Power chip packaging module with heat dissipation function

Abstract

A power chip packaging module with a heat dissipation function comprises a steam cavity, a dielectric layer, a conductive layer and a power chip, the steam cavity comprises a copper upper cover and a lower plate opposite to the copper upper cover, the copper upper cover is provided with an upper cover upper surface, and when the copper upper cover is coupled to the lower plate, a closed air cavity, a heat absorption area and a condensation area are formed, the heat-absorbing area is positioned on the copper upper cover; the condensation area is located on the lower plate, the dielectric layer is arranged on the upper surface of the upper cover, the conductive layer is arranged on the dielectric layer, and the power wafer is arranged on the conductive layer. Heat energy generated by the power wafer can be directly transmitted to the heat absorption area of the steam cavity element through the conductive layer and the dielectric layer, phase change and two-phase flow circulation of working fluid in the steam cavity are started, the system thermal resistance is effectively reduced, and therefore the heat dissipation efficiency of the power wafer is improved.

Description

Technical Field

[0001] The utility model relates to a power chip packaging module, and more particularly to a power chip packaging module which eliminates the conventional ceramic copper-clad substrate and can directly integrate a dielectric layer, a conductive layer, a power chip and a vapor chamber heat sink into one body, and can further integrate a jet flow heat dissipation technology and a shovel-tooth microchannel heat dissipation technology to form a power chip packaging module with liquid cooling function. Background Art

[0002] See also Figure 1 , Figure 1 The conventional power chip package and heat dissipation module are shown. Figure 1 As shown, the conventional power chip package and heat dissipation module E comprises a power chip 51, a double-sided copper-clad ceramic copper-clad substrate 71, and a conventional heat dissipation module 81. The double-sided copper-clad ceramic substrate 71 is formed by bonding two copper layers 701 up and down, and the power chip 51 is bonded to the double-sided copper-clad ceramic copper-clad substrate 71 and the heat dissipation module 81 by welding (i.e., the welding layer 702 shown in the figure). In actual applications, the power chip 51 is a power chip such as IGBT or SiC MOSFET.

[0003] As the heat dissipation power and power density required by power chip packaging modules are increasing, Figure 1 From the conventional power chip package and heat dissipation module E shown, it can be seen that the conventional power chip package module has multiple thermal resistances from the chip to the heat dissipation module. The more layers of thermal resistance there are, the more difficult it will be to dissipate heat from the chip. In addition, for future chips with higher power and higher power density, the more layers of thermal resistance will affect the heat dissipation efficiency. Excessive system thermal resistance will also cause the junction temperature of the power chip to be too high, thereby affecting the performance and service life of the power chip.

[0004] Therefore, in order to solve the heat dissipation and heat dissipation challenges brought about by the increasing power and power density of current power chips, it is necessary to provide a more efficient power chip heat dissipation and heat distribution solution. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide a power chip packaging module with heat dissipation function, which overcomes the defects of the prior art, greatly reduces the number of layers of thermal resistance, provides a large-area heat dissipation structure with a microchannel structure, effectively increases the heat dissipation surface area, can provide two-phase flow circulation heat dissipation and coolant for liquid cooling to achieve double-effect heat dissipation, and greatly increase the overall heat dissipation efficiency.

[0006] To achieve the above object, the utility model discloses a power chip packaging module with heat dissipation function, which is characterized by comprising:

[0007] A vapor chamber, comprising a copper upper cover and a lower plate opposite to the copper upper cover, wherein the copper upper cover has an upper cover upper surface and when the copper upper cover is coupled to the lower plate, a closed air chamber, a heat absorption zone and a condensation zone are formed, wherein the heat absorption zone is located at the copper upper cover, and the condensation zone is located at the lower plate;

[0008] a dielectric layer and a conductive layer, the dielectric layer is disposed on the upper surface of the upper cover, and the conductive layer is disposed on the dielectric layer; and

[0009] A power chip is disposed on the conductive layer.

