Reactive power compensation device

Abstract

The utility model relates to a reactive power compensation device (2) for a power grid, which comprises a metal shell (10), a capacitor bank (20), a reactor (30) and a heat insulation barrier (40), the capacitor bank (20), the reactor (30) and the heat insulation barrier (40) are arranged in the metal shell (10), and the heat insulation barrier (40) is arranged between the capacitor bank (20) and the reactor (30) and is separated from the capacitor bank (20) and the reactor (30) by a distance (48, 49). The utility model further relates to application of the heat insulation barrier (40).

Description

Technical Field

[0001] The utility model relates to a reactive power compensation device for a power grid, comprising a metal shell, a capacitor group and a reactor, wherein the capacitor group and the reactor are arranged inside the metal shell. Background Art

[0002] Typically, heat is generated in reactive power compensation devices. Existing solutions provide cooling, for example by providing cooling holes in the metal housing or by limiting the electrical power of the device.

[0003] In reactive power compensation arrangements, especially in non-power limited applications, it is a problem to provide improvements with respect to cooling and heat distribution. Utility Model Content

[0004] Therefore, the object of the present invention is to provide a solution for reactive power compensation devices, which solution provides improved power compensation capability and efficiency, reduced costs and increased service life. In particular, the object of the present invention is to avoid or reduce the disadvantages of known solutions.

[0005] This object is achieved by the features of the independent claims. Preferred embodiments are described in detail in the dependent claims, the description and the drawings.

[0006] The object is solved in particular by a reactive power compensation device (e.g. a device configured for reactive power compensation), the device comprising a metal housing, a capacitor bank, a reactor and a thermal insulation barrier, wherein:

[0007] The capacitor bank, the reactor and the thermal insulation barrier are arranged inside the metal housing, and

[0008] The heat insulation barrier is arranged between the capacitor bank and the reactor and is spaced apart from the capacitor bank and the reactor.

[0009] In other words, in particular, a device capable of reactive power compensation is proposed to have a capacitor or a plurality thereof (for example arranged as a capacitor bank and / or a capacitor row), a reactor or a plurality thereof, and a casing made of metal. The capacitor, the reactor and an additional separation element are arranged inside the casing. The separation element is configured for thermal insulation. The separation element is arranged between the reactor and the capacitor, in particular for receiving heat radiated between the capacitor and the reactor, in particular heat radiated from the reactor to the capacitor. The thermal insulation barrier can be a plate or the like. The thermal insulation barrier is not in contact with the capacitor and the reactor to avoid direct heat conduction. As an example, from the reactor to the reactor (or vice versa), the thermal insulation barrier overlaps with the projection of both the reactor and the capacitor. As an example, in a top view, the reactor, the thermal insulation barrier and the capacitor are arranged in a row with a distance between them.

[0010] The present invention advantageously provides a method for reducing the average temperature of the capacitor bank relative to known solutions. In particular, relative to known solutions that do not implement a thermal insulation barrier, the average temperature of the capacitor bank can be reduced by at least 1°C, at least 5°C, at least 8°C or at least 10°C; in some cases even more. The temperature of the reactor does not necessarily rise significantly. It can be provided that the thermal insulation barrier reduces the heat transfer from the reactor to the capacitor bank because the radiation is at least partially captured at the thermal insulation barrier. According to the arrangement of the present invention, the thermal insulation barrier provides a movement path for air within the metal housing along the thermal insulation barrier and along the capacitor bank and the reactor to improve and concentrate convection cooling.

[0011] Reactive power compensation, such as can be performed by the device proposed in this article, can be performed by a device with a capacitive power load and an inductive power load in the same circuit. Energy can be exchanged between the two loads. In this way, the reactive power required by the inductive load can be compensated by the reactive power output by the capacitive load. The device can be configured as a harmonic filter.

