Socket

Abstract

The utility model provides a socket. The socket comprises a housing with an opening side; the grounding component is at least partially accommodated in the shell and divides the space into a first area and a second area; a first insulating member accommodated in the first region and adjacent to the grounding member; the first circuit board component is accommodated in the first area and is adjacent to the opening side, and an interface is arranged on the first circuit board component; the first heat conduction part is arranged between the first circuit board part and the first insulation part and guides heat of the first circuit board part to the grounding part; a second insulating member accommodated in the second region and adjacent to the grounding member; the second circuit board component is accommodated in the second area; the second heat conduction part is arranged between the second circuit board part and the second insulation part and guides heat of the second circuit board part to the grounding part; and a surface cover mounted to the open side and including a slot to expose the interface to the outside. The socket has a better heat dissipation effect, and heat accumulation in the socket can be reduced.

Description

Technical Field

[0001] The utility model relates to the electrical field, and more specifically, to a socket. Background Art

[0002] With the popularization of electronic devices, many sockets in application scenarios provide not only AC interfaces but also DC interfaces to provide both AC and DC outputs to meet the needs of different electronic devices. Compared with only AC interfaces, sockets with both types of interfaces often have additional circuit board components to, for example, convert external AC power into current suitable for DC interface output.

[0003] However, when a DC power output is provided to an electronic device through a DC interface, the electronic components on the circuit board will emit heat. If the heat inside the socket cannot be removed in time, the heat accumulated inside the socket will easily cause damage to the electronic components and even pose a safety hazard. Therefore, a socket with good heat dissipation effect is urgently needed. Utility Model Content

[0004] In order to solve one or more of the above problems existing in the prior art, each embodiment of the utility model provides an improved socket.

[0005] According to one aspect of the present invention, a socket comprises: a shell, which comprises an open side; a grounding component, which is at least partially accommodated in the shell and divides the space in the shell into a first area and a second area; a first insulating component, which is accommodated in the first area and arranged adjacent to the grounding component; a first circuit board component, which is accommodated in the first area and arranged adjacent to the open side of the shell, and an interface is arranged on the first circuit board component; a first heat-conducting component, which is arranged between the first circuit board component and the first insulating component, and is configured to guide the heat of the first circuit board component to the grounding component via the first insulating component for heat dissipation; a second insulating component, which is accommodated in the second area and arranged adjacent to the grounding component; a second circuit board component, which is accommodated in the second area and electrically connected to the first circuit board component; a second heat-conducting component, which is arranged between the second circuit board component and the second insulating component, and is configured to guide the heat of the second circuit board component to the grounding component via the second insulating component for heat dissipation; and a cover, which is mounted to the open side of the shell, and the cover comprises a slot to expose the interface to the outside.

[0006] In one embodiment, the second insulating component includes a bracket having an insulating plate, and the bracket is configured to support the grounding component, the first insulating component, the first heat-conducting component and the first circuit board component located in the first area, and the second heat-conducting component and the second circuit board component located in the second area.

[0007] In one embodiment, the insulating plate is made of plastic.

[0008] In one embodiment, the thickness of the insulating plate is no greater than 1.5 mm.

[0009] In one embodiment, the thickness of the insulating plate is 1.2 mm.

[0010] In one embodiment, the first insulating component and / or the second insulating component comprises Mylar sheet.

[0011] In one embodiment, the first heat-conducting component and / or the second heat-conducting component comprises a heat-conducting silicone pad.

[0012] In one embodiment, heat dissipation holes are formed on the housing.

[0013] In one embodiment, the interface comprises at least one DC interface.

[0014] In one embodiment, the grounding component includes an arm portion configured to extend to an exterior of the housing when the grounding component is at least partially received within the housing.

[0015] In the socket of each embodiment of the utility model, by arranging a first heat-conducting component between the first circuit board component and the grounding component and arranging a second heat-conducting component between the second circuit board component and the grounding component, the heat of the first circuit board component and the second circuit board component can be effectively conducted to the grounding component, thereby reducing heat accumulation in the socket. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The embodiments are shown and explained with reference to the accompanying drawings. These drawings are used to explain the basic principles, and only the aspects necessary for understanding the basic principles are shown. These drawings are not to scale. In the drawings, the same reference numerals represent the same or similar features.