[0010] The vapor chamber is a three-dimensional vapor chamber element, wherein:

[0011] The lower plate has an opening relative to the power chip; and

[0012] The copper upper cover has a lower surface, which has a recessed opening relative to the opening and an annular cavity so that when the copper upper cover is coupled to the lower plate, the annular cavity forms the closed air cavity, and the opening and the recessed opening are interconnected.

[0013] Wherein, the three-dimensional vapor chamber element further comprises:

[0014] A plurality of micro channels, the lower plate has a lower plate lower surface, the micro channels are arranged on the lower plate lower surface, and the micro channels are respectively connected with the concave openings.

[0015] The recessed opening has an opening surface for receiving a splash of cooling liquid.

[0016] The three-dimensional vapor chamber element further comprises:

[0017] A semi-open lower shell is coupled to the lower plate of the three-dimensional vapor chamber element to form a heat exchange chamber. The semi-open lower shell includes a spray head and has an input port and an output port. The input port inputs the cooling liquid. The spray head is connected to the input port to first spray the cooling liquid on the opening surface through the opening and the recessed opening, and then flows through the microchannels on the lower surface of the lower plate and the heat exchange chamber, and outputs the cooling liquid through the output port.

[0018] Wherein, the channel width of the microchannels is less than or equal to 1 mm.

[0019] A plurality of heat dissipation structures are arranged on the opening surface, and the opening surface is located at a hot spot of the power chip.

[0020] The three-dimensional vapor chamber element further comprises a continuous multi-porous capillary structure, which is disposed on the copper upper cover and the lower plate in the closed air chamber.

[0021] The invention also comprises a half-open upper shell, which is coupled to the copper upper cover to form an accommodating space for accommodating and protecting the power chip.

[0022] The vapor chamber further comprises a plurality of fins, a plurality of microchannels and a semi-open lower shell, wherein the lower plate has a lower surface of the lower plate, the fins and the microchannels are arranged on the lower surface of the lower plate, and a lower opening is formed on the lower surface of the lower plate relative to the power chip, the semi-open lower shell is coupled to the lower plate to form a heat exchange cavity, the semi-open lower shell comprises a spray head and has an input port and an output port, a coolant is input into the input port, the spray head is connected to the input port to first spray the coolant onto the lower surface of the lower plate through the lower opening, and then flow through the microchannels on the lower surface of the lower plate and the heat exchange cavity, and output the coolant through the output port.

[0023] In summary, the utility model provides a power chip packaging module with heat dissipation function that integrates a vapor chamber, a dielectric layer, a conductive layer and a power chip. Compared with the conventional power chip packaging and heat dissipation module, which has multiple thermal resistances, the power chip packaging module of the utility model can directly integrate the dielectric layer, the conductive layer and the power chip with a vapor chamber radiator, so that the power chip can directly transfer heat energy to the vapor chamber heat absorption area through the thinner high-voltage resistant dielectric layer and the conductive layer, greatly reducing the number of thermal resistance layers. In the process of heat dissipation, in addition to utilizing the two-phase flow circulation inside the vapor chamber to dissipate heat, the coolant can be further sprayed along the spray head provided on the semi-open lower shell and impact the opening surface of the recessed opening corresponding to the hot spot with the highest temperature of the power chip to force heat exchange. Furthermore, the lower plate of the vapor chamber or three-dimensional vapor chamber element of the utility model is provided with a large-area heat dissipation structure with a microchannel structure. In addition to increasing the heat dissipation surface area in the two-phase flow circulation of the vapor chamber or three-dimensional vapor chamber element, the microchannel structure can also be diverted and flow through the large-area heat dissipation fins along the direction of the microchannel setting after the coolant impacts the recessed opening surface, and further forced heat exchange is performed, allowing the coolant to take the heat away from the radiator. In addition, the power chip of the power chip packaging module with heat dissipation function of the utility model can also use IGBT or silicon carbide (SiC) type power chips or multi-chip patterns to be integrated in the same heat exchanger for heat dissipation, thereby improving the overall heat dissipation efficiency of the utility model. Compared with the conventional technology, the vapor chamber or three-dimensional vapor chamber element of the utility model can simultaneously perform internal two-phase flow circulation heat dissipation and liquid cooling heat dissipation of the coolant to achieve double-effect heat dissipation, thereby effectively dissipating and equalizing the heat energy generated by the power chip, and the overall heat dissipation efficiency can be greatly increased by double-effect heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A conventional power chip package and heat dissipation module is shown.

