arranged in the rotating frame (8); A shifting rod (10), wherein the shifting rod (10) is fixedly connected to the rotating frame (8); A slide (11), wherein the slide (11) is slidably disposed on the lever (10); A driving frame (12), the driving frame (12) being rotatably connected to the partition (4), and one end of the driving frame (12) being fixedly connected to the slide frame (11); A first motor (13), wherein the first motor (13) is arranged on the partition (4), and an output end of the first motor (13) is fixedly connected to the driving frame (12).

4. The semiconductor refrigeration sheet (1) for ion beam etching cooling according to claim 3, characterized in that: The buffer mechanism comprises: A buffer rod (14), wherein two buffer rods (14) are provided, and both of the two buffer rods (14) are rotatably connected in the refrigeration box (2); Buffer plates (15), wherein the buffer plates (15) are provided in two groups, and the two groups of buffer plates (15) are respectively fixedly connected to the two buffer rods (14); A driving assembly is arranged on the refrigeration box (2) and is used to drive two buffer rods (14) to rotate.

5. The semiconductor refrigeration sheet (1) for ion beam etching cooling according to claim 4, characterized in that: The drive assembly comprises: A rotating wheel (16), wherein two rotating wheels (16) are provided, and the two rotating wheels (16) are respectively fixedly connected to the two buffer rods (14); A transmission belt (17), the transmission belt (17) being transmission-connected between the two rotating wheels (16); A second motor (18), wherein the first motor (13) is arranged on the refrigeration box (2), and an output end of the second motor (18) passes through the refrigeration box (2) and is fixedly connected to one of the buffer rods (14).

6. The semiconductor refrigeration sheet (1) for ion beam etching cooling according to claim 5, characterized in that: Two baffles (19) are provided at the operation opening.

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