[0017] Figure 1 A schematic diagram of an exemplary socket according to an embodiment of the present invention is shown.

[0018] Figure 2 An exploded view of an exemplary socket according to an embodiment of the present invention is shown.

[0019] Figure 3An exploded view of a portion of an exemplary socket according to an embodiment of the present invention is shown.

[0020] Figure 4 Shows Figure 3 A schematic diagram of a portion of an exemplary socket after assembly.

[0021] Figure 5 Shows Figure 3 A cross-sectional view of a portion of an exemplary socket after assembly. DETAILED DESCRIPTION

[0022] The implementation and use of the embodiments are discussed in detail below. However, it should be understood that the specific embodiments discussed are merely exemplary of specific ways to implement and use the present invention, and are not intended to limit the scope of the present invention. When describing the structural positions of the various components, such as up, down, top, bottom, etc., the expressions of directions are not absolute, but relative. When the various components are arranged as shown in the figure, these directional expressions are appropriate, but when the positions of the various components in the figure change, these directional expressions also change accordingly.

[0023] The utility model provides a socket. In the socket, by arranging a first heat-conducting component between a first circuit board component and a grounding component and arranging a second heat-conducting component between a second circuit board component and a grounding component, the heat of the first circuit board component and the second circuit board component can be effectively transferred to the grounding component, thereby reducing the heat accumulation in the socket. The socket of the utility model can be applied to houses, vehicles and other suitable target applications. The socket can be installed in a target installation position such as a wall, a wainscot, a wall decorative panel or a ceiling of a target application to provide power output.

[0024] The exemplary sockets of various embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

[0025] Reference Figures 1 to 5 , the exemplary socket 10 includes a housing 11, a grounding component 12, a first insulating component 13, a first circuit board component 14, a first heat-conducting component 15, a second insulating component 16, a second circuit board component 17, a second heat-conducting component 18, and a cover 19. The housing 11 includes a bottom (not shown) and a side wall 112, which together define a receiving cavity to accommodate various mechanical parts and / or electronic components. The housing 11 also includes an open side 111, which can be located on the opposite side of the bottom. Various mechanical parts and / or electronic components can be placed into the receiving cavity of the housing 11 through the open side 111. The housing 11 can be made of a suitable material such as plastic.

[0026] The grounding component 12 is at least partially accommodated in the accommodating cavity of the housing 11, and divides the accommodating cavity into at least two areas. Taking the grounding component 12 dividing the accommodating cavity into two areas, namely the first area and the second area as an example, the first area may be adjacent to the opening side 111 of the housing 11, and the second area may be adjacent to the bottom of the housing 11. The grounding component 12 may be made of a suitable material such as metal.

[0027] The first circuit board component 14 can be accommodated in the first area and arranged adjacent to the opening side 111. The first circuit board component 14 may include a substrate 142 and an interface 141 arranged on the substrate 142 for providing electrical energy. In some embodiments, the interface 141 may include at least one DC interface. When the number of DC interfaces is plural, the types thereof may be the same or different, depending on the application requirements. In some embodiments, four USB DC interfaces may be arranged on the substrate 142, for example, USB-A type DC interfaces 141a, 141b and USB-C type DC interfaces 141c, 141d. The substrate 142 may be, for example, a PCB board, on which in addition to arranging DC interfaces 141a, 141b, 141c and 141d, other electronic components may also be arranged to convert, for example, DC from the second circuit board component 17 into a current suitable for output of the DC interfaces 141a, 141b, 141c and 141d, which will be described in detail below.

[0028] The first insulating component 13 may be accommodated in the first area and disposed adjacent to the grounding component 12. For example, the first insulating component 13 may be disposed on a first surface of the grounding component 12 facing the opening side 111. The first insulating component 13 may be made of any suitable insulating material, for example, it may be an insulating component such as Mylar. By arranging the first insulating component 13 between the first circuit board component 14 and the grounding component 12, electrical insulation between the two may be ensured so that the socket 10 complies with electrical safety regulations.