[0025] Figure 2 A cross-sectional view of a power chip packaging module with heat dissipation function according to a specific embodiment of the utility model is shown.

[0026] Figure 3 A cross-sectional view of a power chip packaging module with heat dissipation function according to another specific embodiment of the present invention is shown.

[0027] Figure 4 A cross-sectional view of a power chip packaging module with heat dissipation function according to another specific embodiment of the present invention is shown.

[0028] Figure 5 Shows the Figure 4 Exploded view of the three-dimensional vapor chamber components.

[0029] Figure 6 A cross-sectional view of a power chip packaging module with heat dissipation function according to another specific embodiment of the present invention is shown.

[0030] Figure 7 A cross-sectional view of a power chip packaging module with heat dissipation function according to another specific embodiment of the present invention is shown.

[0031] Figure 8 A cross-sectional view of a power chip packaging module with heat dissipation function according to another specific embodiment of the present invention is shown.

[0032] Fig. 9 A cross-sectional view of a power chip packaging module with heat dissipation function according to another specific embodiment of the present invention is shown. DETAILED DESCRIPTION

[0033] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the accompanying drawings and specific embodiments. It should be noted that these specific embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, so it is necessary to explain them first.

[0034] See also Figure 2 , Figure 2 FIG. 1 shows a cross-sectional view of a power chip packaging module 1 with heat dissipation function according to a specific embodiment of the present invention. Figure 2As shown, the power chip package module 1 with heat dissipation function of this specific embodiment includes a vapor chamber 11, a dielectric layer 31, a conductive layer 41 and a power chip 51. The vapor chamber 11 includes a copper upper cover 111 and a lower plate 112 relative to the copper upper cover 111, and the copper upper cover 111 has an upper cover upper surface 1111. When the copper upper cover 111 is coupled to the lower plate 112, the cavity between the copper upper cover 111 and the lower plate 112 will form a closed air cavity 114, and further, the heat absorption area 115 is located at the copper upper cover 111; the condensation area 116 is located at the lower plate 112. The dielectric layer 31 is disposed on the upper cover upper surface 1111, the conductive layer is further disposed on the dielectric layer 31, and then the power chip 51 is disposed on the conductive layer 41. In this specific embodiment, the conductive layer 41 can be a copper layer, and the power chip 51 can be soldered on the copper layer with solder (not shown).

[0035] In practice, the power chip package module 1 with heat dissipation function of this specific embodiment further includes a half-open upper shell 61, wherein the half-open upper shell 61 is coupled to the copper upper cover 111 and further forms a receiving space 611 inside, and the receiving space 611 is used to receive and protect the power chip 51. The receiving space 611 can be filled with a filling material. Figure 2 As shown, the order of components from top to bottom of the power chip packaging module 1 with heat dissipation function of this specific embodiment is: semi-open upper shell 61, power chip 51, conductive layer 41, dielectric layer 31, copper upper cover 111 of vapor chamber 11 and lower plate 112 of vapor chamber 11. It is worth noting that the power chip packaging module with heat dissipation function of the present invention eliminates the conventional double-sided copper-clad ceramic copper-clad substrate, allowing the power chip to directly transfer heat energy to the heat-absorbing end of the vapor chamber through the thinner high-voltage resistant dielectric layer and conductive layer. Furthermore, the power chip of the power chip packaging module with heat dissipation function of the present invention is an IGBT chip or a power chip of silicon carbide (SiC), thereby providing a more efficient heat dissipation means.

