Packaging structure for memory chip

Abstract

The utility model relates to the technical field of chip packaging, in particular to a packaging structure for a memory chip, which comprises a substrate, two storage chips are symmetrically and fixedly connected to the top of the substrate, the two storage chips are stacked, a plurality of flash memory chips are fixedly connected to the tops of the storage chips, and the flash memory chips are staggered and stacked. The first sliding grooves are symmetrically formed in the top of the substrate, the first sliding blocks are slidably connected to the inner side walls of the first sliding grooves, the supporting assemblies are fixedly connected to the tops of the first sliding blocks, the supporting assemblies can play a role in supporting the flash memory chip in a suspended state, the phenomenon that the flash memory chip collapses in the packaging process can be effectively prevented, and the packaging quality of the flash memory chip is improved. By splicing the clamping assembly, the supporting piece can reinforce the flash memory chips of different layers, and by rotating the adjusting assembly, the telescopic assembly is driven by the adjusting assembly to move to the tail end of the clamping assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a packaging structure for a memory chip. Background Art

[0002] A chip is a semiconductor plus an integrated circuit, which is a miniaturized circuit manufactured in a semiconductor wafer with certain special functions. Chips are divided into system chips and memory chips according to their uses. System chips integrate computers or specific electronic systems into a single chip through integrated circuits. Common system chips include CPU, GPU, DSP and Modem, etc. Packaging technology is a technology that packages integrated circuits with insulating plastic or ceramic materials. Packaging technology is necessary and crucial for chips, because chips must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, packaged chips are also easier to install and transport. The quality of packaging technology directly affects the performance of the chip itself and the design and manufacture of the PCB connected to it, so it is crucial. Therefore, a packaging structure for memory chips is required.

[0003] The memory chip packaging structure is a necessary process in chip production. The existing memory chip packaging is to first place the memory chip on the substrate by a stacking method, then place the flash memory chip on the substrate by a stacking method, and finally package the memory chip and the flash memory chip on the substrate by a plastic encapsulation resin; its specific structure is such as a memory chip packaging structure proposed by patent No. CN218241847U, including a plastic encapsulation material and a stacking body, the stacking body includes a substrate, a memory chipset, a flash memory chipset, a gasket and a control chip, the memory chipset includes a pair of memory chip stacks arranged side by side with a gap between the two, the gasket and the control chip are both arranged on the substrate and located in the gap, the flash memory chipset is stacked above the pair of memory chip stacks, and the lower end is abutted against the upper end of the gasket.

[0004] Through the above arrangement, the utility model described in the prior art stacks the memory chips on both sides of the substrate, reduces the stacking height, reduces the longitudinal space of the chip stack, and forms a tunnel between the memory chip stacks, arranges the gasket and the control chip in the tunnel, and reduces the lateral space of the chip stack; however, the memory chip packaging structure of the prior art solution has the following defects during operation:

[0005] (1) Memory chips require a certain stability when they are packaged. However, the above technical solution first places the memory chips on the substrate in a stacked manner, and then places multiple flash memory chips on top of the memory chips in a staggered stack. The chips are then packaged on the substrate with a plastic resin. However, the center of gravity of the staggered stack of flash memory chips is in a suspended position, and the spacing of the staggered stack is difficult to control, resulting in a deviation of the center of gravity. This can easily cause the flash memory chips to collapse, which requires restacking, further increasing the workload. Utility Model Content

[0006] The utility model is intended to provide a packaging structure for a memory chip, mainly for solving the technical problem in the prior art that, in the process of packaging the memory chip, the chip may collapse due to the lack of chip positioning.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0008] A packaging structure for a memory chip comprises a substrate, wherein two storage chips are symmetrically fixedly connected to the top of the substrate, the two storage chips are stacked, a plurality of flash memory chips are fixedly connected to the top of the storage chips, and the plurality of flash memory chips are staggered and stacked, a first slide groove is symmetrically provided on the top of the substrate, a first slider is slidably connected to the inner side wall of the first slide groove, a supporting component is fixedly connected to the top of the first slider, a locking component is movably connected to the end of the supporting component, a second slide groove is provided on the top of the first slider, an adjusting component is slidably connected to the inner side wall of the second slide groove, and a telescopic component is fixedly connected to the top of the sliding component.

