Insulating substrate and optical driving base

Abstract

The utility model discloses an insulating substrate and an optical driving base, and the insulating substrate comprises a main body part and a conducting strip. The conducting strip is arranged on the main body part; the conducting strip at least comprises a first conducting part arranged on the first surface of the main body part and a second conducting part arranged on the second surface of the main body part, and the first conducting part and the second conducting part are jointly used for being connected with an external connecting terminal; wherein the first surface and the second surface are adjacent surfaces of the main body part. The insulating substrate and the optical driving base are used for improving the stability of the connection between the conducting strip and the connecting terminal.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to an insulating substrate and an optical driving base. Background Art

[0002] The motor is one of the main components for realizing the focus or anti-shake function of the camera module. The motor usually includes an optical drive base and various electronic components installed on the optical drive base, as well as focusing or anti-shake components such as coils and magnets. The optical drive base usually contains an insulating substrate, such as a ceramic substrate, on which a number of connecting circuits, pads and conductive sheets are provided. Among them, the conductive sheet is used to connect to the connecting terminal so that the external component can be electrically connected to the insulating substrate through the connecting terminal.

[0003] The existing conductive sheet is usually connected to the connection terminal by spot soldering, which can achieve electrical connection between the conductive sheet and the connection terminal while fixing the insulating substrate to the connection terminal. The existing conductive sheet is usually a sheet structure, and the conductive sheet is parallel to the connection terminal, and one surface of the conductive sheet is parallel to one surface of the connection terminal and is fixed by welding. The welding effect of the conductive sheet and the connection terminal in a single plane is limited, and the conductive sheet and the connection terminal may be separated, thereby affecting the use of the motor. Utility Model Content

[0004] The utility model aims to provide an insulating substrate and an optical driving base, which are used to improve the stability of the connection between the conductive sheet and the connecting terminal.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] An insulating substrate, comprising:

[0007] Main body;

[0008] A conductive sheet, disposed on the main body; the conductive sheet at least comprises a first conductive portion disposed on a first surface of the main body, and a second conductive portion disposed on a second surface of the main body, wherein the first conductive portion and the second conductive portion are used together to connect to an external connection terminal;

[0009] Wherein, the first surface and the second surface are adjacent surfaces of the main body.

[0010] Preferably, the second surface of the main body is provided with a receiving hole recessed toward the inner side of the main body, and the second conductive part is received in the receiving hole.

[0011] Preferably, the second conductive portion is provided with a concave structure matching with the hole wall of the accommodating hole;

[0012] And / or, the first conductive portion is a flat plate structure parallel to the first surface.

[0013] Preferably, the second conductive portion comprises a metal bottom layer and a metal plating layer which are stacked, the metal bottom layer is arranged on a side close to the hole wall of the receiving hole, and the metal plating layer is arranged on a side of the metal bottom layer away from the hole wall of the receiving hole;

[0014] And / or, the first conductive part includes a metal bottom layer and a metal plating layer, the metal bottom layer is arranged on the first surface, and the metal plating layer is arranged on a side of the metal bottom layer away from the first surface.

[0015] Preferably, the second conductive portion includes a pair of cutting planes close to the outermost side of the second surface and an arcuate surface connected between the pair of cutting planes, the cutting planes present the metal base layer and the metal plating layer, and the arcuate surface presents the metal plating layer.

[0016] Preferably, the metal base layer is a copper layer; the metal plating layer includes a nickel layer and a gold layer stacked in sequence, or the metal plating layer includes a nickel layer and a silver layer stacked in sequence.

[0017] Preferably, the concave structure of the second conductive portion is in a sector ring or semicircular shape along a transverse cross section parallel to the first surface; the accommodating hole is a semi-hole-shaped through hole or a blind hole;

[0018] And / or, the first surface is a surface of the main body along the thickness direction; the second surface is a side surface of the main body.

[0019] Preferably, a plurality of the conductive sheets are provided, and the plurality of the conductive sheets are distributed at least on two opposite sides of the main body, and the plurality of the conductive sheets are arranged at intervals;

[0020] And / or, the insulating substrate is a ceramic substrate.

[0021] An optical drive base, comprising:

[0022] Any one of the above-mentioned insulating substrates, insulating bases and electronic components, wherein the insulating substrate is further provided with pads and conductive circuits for connecting the electronic components, and the insulating base is provided with connecting terminals electrically connected to the conductive sheets.