[0036] Furthermore, the power chip package module 1 with heat dissipation function of this specific embodiment further includes a continuous multi-porous capillary structure (not shown) and a plurality of support columns 117 with the multi-porous capillary structure. In practice, the multi-porous capillary structure is disposed on the inner surface of the copper upper cover 111 and the upper surface of the lower plate 112, and the support columns 117 are disposed between the copper upper cover 111 and the lower plate 112. When the copper upper cover 111 and the lower plate 112 are coupled, the plurality of support columns 117 with the multi-porous capillary structure are located between the copper upper cover 111 and the lower plate 112, and further, at this time, the plurality of support columns 117 with the multi-porous capillary structure will form a continuous capillary structure with the multi-porous capillary structure on the inner surface of the copper upper cover 111 and the upper surface of the lower plate 112. Next, the working fluid is injected into the capillary structure in the cavity between the copper upper cover 111 and the lower plate 112 from the pre-set liquid injection port (not shown) in the lower plate 112, and vacuum is evacuated and the liquid injection port is sealed, and the internal cavity forms a closed air cavity 114. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol.

[0037] In practical applications, the power chip package module 1 with heat dissipation function of this specific embodiment can be used for air cooling. When the power chip 51 generates heat energy during operation, the heat energy is first transferred to the heat absorption area 115 of the vapor chamber 11 through the conductive layer 41 and the dielectric layer 31. At this time, after the heat absorption area 115 of the vapor chamber 11 absorbs the heat energy, the working fluid in the closed air cavity 114 of the vapor chamber 11 absorbs the heat energy and changes phase from the liquid working fluid to the gaseous working fluid. Then the gaseous working fluid drifts to the condensation area 116. Due to the decrease in temperature, the cooled working fluid will change phase again and turn back to the liquid working fluid. Finally, it flows back to the heat absorption area 115 along the porous capillary structure and the support column 117, thereby repeating the two-phase flow cycle inside the vapor chamber.

[0038] Furthermore, the present invention provides a state that can be applied to liquid cooling. Figure 3 , Figure 3 FIG. 2 shows a cross-sectional view of a power chip packaging module 2 with heat dissipation function according to another specific embodiment of the present invention. Figure 3As shown, the vapor chamber 12 of the power chip packaging module 2 with heat dissipation function of this specific embodiment is further provided with a semi-open lower shell 118. The semi-open lower shell 118 has an input port 1183 and an output port 1184, and the input port 1183 and the output port 1184 are used to transport cooling liquid. And the lower plate 112 of the vapor chamber 11 is further provided with a heat dissipation fin 1116. In practice, the joining holes of the semi-open lower shell 118 can be joined with the lower plate lower surface 1122 of the lower plate 112 of the vapor chamber 11, and the hole joining ends on the semi-open lower shell 118 are fastened and fixed to the lower plate 112 by screws. After the joining, the space inside the semi-open lower shell 118 is the heat exchange chamber 1181. In another embodiment, the semi-open lower shell is coupled to the lower plate of the vapor chamber by stir friction welding, but the joining method of the semi-open lower shell and the vapor chamber is not limited to this. For further information, please continue to refer to Figure 3 When the power chip 51 generates heat during operation, the heat can be dissipated through the two-phase flow circulation inside the vapor chamber, and the coolant flows in from the input port 1183 to further exchange heat with the heat sink fins 1116 of the lower plate 112 of the vapor chamber 11. In practice, the coolant can be one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants, but is not limited thereto. The coolant can also be other fluids that absorb heat and take away heat energy.

[0039] Furthermore, the present invention provides other embodiments. Figure 4 as well as Figure 5 . Figure 4 A cross-sectional view of a power chip packaging module 3 with heat dissipation function according to another specific embodiment of the present invention is shown. Figure 5 Shows the Figure 4 An exploded view of the three-dimensional vapor chamber element 13. Figure 4 as well as Figure 5 As shown, the vapor chamber of the power chip package module 3 with heat dissipation function of this specific embodiment uses a three-dimensional vapor chamber element 13. The three-dimensional vapor chamber element 13 of this specific embodiment includes a copper upper cover 119 and a lower plate 120. Among them, the lower plate 120 further includes a plurality of microchannels 1123 and an opening 1121, and the microchannels 1123 are arranged on the lower plate lower surface 1122 of the lower plate 120, and the position of the opening 1121 is relative to the power chip 51. The copper upper cover 119 has an upper cover lower surface 1112, and a recessed opening 1113 and an annular cavity 113 are provided on the upper cover lower surface 1112 relative to the opening 1121. When the copper upper cover 119 is coupled to the lower plate 120, the annular cavity 113 further forms a closed air cavity 114, and the opening 1121 and the recessed opening 1113 are mutually connected and mutually connected with the recessed opening 1113.