[0009] The working principle and beneficial effects of the utility model:

[0010] 1. Working principle: When the memory chip and the flash memory chip are stacked and placed on the substrate, the first slider is slid to drive the support assembly to support the suspended flash memory chip, and the card assembly is spliced ​​to complete the support members of different lengths, and then the telescopic assembly is moved to the lower end of the card assembly by rotating the adjustment assembly, and finally the telescopic assembly is raised to support the suspended flash memory chip, thereby facilitating the packaging work of the plastic encapsulation resin and preventing the flash memory chip from collapsing.

[0011] 2. Beneficial effects:

[0012] (1) The prior art solves the technical problem of memory chip packaging. However, in the prior art memory chip packaging, the misaligned and stacked flash memory chips are prone to collapse during packaging, thereby increasing the workload of the staff. The present solution is provided with a support assembly, which drives the support assembly to move by moving the first slider, and then the support assembly can support the flash memory chip in a suspended state, which can effectively prevent the flash memory chip from collapsing during the packaging process. The support member can reinforce the flash memory chips at different levels by splicing the clamping assembly. The adjustment assembly is rotated to drive the telescopic assembly to move to the tail end of the clamping assembly, and finally the telescopic assembly is connected to the clamping assembly to complete the reinforcement work, thereby performing the packaging work of the plastic encapsulation resin.

[0013] Preferably: the support assembly includes a support column fixedly connected to the top of the first slider, the top of the support column is fixedly connected to a C-shaped seat, the top of the C-shaped seat is provided with a rectangular groove, and the two inner walls of the rectangular groove are provided with circular card grooves. The support assembly is used to reinforce the suspended flash memory chip, and by moving the first slider, the support assembly is driven by the first slider to move to the bottom of the flash memory chip to prevent the flash memory chip from collapsing.

[0014] Preferably: the locking assembly includes an L-shaped seat, a rectangular block is fixedly connected to the side wall of the L-shaped seat, both side walls of the rectangular block are provided with circular holes, the inner side wall of the circular hole is fixedly connected to a spring, the other end of the spring is fixedly connected to a latch, the latch is slidably connected to the inner side wall of the circular hole, and the side wall of the latch located at the outer end of the circular hole is rotatably connected to the inside of the circular slot, a rectangular slot is provided on the top of the L-shaped seat, a plurality of L-shaped seats are provided with rectangular slots on the top, and rectangular blocks are fixedly connected to the side walls of the plurality of L-shaped seats, the plurality of rectangular blocks are connected end to end in sequence through the latch and the circular slot, so as to fix flash memory chips at different levels, thereby preventing the flash memory chips from collapsing.

[0015] Preferably: the adjustment component includes a mounting hole that passes through the side wall of the first slider, the mounting hole is connected to the second slide groove, the inner side wall of the mounting hole is rotatably connected to the first screw rod, the end of the first screw rod is rotatably connected to the side wall of the second slide groove, the outer side wall of the first screw rod is threadedly connected to the second slider, the second slider is slidably connected to the inner side wall of the second slide groove, the first screw rod is rotated to make the second slider drive the telescopic component to move, thereby determining the spacing of the misalignment of the flash memory chip, which is convenient for its reinforcement.

