Wafer bearing device, detection equipment and detection method

Abstract

The invention relates to the technical field of wafer detection, in particular to a wafer bearing device, detection equipment and a detection method.The wafer bearing device comprises a plurality of bearing single bodies and a rotary table, and the bearing single bodies are circumferentially distributed on the rotary table; each bearing single body comprises a horizontal moving mechanism and a vertical moving mechanism, a horizontal sliding block reciprocates in the radial direction of the rotary table under the action of a horizontal driving part, the vertical moving mechanism is arranged on the horizontal sliding block, and a vertical sliding block reciprocates and ascends on the horizontal sliding block in the vertical direction under the action of a vertical driving part; the vertical sliding block is fixedly connected with a clamping jaw used for clamping a wafer. According to the invention, the bearing single body at the to-be-detected position can independently withdraw the clamping jaw, so that the edge area of the wafer is completely exposed; the complete edge area of the wafer can be detected through one-time rotation, cooperation with other equipment is not needed, the device structure is effectively simplified, the detection time is shortened, and the precision and quality of a detection result are improved.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a wafer carrying device, detection equipment and detection method. Background Art

[0002] During the semiconductor manufacturing process, the edge of the wafer needs to be inspected to improve the yield and meet the requirements of advanced processes. During the wafer inspection process, tooling is required to clamp and position the wafer, and the wafer needs to be continuously rotated during the inspection process to complete the inspection of multiple edge areas or complete edges. However, in the prior art, the tooling supports and clamps the outer edge of the wafer from the bottom of the wafer, causing the bottom of the wafer edge to be blocked, and the inspection process cannot be completed with one rotation. In response to the above problems, the prior art uses a clamping mechanism to lift and rotate the wafer, and then puts the wafer back and inspects the blocked area to improve the method. However, the structure and operation steps of this improvement scheme are complex, the operation is time-consuming, and the results of multiple inspections need to be complexly processed to obtain complete edge detection results, and the inspection cost is high. Summary of the invention

[0003] The present invention aims to solve the above problems and provides a wafer carrying device, a detection device and a detection method, the technical solutions adopted by the present invention are as follows: A wafer carrying device comprises a carrying unit and a turntable, wherein the turntable is arranged in the horizontal direction, and the number of the carrying units is multiple and distributed circumferentially on the turntable; the carrying unit comprises a horizontal moving mechanism and a vertical moving mechanism, the horizontal moving mechanism comprises a horizontal driving member and a horizontal sliding block, the horizontal sliding block reciprocates radially along the turntable under the action of the horizontal driving member, the vertical moving mechanism is arranged on the horizontal sliding block, comprises a vertical driving member and a vertical sliding block, the vertical sliding block reciprocates and rises and falls in the vertical direction on the horizontal sliding block under the action of the vertical driving member; a clamping claw for clamping a wafer is fixedly connected to the vertical sliding block.

[0004] On the basis of the above scheme, the bearing unit also includes a limiting mechanism, which includes a threaded limiting nut and a limiting stud, and the limiting stud is arranged on the horizontal sliding block along the vertical direction and is threadedly connected to the horizontal sliding block; when the vertical sliding block moves up to the extreme position, the bottom end of the limiting stud abuts against the vertical sliding block.

[0005] Preferably, the number of the load-bearing units is 5 and they are evenly distributed circumferentially on the turntable.

[0006] Preferably, the clamping claw comprises a receiving arm extending radially outwardly along the turntable, and an outer end portion of the receiving arm extends upward to form a clamping block, and the clamping block abuts against an outer edge of the wafer.

[0007] Based on the above solution, a flexible device is arranged on the side of the clamping block facing the wafer along the radial direction of the wafer.

[0008] Preferably, the horizontal moving mechanism also includes a horizontal slide rail, and the vertical moving mechanism also includes a vertical slide rail. The horizontal slide rail is fixedly installed on the turntable in the radial direction, and the horizontal slide block is movably arranged on the horizontal slide rail. The vertical slide rail is fixedly arranged on the horizontal slide block in the vertical direction, and the vertical slide block is slidably arranged on the vertical slide rail.