[0040] It is worth noting that the microchannel 1123 structure of the power chip package module 3 with heat dissipation function in this specific embodiment is formed by arranging a plurality of heat dissipation fins with large areas. The heat dissipation fin structure of the power chip package module 3 with heat dissipation function in this specific embodiment is a quadrilateral structure as a whole. In practice, the lower plate metal material can be first milled by a tooth-cutting process to form the specific contour of the overall structure, such as the chamfers of the four sides and the opening 1121 in the middle, and then the drainage channels of the microchannel 1123 are cut and processed in sequence so that the coolant can flow through each microchannel 1123 more evenly. Please note that Figure 5 The square groove in the middle of the copper cover 119 corresponds to the space of the annular cavity 113, and the middle hollow is the recessed opening 1113. When the copper cover 119 and the lower plate 120 are coupled, the opening 1121 of the lower plate 120 will be mutually connected with the recessed opening 1113 of the copper cover 119, and when vacuuming, the annular cavity 113 will be separated to further form a closed air cavity. Please note that the power chip packaging module 3 with heat dissipation function of this specific embodiment is substantially the same as the structure and function of the corresponding components of the aforementioned specific embodiment, so it will not be repeated here.

[0041] The utility model provides other aspects that can be applied to liquid cooling, thereby effectively solving the problem of insufficient heat dissipation efficiency of power chips. Figure 6 , Figure 6 FIG. 4 is a cross-sectional view of a power chip packaging module 4 with heat dissipation function according to another specific embodiment of the present invention. Figure 6 As shown, the three-dimensional vapor chamber element 14 of the power chip packaging module 4 with heat dissipation function of this specific embodiment further includes a semi-open lower shell 131, and is coupled to the lower plate 120 of the three-dimensional vapor chamber element 14 to form a heat exchange cavity 1311. Among them, the semi-open lower shell 131 includes a shower head 1312 and has an input port 1313 and an output port 1314. That is to say, when the semi-open lower shell 131 is coupled to the lower plate 120, the internal space forms a heat exchange cavity 1311, at this time, the microchannel 1123 structure of the three-dimensional vapor chamber element 14 will also be accommodated in the heat exchange cavity 1311, and the shower head 1312 will be completely accommodated in the recessed opening 1113. In practice, the shower head 1312 is connected to the input port 1313, and the coolant is input into the heat exchange cavity 1311 through the input port 1313, and the coolant is discharged from the output port 1314.

[0042] In actual applications, the power chip 51 of the power chip packaging module 4 with heat dissipation function of this specific embodiment will generate heat energy during operation. At this time, the power chip packaging module 4 with heat dissipation function can simultaneously dissipate heat through the two-phase flow circulation inside the three-dimensional vapor chamber element 14 and through liquid cooling through the coolant. Please continue to refer to Figure 6 , Figure 6 The arrow flow direction shown in FIG. 1 is the coolant flow direction F. After the coolant flows in from the input port 1313 of the semi-open lower shell 131, the coolant can flow out directly from the shower head 1312 and directly splash the coolant onto the opening surface 1114 of the recessed opening 1113 of the three-dimensional vapor chamber element 14. The position of this opening surface 1114 corresponds to the relative position of the hot spot 511 with the highest temperature in the power chip 51, and is also the distance closest to the hot spot 511. Therefore, when the coolant is directly splashed onto the opening surface 1114, it can directly impact the place with the highest temperature of the power chip 51 to force heat exchange and heat dissipation. Then, the coolant splashed onto the opening surface 1114 will flow along the microchannel 1123 structure, so that the coolant will flow through each microchannel 1123 after being splashed from the shower head 1312 and further force heat exchange with each large-area heat dissipation fin during the flow process. Finally, the coolant is discharged from the output port 1314 to complete a heat exchange liquid cooling cycle.