[0023] Preferably, the connecting terminal and the conductive sheet are soldered together, and the solder covers at least a portion of the first conductive portion and at least a portion of the second conductive portion.

[0024] Preferably, the second conductive portion is provided with a concave structure recessed toward the inside of the main body portion, and the concave structure is used to accommodate solder.

[0025] Preferably, the first conductive portion of the conductive sheet is arranged flush with the connecting terminal, and solder covers a portion of the connecting terminal, the first conductive portion, and the second conductive portion.

[0026] Preferably,

[0027] The insulating base is provided with a first cavity and a second cavity connected to each other, a step surface is formed at the connection between the first cavity and the second cavity, at least a part of the connecting terminal is exposed on the step surface, and the insulating substrate is installed in the first cavity.

[0028] Preferably, the first conductive portion of the conductive sheet is stacked with the connecting terminal, and solder covers a portion of the connecting terminal, between the first conductive portion and the connecting terminal, and on the second conductive portion.

[0029] Preferably, the insulating base is provided with a third cavity, at least a portion of the connecting terminal is exposed from a bottom wall forming the third cavity, and the insulating substrate is installed in the third cavity.

[0030] Compared with the prior art, the beneficial effects of the present invention include at least:

[0031] By using the first conductive part and the second conductive part to form a conductive sheet with a three-dimensional structure, the electrical connection contact area between the conductive sheet and the connecting terminal is increased, and the connection stability between the conductive sheet and the connecting terminal is improved. Therefore, when the connecting terminal and the conductive sheet are fixed by welding or the like, the connection stability between the connecting terminal and the conductive sheet with the three-dimensional structure is increased, and the risk of the conductive sheet and the connecting terminal falling off is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of an insulating substrate according to an embodiment of the utility model;

[0033] Figure 2 This is a schematic structural diagram of an insulating substrate and a connecting terminal in an embodiment of the utility model when they are connected;

[0034] Figure 3 It is a structural schematic diagram of an insulating substrate of another embodiment of the utility model;

[0035] Figure 4 This is a structural schematic diagram of another embodiment of the utility model when the insulating substrate is connected to the connecting terminal;

[0036] Figure 5 It is a schematic structural diagram of a conductive sheet according to an embodiment of the utility model;

[0037] Figure 6 It is a structural schematic diagram of an optical drive base according to an embodiment of the utility model;

[0038] Figure 7 is a cross-sectional view of an optical drive base according to an embodiment of the utility model;

[0039] Figure 8 yes Figure 7 Enlarged view of part A in the middle;

[0040] Fig. 9 is a cross-sectional view of an optical drive base according to another embodiment of the utility model;

[0041] Fig.10 yes Fig. 9 Enlarged view of part B in the middle.

[0042] In the figure: 1. insulating substrate; 11. main body; 111. first surface; 112. second surface; 1121. accommodating hole; 12. conductive sheet; 121. first conductive part; 122. second conductive part; 1221. cutting plane; 1222. arc surface; 13. soldering pad; 2. connecting terminal; 3. insulating base; 31. first concave cavity; 32. second concave cavity; 33. third concave cavity; 331. bottom wall; 34. step surface; 4. electronic component; 5. solder. DETAILED DESCRIPTION

[0043] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0044] The words expressing positions and directions described in the present utility model are all explained by taking the drawings as examples, but they can be changed as needed, and all the changes are included in the protection scope of the present utility model.

[0045] like Figure 1 As shown, the utility model provides an insulating substrate 1, including a main body 11 and a conductive sheet 12 connected to the main body 11. The insulating substrate 1 may further include a wire circuit and a pad 13.

[0046] The main body 11 is made of insulating material, for example, the main body 11 is made of ceramic material, and the insulating substrate 1 can be a ceramic substrate. The main body 11 can be a rectangular plate-shaped structure. The conductive sheet 12, the conductive circuit, the pad 13 and other structures are all installed on the main body 11. Among them, the conductive circuit can be distributed on two opposite surfaces of the main body 11 along its thickness direction, and the conductive circuit can be electrically connected to the conductive circuit, the conductive sheet 12 or the pad 13 located on the other surface of the main body 11 through a conductive through hole or a conductive column.