[0029] The first heat-conducting component 15 can be accommodated in the first area and arranged between the first circuit board component 14 and the first insulating component 13. The first heat-conducting component 15 can guide the heat generated by the first circuit board component 14 to the grounding component 12 through the first insulating component 13 for heat dissipation. In some embodiments, the first heat-conducting component 15 can be a thermally conductive silicone pad. In other embodiments, the first heat-conducting component 15 can also be made of cured thermally conductive glue. The first heat-conducting component 15 can be arranged to be closely attached to the surface of the substrate 142 of the first circuit board component 14 facing the grounding component 12 to fill the gap on the surface, so as to better conduct the heat of the first circuit board component 14 to the grounding component 12.

[0030] The second circuit board component 17 may be accommodated in the second area, and may be disposed, for example, adjacent to the bottom of the housing 11. The second circuit board component 17 may be electrically connected to the first circuit board component 14, for example, by a wire. The second circuit board component 17 may include a substrate 171 and electronic components arranged on the substrate 171 to convert, for example, AC power from the outside into DC power and provide it to the first circuit board component 14. The substrate 171 may be, for example, a PCB board.

[0031] The second insulating member 16 can be accommodated in the second area and disposed adjacent to the grounding member 12. For example, the second insulating member 16 can be disposed on a second surface of the grounding member 12 facing the bottom of the housing 11. The second insulating member 16 can be made of any suitable insulating material. By arranging the second insulating member 16 between the second circuit board member 17 and the grounding member 12, electrical insulation between the two can be ensured so that the socket 10 complies with electrical safety regulations.

[0032] The second heat-conducting component 18 can be accommodated in the second area and arranged between the second circuit board component 17 and the second insulating component 16. The second heat-conducting component 18 can guide the heat generated by the second circuit board component 17 to the grounding component 12 through the second insulating component 16 for heat dissipation. In some embodiments, the second heat-conducting component 18 can be a thermally conductive silicone pad. In other embodiments, the second heat-conducting component 18 can also be made of cured thermally conductive glue. The second heat-conducting component 18 can be arranged to be closely attached to the surface of the substrate 171 of the second circuit board component 17 facing the grounding component 12 to fill the gap on the surface, so as to better conduct the heat of the second circuit board component 17 to the grounding component 12.

[0033] In some embodiments, the second insulating component 16 may be a bracket having an insulating plate. The bracket sequentially carries the grounding component 12, the first insulating component 13, the first heat conducting component 15, and the first circuit board component 14 on the side facing the first area. The bracket sequentially carries the second heat conducting component 18 and the second circuit board component 17 on the side facing the second area. By configuring the bracket-type second insulating component 16, each component can be stably held in the socket 10.

[0034] The insulating plate may be located, for example, in the middle region of the bracket, and may be made of, for example, plastic. In order to ensure that the heat of the second circuit board component 17 is well transferred to the ground component 12, in some examples, the thickness of the insulating plate is no greater than 1.5 mm. Furthermore, the thickness of the insulating plate may be about 1.2 mm.

[0035] In other embodiments, the second insulating component 16 may also be an insulating component such as a Mylar sheet, etc. In this configuration, the components may be stably held in the socket 10 by other fixing means, such as a snap connection, a screw connection, etc.

[0036] The cover 19 is mounted to the open side 111 of the housing 11. The two can be fixed by means of, for example, a snap connection, a screw connection, etc. The cover 19 may include a slot 191. When the first circuit board component 14 is accommodated in the first area, the interface 141 thereon can be exposed through the slot 191, so that the electronic device can be inserted therein to obtain electrical energy. For example, when the socket 10 is installed in the target installation position, the cover 19 can be exposed to the outside, so that the interface 141 is exposed to the outside through the slot 191.