[0012] The device is arranged for use in power grids or electrical grids. The power grid is configured to transmit and / or distribute electrical power. The power grid may be a medium voltage power grid, i.e. the voltage carried may therefore be a medium voltage. Alternatively, or additionally, the power grid may be a high voltage power grid, i.e. the voltage carried may therefore be a medium voltage.

[0013] The term high voltage preferably means voltages above 12 kV or 36 kV or 72 kV or 1100 kV. High voltage preferably means nominal voltages ranging from above 12 kV, 36 kV or 72 kV to 550 kV or 1100 kV, such as 145 kV, 245 kV or 420 kV, or higher.

[0014] The term medium voltage preferably means a voltage above 1 kV or 12 kV or 36 kV.Medium voltage preferably means a nominal voltage ranging from above 1 kV, 12 kV or 36 kV to 72 kV, such as 5 kV, 10 kV, 25 kV or 70 kV.

[0015] The metal housing surrounds the capacitor bank, the reactor and the thermal insulation barrier. The metal housing may provide protection for the components. The metal housing may include walls, a bottom and / or a top cover, in particular made of metal (e.g. steel or aluminum), in particular coated or painted to be further protected. The steel may be stainless steel and / or mild steel. The metal housing may have a generally cubic shape.

[0016] The capacitor bank can generally include or consist of electrically connected capacitors or capacitor units, in particular arranged in a row. The capacitors or capacitor units can be arranged horizontally and / or along the bottom of the metal housing. The capacitors or capacitor units can be stacked. The capacitors or capacitor units can have a flat shape. The capacitor is in particular a device that stores electrical energy by accumulating charge on two closely spaced surfaces insulated from each other. The device can be understood as a passive electronic component with at least one terminal, in particular two terminals.

[0017] The reactor, also known as an inductor, coil or choke, can be a passive two-terminal electronic component that stores energy in a magnetic field when current flows through the component. The reactor is usually composed of an insulated wire wound into a coil. When the current flowing through the reactor changes, the time-varying magnetic field generates an electromotive force (voltage) in the conductor, which is described by Faraday's law of induction. According to Lenz's law, the polarity (direction) of the induced voltage hinders the change in the current that produces it. Therefore, inductors hinder any change in the current passing through them. The reactor can be in the form of a wire wrapped in a magnet, called an air-core reactor. In order to make the reactor have a larger inductance, a core can be inserted into the magnet to obtain an iron-core reactor. The reactor may include or be a surge, detuned or filter reactor.

[0018] In particular, it is provided that the capacitor bank, the reactor and the thermal insulation barrier ("the components") are accommodated in the metal housing. The metal housing may be larger than one, two or all of these components. For example, it may be provided that one, two or all of these components are arranged inside the metal housing so that one, two or all of these components do not form a projection from the metal housing or project outside the metal housing. In particular, the metal housing forms a Faraday-bur around one, two or all of these components. One, two or all of these components may be attached to the metal housing.

[0019] The thermal insulation barrier is arranged between the capacitor bank and the reactor, in particular as a part separated from the capacitor bank and the reactor. Therefore, the thermal insulation barrier may not be in (direct) contact with the capacitor bank and the reactor. The thermal insulation barrier is arranged at a distance from the capacitor bank and the reactor so that the thermal insulation barrier can receive radiation from the capacitor bank and / or the reactor. The thermal insulation barrier may cover at least a part of the capacitor bank in a view from the reactor towards the capacitor bank, for example, it may cover at least one capacitor unit or two capacitor units or a capacitor combination of the capacitor bank. The thermal insulation barrier that prevents air from moving in the metal shell additionally provides convective heat transfer that is advantageously redirected.

[0020] The device may include a door, in particular for accessing the interior of the metal housing. The door may be movably arranged at the metal housing. The door may be pivotally attached to the metal housing. The door may be detachable from the metal housing. The door may be closed and opened. The door may be made of metal, such as steel or aluminum.