[0009] A wafer detection device, characterized in that it includes the above-mentioned wafer carrying device, as well as a sliding mechanism, a rotating mechanism and a detection mechanism, the rotating mechanism includes a rotating drive member, the turntable is installed on the rotating drive member, and is driven to rotate by the rotating drive member; the sliding mechanism includes a first sliding guide rail fixedly arranged on an upper base plate, the first sliding guide rail is arranged in a horizontal direction, the rotating mechanism can be slidably arranged on the first sliding guide rail, and move between a placement position and a detection position, and the detection mechanism is arranged at the detection position.

[0010] On the basis of the above scheme, the rotating mechanism also includes a slip ring and a rotating frame, the rotating frame is coaxially fixedly connected to the turntable, the rotating frame is coaxially fixedly connected to the rotor of the slip ring through a connecting rod, and a hollow groove connected to the rotor is provided in the middle of the rotating frame and the connecting rod, and the connecting rod passes through the rotating driving member.

[0011] A wafer inspection method, using the above-mentioned wafer inspection device, comprises the following steps: S1. Adjust the relative position of each carrier monomer so that each clamp is in the same horizontal plane and the center of the circle formed by the clamping position of each clamp is coaxial with the turntable; S2. The rotating mechanism moves to the placement position, and the wafer to be tested is placed on each clamping jaw of the carrier, and the inner side of each clamping jaw abuts against the edge of the wafer; S3. The rotating mechanism moves to the detection position, and the rotating drive member drives the turntable to rotate; S4. When a certain clamp moves toward the detection mechanism and there is a predetermined distance from the detection mechanism, the clamp extends radially outward and then moves downward, and then retracts radially inward, exposing the bottom and side surfaces of the wafer at the position where the clamp supports to the detection range of the detection mechanism; S5. After the detection mechanism completes the detection of the wafer at that location, the clamp extends radially outward and moves upward, and then retracts radially inward until it returns to its original position and abuts against the wafer; S6. Repeat steps S4 and S5 until the inspection area of ​​the wafer is completed.

[0012] On the basis of the above scheme, when leveling the clamping jaws in step S1, the following steps are included: A1. Place the wafer standard on the carrier; A2. Place a level at the center of the wafer standard; A3. According to the level test results, rotate the limit stud of the load-bearing unit in the direction of abnormal height, adjust the bottom height of the limit stud, and then adjust the height of the vertical sliding block and the clamping claw; A4. After rotating the level to a predetermined angle, repeat step A3; A5. Rotate the level to the initial direction when placed, and determine whether the wafer standard component is in a horizontal state at this time; if the wafer standard component is not in a horizontal state, repeat steps A4 and A5.

[0013] Preferably, the horizontal movement mechanism further includes a first horizontal travel switch and a second horizontal travel switch, and the horizontal sliding block is fixedly connected to a horizontal sliding member; when the horizontal sliding block retracts inward to a first predetermined position, the horizontal sliding member enters the detection range of the first horizontal travel switch, and when the horizontal sliding block retracts inward to a second predetermined position, the horizontal sliding member enters the detection range of the second horizontal travel switch; the vertical movement mechanism further includes a vertical displacement sensor, and when the vertical sliding block moves upward to a third predetermined position, the vertical displacement sensor detects a position signal of the vertical sliding block; In steps S2 and S5, when the vertical sliding block moves upward to the third predetermined position, the clamping claw contacts the wafer, and the vertical driving member stops moving; when the horizontal sliding block retracts inward to the first predetermined position, the first horizontal travel switch is triggered, and the horizontal driving member stops moving, at which time the inner side of the clamping claw contacts the edge of the wafer; In step S4, the clamp extends radially outward and then moves downward, and then retracts radially inward to a second predetermined position, triggering the second horizontal travel switch. At this time, the clamp moves out of the detection range of the detection mechanism, and the horizontal drive member stops moving.

[0014] The beneficial effects of the present invention are as follows: the wafer is stably supported by a supporting unit that can be independently controlled; during the wafer edge detection process, the supporting unit at the position to be detected can retract the clamping claws individually, thereby completely exposing the wafer edge area, while not affecting the stability of the wafer support and avoiding errors in the detection results caused by the displacement of the wafer position; the entire edge area of ​​the wafer can be detected through one rotation without the need for coordination with other equipment, which effectively simplifies the device structure, shortens the detection time, and improves the accuracy and quality of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 : Schematic diagram of the structure of the present invention; Figure 2 : Schematic diagram of the wafer-carrying state of the present invention; Figure 3 : A cross-sectional view of the structure of the present invention; Figure 4 : Schematic diagram of the installation state of the load-bearing unit of the present invention; Figure 5 : Schematic diagram of the load-bearing monomer structure of the present invention; Figure 6 : A schematic structural diagram of the load-bearing monomer of the present invention from another perspective; Figure 7 : Schematic diagram of the structure of the load-bearing unit limiting mechanism of the present invention. DETAILED DESCRIPTION