[0043] It is worth noting that the opening surface of the power chip packaging module 4 with heat dissipation function of this specific embodiment can be further provided with multiple heat dissipation structures (not shown in the figure) to increase the surface area for impact forced heat exchange with the coolant. In practice, the heat dissipation structure can be a small cylinder that can extend upward from the opening surface or be recessed downward. However, the shape, number, and arrangement of the heat dissipation structure can be optimized according to actual needs. Please note that the power chip packaging module 4 with heat dissipation function of this specific embodiment is roughly the same as the structure and function of the corresponding elements of the aforementioned specific embodiment, so it will not be repeated here, and considering the heat exchange area of ​​the microchannel and the flow rate of the coolant flowing through, the flow channel width d of the microchannel is less than or equal to 1mm. In actual applications, the flow channel width of the microchannel, the copper metal thickness between the microchannels, the drainage structure, etc. are not limited to this and can be adjusted according to the design.

[0044] Furthermore, if the space of the electronic product where the power chip packaging module is installed has a height limit, due to the height limit, the input port cannot directly correspond to the position vertically arranged on the power chip, and the utility model further provides other embodiments. Figure 7 , Figure 7 FIG. 5 shows a cross-sectional view of a power chip packaging module 5 with heat dissipation function according to another specific embodiment of the present invention. Figure 7As shown, the semi-open lower shell 141 of the power chip packaging module 5 with heat dissipation function of this specific embodiment further includes a top plate 1411 and a side plate 1413, and the top plate 1411 is provided with a top plate channel 1412. The microchannel 1123 is arranged on the side end of the top plate 1411 and connected to the top plate channel 1412. The coolant flows in from the input port 1313 on the side end of the top plate 1411 and flows along the top plate channel 1412 to the shower head 1312. The coolant is further directly splashed and impacts the opening surface 1114 of the recessed opening 1113, and absorbs the heat energy of the power chip therefrom. Then, the coolant further performs heat exchange along the microchannel 1123 structure, takes away the remaining heat energy again and flows through the heat exchange cavity 1311, and finally flows out from the output port 1314 of the side plate 1413 to complete a heat exchange liquid cooling cycle. Figure 7 The input port is shown to be disposed on the right side of the side end of the top plate, but the location is not limited thereto, and the output port may also be disposed in the top plate. Other devices of this embodiment are substantially the same as those corresponding to the aforementioned embodiments, and are therefore not described in detail here.

[0045] Furthermore, in view of the specifications of multi-chip packages currently on the market, the present invention further provides applicable embodiments. Figure 8 , Figure 8 FIG. 2 shows a cross-sectional view of a power chip packaging module with heat dissipation function according to another specific embodiment of the present invention. Figure 8 As shown, the power chip package module 6 with heat dissipation function of this specific embodiment includes a semi-open lower shell 151, a plurality of power chips 51, a dielectric layer 31, a conductive layer 41 and a three-dimensional vapor chamber element 15. Among them, the number of power chips 51 of the power chip package module 6 with heat dissipation function of this specific embodiment is 3. The three-dimensional vapor chamber element 15 of the power chip package module 6 with heat dissipation function of this specific embodiment also includes 3 groups of microchannel 1123 structures, and each has a recessed opening 1113 at the position corresponding to each power chip 51. In addition, the semi-open lower shell 151 includes 3 groups of shower heads 1312 and each shower head 1312 is provided with a corresponding microchannel 1123.