[0021] The device may include a cooling device, such as a fan and / or an air conditioner. The cooling device may be attached to the metal housing and / or the door. The cooling device is particularly configured to provide ventilation to the metal housing. For example, the metal housing and / or the door may include an opening for the cooling device. The cooling device may provide suction externally to guide ambient air into the metal housing to cool the components. The device may include more openings for sucking air into and / or pushing air out of the metal housing.

[0022] The device may include a heating device, such as a heater. The heating device may be attached to the metal housing and / or the door. The heating device is particularly configured to provide heating to the metal housing to achieve a minimum temperature of the components housed in the housing. For example, the metal housing and / or the door may include an opening for the heating device. The heating device may provide suction externally to guide ambient air into the metal housing while heating the air to heat the components. The device may include more openings for sucking and / or pushing air out of the metal housing. Alternatively, or additionally, the heating device may be located inside the metal housing and / or adjacent to the capacitor bank and / or reactor bank and / or other electronic components of the device. The heating device may be configured for convection and / or convection heating inside the metal housing. The heating device may be in contact with the reactor bank and / or capacitor bank or other electronic components of the device to provide conductive heating.

[0023] Typically, the capacitor bank comprises two or more capacitor cells. The capacitor cells may have a flat shape and / or a substantially rectangular cross-section. The capacitor cells may comprise at least two substantially parallel side walls. The capacitor cells may be arranged substantially parallel to each other, in particular with respect to the side walls. The capacitor cells may form a gap between adjacent capacitor cells, in particular between the side walls of two adjacent capacitor cells, in particular in order to provide the possibility of efficient convection cooling.

[0024] Four or more capacitor units may be arranged into capacitor combinations, each combination comprising at least two capacitor units. A capacitor combination may form a gap that is narrower than the gap formed with an adjacent capacitor unit or capacitor combination. In other words, the capacitor units may be arranged to form at least two different gap sizes between each other. This helps distribute air in the metal housing and thereby reduce the temperature of the capacitor bank.

[0025] The gap is at least 10 mm wide and / or no more than 300 mm wide. For example, the gap (especially the gap between adjacent capacitor combinations) can be 100 mm ± 50 mm. For example, the gap (especially the gap between capacitor units in a capacitor combination) can be 50 mm ± 25 mm.

[0026] The thermal insulation barrier may be understood as a component or part providing separation between the reactor and the capacitor bank within the metal housing in terms of thermal effects between the reactor and the capacitor bank, for example, the thermal effect is radiation. The thermal insulation barrier may be referred to as a thermal barrier.

[0027] The thermal insulation barrier may be two-dimensionally elongated at least in a portion or in its entirety. The thermal insulation barrier may have a plate shape or consist of a plate shape. The thermal insulation barrier may include two substantially flat sides that are substantially parallel. The thermal insulation barrier may be curved in a portion. This shape helps to shield radiation from the reactor to the capacitor bank, thereby reducing the temperature of the capacitor bank.

[0028] The thermal insulation barrier may be arranged obliquely or perpendicularly to the main extension plane of the gap and / or the capacitor unit. The thermal insulation barrier may be arranged along or approximately parallel to the capacitor bank. The thermal insulation barrier may be arranged approximately vertically in the metal housing and / or approximately parallel to the wall of the metal housing. Such an orientation helps to shield radiation from the reactor to the capacitor bank, thereby reducing the temperature of the capacitor bank.

[0029] The thermal insulation barrier may include a substantially non-porous and / or non-perforated structure at least in part or in its entirety. In particular, the thermal insulation barrier may include or consist of a solid non-porous material. Such a design helps to shield radiation from the reactor to the capacitor bank, thereby reducing the temperature of the capacitor bank. Typically, the thermal insulation barrier may include at least one opening or channel extending from one side (reactor) to the other side (capacitor bank); this may help to partially provide convection.