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments: In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0017] In the description of the present invention, it should be understood that the terms "center", "length", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0018] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0019] like Figure 1 and Figure 2 As shown, a wafer bearing device includes a bearing unit and a turntable 22, wherein the turntable 22 is arranged in the horizontal direction and rotates in the horizontal plane. The number of the bearing units is multiple, and they are distributed circumferentially on the turntable 22; preferably, the number of the bearing units is 5, and they are evenly distributed circumferentially on the turntable 22, so as to achieve stable support for the wafer 6, and at the same time ensure that when any of the bearing units does not provide the bearing function, the wafer 6 can still maintain a stable position without deflection or shaking.

[0020] like Figures 4 to 6 As shown, the bearing unit includes a horizontal moving mechanism and a vertical moving mechanism, the horizontal moving mechanism includes a horizontal driving member 31 and a horizontal sliding block 33, the horizontal sliding block 33 moves back and forth along the radial direction of the turntable 22 under the action of the horizontal driving member 31, and the vertical moving mechanism is arranged on the horizontal sliding block 33, including a vertical driving member 41 and a vertical sliding block 43, the vertical sliding block 43 moves back and forth along the vertical direction on the horizontal sliding block 33 under the action of the vertical driving member 41. The horizontal driving member 31 and the vertical driving member 41 can be linear driving elements such as motors, cylinders, and hydraulic cylinders. Preferably, the horizontal moving mechanism also includes a horizontal slide rail 32, and the vertical moving mechanism also includes a vertical slide rail 44. The horizontal slide rail 32 is fixedly installed on the turntable 22 in the radial direction, and the horizontal slide block 33 is movably set on the horizontal slide rail 32. The vertical slide rail 44 is fixedly set on the horizontal slide block 33 in the vertical direction, and the vertical slide block 43 is slidably set on the vertical slide rail 44. The horizontal slide rail 32 and the vertical slide rail 44 ensure the stability and accuracy of the moving paths of the horizontal slide block 33 and the vertical slide block 43.

[0021] The vertical sliding block 43 is fixedly connected with a clamping claw 5 for clamping the wafer 6, and the clamping claw 5 includes a receiving arm extending radially outward along the turntable 22, and the outer end of the receiving arm extends upward to form a clamping block, and the clamping block abuts against the outer edge of the wafer 6. The receiving arm supports the wafer 6 from the bottom of the wafer 6, and the abutment effect of the clamping block on the edge of the wafer 6 is combined to complete the support and positioning of the wafer 6.

[0022] Since the wafer 6 is relatively thin at the edge, when radial clamping is performed at the edge, excessive clamping force may easily cause damage to the edge such as collapse, while too little clamping force may cause problems such as unstable positioning and clamping, and wafer eccentricity. Therefore, a flexible device is provided along the radial direction of the wafer 6 on the side of the clamping block facing the wafer 6 to improve the clamping effect while preventing damage to the wafer edge. The flexible device may be a structure such as a spring or a buffer sheet, which undergoes dimensional changes in the form of elastic deformation along the radial direction of the wafer 6.

[0023] The load-bearing unit also includes a limiting mechanism, such as Figure 7As shown, the limiting mechanism includes a limiting nut 45 and a limiting stud 46 connected in a threaded manner. The limiting nut 45 is sleeved outside the limiting stud 46 to position the limiting stud 46. The limiting stud 46 is arranged on the horizontal sliding block 33 along the vertical direction and is threadedly connected to the horizontal sliding block 33. When the vertical sliding block 43 moves up to the limit position, the bottom end of the limiting stud 46 abuts against the vertical sliding block 43. The height is adjusted by rotating the limiting stud 46 to limit the limit position when the vertical sliding block 43 and the clamping jaw 5 move to the top, and then the leveling operation is performed when the carrying device carries the wafer 6, so as to ensure the accuracy of the horizontal position and angle of the wafer 6.