[0047] The conductive sheet 12 is used to connect the external connection terminal 2. The conductive sheet 12 and the connection terminal 2 can be connected and fixed by welding with solder 5. In other embodiments, the conductive sheet 12 and the connection terminal 2 can also be fixed by bonding with conductive adhesive, and the conductive sheet 12 can be in a three-dimensional structure. One or more conductive sheets 12 can be provided. When the conductive sheet 12 is provided in plurality, the plurality of conductive sheets 12 are arranged at intervals, and the plurality of conductive sheets 12 are distributed at least on the opposite sides of the main body 11. For example, one or more conductive sheets 12 are provided on the opposite sides along the length direction or the width direction of the main body 11, or one or more conductive sheets 12 can be provided on the four sides of the main body 11, which is not limited here.

[0048] Reference Figure 1 and Figure 5 In some specific embodiments, the conductive sheet 12 may include a first conductive portion 121 disposed on the first surface 111 of the main body 11, and a second conductive portion 122 disposed on the second surface 112 of the main body 11, and the first conductive portion 121 and the second conductive portion 122 located on different surfaces together form a conductive sheet 12 with a three-dimensional structure. Both the first conductive portion 121 and the second conductive portion 122 can be used for welding with the connecting terminal 2, thereby increasing the electrical connection area between the conductive sheet 12 and the connecting terminal 2, improving the electrical connection stability between the conductive sheet 12 and the connecting terminal 2, and the stability of the connection between the conductive sheet 12 and the connecting terminal 2. Among them, the first surface 111 and the second surface 112 may be adjacent surfaces of the main body 11. For example, the first surface 111 is a surface of the main body 11 along the thickness direction; the second surface 112 is a side surface of the main body 11. In other embodiments, the conductive sheet 12 may also include a third conductive portion or more conductive portions, and the multiple conductive portions are distributed on different surfaces of the main body 11, and the multiple surfaces for setting the multiple conductive portions may be adjacent to each other.

[0049] The first conductive portion 121 may be a flat plate structure parallel to the first surface 111. When connected to the connection terminal 2, the first conductive portion 121 may be parallel to the connection terminal 2.

[0050] Reference Figure 2 In some specific embodiments, the first conductive portion 121 may be flush with the connection terminal 2 of the optical drive base, that is, a surface of the first conductive portion 121 along its thickness direction is flush with a surface of the connection terminal 2 along its thickness direction. The first surface 111 may be the upper surface of the main body 11, and is used to form structures such as the pad 13, and the second conductive portion 122 is located below the first conductive portion 121. Spot soldering is performed on the flush surfaces of the first conductive portion 121 and the connection terminal 2 to achieve connection between the conductive sheet 12 and the connection terminal 2.

[0051] Reference Figure 3 and Figure 4 In some other specific embodiments, the first conductive part 121 is stacked with the connection terminal 2. The first surface 111 may be the lower surface of the main body 11, and the second conductive part 122 is located above the first conductive part 121. Solder 5 may be added to the surface of the connection terminal 2 for contacting with the first conductive part 121, and then the first conductive part 121 is stacked and placed on the surface to achieve welding of the conductive sheet 12 and the connection terminal 2. Among them, the first conductive part 121 may be a metal bottom layer formed on the first surface 111 of the main body 11 and a metal plating layer arranged on the metal bottom layer. The metal bottom layer may be a copper layer, and the metal plating layer is arranged on the side of the metal bottom layer away from the first surface 111. The metal plating layer may be a layered structure with strong bonding with the solder 5 and conducive to tin aggregation. For example, the metal plating layer is a nickel layer and a gold layer stacked in sequence, and the gold layer may be arranged on the side of the nickel layer away from the first surface 111; or, the metal plating layer includes a nickel layer and a silver layer stacked in sequence, and the silver layer may be arranged on the side of the nickel layer away from the first surface 111.

[0052] Reference Figure 5 , the second conductive part 122 may be provided with a concave structure that is recessed toward the inside of the main body 11. When the second conductive part 122 is spot-soldered with the connecting terminal 2, the solder 5 may climb along the surface of the second conductive part 122 and be contained in the concave structure of the second conductive part 122, so as to facilitate the gathering of the solder 5. Moreover, gathering the solder 5 in the concave structure of the second conductive part 122 may also reduce the extra space required to be occupied by the solder 5 when it bulges outward, thereby improving space utilization. Among them, the concave structure of the second conductive part 122 may be fan-shaped along the transverse section parallel to the first surface 111, for example, the concave structure of the second conductive part 122 may be a columnar structure with a semicircular ring cross-section along the transverse section parallel to the first surface 111.