[0046] like Figure 8As shown, the difference between the power chip package module 6 with heat dissipation function of the present embodiment and the aforementioned embodiment is that the three-dimensional vapor chamber element 15 of the power chip package module 6 with heat dissipation function of the present embodiment is coupled to the same copper upper cover 152 through three sets of lower plates 120. That is to say, the three sets of lower plates 120 can be respectively arranged at the position corresponding to each power chip 51, and heat exchange is performed in the same heat exchange cavity 1511. In actual application, the coolant flows in from the three sets of input ports of the semi-open lower shell at the same time, and the coolant can be simultaneously splashed from the three sets of spray heads to the opening surface of each recessed opening, thereby dissipating the heat energy emitted by the three sets of chips at the same time. In detail, when the chips of the power chip package module 6 with heat dissipation function of the present embodiment are actually operating and emitting heat energy, they can be dissipated by two-phase flow circulation through the working fluid in the corresponding closed air cavity, and can also be forced to heat exchange the recessed opening corresponding to each power chip at the same time through the coolant, and finally the coolant is output from the output port. In practice, the number and arrangement of power chips are not limited to this; the three-dimensional vapor chamber element can be designed according to the number of power chips; the positions of the input port and output port of the semi-open lower shell are not limited to this. In practice, the semi-open lower shell can be joined with the copper upper cover of the three-dimensional vapor chamber element, and then the joint of the semi-open lower shell and the copper upper cover are fastened and fixed with screws. It can also be coupled by welding, bonding and stir friction welding. In addition, any method that can join the semi-open lower shell and the copper upper cover is one of the means that can be adopted by the utility model. Please note that the power chip packaging module 6 with heat dissipation function of this specific embodiment is roughly the same as the structure and function of the corresponding element of the aforementioned specific embodiment, so it will not be repeated here.

[0047] See also Fig. 9 , Fig. 9 FIG. 2 shows a cross-sectional view of a power chip packaging module 7 with heat dissipation function according to another specific embodiment of the present invention. Fig. 9As shown, the vapor chamber 16 of the power chip packaging module 7 with heat dissipation function of this specific embodiment further includes a plurality of microchannels 1123 and a semi-open lower shell 161. The lower plate 121 has a lower plate lower surface 1122, the microchannels 1123 are arranged on the lower plate lower surface 1122, and a lower opening 1124 is provided at a position relative to the power chip 51. In a specific embodiment, the lower opening 1124 can be formed by machining the shovel-toothed fins on the lower plate lower surface 1122 using CNC, and the semi-open lower shell 161 is coupled to the lower plate 121 to form a heat exchange chamber 1611, and the semi-open lower shell 161 includes a shower head 1612 and has an input port 1613 and an output port 1614. After the cooling liquid flows in from the input port 1613 , it is sprayed on the lower plate lower surface 1122 of the lower opening 1124 through the spray head 1612 , and then flows through the multiple microchannels 1123 on the lower plate lower surface 1122 and the heat exchange chamber 1611 , and is output through the output port 1614 .

[0048] In summary, the utility model provides a power chip packaging module with heat dissipation function that integrates a vapor chamber, a dielectric layer, a conductive layer and a power chip. Compared with the conventional power chip packaging and heat dissipation module, which has multiple thermal resistances, the power chip packaging module of the utility model can directly integrate the dielectric layer, the conductive layer and the power chip with a vapor chamber radiator, so that the power chip can directly transfer heat energy to the vapor chamber through the thinner high-voltage resistant dielectric layer and the conductive layer, and greatly reduce the number of thermal resistance layers. In the process of heat dissipation, in addition to utilizing the two-phase flow circulation inside the vapor chamber to dissipate heat, the coolant can be further sprayed along the spray head provided on the semi-open lower shell and impact the opening surface of the recessed opening corresponding to the hot spot with the highest temperature of the power chip to force heat exchange. Furthermore, the lower plate of the vapor chamber or three-dimensional vapor chamber element of the utility model is provided with a large-area heat dissipation structure with a microchannel structure. In addition to increasing the heat dissipation surface area in the two-phase flow cycle of the vapor chamber or three-dimensional vapor chamber element, the microchannel structure can also be guided and flow through the large-area heat dissipation fins along the direction of the microchannel setting after the coolant impacts the concave opening surface, and further forced heat exchange is performed, allowing the coolant to take the heat away from the radiator. Compared with the conventional technology, the vapor chamber or three-dimensional vapor chamber element of the utility model can simultaneously perform internal two-phase flow heat dissipation and liquid cooling heat dissipation of the coolant to achieve double-effect heat dissipation, thereby effectively dissipating the heat energy generated by the power chip, and the overall heat dissipation efficiency can be greatly increased by the double-effect heat dissipation.