[0016] Preferably: the telescopic assembly includes a sleeve fixedly connected to the top of the second slider, the top of the sleeve is rotatably connected to a threaded sleeve, the inner wall of the sleeve is slidably connected to a second screw rod, the second screw rod is threadedly connected to the threaded sleeve, the top of the second screw rod is fixedly connected to a mounting seat, the top of the mounting seat is fixedly connected to a rectangular block, the second screw rod is raised by rotating the threaded cap, so that the rectangular block is rotatably connected to the rectangular groove 22 through a pin, thereby achieving the purpose of reinforcing flash memory chips of different heights.

[0017] Preferably, it also includes a rotating block fixedly connected to the first screw rod on the outer side wall of the mounting hole, so that when the first screw rod is rotated, the rotating block can greatly save effort and facilitate operation.

[0018] Preferably: circular slots are provided on both inner side walls of the plurality of rectangular slots, circular holes are provided on both ends of the side walls of the plurality of rectangular blocks, and latches are slidably connected to the inner side walls of the circular holes, which are rotatably connected to the plurality of circular center slots through the plurality of latches, thereby enabling flash memory chips of different heights to be reinforced. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural diagram of this utility model patent;

[0020] Figure 2 This is a structural diagram of the first slider, the first slide groove and the base plate of the utility model patent;

[0021] Figure 3 This is a schematic diagram of the structure of the second sliding block and the second sliding groove of the utility model patent;

[0022] Figure 4 This is a structural diagram of the latch, the circular hole and the spring of the utility model patent;

[0023] The figure marks in the drawings of the specification include: 1. flash memory chip; 2. substrate; 3. first slide groove; 4. storage chip; 5. first slider; 6. C-shaped seat; 7. support column; 8. first screw rod; 9. rotating block; 10. mounting hole; 11. second slide groove; 12. second slider; 13. sleeve; 14. mounting seat; 15. L-shaped seat; 16. threaded sleeve; 17. second screw rod; 18. latch; 19. spring; 20. round hole; 21. rectangular block; 22. rectangular groove; 23. round card slot. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] like Figure 1 As shown, the substrate 2 is rectangular, and two storage chips 4 are symmetrically fixedly connected to the top of the substrate 2, and the two storage chips 4 are stacked, and a plurality of flash memory chips 1 are fixedly connected to the top of the storage chip 4, and the plurality of flash memory chips 1 are staggered and stacked, and the storage chip 4 and the flash memory chip 1 are stacked on the top of the substrate 2 in sequence, and then electrically connected through the substrate 2, the flash memory chip 1, the storage chip 4, and between the chip and the substrate 2 through gold wires;

[0026] like Figure 2 , 3 As shown in Figure 4, the top of the substrate 2 is symmetrically provided with a first slide groove 3, the inner side wall of the first slide groove 3 is slidably connected with a first slider 5, the top of the first slider 5 is fixedly connected with a support assembly, the support assembly includes a support column 7 fixedly connected to the top of the first slider 5, the top of the support column 7 is fixedly connected with a C-shaped seat 6, the top of the C-shaped seat 6 is provided with a rectangular groove 22, and the two inner side walls of the rectangular groove 22 are provided with circular card grooves 23. When the storage chip 4 and the flash memory chip 1 are stacked on the top of the substrate 2 in sequence, the first slider 5 is pushed to make the first slider 5 slide on the inner side wall of the first slide groove 3. In this process, the first slider 5 drives the support column 7 to approach one end of the flash memory chip 1, and the C-shaped seat 6 is used to reinforce the misaligned and stacked flash memory chip 1, thereby preventing the flash memory chip 1 from collapsing due to unstable center of gravity;