[0024] A wafer inspection device includes the above-mentioned wafer carrying device, as well as a sliding mechanism, a rotating mechanism and a detection mechanism. The rotating mechanism includes a rotating driving member 21. The turntable 22 is installed on the rotating driving member 21 and is driven to rotate by the rotating driving member 21. The rotating driving member 21 can be a rotating driving element such as an electric motor, a gear mechanism, etc. Since the carrying device includes multiple connecting wires, in order to prevent the connecting wires from getting tangled during the rotation of the turntable 22, such as Figure 3 As shown, the rotating mechanism further includes a slip ring 23 and a rotating frame 24, the slip ring 23 includes a stator and a rotor, the stator, the rotating frame 24 is coaxially fixedly connected to the turntable 22, the rotating frame 24 is coaxially fixedly connected to the rotor of the slip ring 23 through a connecting rod, and a hollow groove communicating with the rotor is provided in the middle of the rotating frame 24 and the connecting rod, and the connecting rod passes through the rotating driving member 21. The connecting line of the carrying device passes through the rotating frame 24, the connecting rod and the rotor and is connected to the stator accordingly.

[0025] The sliding mechanism includes a first sliding guide rail 12 fixedly arranged on the upper base plate 11, the first sliding guide rail 12 is arranged in the horizontal direction, the rotating mechanism is slidably arranged on the first sliding guide rail 12, and moves between the placement position and the detection position, specifically, the first sliding seat 13 is slidably arranged on the first sliding guide rail 12, and the rotating mechanism is fixedly arranged on the first sliding seat 13. The sliding mechanism may also include a second sliding guide rail 15 fixedly arranged on the lower base plate 14, the second sliding guide rail 15 is arranged parallel to the first sliding guide rail 12 in the horizontal plane, the second sliding seat 16 is slidably arranged on the second sliding guide rail 15, and the stator of the slip ring 23 is fixedly installed on the second sliding seat 16.

[0026] The detection mechanism is arranged at the detection position, and the detection mechanism can be a device such as a camera, a sensor, etc. for detecting the wafer.

[0027] A wafer inspection method, using the above-mentioned wafer inspection device, comprises the following steps: S1. Adjust the relative position of each bearing monomer so that each clamping jaw 5 is in the same horizontal plane, and the center of the circle formed by the clamping position of each clamping jaw 5 is coaxial with the turntable 22; wherein the leveling of the clamping jaw 5 comprises the following steps: A1. Place the wafer standard on the carrier; A2. Place a level at the center of the wafer standard; A3. According to the level test results, rotate the limit stud 46 of the load-bearing monomer in the abnormal height direction, adjust the bottom height of the limit stud 46, and then adjust the height of the vertical sliding block 43 and the clamp 5; A4. After rotating the level to a predetermined angle, repeat step A3; A5. Rotate the level to the initial direction when placed, and determine whether the wafer standard part is in a horizontal state at this time; if the wafer standard part is not in a horizontal state, repeat steps A4 and A5 until the wafer standard part is in a horizontal state.

[0028] S2. The rotating mechanism moves to the placement position, and the wafer 6 to be tested is placed on each clamping jaw 5 of the carrier, and the inner side of each clamping jaw 5 abuts against the edge of the wafer 6; S3. The rotating mechanism moves to the detection position, and the rotating driving member 21 drives the turntable 22 to rotate; S4. When a certain clamping jaw 5 moves toward the detection mechanism and there is a predetermined distance from the detection mechanism, the clamping jaw 5 extends radially outward and then moves downward, and then retracts radially inward, exposing the bottom and side surfaces of the wafer 6 at the supporting position of the clamping jaw 5 to the detection range of the detection mechanism; S5. After the detection mechanism completes the detection of the wafer 6, the clamping jaw 5 extends radially outward and moves upward, and then retracts radially inward until it returns to its original position and abuts against the wafer 6; S6. Repeat steps S4 and S5 until the inspection area at the edge of the wafer 6 is inspected.