[0053] To form the second conductive part 122, the main body 11 may be provided with a receiving space for accommodating the second conductive part 122. Specifically, the second surface 112 of the main body 11 is provided with a receiving hole 1121 recessed toward the inner side of the main body 11. The second conductive part 122 is received in the receiving hole 1121, and the concave surface structure of the second conductive part 122 matches the hole wall of the receiving hole 1121. The second conductive part 122 may be a metal bottom layer formed in the receiving hole 1121 of the main body 11. Alternatively, to improve the welding reliability between the second conductive part 122 and the connecting terminal 2, the second conductive part 122 is a metal bottom layer and a metal plating layer formed in the receiving hole 1121 of the main body 11. The metal bottom layer and the metal plating layer are stacked. For example, the metal bottom layer is arranged on one side of the hole wall of the receiving hole 1121 of the main body 11, and the metal plating layer is arranged on the side of the metal bottom layer facing the outside of the main body 11, that is, the side away from the hole wall of the receiving hole 1121, and the metal plating layer is mainly used to contact with the solder 5. Among them, the metal bottom layer can be a copper layer. The metal plating layer can be a layered structure that has a strong bonding force with the solder 5 and is conducive to tin polymerization. For example, the metal plating layer is a nickel layer and a gold layer stacked in sequence, and the gold layer can be arranged on the side of the nickel layer facing the outside of the main body 11; or, the metal plating layer includes a nickel layer and a silver layer stacked in sequence, and the silver layer can be arranged on the side of the nickel layer facing the outside of the main body 11.

[0054] Among them, the accommodation hole 1121 of the main body 11 can be formed by opening a hole on the main body substrate. The second conductive part 122 is formed in the hole of the main body substrate. Specifically, the main body 11 is a partial structure obtained by cutting along the hole on the main body substrate. A hole will be opened in the main body substrate first, and the hole can be a through hole or a blind hole. Then, a metal base layer that is close to forming the hole wall and a metal plating layer that is close to the metal base layer will be formed in the hole. Here, the metal base layer and the metal plating layer can both be a columnar structure with a circular cross-section. If the hole of the main body substrate is relatively small, the metal plating layer can also fill the hole to form a cylindrical structure. After that, the main board substrate is cut, and the hole is cut into two half holes. The half hole located on the main body 11 forms a accommodating hole 1121 for accommodating the second conductive part 122, and the metal base layer and metal plating layer placed in the half hole form the second conductive part 122. Therefore, when the metal plating layer does not fill the hole, the concave structure of the second conductive part 122 along the transverse section parallel to the first surface 111 can be fan-shaped, and the second conductive part 122 is a columnar structure with a semicircular cross-section; the metal plating layer can also fill the hole to form a cylindrical structure, in which case the concave structure of the conductive part 122 along the transverse section parallel to the first surface 111 can be semicircular, and the second conductive part 122 is a semi-cylindrical structure. In one embodiment, as Figure 5As shown, the second conductive part 122 includes a pair of cutting planes 1221 close to the outermost side of the second surface 112 and an arc surface 1222 connected between the pair of cutting planes 1221. The cutting plane 1221 presents a metal bottom layer and a metal plating layer, while the arc surface 1222 presents only a metal plating layer. When the hole opened on the substrate of the main body is a through hole, the receiving hole 1121 of the main body 11 is a through hole-like structure that penetrates the main body 11 along the thickness direction of the main body 11, specifically a semi-hole-like through hole structure; when the hole opened on the substrate of the main body is a blind hole, the receiving hole 1121 of the main body 11 is a semi-hole-like blind hole structure that is recessed along the thickness direction of the main body 11. When the receiving hole 1121 is a blind hole structure, the bottom wall of the receiving hole 1121 can be used to support the solder 5 to prevent the solder 5 contained in the receiving hole 1121 from falling off due to self-weight or other reasons.

[0055] Reference Figure 6 The utility model also provides an optical drive base, which can be used in the optical drive mechanism of the camera module to drive optical components such as lens components or aperture components. The optical drive base can be a focus motor base, an anti-shake motor base, an aperture component base, a periscope motor base, a voice coil motor base, etc. The optical drive base includes the above-mentioned insulating substrate 1 and the connecting terminal 2, and can also include an insulating base 3 and an electronic component 4.