[0037] The number and shape of the slots 191 may match the number and shape of the interfaces 141. In some embodiments, USB-A DC interfaces 141a, 141b and USB-C DC interfaces 141c, 141d may be arranged on the substrate 142. Accordingly, the slots 191 may include slots 191a, 191b that are adapted to the shapes of the USB-A DC interfaces 141a, 141b and slots 191c, 191d that are adapted to the shapes of the USB-C DC interfaces 141c, 141d.

[0038] In some embodiments, the grounding component 12 may include arms 121 and 122. When the grounding component 12 is accommodated in the accommodating cavity of the housing 11, the arms 121 and 122 extend to the outside of the housing 11. The socket 10 can be installed in a target installation location, such as a wall, through the arms 121 and 122. In addition, since the arms 121 and 122 extend to the outside of the housing 11, the heat on the first circuit board component 14 and the second circuit board component 17 is conducted to the grounding component 12, and then can be dissipated to the outside of the housing 11 through the arms 121 and 122 thereon, thereby better heat dissipation.

[0039] In some embodiments, heat dissipation holes 113 may be formed on the housing 11. The heat dissipation holes 113 can better dissipate the heat inside the housing 11 to the outside of the housing 11.

[0040] Depending on the application requirements, other components may be accommodated in the housing cavity of the housing 11. In some embodiments, an AC interface may be accommodated in the housing cavity to provide AC output. At the same time, a slot may be formed on the cover 19 to expose the AC interface to the outside.

[0041] It should be understood that Figures 1 to 5 The illustrated embodiment only shows and labels the main implementation units or components of the socket according to the present invention. The shape and arrangement of each unit or component are only for illustration and not limitation. Without departing from the concept and scope of the present invention, the socket may adopt units or components of other shapes and sizes.

[0042] The technical content and technical features of the utility model have been disclosed above. However, it can be understood that under the creative idea of ​​the utility model, technicians in this field can make various changes and improvements to the above-disclosed concepts, but they all belong to the protection scope of the utility model. The description of the above implementation mode is illustrative rather than restrictive, and the protection scope of the utility model is determined by the claims.

Claims

1. A socket, characterized in that: The socket comprises: a housing including an open side; a grounding member, which is at least partially accommodated in the housing and divides the space in the housing into a first area and a second area; a first insulating member, which is accommodated in the first region and disposed adjacent to the grounding member; A first circuit board component is accommodated in the first area and is disposed adjacent to the opening side of the housing, wherein the first circuit board component is provided with an interface; a first heat-conducting component, which is disposed between the first circuit board component and the first insulating component and is configured to conduct heat of the first circuit board component to the grounding component via the first insulating component for heat dissipation; a second insulating member, which is accommodated in the second region and disposed adjacent to the grounding member; a second circuit board component housed in the second region and electrically connected to the first circuit board component; a second heat conducting member disposed between the second circuit board member and the second insulating member and configured to conduct heat of the second circuit board member to the grounding member via the second insulating member for heat dissipation; and A face cover is mounted to the open side of the housing, wherein the face cover includes a slot to expose the interface to the outside.

2. The socket according to claim 1, characterized in that: The second insulating component includes a bracket having an insulating plate, and the bracket is configured to support the grounding component, the first insulating component, the first heat conducting component and the first circuit board component located in the first area, and the second heat conducting component and the second circuit board component located in the second area.

3. The socket according to claim 2, characterized in that: The insulating plate is made of plastic.

4. The socket according to claim 3, characterized in that: The thickness of the insulating plate is not greater than 1.5 mm.

5. The socket according to claim 4, characterized in that: The thickness of the insulating plate is 1.2 mm.

6. The socket according to claim 1, characterized in that: The first insulating component and / or the second insulating component comprises a Mylar sheet.

7. The socket according to claim 1, characterized in that: The first heat-conducting component and / or the second heat-conducting component comprises a heat-conducting silicone pad.

8. The socket according to claim 1, characterized in that: The shell is formed with heat dissipation holes.

9. The socket according to claim 1, characterized in that: The interface includes at least one DC interface.

10. The socket according to claim 1, characterized in that The ground member includes an arm portion configured to extend to an exterior of the housing when the ground member is at least partially received within the housing.

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