Flower basket for double-sided corrosion of wafer
Through the design of the flower baskets of the groove and the pore structure, the problems of chip and flower basket adhesion and uneven corrosion of the existing technologies have been solved, and the double -sided sides of the chip are cleaned and corrosion, and the risk of damage to the chip surface is reduced, increasing the corrosion technology stability.
Patent Information
- Application Number
- CN202420256216.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-02
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-02-02
AI Technical Summary
The existing corrosion baskets can easily cause the wafer to stick to the basket during the wafer corrosion process, resulting in uneven corrosion, making it difficult to achieve double-sided cleaning and corrosion, and are difficult to operate, which can easily cause scratches on the surface of the wafer.
Design a flower basket for double -sided corrosive chips, which uses the groove structure to carry chips. Through the hole and side limits, the corrosion liquid circulates evenly, reduce the contact surface of the chip and the flower basket, reduce the risk of adhesion, and via the slope surface through the slope surface Protect the surface of the chip.
The double -sided side cleaning and corrosion of the chip is realized, the risk of damage to the surface of the chip on the surface of the chip is reduced, the stability of the corrosion process is improved, and the work structure is simplified to facilitate the manufacturing.
Smart Images
Figure CN222421919U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of wafer etching, and particularly relates to a flower basket used for double-sided etching of wafers. Background Art
[0002] In the semiconductor etching process, a special etching basket is usually required to support the wafer and place it in the etching solution so that the etching solution reacts with the wafer.
[0003] When using the existing etching basket to etch the wafer, since the wafer is generally thin, the wafer and the etching basket are prone to adhesion, resulting in uneven corrosion on the side of the wafer in contact with the etching basket, and it is impossible to achieve double-sided cleaning and etching of the wafer. The overall cleanliness and etching effect of the wafer are very poor. In addition, when the wafer is transferred into and out of the basket before and after etching and cleaning, it is easy to scratch the surface of the wafer, which has the disadvantages of difficult operation and poor workability. Utility Model Content
[0004] In order to solve the above problems, the utility model provides a flower basket for double-sided etching of wafers, which can realize double-sided cleaning and etching of wafers and reduce the risk of scratches on the wafer surface caused by the cleaning and etching operation.
[0005] The specific technical solutions are as follows:
[0006] A flower basket for double-sided etching of wafers, comprising a flower basket body and side edges surrounding and higher than the flower basket body; the flower basket body is provided with through holes and grooves, and the grooves are adapted to the size of a single wafer.
[0007] In this scheme, the wafer is placed in the groove, the edge of the wafer is set on the upper plane of the flower basket body, and the wafer is suspended through the groove; the flower basket body is immersed in the etching liquid, so that both sides of the wafer are immersed in the liquid, and the wafer is circumferentially limited by the side; after the etching is completed, the flower basket body is taken out, and the etching liquid flows out from the through hole. The design of the groove can not only reduce the contact surface between the wafer and the flower basket to avoid the damage of the wafer when the wafer is placed in the flower basket; at the same time, it can reduce the adhesion with the flower basket, so that the side of the wafer that contacts the flower basket body can be fully cleaned or corroded, and double-sided corrosion can be achieved.
[0008] Furthermore, the groove is arranged at the center of the flower basket body, and the through hole is arranged around the groove.
[0009] Furthermore, the through hole is a circular through hole with a diameter of 2-4 mm.
[0010] Furthermore, a slope is provided on one side of the groove, and the slope surface is not higher than the plane of the flower basket body.
[0011] Furthermore, the groove is a hollow groove, or a plurality of through holes are provided at the bottom of the groove.
[0012] Furthermore, the groove is a rectangular groove.
[0013] Furthermore, the flower basket is made of polytetrafluoroethylene.
[0014] Furthermore, the flower basket also includes a handle connected to the flower basket body.
[0015] Furthermore, the handle is detachably connected to the flower basket body.
[0016] Furthermore, the handle is connected to the flower basket body by threads.
[0017] Compared with the prior art, one or more of the above technical solutions can achieve at least one of the following beneficial effects:
[0018] The flower basket for double-sided etching of wafers of the utility model is designed with grooves to carry the wafers, and limits are set around the flower basket so that etching liquid can flow in the through holes and the grooves, thereby reducing the contact surface between the wafer and the flower basket and reducing the adhesion phenomenon, so that the etching liquid can fully contact with the wafer, and double-sided cleaning and etching of the wafer can be achieved, thereby ensuring the stability of the etching process; and, by setting the slope surface, the risk of scratches on the wafer surface caused by the cleaning and etching operation can be reduced; the tooling structure is simple and easy to manufacture. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of the flower basket used for double-sided etching of wafers in Example 2.
[0021] Figure 2 This is a schematic diagram of the three-dimensional structure of the flower basket body of Example 2.
[0022] Figure 3 This is a schematic diagram of the top view of the flower basket body of Example 2.
[0023] Figure 4 This is a schematic diagram of the cross-sectional structure of the flower basket body of Example 2.
[0024] Figure 5 This is a schematic diagram of the front planar structure of the handle of Example 2.
[0025] In the figure, 1, flower basket body; 2, side; 3, handle; 4, through hole; 5, groove; 6, slope surface; 7, groove bottom; 8, chamfer. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] Example 1
[0028] This embodiment provides a flower basket for double-sided etching of wafers, the flower basket comprising a flower basket body and side edges and a handle surrounding and higher than the flower basket body. The flower basket body is provided with through holes and grooves, and the grooves are adapted to the size of a single wafer.
[0029] The groove is arranged at the center of the flower basket body, and the through hole is arranged around the groove. The handle is connected to the flower basket body. As a preferred embodiment, the handle is detachably connected to the flower basket body. In this embodiment, the handle is connected to the flower basket body by threading. One side of the handle is in the shape of an inverted truncated cone, and the other side is provided with an external thread structure; the flower basket body is provided with an internal thread structure adapted to the handle.