[0056] The electronic component 4 is electrically connected to the insulating substrate 1 through the pad 13 on the insulating substrate 1. The electronic component 4 may be a high-density integrated circuit, IC, capacitor, Hall element or other element.

[0057] The connection terminal 2 is used to electrically connect to the conductive sheet 12 in the insulating substrate 1, so that the insulating substrate 1 and the electronic component 4 connected to the insulating substrate 1 can be electrically connected to the external components of the optical drive base through the connection terminal 2. The connection terminal 2 can be embedded in the insulating base 3, and at least a portion of the connection terminal 2 is exposed outside the insulating base 3 for connecting to the conductive sheet 12.

[0058] Reference Figure 7 and Figure 8When the first conductive portion 121 is stacked with the connection terminal 2, the insulating base 3 may be provided with a third cavity 33, and the third cavity 33 is used to accommodate components such as the insulating substrate 1 and the electronic component 4. At least a portion of the connection terminal 2 is exposed from the bottom wall 331 forming the third cavity 33, for example, the upper surface of the connection terminal 2 is exposed from the bottom wall 331. Solder 5 may be added to the portion of the connection terminal 2 exposed from the bottom wall 331 first, and then, after the insulating substrate 1 is installed in the third cavity 33, the first conductive portion 121 in the insulating base 3 is stacked on the portion of the connection terminal 2 exposed from the bottom wall 331, so that the first conductive portion 121 and the connection terminal 2 can be fixed by soldering with the solder 5. Since the second conductive part 122 is formed with a metal plating layer for tin aggregation, the solder 5 will have a tin climbing phenomenon and gather toward the concave structure of the second conductive part 122, so the solder 5 covers part of the connecting terminal 2, between the first conductive part 121 and the connecting terminal 2, and on the second conductive part 122, so that the second conductive part 122 and the connecting terminal 2 can be welded and fixed by the solder 5. By arranging the first conductive part 121 to be stacked with the connecting terminal 2, so that the second conductive part 122 is located above the first conductive part 121, it is convenient to observe the welding condition of the second conductive part 122, and the welding stability between the conductive sheet 12 and the connecting terminal 2 can also be improved.

[0059] Reference Fig. 9 and Fig.10 When the first conductive portion 121 is arranged flush with the connection terminal 2, the insulating base 3 is provided with a first cavity 31 and a second cavity 32 that are connected to each other, and a step surface 34 is formed at the connection between the first cavity 31 and the second cavity 32. The first cavity 31 can be arranged on one side of the insulating base 3 adjacent to the bottom, and the first cavity 31 is used to accommodate the insulating substrate 1. The second cavity 32 is used to accommodate components such as the electronic component 4. At least a portion of the connection terminal 2 is exposed on the step surface 34, for example, the upper surface of the connection terminal 2 is exposed on the step surface 34, and the side surface of the connection terminal 2 can extend to the first cavity 31 and be exposed to the first cavity 31. After the insulating substrate 1 is installed in the first cavity 31, the first conductive part 121 is flush with the connecting terminal 2, and the upper surfaces of the first conductive part 121 and the connecting terminal 2 are soldered with solder 5. Due to its own weight and the tin-collecting effect of the second conductive part 122, the solder 5 will gather in the concave structure of the second conductive part 122 and can protrude from the concave structure and be arranged between the connecting terminal 2 and the second conductive part 122. Therefore, the solder 5 covers part of the connecting terminal 2, the first conductive part 121 and the second conductive part 122, so that the second conductive part 122 and the connecting terminal 2 can be fixed by soldering with solder 5.

[0060] By adopting the three-dimensional conductive sheet 12, the electrical connection area between the conductive sheet 12 and the connection terminal 2 is effectively increased, the connection reliability between the conductive sheet 12 and the connection terminal 2 is improved, and the stability of the insulating substrate 1 installed on the insulating base 3 is also improved. In addition, the second conductive portion 122 is provided with a concave structure, which can reduce the portion of the solder 5 protruding from the insulating substrate 1, saving the space of the cavity in the insulating base 3 for installing the insulating substrate 1.

[0061] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the utility model. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the utility model.

Claims

1. An insulating substrate, characterized in that: include: A main body (11); A conductive sheet (12) disposed on the main body (11); the conductive sheet (12) at least comprises a first conductive portion (121) disposed on a first surface (111) of the main body (11), and a second conductive portion (122) disposed on a second surface (112) of the main body (11); the first conductive portion (121) and the second conductive portion (122) are used together to connect to an external connection terminal (2); Wherein, the first surface (111) and the second surface (112) are adjacent surfaces of the main body (11).