[0027] like Figure 2 , 3As shown in FIG. 4 , an L-shaped seat 15 is provided with a rectangular block 21 fixedly connected to the side wall of the L-shaped seat 15. The two side walls of the rectangular block 21 are provided with a circular hole 20. The inner side wall of the circular hole 20 is fixedly connected with a spring 19. The other end of the spring 19 is fixedly connected with a latch 18. The latch 18 is slidably connected to the inner side wall of the circular hole 20. The side wall of the latch 18 at the outer end of the circular hole 20 is rotatably connected to the inside of the circular slot 23. A rectangular slot 22 is provided on the top of the L-shaped seat 15. When there are many flash memory chips 1 stacked in an offset manner, the latch 18 on one L-shaped seat 15 is retracted first. To the inside of the circular hole 20, and then align the rectangular block 21 with the rectangular groove 22 on another L-shaped seat 15, and push the pin 18 into the inside of the circular card slot 23 through the compressed spring 19, and connect them end to end in sequence, so as to reinforce the multi-layer flash memory chip 1; the adjustment component includes a mounting hole 10 that penetrates and is opened on the side wall of the first slider 5, and the mounting hole 10 is connected to the second slide groove 11, and the inner side wall of the mounting hole 10 is rotatably connected to the first screw rod 8, and the end of the first screw rod 8 is rotatably connected to the side wall of the second slide groove 11, and the outer side wall of the first screw rod 8 A second slider 12 is threadedly connected, and the second slider 12 is slidably connected to the inner side wall of the second slide groove 11. The telescopic component includes a sleeve 13 fixedly connected to the top of the second slider 12, and the top of the sleeve 13 is rotatably connected to a threaded sleeve 16. The inner side wall of the sleeve 13 is slidably connected to a second screw rod 17, and the second screw rod 17 is threadedly connected to the threaded sleeve 16. The top of the second screw rod 17 is fixedly connected to a mounting seat 14, and the top of the mounting seat 14 is fixedly connected to a rectangular block 21. After multiple L-shaped seats 15 are connected end to end in sequence, by rotating the first screw rod 8, The second slider 12 moves inside the second slide groove 11, and the second slider 12 drives the sleeve 13 and the mounting seat 14 to move during the movement. When the mounting seat 14 moves to the tail of the L-shaped seat 15, the rotation of the first screw rod 8 is stopped, and the threaded sleeve 16 is rotated at this time to make the second screw rod 17 drive the mounting seat 14 to move upward, thereby moving the rectangular block 21 to a height suitable for the rectangular groove 22, and then the pin 18 is connected to the circular card groove 23 again, thereby completing the reinforcement of the flash memory chip 1, and finally completing the packaging work by plastic encapsulation resin.

[0028] From the above, it can be seen that the specific implementation of the utility model is as follows:

[0029] When the memory chip needs to be packaged, when the storage chip 4 and the flash memory chip 1 are stacked on the top of the substrate 2 in sequence, the first slider 5 is pushed to slide on the inner wall of the first slide groove 3. During this process, the first slider 5 drives the support column 7 to approach one end of the flash memory chip 1, and contacts the suspended part of the flash memory chip 1 through the top of the C-shaped seat 6. When there are many flash memory chips 1 stacked in an offset manner, the pin 18 on an L-shaped seat 15 is first retracted to the inside of the circular hole 20, and then the rectangular block 21 is aligned with the rectangular groove 22 on the other L-shaped seat 15. The pin 18 is pushed to the inside of the circular card groove 23 by the compressed spring 19, and the two are connected end to end in sequence, so as to reinforce the multi-layer flash memory chip 1. When multiple L-shaped seats are stacked After the ends of 15 are connected in sequence, the first screw rod 8 is rotated by the rotating block 9, so that the second slider 12 moves inside the second slide groove 11. The second slider 12 drives the sleeve 13 and the mounting seat 14 to move during the movement. When the mounting seat 14 moves to the tail of the L-shaped seat 15, the rotation of the first screw rod 8 is stopped. At this time, the threaded sleeve 16 is rotated to make the second screw rod 17 drive the mounting seat 14 to move upward, thereby moving the rectangular block 21 to a height suitable for the rectangular groove 22, and then the pin 18 is connected to the circular card groove 23 again, thereby completing the reinforcement of the flash memory chip 1, and then the substrate 2, the flash memory chip 1, the storage chip 4, and the chip and the substrate 2 are electrically connected through gold wires, and finally the packaging work is completed by plastic encapsulation resin.