[0030] The thermal insulation barrier may be made of a polymer compound and / or a metal-free material. The thermal insulation barrier may be made of an electrically insulating material. The thermal insulation barrier may be coated with an electrically insulating material. The thermal insulation barrier may include or consist of a polymer compound polyvinyl chloride (PVC). The thermal insulation barrier may be an injection molded part. Such a design helps to uniformly shield radiation from the reactor to the capacitor bank, thereby reducing the temperature of the capacitor bank. Additionally, the assembly of the thermal insulation barrier can therefore be easier.

[0031] The thermal insulation barrier may have a generally rectangular shape. For example, the thermal insulation barrier may have two pairs of generally parallel edges. One edge may face or contact the bottom of the metal shell. One edge may face or contact the top of the metal shell. The other two edges may face or contact the wall and / or door of the metal shell. Such a design helps to shield radiation from the reactor to the capacitor bank.

[0032] The thermal insulation barrier may have a height corresponding to the height of the capacitor bank. The height of the capacitor bank may be considered with or without terminals. The height of the thermal insulation barrier may be 1000 mm ± 250 mm, for example 1050 mm ± 50 mm. For example, the thermal insulation barrier may be at least as high as the capacitor bank. The thermal insulation barrier may extend from the bottom in the metal shell. The thermal insulation barrier may be in contact with the bottom, in particular extend upward from it, and / or extend along the height of the capacitor bank, for example approximately parallel to it. The thermal insulation barrier may be fixed to the bottom. Thereby, radiation is well shielded and the stability of the thermal insulation barrier can be improved.

[0033] The thermal insulation barrier may have a height corresponding to less than the height of the capacitor bank. The height of the capacitor bank may be considered with or without terminals. The height of the thermal insulation barrier may be 800 mm ± 250 mm, for example 850 mm ± 50 mm. The thermal insulation barrier may extend at a distance from the bottom in the metal shell, in particular the distance is at least 50 mm, preferably the distance is 175 mm ± 50 mm. In other words, in particular the thermal insulation barrier may be arranged at a distance from the bottom and / or may be arranged to float in the metal shell, in particular above the bottom. The distance may provide gaps for better distribution of air in the metal shell, while radiation is still shielded to a sufficient extent. Additionally, material costs can be limited.

[0034] The thermal insulation barrier may have a width corresponding to any one / only one of the capacitor combinations and / or corresponding to only a portion / any portion of the capacitor group. It can be provided that the width of the thermal insulation barrier is less than the width of the capacitor group, in particular less than the width of only one / any one of the capacitor combination and / or the capacitor unit. The thermal insulation barrier may include or consist of two or more parts (or may also be understood as thermal insulation barrier parts). In particular, two or more thermal insulation barriers may be provided. The thermal insulation barriers may be arranged to be substantially parallel to each other and / or spaced apart from each other. For example, in the case of providing two or more thermal insulation barriers, one of the thermal insulation barriers may be allocated to a capacitor combination, more than one capacitor combination, and / or a portion of the capacitor group and / or a capacitor unit or two or more capacitor units. Thus, space is provided for better distribution of air in the metal housing, while radiation is still shielded to a sufficient range. In addition, material costs can be limited.

[0035] It can be provided that the thermal insulation barrier has a width corresponding to the entire capacitor bank, in particular the width of the capacitor bank. For example, the thermal insulation barrier can be approximately as wide as the capacitor bank or wider. Exactly one thermal insulation barrier can be provided, meaning that the thermal insulation barrier is the only one in the metal shell. The thermal insulation barrier can extend from a wall in the metal shell and extend along, in particular approximately parallel to, the capacitor bank. The thermal insulation barrier can extend between two opposing walls in the metal shell. The thermal insulation barrier can be in contact with one or both walls in the metal shell. The thermal insulation barrier can be attached to a wall in the metal shell. Thus, the thermal insulation barrier can protect the capacitor bank over its entire width from radiation from the inductor. Additionally, the stability of the thermal insulation barrier can be improved.