2. The insulating substrate according to claim 1, characterized in that The second surface (112) of the main body (11) is provided with a receiving hole (1121) recessed toward the inside of the main body (11), and the second conductive part (122) is received in the receiving hole (1121).

3. The insulating substrate according to claim 2, characterized in that The second conductive portion (122) is provided with a concave structure that matches with the hole wall of the accommodating hole (1121); And / or, the first conductive portion (121) is a flat plate structure parallel to the first surface (111).

4. The insulating substrate according to claim 3, characterized in that The second conductive portion (122) comprises a metal bottom layer and a metal plating layer which are stacked, the metal bottom layer being arranged on a side close to the hole wall of the receiving hole (1121), and the metal plating layer being arranged on a side of the metal bottom layer away from the hole wall of the receiving hole (1121); And / or, the first conductive part (121) comprises a metal base layer and a metal plating layer, the metal base layer is arranged on the first surface (111), and the metal plating layer is arranged on a side of the metal base layer away from the first surface (111).

5. The insulating substrate according to claim 4, characterized in that The second conductive portion (122) comprises a pair of cutting planes (1221) close to the outermost sides of the second surface (112) and an arcuate surface (1222) connected between the pair of cutting planes (1221), the cutting planes (1221) present the metal base layer and the metal coating, and the arcuate surface (1222) presents the metal coating.

6. The insulating substrate according to claim 4, characterized in that The metal base layer is a copper layer; the metal plating layer comprises a nickel layer and a gold layer stacked in sequence, or the metal plating layer comprises a nickel layer and a silver layer stacked in sequence.

7. The insulating substrate according to claim 3, characterized in that The concave structure of the second conductive portion (122) is in the shape of a fan ring or a semicircle along a transverse cross section parallel to the first surface (111); the accommodating hole (1121) is a semi-hole-shaped through hole or a blind hole; And / or, the first surface (111) is a surface of the main body (11) along the thickness direction; and the second surface (112) is a side surface of the main body (11).

8. The insulating substrate according to claim 1, characterized in that A plurality of the conductive sheets (12) are provided, the plurality of the conductive sheets (12) are distributed at least on two opposite sides of the main body (11), and the plurality of the conductive sheets (12) are arranged at intervals; And / or, the insulating substrate (1) is a ceramic substrate.

9. An optical drive base, characterized in that: include: According to any one of claims 1 to 8, the insulating substrate (1), the insulating base (3) and the electronic component (4), the insulating substrate (1) is further provided with a soldering pad (13) and a conductive circuit for connecting the electronic component, and the insulating base (3) is provided with a connecting terminal (2) electrically connected to the conductive sheet (12).

10. The optical drive base according to claim 9, characterized in that: The connecting terminal (2) and the conductive sheet (12) are welded together by solder (5), and the solder (5) covers at least a portion of the first conductive portion (121) and at least a portion of the second conductive portion (122).

11. The optical drive base according to claim 10, characterized in that: The second conductive portion (122) is provided with a concave structure recessed toward the inside of the main body portion (11), and the concave structure is used to accommodate solder.

12. The optical drive base according to claim 11, characterized in that: The first conductive portion (121) of the conductive sheet (12) is arranged flush with the connecting terminal (2), and the solder (5) covers part of the connecting terminal (2), the first conductive portion (121) and the second conductive portion (122).

13. The optical drive base according to claim 12, characterized in that: The insulating base (3) is provided with a first cavity (31) and a second cavity (32) which are connected to each other, a step surface (34) is formed at the connection between the first cavity (31) and the second cavity (32), at least a part of the connecting terminal (2) is exposed on the step surface (34), and the insulating substrate (1) is installed in the first cavity (31).

14. The optical drive base according to claim 11, characterized in that: The first conductive part (121) of the conductive sheet (12) and the connecting terminal (2) are stacked, and the solder (5) covers part of the connecting terminal (2), between the first conductive part (121) and the connecting terminal (2), and on the second conductive part (122).

15. The optical drive base according to claim 14, characterized in that: The insulating base (3) is provided with a third cavity (33), at least a portion of the connecting terminal (2) is exposed on a bottom wall (331) forming the third cavity (33), and the insulating substrate (1) is installed in the third cavity (33).

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