[0049] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

Claims

1. A power chip packaging module with heat dissipation function, characterized in that Contains: A vapor chamber, comprising a copper upper cover and a lower plate opposite to the copper upper cover, wherein the copper upper cover has an upper cover upper surface and when the copper upper cover is coupled to the lower plate, a closed air chamber, a heat absorption zone and a condensation zone are formed, wherein the heat absorption zone is located at the copper upper cover, and the condensation zone is located at the lower plate; a dielectric layer and a conductive layer, the dielectric layer is disposed on the upper surface of the upper cover, and the conductive layer is disposed on the dielectric layer; and A power chip is disposed on the conductive layer.

2. The power chip packaging module with heat dissipation function as claimed in claim 1, characterized in that: The vapor chamber is a three-dimensional vapor chamber element, wherein: The lower plate has an opening relative to the power chip; and The copper upper cover has a lower surface, which has a recessed opening relative to the opening and an annular cavity so that when the copper upper cover is coupled to the lower plate, the annular cavity forms the closed air cavity, and the opening and the recessed opening are interconnected.

3. The power chip packaging module with heat dissipation function as claimed in claim 2, characterized in that: The three-dimensional vapor chamber element further comprises: A plurality of micro channels, the lower plate has a lower plate lower surface, the micro channels are arranged on the lower plate lower surface, and the micro channels are respectively connected with the concave openings.

4. The power chip packaging module with heat dissipation function as claimed in claim 3, characterized in that: The recessed opening has an opening surface for receiving a splash of cooling liquid.

5. The power chip packaging module with heat dissipation function as claimed in claim 4, characterized in that: The three-dimensional vapor chamber element further comprises: A semi-open lower shell is coupled to the lower plate of the three-dimensional vapor chamber element to form a heat exchange chamber. The semi-open lower shell includes a spray head and has an input port and an output port. The input port inputs the cooling liquid. The spray head is connected to the input port to first spray the cooling liquid on the opening surface through the opening and the recessed opening, and then flows through the microchannels on the lower surface of the lower plate and the heat exchange chamber, and outputs the cooling liquid through the output port.

6. The power chip packaging module with heat dissipation function as claimed in claim 3, characterized in that: The channel width of the micro channels is less than or equal to 1 mm.

7. The power chip packaging module with heat dissipation function as claimed in claim 4, characterized in that: A plurality of heat dissipation structures are arranged on the opening surface, and the opening surface is located at a hot spot of the power chip.

8. The power chip packaging module with heat dissipation function as claimed in claim 2, characterized in that: The three-dimensional vapor chamber element further comprises a continuous multi-porous capillary structure, which is arranged on the copper upper cover and the lower plate in the closed air chamber.

9. The power chip packaging module with heat dissipation function as claimed in claim 1, characterized in that: The invention also comprises a half-open upper shell body, which is coupled to the copper upper cover to form an accommodating space for accommodating and protecting the power chip.

10. The power chip packaging module with heat dissipation function as claimed in claim 1, characterized in that: The vapor chamber further includes a plurality of fins, a plurality of microchannels, and a semi-open lower shell. The lower plate has a lower plate lower surface. The fins and the microchannels are arranged on the lower plate lower surface, and a lower opening is formed on the lower plate lower surface relative to the power chip. The semi-open lower shell is coupled to the lower plate to form a heat exchange cavity. The semi-open lower shell includes a spray head and has an input port and an output port. A cooling liquid is input into the input port. The spray head is connected to the input port to first spray the cooling liquid onto the lower plate lower surface through the lower opening, and then flow through the microchannels on the lower plate lower surface and the heat exchange cavity, and output the cooling liquid through the output port.

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