[0036] The thermal insulation barrier may have a thickness of at least 1 mm and / or not more than 20 mm, in particular a thickness of 10 mm ± 5 mm, for example a thickness of 8 mm. A thickness of at least 1 mm provides stability, in particular to prevent air from moving in the metal shell; moreover, at elevated temperatures, for example above 50° C., the stability of the material remains sufficient to maintain the shape of the thermal insulation barrier. Further, a thickness below and not exceeding 20 mm provides limited material usage to limit the cost and weight of the thermal insulation barrier, which for example facilitates installation and maintenance when handling of the thermal insulation barrier is required. A thickness of 8 mm ± 2 mm, in particular when made of polymer compounds (in particular PVC), has proven in practice to be a good compromise between weight, stability and thermal effect.

[0037] The thermal insulation barrier can be arranged at a distance of at least 100 mm and / or not more than 300 mm from the capacitor bank and / or from the reactor, in particular at a distance of 175 mm ± 50 mm. In this respect, it can be provided that the radiation from the thermal insulation barrier has a reduced radiation range to the capacitor bank compared to a distance below 100 mm. In addition, maintenance space is provided. Further, it is provided that not too much space is taken up inside the metal housing.

[0038] Furthermore, the object is especially solved by using a thermal insulation barrier as described herein or by a thermal insulation barrier made especially of a polymer compound and / or a non-metallic material in a reactive power compensation device. The thermal insulation barrier may be configured to receive heat radiated from the reactor to the capacitor bank.

[0039] Furthermore, the object is especially solved by using the reactive power compensation device described herein for reactive power compensation, in particular of a wind farm or a solar farm.

[0040] Throughout the present disclosure, the term "or" can be replaced with "and / or." Therefore, when "or" is used, it does not necessarily mean that only alternatives are named. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.

[0042] In the attached picture:

[0043] Figure 1 A schematic perspective view of a reactive power compensation device for a medium and high voltage power grid is shown, the device comprising a capacitor bank and a thermal insulation barrier with a transparent metal housing;

[0044] Figure 2 a view parallel to the thermal insulation barrier showing the capacitor bank and the thermal insulation barrier; and

[0045] Figure 3A-3C Shown with Figure 2 A similar view parallel to a thermal insulation barrier arranged next to a capacitor bank, wherein the barrier has a height corresponding to the height of the capacitor bank (A), wherein the barrier has a height corresponding to less than the height of the capacitor bank (B), and wherein three barriers each have a width (C) corresponding to one of the three capacitor combinations. DETAILED DESCRIPTION

[0046] It is emphasized to the reader that any structural feature described below can be understood as a separate aspect of the present invention, as distinguished from known solutions, although it may be extracted from the context.

[0047] Figure 1 An apparatus 2 configured for reactive power compensation is shown. The apparatus 2 can be used in a medium voltage or high voltage grid.

[0048] The reactive power compensation device 2, referred to as the device 2, includes a capacitor bank 20, a reactor 30, and a thermal insulation barrier 40 arranged inside a metal housing 10. The thermal insulation barrier 40 is arranged between the capacitor bank 20 and the reactor 30 and is spaced apart from the capacitor bank 20 and the reactor 30. In particular, the thermal insulation barrier 40 is arranged at a distance 48 from the capacitor bank 20 and at a distance 49 from the reactor 30. The thermal insulation barrier 40 is placed approximately in the middle of the distance between the reactor 30 and the capacitor bank 20. The thermal insulation barrier 40 does not contact any of the capacitor bank 20 and the reactor 30.

[0049] It is shown that a heat insulation barrier 40 made of a polymer compound PVC (non-metallic material) is used in a reactive power compensation device 2, wherein the heat insulation barrier 40 is configured to receive heat radiated from the reactor 30 to the capacitor bank 20. The heat insulation barrier 40 is an injection molded part. It is provided to reduce the temperature of the capacitor bank 20 relative to a device without a heat insulation barrier. Compared with an arrangement without the heat insulation barrier 40, it can be provided that the temperature of the capacitor unit 22 of the capacitor bank 20 is reduced by about 8 to 10°C, while the temperature of the reactor 30 is not greatly increased.