[0029] The horizontal movement mechanism further includes a first horizontal travel switch 35 and a second horizontal travel switch 36. The horizontal sliding block 33 is fixedly connected to a horizontal sliding member 34. When the horizontal sliding block 33 retracts inward to a first predetermined position, the horizontal sliding member 34 enters the detection range of the first horizontal travel switch 35. When the horizontal sliding block 33 retracts inward to a second predetermined position, the horizontal sliding member 34 enters the detection range of the second horizontal travel switch 36. The vertical movement mechanism further includes a vertical displacement sensor 42. When the vertical sliding block 43 moves upward to a third predetermined position, the vertical displacement sensor 42 detects a position signal of the vertical sliding block 43. In steps S2 and S5, when the vertical sliding block 43 moves upward to the third predetermined position, the clamping jaw 5 abuts against the wafer 6, specifically, the top surface of the receiving arm of the clamping jaw 5 abuts against the bottom surface of the wafer 6, and the vertical driving member 41 stops to ensure the horizontal state of the wafer 6; when the horizontal sliding block 33 retracts inward to the first predetermined position, the first horizontal travel switch 35 is triggered, and the horizontal driving member 31 stops, at which time the inner side of the clamping jaw 5 abuts against the edge of the wafer 6, completing the clamping action of the wafer 6; In step S4, the clamp 5 extends radially outward and then moves downward, and then retracts radially inward to a second predetermined position, triggering the second horizontal travel switch 36. At this time, the clamp 5 moves out of the detection range of the detection mechanism, and the clamp 5 does not interfere with the detection mechanism, and the horizontal drive member 31 stops moving, thereby preventing the clamp 5 from colliding with the detection mechanism during rotation, and ensuring that the detection mechanism can completely detect or sample the edge area of ​​the wafer.

[0030] By setting various travel switches and sensors, the moving range of each action part can be limited, and the corresponding action signal can be sent to the upper computer to accurately monitor the machine control detection process.

[0031] The present invention is described above by way of examples, but the present invention is not limited to the above specific embodiments, and any changes or modifications made based on the present invention belong to the scope of protection claimed by the present invention.

Claims

1. A wafer carrying device, characterized in that: The invention comprises a bearing unit and a turntable (22), wherein the turntable (22) is arranged in a horizontal direction, and the bearing units are in a plurality and are circumferentially distributed on the turntable (22); the bearing unit comprises a horizontal moving mechanism and a vertical moving mechanism, wherein the horizontal moving mechanism comprises a horizontal driving member (31) and a horizontal sliding block (33), wherein the horizontal sliding block (33) reciprocates radially along the turntable (22) under the action of the horizontal driving member (31), and the vertical moving mechanism is arranged on the horizontal sliding block (33), and comprises a vertical driving member (41) and a vertical sliding block (43), wherein the vertical sliding block (43) reciprocates and rises and falls in a vertical direction on the horizontal sliding block (33) under the action of the vertical driving member (41); and a clamping claw (5) for clamping a wafer (6) is fixedly connected to the vertical sliding block (43).

2. A wafer carrier according to claim 1, characterized in that: The bearing unit also includes a limiting mechanism, which includes a limiting nut (45) and a limiting stud (46) connected in a threaded manner. The limiting stud (46) is arranged on the horizontal sliding block (33) along the vertical direction and is threadedly connected to the horizontal sliding block (33). When the vertical sliding block (43) moves upward to the limit position, the bottom end of the limiting stud (46) abuts against the vertical sliding block (43).

3. A wafer carrying device according to claim 1, characterized in that: The number of the load-bearing monomers is 5, and they are evenly distributed circumferentially on the turntable (22).

4. A wafer carrying device according to claim 1, characterized in that: The clamping claw (5) comprises a receiving arm extending radially outward along the turntable (22), the outer end of the receiving arm extending upward to form a clamping block, and the clamping block abuts against the outer edge of the wafer (6).

5. A wafer carrying device according to claim 4, characterized in that: A flexible device is arranged on the side of the clamping block facing the wafer (6) along the radial direction of the wafer (6).

6. The wafer carrying device according to claim 1, characterized in that: The horizontal movement mechanism further comprises a horizontal slide rail (32), and the vertical movement mechanism further comprises a vertical slide rail (44). The horizontal slide rail (32) is fixedly mounted on the turntable (22) in a radial direction, and the horizontal slide block (33) is movably arranged on the horizontal slide rail (32). The vertical slide rail (44) is fixedly arranged on the horizontal slide block (33) in a vertical direction, and the vertical slide block (43) is slidably arranged on the vertical slide rail (44).

