Triode with self-protection function
Through the design of hot -melt pieces and springs between the triode chip and the installation seat, the self -protection of the triode is achieved, preventing the problem of burning due to increased temperature, and improving the maintenance of the circuit.
Patent Information
- Application Number
- CN202323290970.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-04
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2033-12-04
AI Technical Summary
The transistor is easily burned due to the increase in temperature during use, especially when short circuit, overvoltage, overcurrent, etc. occur in the circuit.
A triode with self -protection is designed. By setting hot -melt pieces and springs between the triode chip and the installation seat, when the temperature is too high, the hot -melt sheet is stretched. The feet are separated, thereby disconnecting the power to prevent overload.
Effectively prevent the triode from burning out due to overload, and because the triode chip can be replaced, the maintenance of the circuit is improved.
Smart Images
Figure CN222421980U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field related to triodes, in particular to a triode with self-protection. Background Art
[0002] With the development of society, the use of electrical and electronic equipment is becoming more and more widespread. The triode is a basic semiconductor component with current amplification function. It is the core component of electronic circuits and is widely used in broadcasting, television, communications, radar, calculators, automatic control devices, electronic instruments, household appliances and other fields.
[0003] Transistors often generate heat during use. If short circuit, overvoltage, overcurrent, etc. occur in the circuit, the temperature of the transistor will be too high, which can easily burn the transistor. Utility Model Content
[0004] In order to solve the defects in the prior art, the utility model provides a triode with self-protection.
[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:
[0006] The utility model discloses a self-protecting triode, comprising a triode chip and a mounting seat, wherein the lower end of the triode chip is provided with three conductive contacts, the mounting seat is provided with insulating sleeves corresponding to the positions of the three conductive contacts, each of the insulating sleeves is fixedly connected with a pin, two springs are provided between the triode chip and the mounting seat, and hot melt sheets abutting the triode chip are fixedly installed between the two sides of the mounting seat and the two sides of the triode chip.
[0007] As a preferred technical solution of the utility model, a connector is provided at the upper end of the transistor chip, and a through hole is opened on the connector.
[0008] As a preferred technical solution of the utility model, the outer sides of the three conductive contacts at the lower end of the transistor chip are all provided with insulating card frames, and the three insulating sleeves are respectively inserted in the three insulating card frames.
[0009] As a preferred technical solution of the utility model, the three springs are all fixed on the transistor chip, and an anti-deflection column connected to the transistor chip is arranged in each spring.
[0010] As a preferred technical solution of the utility model, two sleeve frames are arranged on the mounting seat, and the positions of the two sleeve frames correspond to the positions of the two springs.
[0011] As a preferred technical solution of the utility model, plastic strips are provided at both ends of the hot melt sheet, mounting frames are provided on both sides of the transistor chip and both sides of the mounting seat, each mounting frame is threadedly connected with screws, and the plastic strips at both ends of the hot melt sheet are respectively located in two mounting frames on the same side.
[0012] As a preferred technical solution of the utility model, the two sides corresponding to each other of the mounting seat are fixedly connected with wave heat sinks, and the two wave heat sinks are respectively attached to the two side surfaces of the transistor chip.
