Wafer bearing table for wafer adsorption

Abstract

The utility model belongs to the technical field of semiconductors, and particularly relates to a wafer bearing table for wafer adsorption, which comprises a table top part and a connecting sleeve part which are connected together, the upper end of the connecting sleeve part is connected with the middle part of the lower surface of the table top part, and a plurality of supporting bosses are convexly arranged on the upper surface of the table top part. The arrangement positions of the supporting bosses correspond to the positions, not provided with small holes, of a wafer to be borne and adsorbed, and vacuum adsorption hole channels are formed in the inner sides of the supporting bosses respectively. According to the utility model, stable and reliable adsorption can be carried out on the part, which is not provided with a small hole, of the wafer to be received and adsorbed, so that the phenomenon that a vacuum pipeline is blocked or corroded due to the fact that photoresist directly enters a vacuum adsorption hole channel from the small hole in the middle of the wafer is avoided; the photoresist which is thrown out along the small hole of the wafer can be effectively prevented from blocking the photoresist vacuum adsorption hole channel; the utility model is also suitable for other wafers whose centers cannot be adsorbed, and has the advantages of simple structure and reliable use.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, in particular to a wafer support table used for wafer adsorption. Background Art

[0002] At present, most of the wafers used in the semiconductor industry are flat wafers with tiny flat grooves or V grooves. However, when applying glue to wafers in special processes, such as when there are many small holes in the middle of the wafer, it is not feasible to use normal vacuum adsorption. Because if the small holes are set close to the vacuum adsorption holes of the conventional wafer stage, the speed of liquid flowing down from the small holes will increase, which will cause the vacuum pipeline connected to the small holes to be blocked or corroded. Utility Model Content

[0003] In view of the problem that there is no dedicated wafer stage for wafers with centrally distributed small holes in the current semiconductor industry, the utility model aims to provide a wafer stage for wafer adsorption.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A wafer support table for wafer adsorption comprises a table portion and a connecting sleeve portion connected together, wherein the lower end of the connecting sleeve portion is used to connect to an external wafer support table connection structure, and the upper end of the connecting sleeve portion is connected to the lower surface of the table portion.

[0006] A plurality of supporting bosses are protruding from the upper surface of the table portion, and the setting position of each supporting boss corresponds to the unopened small hole of the wafer to be received and adsorbed, and a plurality of vacuum adsorption channels are opened on the inner side of each supporting boss, and each of the vacuum adsorption channels has upper and lower openings, and the upper opening of each vacuum adsorption channel is located on the top surface of the corresponding supporting boss, and the lower opening of each vacuum adsorption channel is located on the lower surface of the table portion, and are respectively connected to an external vacuum pumping device.

[0007] A vacuum adsorption channel is respectively opened on the inner side of each of the supporting bosses, and the upper end opening of each of the vacuum adsorption channels is located at the middle position of the top surface of the supporting boss.

[0008] A suction groove is concavely formed on the top surface of each supporting boss and is communicated with the upper end opening of the vacuum suction channel on the supporting boss.

[0009] The top surface height positions of the supporting bosses are the same, and liquid blocking protrusions are respectively provided on the upper surface of the table portion near the outer periphery of each supporting boss, and the top surface height position of each liquid blocking protrusion is less than or equal to the top surface height position of the supporting boss.

[0010] Each of the liquid-blocking protrusions is in an arc shape.

[0011] A plurality of pin needle passing holes are provided on the table portion, and each of the pin needle passing holes is used for passing a lifting pin.

[0012] Liquid blocking bosses are respectively provided on the upper surface of the table portion and on the periphery of each pin needle passing hole, and the top surface height position of each liquid blocking boss is smaller than the top surface height position of all the supporting bosses.

[0013] A plurality of pouring slopes are formed at the peripheral edge of the upper surface of the table portion, and each of the pouring slopes gradually slopes downward from the middle of the table portion to the direction away from the middle of the table portion.