[0050] The device 2 has a door 12 which is movably arranged on the metal housing 10 , for example for access to the interior of the metal housing 10 , for example the door 12 is hinged on the metal housing 10 .

[0051] The device 2 has a cooling device, in particular a fan 14 or a blower, attached to the metal housing 10. The cooling device is configured to provide ventilation to the metal housing 10. The cooling device can be configured to push air into the metal housing 10 and / or to suck air out of the metal housing 10. The cooling device is in particular arranged in the top area of ​​the metal housing 10, for example in the upper half of the metal housing 10.

[0052] Not shown, a heating device may be provided to heat the electrical components (eg, capacitor bank 20 and / or reactor 30) in the metal housing. This may be advantageous in ensuring functionality in cold environments.

[0053] The capacitor bank 20 has six capacitor units 22 arranged in parallel with each other, with gaps 23 and 24 formed between adjacent capacitor units 22. Figure 3A-3C , roughly showing Figure 1 In the capacitor bank 20, six capacitor units 22 are arranged in three capacitor groups 21, each group 21 having two of the capacitor units 22. A gap 24 is formed between two adjacent groups 21 and is equal to, for example, 100 mm ± 20 mm. Each of the capacitor groups 21 has a gap 23, which is, for example, 50 mm and is therefore smaller than the gap 24.

[0054] The thermal insulation barrier 40 has a rectangular shape and is plate-shaped, i.e., two-dimensionally elongated and substantially flat. The thermal insulation barrier 40 is arranged obliquely (i.e., perpendicularly) to the main extension plane of the gaps 23, 24. The thermal insulation barrier 40 is non-porous and non-perforated and is made of a polymer compound and / or a non-metallic material, in this case PVC.

[0055] exist Figure 1 In another compartment of the metal housing 10 shown on the right, a control element is provided. The control element can assist the function of the reactive power compensation and / or control device 2.

[0056] for Figure 2 , only shows Figure 1 2 and a thermal insulation barrier 40 of a device 2. In this view, six capacitor units 22 are arranged one behind the other. The distance 48 between the group 20 and the barrier 40 is equal to 175 mm ± 25 mm, for example 170 mm, preferably approximately in the middle of the distance from the capacitor group 20 to the reactor 30. The thermal insulation barrier 40 has a height 42 corresponding to the height of the capacitor group and extends from the bottom 11 in the metal housing 10. The thickness of the thermal insulation barrier 40 is 8 mm.

[0057] for Figure 3A-3C , showing Figure 2 The capacitor bank 20 is shown in Figure 1 and in each figure there is a different embodiment of the entire device 2. In each figure, a different thermal insulation barrier 40 is implemented.

[0058] for Figure 3A , showing Figure 1 and Figure 2 The thermal insulation barrier 40 extends from the bottom 10. The thermal insulation barrier 40 is attached to the bottom 10. The height 42 of the thermal insulation barrier 40 may be 1050 mm ± 50 mm.

[0059] for Figure 3A and 3B , the heat insulation barrier 40 has a width 46 corresponding to the entire capacitor bank 20 or its width. In each case, exactly one heat insulation barrier 40 is provided. The width 46 of the heat insulation barrier 40 can be 1400 mm±200 mm and can in particular correspond to the width of the capacitor bank 20.

[0060] for Figure 3B and Figure 3C The heat insulation barrier 40 has a height 42 corresponding to less than the capacitor bank height 25. The height 42 may be equal to 900 mm ± 200 mm, for example 850 mm ± 50 mm. The heat insulation barrier 40 extends at a distance 44 from the bottom 11 in the metal housing 10, and the distance 44 is 175 mm ± 50 mm.