[0013] The beneficial effects of the utility model are:
[0014] 1. This self-protective transistor is provided with a conductive contact, a pin, a spring and a hot melt. After the transistor chip is installed in the mounting seat, the hot melt is installed between the transistor chip and the two sides of the mounting seat. At this time, the hot melt will fix the position of the transistor chip and the mounting seat, and the insulating sleeve on the mounting seat will be stuck in the insulating card frame on the transistor chip. At this time, the conductive contact in the insulating card frame will be connected with the pin on the corresponding insulating sleeve, and the current will be transmitted to the transistor chip through the pin and the conductive contact, and the spring between the transistor chip and the mounting seat will be squeezed. When the temperature of the transistor chip is too high, the hot melt attached to the transistor chip will be stretched. At this time, under the elastic force of the spring, the conductive contact on the transistor chip will be separated from the pin on the mounting seat, thereby cutting off the power to the transistor chip to prevent the transistor chip from overloading;
[0015] Since the transistor chip is inserted into the mounting base, the transistor chip can still be replaced when the mounting base is soldered on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0017] Figure 1 This is a schematic diagram of the main structure of a self-protection triode of the utility model;
[0018] Figure 2 This is a schematic diagram of the connection structure of a triode chip and a conductive contact with self-protection in the utility model;
[0019] Figure 3 The utility model is a triode with self-protection Figure 1 The enlarged structural diagram at A in the middle;
[0020] Figure 4The utility model is a schematic diagram of a mounting base and an insulating sleeve connection structure of a self-protecting triode.
[0021] In the figure: 1. transistor chip; 2. conductive contact; 3. mounting seat; 4. insulating sleeve; 5. pin; 6. spring; 7. hot melt; 8. connector; 9. insulating card frame; 10. anti-deflection column; 11. sleeve frame; 12. mounting frame; 13. wave heat sink. DETAILED DESCRIPTION
[0022] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.
[0023] Example: Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the utility model is a self-protecting triode, comprising a triode chip 1 and a mounting seat 3, three conductive contacts 2 are arranged at the lower end of the triode chip 1, and an insulating sleeve 4 corresponding to the positions of the three conductive contacts 2 is arranged on the mounting seat 3, and a pin 5 is fixedly connected to each insulating sleeve 4, and two springs 6 are arranged between the triode chip 1 and the mounting seat 3, and hot melt sheets 7 attached to the triode chip 1 are fixedly installed between the two sides of the mounting seat 3 and the two sides of the triode chip 1. By setting the mounting seat 3, since the triode chip 1 is inserted in the mounting seat 3, when the mounting seat 3 is welded on the circuit board, the triode chip 1 can still be replaced, and by setting the spring 6, when the hot melt sheet 7 is heated and extended, under the elastic force of the spring 6, the conductive contact 2 on the triode chip 1 will be separated from the pin 5 on the mounting seat 3, thereby cutting off the power to the triode chip 1 to prevent the triode chip 1 from being overloaded.
[0024] A connector 8 is provided at the upper end of the transistor chip 1 , and a through hole is provided on the connector 8 . The connector 8 is provided to facilitate the insertion and removal of the transistor chip 1 on the circuit board.
[0025] Among them, the outer sides of the three conductive contacts 2 at the lower end of the transistor chip 1 are each provided with an insulating card frame 9, and the three insulating sleeves 4 are respectively inserted in the three insulating card frames 9. By setting the insulating card frames 9, when the transistor chip 1 is inserted in the mounting seat 3, the conductive contacts 2 in the insulating card frame 9 will be connected with the pins 5 in the corresponding insulating sleeves 4.
[0026] Among them, the three springs 6 are all fixed on the transistor chip 1, and each spring 6 is provided with an anti-deflection column 10 connected to the transistor chip 1. By providing the anti-deflection column 10, the spring 6 can be prevented from deflecting when being squeezed.
[0027] Among them, two sleeve frames 11 are arranged on the mounting seat 3, and the positions of the two sleeve frames 11 correspond to the positions of the two springs 6. By setting the sleeve frames 11, when the transistor chip 1 is inserted into the mounting seat 3, the spring 6 will touch the bottom inner wall of the sleeve frames 11, so that the spring 6 is compressed.
[0028] Among them, plastic strips are provided at both ends of the hot melt sheet 7, and mounting frames 12 are provided on both sides of the transistor chip 1 and both sides of the mounting seat 3. Screws are threadedly connected on each mounting frame 12. The plastic strips at both ends of the hot melt sheet 7 are respectively located in the two mounting frames 12 on the same side. By setting the mounting frame 12, it is convenient to fix the hot melt sheet 7 between the transistor chip 1 and the mounting seat 3.