[0014] The advantages and positive effects of the utility model are:

[0015] The utility model can stably and reliably adsorb the unopened small holes of the wafer to be adsorbed, thereby preventing the photoresist from directly entering the vacuum adsorption channel from the small holes in the middle of the wafer and causing the vacuum pipeline to be blocked or corroded. It can also effectively prevent the photoresist thrown out from the small holes of the wafer from clogging the photoresist vacuum adsorption channel. The utility model is also suitable for other wafers whose centers cannot be adsorbed, and has a simple structure and reliable use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 for Figure 1 A magnified image of point A;

[0018] Figure 3 The present invention is a schematic structural diagram of a wafer with small holes distributed in the middle thereof, to which the present invention is applicable.

[0019] In the figure: 1 is the table portion, 101 is the supporting boss, 1011 is the vacuum adsorption channel, 1012 is the adsorption groove, 102 is the liquid blocking protrusion, 103 is the pin needle passing hole, 104 is the liquid blocking boss, 105 is the liquid pouring slope; 2 is the connecting sleeve portion. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1-3 The utility model is further described in detail.

[0021] A wafer stage for wafer adsorption, such as Figure 1-2As shown, this embodiment includes a table portion 1 and a connecting sleeve portion 2 connected together, the lower end of the connecting sleeve portion 2 is used to connect to the external wafer table connection structure, and the upper end of the connecting sleeve portion 2 is connected to the middle of the lower surface of the table portion 1. In this embodiment, the specific connection method of the connecting sleeve portion 2 and the external wafer table connection structure, as well as the connection method of the upper end of the connecting sleeve portion 2 and the middle of the lower surface of the table portion 1 are all based on existing technologies. The wafer with small holes distributed in the middle part applicable to this embodiment is as follows Figure 3 As shown, the white part in the middle is the part with distributed small holes, and the black part is the edge of the periphery where no small holes are opened.

[0022] In this embodiment, four support bosses 101 are evenly protruded at the peripheral edge of the upper surface of the table portion 1. The setting position of each support boss 101 corresponds to the edge of the outer periphery of the wafer to be received and adsorbed where no small hole is provided. The top surface height position of each support boss 101 is the same. A vacuum adsorption channel 1011 is provided on the inner side of each support boss 101. Each vacuum adsorption channel 1011 has upper and lower openings. The upper end opening of each vacuum adsorption channel 1011 is located on the top surface of the corresponding support boss 101, and the lower end opening of each vacuum adsorption channel 1011 is located on the lower surface of the table portion 1 and is respectively connected to an external vacuum pumping device. The connection method of the vacuum adsorption channel 1011 and the external vacuum pumping device also adopts the existing technology. No vacuum adsorption channel 1011 is provided at all on the upper surface of the table portion 1 where the small hole is provided for the wafer.

[0023] Specifically, if Figure 2 As shown, in this embodiment, the upper opening of each vacuum adsorption channel 1011 is located in the middle of the top surface of the support boss 101, and the top surface of each support boss 101 is concavely provided with an adsorption groove 1012 connected to the upper opening of the vacuum adsorption channel 1011 on the support boss 101. The provision of the adsorption groove 1012 connected to the vacuum adsorption channel 1011 can appropriately increase the adsorption area of ​​the edge of the wafer where the small hole is not provided, thereby stably and evenly adsorbing the wafer; when the external wafer stage connection structure drives the wafer stage to rotate as a whole, it can ensure the stable adsorption of the wafer.

[0024] Specifically, in this embodiment, liquid blocking protrusions 102 are respectively provided on the upper surface of the table portion 1 near the outer periphery of each supporting boss 101, and each liquid blocking protrusion 102 is in an arc shape. During the glue coating process, each liquid blocking protrusion 102 can block the photoresist thrown out along the small hole of the wafer and prevent the vacuum adsorption channel 1011 from being blocked. The top surface height position of each liquid blocking protrusion 102 is equal to the top surface height position of the supporting boss 101, and can also play a certain supporting role for the wafer.