7. A wafer inspection device, characterized in that: The invention comprises a wafer carrier device as claimed in any one of claims 1 to 6, as well as a sliding mechanism, a rotating mechanism and a detecting mechanism, wherein the rotating mechanism comprises a rotating driving member (21), the turntable (22) is mounted on the rotating driving member (21) and is driven to rotate by the rotating driving member (21); the sliding mechanism comprises a first sliding guide rail (12) fixedly arranged on an upper base plate (11), the first sliding guide rail (12) is arranged in a horizontal direction, the rotating mechanism can be slidably arranged on the first sliding guide rail (12) and move between a placement position and a detection position, and the detection mechanism is arranged at the detection position.

8. The wafer inspection device according to claim 7, characterized in that: The rotating mechanism further comprises a slip ring (23) and a rotating frame (24); the rotating frame (24) is coaxially fixedly connected to the turntable (22); the rotating frame (24) is coaxially fixedly connected to the rotor of the slip ring (23) via a connecting rod; a hollow groove communicating with the rotor is provided in the middle of the rotating frame (24) and the connecting rod; the connecting rod passes through the rotating drive member (21).

9. A wafer detection method, characterized in that: Using the wafer inspection device according to claim 7 or 8 comprises the following steps: S1. Adjust the relative position of each carrier monomer so that each clamp (5) is in the same horizontal plane, and the center of the circle formed by the clamping position of each clamp (5) is coaxial with the turntable (22); S2. The rotating mechanism moves to the placement position, and the wafer (6) to be inspected is placed on each clamping jaw (5) of the carrying device, and the inner side of each clamping jaw (5) abuts against the edge of the wafer (6); S3. The rotating mechanism moves to the detection position, and the rotating driving member (21) drives the turntable (22) to rotate; S4. When a certain clamp (5) moves toward the detection mechanism and is at a predetermined distance from the detection mechanism, the clamp (5) extends radially outward and then moves downward, and then retracts radially inward, exposing the bottom surface and side surface of the wafer (6) at the supporting position of the clamp (5) within the detection range of the detection mechanism; S5. After the detection mechanism completes the detection of the wafer (6), the clamping claw (5) extends radially outward and moves upward, and then retracts radially inward until it returns to its original position and abuts against the wafer (6); S6. Repeat steps S4 and S5 until the inspection area of ​​the wafer (6) is inspected.

10. A wafer detection method according to claim 9, characterized in that: When leveling the clamping jaws (5) in step S1, the following steps are included: A1. Place the wafer standard on the carrier; A2. Place a level at the center of the wafer standard; A3. According to the level test results, rotate the limit stud (46) of the load-bearing monomer in the abnormal height direction, adjust the bottom height of the limit stud (46), and then adjust the height of the vertical sliding block (43) and the clamp (5); A4. After rotating the level to a predetermined angle, repeat step A3; A5. Rotate the level to the initial direction when placed, and determine whether the wafer standard component is in a horizontal state at this time; if the wafer standard component is not in a horizontal state, repeat steps A4 and A5.

11. A wafer detection method according to claim 9, characterized in that: The horizontal movement mechanism further comprises a first horizontal travel switch (35) and a second horizontal travel switch (36); the horizontal sliding member (34) is fixedly connected to the horizontal sliding block (33); when the horizontal sliding block (33) retracts inwards to a first predetermined position, the horizontal sliding member (34) enters a detection range of the first horizontal travel switch (35); when the horizontal sliding block (33) retracts inwards to a second predetermined position, the horizontal sliding member (34) enters a detection range of the second horizontal travel switch (36); the vertical movement mechanism further comprises a vertical displacement sensor (42); when the vertical sliding block (43) moves upwards to a third predetermined position, the vertical displacement sensor (42) detects a position signal of the vertical sliding block (43); In steps S2 and S5, when the vertical sliding block (43) moves upward to the third predetermined position, the clamping jaw (5) contacts the wafer (6), and the vertical driving member (41) stops moving; when the horizontal sliding block (33) retracts inward to the first predetermined position, the first horizontal travel switch (35) is triggered, and the horizontal driving member (31) stops moving, at which time the inner side of the clamping jaw (5) contacts the edge of the wafer (6); In step S4, the clamping jaw (5) extends radially outward and then moves downward, and then retracts radially inward to a second predetermined position, triggering the second horizontal travel switch (36). At this time, the clamping jaw (5) moves out of the detection range of the detection mechanism, and the horizontal driving member (31) stops moving.

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