[0030] In this embodiment, the material used for the flower basket is polytetrafluoroethylene, which is acid, alkali and high temperature resistant.
[0031] As a specific implementation, the groove may be a hollow groove.
[0032] The working principle of this embodiment is: placing the wafer in the hollow groove, with the edge of the wafer set on the upper plane of the flower basket body, and the wafer suspended through the hollow groove; immersing the flower basket body in the etching liquid through the handle, so that both sides of the wafer are immersed in the liquid, and the wafer is circumferentially limited by the side; after the etching is completed, the flower basket body is taken out, and the etching liquid flows out from the through hole and the hollow groove; and the wafer is taken out.
[0033] The flower basket for double-sided etching of wafers of this embodiment can realize double-sided cleaning or etching of wafers and reduce the risk of scratches on the wafer surface caused by cleaning or etching operations; and the device is simple, easy to manufacture and low in cost.
[0034] Example 2
[0035] like Figure 1As shown, this embodiment provides a flower basket for double-sided etching wafers, including a flower basket body 1 and a handle 3. The flower basket body 1 is provided with a through hole 4 and a groove 5, the groove 5 is adapted to the size of a single wafer, and the flower basket body 1 is surrounded by a side edge 2 that is higher than the flower basket body.
[0036] like Figures 2 to 4 As shown, the groove 5 is arranged at the center of the basket body 1, and the through holes 4 are evenly arranged around the groove 5. The through holes 4 are circular through holes with a diameter of 2-4 mm.
[0037] One side of the groove 5 is provided with a slope surface 6, which is a rectangular surface with a slope of 30°. The slope surface 6 is not higher than the upper plane of the basket body 1, so as to protect the wafer from being safely put in and taken out.
[0038] like Figure 5 As shown, the handle 3 is connected to the flower basket body 1. As a preferred embodiment, the handle 3 is detachably connected to the flower basket body 1. In this embodiment, the handle 3 is threadedly connected to the flower basket body 1. One side of the handle 3 is in the shape of an inverted truncated cone, and the other side is provided with an external thread structure; the flower basket body 1 is provided with an internal thread structure adapted to the handle 3. The flower basket body and the handle are connected as one body by a threaded structure, and one side of the handle is in the shape of an inverted truncated cone, which can ensure that the operator can manually clean the wafer by pinching the handle with his hand.
[0039] The material used for the flower basket is polytetrafluoroethylene, which is resistant to acid, alkali and high temperature.
[0040] As a preferred embodiment, the groove 5 is a rectangular groove. When placing a wafer, the two short sides of the rectangular groove can be used to support the wafer. The bottom 7 of the groove 5 is evenly provided with through holes.
[0041] Circular chamfers 8 are provided at the four rectangular corners of the rectangular groove. When the flower basket is manufactured, the groove 5 is formed by cutting from the chamfers 8 .
[0042] The working principle of this embodiment is as follows: place the wafer in the groove 5, the edge of the wafer is set on the upper plane of the basket body, and the wafer is suspended through the groove; immerse the basket body in the etching liquid through the handle, so that both sides of the wafer are immersed in the liquid, and the wafer is circumferentially limited by the side 2; after the etching is completed, take out the basket body 1, and the etching liquid flows out from the through hole of the basket body and the through hole of the groove; take out the wafer. The wafer is put in and taken out by using auxiliary tools such as tweezers and shovels to put in and take out the wafer from the slope surface 6.
[0043] The flower basket for double-sided etching of wafers in this embodiment adopts a double-layer structure in which a circular through hole and a groove are provided on the flower basket body, and a through hole is provided on the bottom of the groove. While reducing the contact area between the wafer and the flower basket body to reduce adhesion, it ensures that the etching liquid flows in and out evenly, further improves the uniformity of etching, and reduces the pressure of the solution on the wafer, ensuring that double-sided etching is achieved in the effective area of the wafer; and a slope surface is provided for taking and placing the wafer to avoid damage to the wafer during taking and placing.
[0044] Obviously, the above embodiments are merely examples for clearly illustrating the technical solution of the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection of the claims of the utility model.
Claims
1. A flower basket for double-sided etching of wafers, characterized in that: The flower basket comprises a flower basket body and side edges surrounding and higher than the flower basket body; a through hole and a groove are arranged on the flower basket body, and the groove is adapted to the size of a single wafer.
2. The flower basket for double-sided etching of wafers according to claim 1, characterized in that: The groove is arranged at the center of the flower basket body, and the through hole is arranged around the groove.
3. The flower basket for double-sided etching of wafers according to claim 1, characterized in that: The through hole is a circular through hole with a diameter of 2-4 mm.
4. The flower basket for double-sided etching of wafers according to claim 1, characterized in that: One side of the groove is provided with a slope surface, and the slope surface is not higher than the upper plane of the flower basket body.
5. The flower basket for double-sided etching of wafers according to claim 1, characterized in that: The groove is a hollow groove, or a plurality of through holes are provided at the bottom of the groove.
6. The flower basket for double-sided etching of wafers according to claim 5, characterized in that: The groove is a rectangular groove.
7. The flower basket for double-sided etching of wafers according to claim 1, characterized in that: The material of the flower basket is polytetrafluoroethylene.
8. The flower basket for double-sided etching of wafers according to any one of claims 1 to 7, characterized in that: The flower basket also includes a handle connected to the flower basket body.
9. The flower basket for double-sided etching of wafers according to claim 8, characterized in that: The handle is detachably connected to the flower basket body.
10. The flower basket for double-sided etching of wafers according to claim 9, characterized in that: The handle is connected to the flower basket body by thread.