[0029] Among them, the two corresponding sides of the mounting base 3 are fixedly connected with wave heat sinks 13, and the two wave heat sinks 13 are respectively attached to the two side surfaces of the transistor chip 1. By setting the wave heat sinks 13, the transistor chip 1 can be helped to dissipate heat.
[0030] During operation, first install the three pins 5 on the mounting seat 3 in the corresponding holes of the circuit board and solder them with tin liquid, then insert the appropriate transistor chip 1 into the mounting seat 3, and then install the hot melt sheet 7 between the transistor chip 1 and the two sides of the mounting seat 3. At this time, the hot melt sheet 7 will fix the position of the transistor chip 1 and the mounting seat 3, and the wavy heat sinks 13 located on both sides of the transistor chip 1 will be attached to the two sides of the transistor chip 1 to dissipate heat for the transistor chip 1, and the spring 6 between the transistor chip 1 and the mounting seat 3 will be squeezed, and the insulating sleeve 4 on the mounting seat 3 will be stuck in the insulating card frame 9 on the transistor chip 1. When the conductive contact piece 2 in the insulating card frame 9 is connected with the pin 5 on the corresponding insulating sleeve 4, the current will be transmitted to the transistor chip 1 through the pin 5 and the conductive contact piece 2. When the temperature of the transistor chip 1 is too high, the hot melt piece 7 attached to the transistor chip 1 will be stretched. At this time, under the elastic force of the spring 6, the conductive contact piece 2 on the transistor chip 1 will be separated from the pin 5 on the mounting seat 3, thereby cutting off the power to the transistor chip 1 to prevent the transistor chip 1 from being overloaded. At the same time, since the transistor chip 1 is inserted in the mounting seat 3, the transistor chip 1 can still be replaced when the mounting seat 3 is welded on the circuit board.
[0031] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A triode with self-protection, characterized in that: The invention comprises a transistor chip (1) and a mounting seat (3), wherein three conductive contacts (2) are arranged at the lower end of the transistor chip (1), and an insulating sleeve (4) corresponding to the positions of the three conductive contacts (2) is arranged on the mounting seat (3), and each insulating sleeve (4) is fixedly connected with a pin (5), and two springs (6) are arranged between the transistor chip (1) and the mounting seat (3), and hot melt sheets (7) abutting against the transistor chip (1) are fixedly installed between the two sides of the mounting seat (3) and the two sides of the transistor chip (1).
2. A self-protection transistor according to claim 1, characterized in that: A connector (8) is provided at the upper end of the triode chip (1), and a through hole is provided on the connector (8).
3. A self-protection transistor according to claim 1, characterized in that: An insulating card frame (9) is provided on the outer sides of the three conductive contacts (2) at the lower end of the triode chip (1), and the three insulating sleeves (4) are respectively inserted into the three insulating card frames (9).
4. A self-protection transistor according to claim 1, characterized in that: The three springs (6) are all fixed on the transistor chip (1), and each spring (6) is provided with an anti-deflection column (10) connected to the transistor chip (1).
5. A self-protection transistor according to claim 1, characterized in that: Two sleeve frames (11) are arranged on the mounting seat (3), and the positions of the two sleeve frames (11) correspond to the positions of the two springs (6).
6. A self-protection transistor according to claim 1, characterized in that: Plastic strips are provided at both ends of the hot melt sheet (7), mounting frames (12) are provided on both sides of the transistor chip (1) and both sides of the mounting seat (3), each mounting frame (12) is threadedly connected with a screw, and the plastic strips at both ends of the hot melt sheet (7) are respectively located in two mounting frames (12) on the same side.
7. A self-protection transistor according to claim 1, characterized in that: The mounting seat (3) has wavy heat sinks (13) fixedly connected to the two corresponding sides thereof, and the two wavy heat sinks (13) are respectively attached to the two side surfaces of the transistor chip (1).