[0025] Specifically, in the present embodiment, three pin needle through holes 103 are evenly provided on the table portion 1, and each pin needle through hole 103 is used to pass through a lifting pin, so as to be applicable to the occasion where a lifting pin needle needs to be set to lift the wafer or to drop the wafer on the supporting boss 101. The number and position of the pin needle through holes 103 can be adjusted according to the demand. The setting structure of the lifting pin is the prior art. Liquid blocking bosses 104 are respectively convexly provided on the upper surface of the table portion 1 and on the outer periphery of each pin needle through hole 103, and the top surface height position of each liquid blocking boss 104 is less than the top surface height position of all supporting bosses 101. The setting of each liquid blocking boss 104 is used to block and prevent the photoresist flowing out along the small hole of the wafer from flowing down from the pin needle through hole 103 and causing damage to the structure below the table portion 1.

[0026] Specifically, in this embodiment, four pouring slopes 105 are evenly formed at the outer edges on the upper surface of the table portion 1. Each pouring slope 105 gradually slopes downward from the middle of the table portion 1 to the direction away from the middle of the table portion 1, so that the glue dripping from the small holes in the wafer can flow downward and outward along the pouring slope 105 after falling on the upper surface of the table portion 1, thereby preventing the photoresist from accumulating on the edge of the upper surface of the table portion 1.

Claims

1. A wafer support table for wafer adsorption, comprising a table portion (1) and a connecting sleeve portion (2) connected together, wherein the lower end of the connecting sleeve portion (2) is used to connect to an external wafer support table connection structure, and the upper end of the connecting sleeve portion (2) is connected to the lower surface of the table portion (1), characterized in that: The upper surface of the table portion (1) is provided with a plurality of supporting bosses (101), and the setting position of each supporting boss (101) corresponds to the position of the wafer to be received and adsorbed without a small hole. The inner side of each supporting boss (101) is provided with a plurality of vacuum adsorption channels (1011), and each vacuum adsorption channel (1011) has upper and lower openings. The upper opening of each vacuum adsorption channel (1011) is located on the top surface of the corresponding supporting boss (101), and the lower opening of each vacuum adsorption channel (1011) is located on the lower surface of the table portion (1) and is respectively connected to an external vacuum pumping device.

2. The wafer stage for wafer adsorption according to claim 1, characterized in that: A vacuum adsorption channel (1011) is respectively provided on the inner side of each of the supporting bosses (101), and the upper end opening of each of the vacuum adsorption channels (1011) is located at the middle position of the top surface of the supporting boss (101).

3. The wafer stage for wafer adsorption according to claim 2, characterized in that: A suction groove (1012) is concavely provided on the top surface of each supporting boss (101) and is connected to the upper end opening of the vacuum suction channel (1011) on the supporting boss (101).

4. The wafer stage for wafer adsorption according to claim 1, characterized in that: The top surface height positions of the supporting bosses (101) are all the same; a liquid blocking protrusion (102) is respectively provided on the upper surface of the table portion (1) near the outer periphery of each supporting boss (101); the top surface height position of each liquid blocking protrusion (102) is less than or equal to the top surface height position of the supporting boss (101).

5. The wafer stage for wafer adsorption according to claim 4, characterized in that: Each of the liquid blocking protrusions (102) is in an arc shape.

6. The wafer stage for wafer adsorption according to claim 1, characterized in that: The table portion (1) is provided with a plurality of pin needle passing holes (103), and each of the pin needle passing holes (103) is used for passing a lifting pin.

7. The wafer stage for wafer adsorption according to claim 6, characterized in that: Liquid blocking bosses (104) are respectively provided on the upper surface of the table portion (1) and on the outer periphery of each pin needle passing hole (103), and the top surface height position of each liquid blocking boss (104) is smaller than the top surface height position of all the supporting bosses (101).

8. The wafer stage for wafer adsorption according to claim 1, characterized in that: A plurality of pouring slopes (105) are also formed at the peripheral edge of the upper surface of the table portion (1), and each of the pouring slopes (105) gradually slopes downward from a direction close to the middle of the table portion (1) to a direction away from the middle of the table portion (1).

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