[0061] for Figure 3C , three insulation barriers 40 are provided, wherein each insulation barrier 40 is assigned to one capacitor bank 21. The width 46 of each insulation barrier 40 corresponds to only one of the capacitor banks 21, i.e., to only a portion of the capacitor bank 20. The width 46 may be equal to 400 mm ± 100 mm. The distance between adjacent insulation barriers 40 may be equal to 100 mm ± 20 mm and / or may correspond to the width of the gap 24, in particular 100 mm. For example, the distance between adjacent insulation barriers 40 may be 90 mm ± 10 mm.

[0062] Reference numerals list

[0063] 2Device

[0064] 10Metal shell

[0065] 11 Bottom

[0066] 12 doors

[0067] 14 Fan

[0068] 20 capacitor banks

[0069] 21 Capacitor combination

[0070] 22 capacitor units

[0071] 23 Gap

[0072] 24 Gap

[0073] 25 Capacitor Bank Height

[0074] 30 Reactor

[0075] 40 Thermal Insulation Barrier

[0076] 42 Height

[0077] 44Distance

[0078] 46 Width

[0079] 48Distance

[0080] 49Distance

Claims

1. A reactive power compensation device (2) for a power grid, comprising a metal housing (10), a capacitor bank (20), a reactor (30) and a thermal insulation barrier (40), wherein: The capacitor bank (20), the reactor (30) and the thermal insulation barrier (40) are arranged inside the metal housing (10), and The thermal insulation barrier (40) is arranged between the capacitor bank (20) and the reactor (30) and is separated from the capacitor bank (20) and the reactor (30) by a first distance (48, 49).

2. The device (2) according to claim 1 comprises a door (12) movably arranged at the metal shell (10), and / or comprises a fan (14) attached to the metal shell (10) and configured to provide ventilation to the metal shell (10).

3. The device (2) according to claim 1 or 2, wherein: The capacitor group (20) includes capacitor units (22) arranged substantially parallel to each other, with gaps (23, 24) formed between adjacent capacitor units (22).

4. The device (2) according to claim 3, wherein: Four or more of the capacitor units (22) are arranged in a capacitor combination (21), and each capacitor combination (21) includes at least two capacitor units (22).

5. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) is elongated two-dimensionally at least in a portion.

6. The device (2) according to claim 3, wherein: The thermal insulation barrier (40) is arranged obliquely or perpendicularly to the main extension plane of the gap (23, 24).

7. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) at least partially comprises a non-porous and / or non-perforated structure.

8. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) is made of a polymer compound and / or a metal-free material.

9. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) has a generally rectangular shape.

10. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) has a height (42) corresponding to the height of the capacitor bank and / or extends from the bottom (11) in the metal housing (10).

11. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) has a height (42) corresponding to less than the height (25) of the capacitor bank, and / or extends at a second distance (44) from the bottom (11) in the metal housing (10), the second distance (44) being at least 50 mm.

12. The device (2) according to claim 11, wherein: The second distance (44) is 175 mm±50 mm.

13. The device (2) according to claim 4, wherein: The thermal insulation barrier (40) has a width (46) corresponding to only one of the capacitor combinations (21) and / or corresponding to only a portion of the capacitor bank (20), and / or two or more thermal insulation barriers (40) are provided.

14. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) has a width (46) corresponding to the entire capacitor bank (20), and / or exactly one thermal insulation barrier (40) is provided.

15. The device (2) according to claim 1 or 2, wherein: The thermal insulation barrier (40) has a thickness of at least 1 mm and / or not more than 20 mm, and / or the thermal insulation barrier is arranged at a first distance (48, 49) of at least 100 mm and / or not more than 300 mm from the capacitor bank (20) and / or from the reactor (30).

16. The device (2) according to claim 15, wherein: The thermal insulation barrier (40) has a thickness of 10 mm ± 5 mm.

17. The device (2) according to claim 15, wherein: The thermal insulation barrier is arranged at a first distance (48, 49) of 175 mm ± 50 mm from the capacitor bank (20) and / or the reactor (30).

Images