[0030] The above is only an embodiment of the utility model, and the common knowledge such as the known specific structure and characteristics in the scheme is not described in detail here. It should be pointed out that for those skilled in the art, several deformations and improvements can be made without departing from the structure of the utility model, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A packaging structure for a memory chip, comprising a substrate (2), two storage chips (4) are symmetrically fixedly connected to the top of the substrate (2), the two storage chips (4) are stacked, a plurality of flash memory chips (1) are fixedly connected to the top of the storage chip (4), and the plurality of flash memory chips (1) are staggered and stacked, characterized in that: A first slide groove (3) is symmetrically provided on the top of the base plate (2); a first slider (5) is slidably connected to the inner wall of the first slide groove (3); a support assembly is fixedly connected to the top of the first slider (5); a locking assembly is movably connected to the end of the support assembly; a second slide groove (11) is provided on the top of the first slider (5); an adjustment assembly is slidably connected to the inner wall of the second slide groove (11); and a telescopic assembly is fixedly connected to the top of the sliding assembly.

2. The packaging structure for a memory chip according to claim 1, characterized in that: The support assembly comprises a support column (7) fixedly connected to the top of the first sliding block (5); the top of the support column (7) is fixedly connected to a C-shaped seat (6); the top of the C-shaped seat (6) is provided with a rectangular groove (22); and both inner side walls of the rectangular groove (22) are provided with circular slots (23).

3. The packaging structure for a memory chip according to claim 1, characterized in that: The clamping assembly comprises an L-shaped seat (15), a rectangular block (21) is fixedly connected to the side wall of the L-shaped seat (15), both side walls of the rectangular block (21) are provided with circular holes (20), a spring (19) is fixedly connected to the inner side wall of the circular hole (20), the other end of the spring (19) is fixedly connected to a latch (18), the latch (18) is slidably connected to the inner side wall of the circular hole (20), and the side wall of the latch (18) located at the outer end of the circular hole (20) is rotatably connected to the inside of a circular clamping groove (23), and a rectangular groove (22) is provided on the top of the L-shaped seat (15).

4. The packaging structure for a memory chip according to claim 1, characterized in that: The adjustment component comprises a mounting hole (10) extending through the side wall of the first sliding block (5), the mounting hole (10) being connected to the second sliding groove (11), the inner side wall of the mounting hole (10) being rotatably connected to the first screw rod (8), the end of the first screw rod (8) being rotatably connected to the side wall of the second sliding groove (11), the outer side wall of the first screw rod (8) being threadedly connected to the second sliding block (12), and the second sliding block (12) being slidably connected to the inner side wall of the second sliding groove (11).

5. The packaging structure for a memory chip according to claim 1, characterized in that: The telescopic assembly comprises a sleeve (13) fixedly connected to the top of the second sliding block (12); the top of the sleeve (13) is rotatably connected to a threaded sleeve (16); the inner side wall of the sleeve (13) is slidably connected to a second screw rod (17); the second screw rod (17) is threadedly connected to the threaded sleeve (16); the top of the second screw rod (17) is fixedly connected to a mounting seat (14); and the top of the mounting seat (14) is fixedly connected to a rectangular block (21).

6. The packaging structure for a memory chip according to claim 4, characterized in that: It also includes a rotating block (9) fixedly connected to the first screw rod (8) and located on the outer side wall of the mounting hole (10).

7. The packaging structure for a memory chip according to claim 2, characterized in that: Both inner side walls of the plurality of rectangular grooves (22) are provided with circular clamping grooves (23).

8. The packaging structure for a memory chip according to claim 3, characterized in that: Both ends of the side walls of the plurality of rectangular blocks (21) are provided with circular holes (20), and the inner side walls of the circular holes (20) are slidably connected with latches (18).

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