Anti-corrosion high-density interconnection circuit board

Abstract

The utility model discloses an anti-corrosion high-density interconnection circuit board which comprises an installation support, a fixing cavity is arranged on the installation support, and a fixing mechanism playing a fixing role is arranged on the periphery of the fixing cavity. The high-density interconnection circuit board body is arranged in the fixing cavity, and a lead of the high-density interconnection circuit board body penetrates through the bottom of the mounting bracket and is connected with external equipment; an anti-corrosion coating is sprayed on the high-density interconnection circuit board body; and the cooling mechanism is arranged below the mounting bracket, and the cooling end of the cooling mechanism is in contact with the high-density interconnection circuit board body. According to the utility model, a stable installation environment is provided, the overall stability is enhanced, and stable transmission of signals is ensured.

Description

Technical Field

[0001] The utility model relates to a high-density interconnection circuit board, in particular to an anti-corrosion high-density interconnection circuit board. Background Art

[0002] High-density interconnection circuit board is a high-density, high-precision, and high-reliability printed circuit board. It uses miniaturization, multi-layering, high-density wiring and other technologies to integrate circuit components on a miniaturized circuit board to achieve more efficient and stable circuit transmission.

[0003] In modern electronic devices, high-density interconnection circuit boards are an indispensable component. However, due to their long-term operation and the influence of environmental factors, high-density interconnection circuit boards are susceptible to corrosion and heat accumulation, which can lead to unstable signal transmission and equipment failure. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a corrosion-resistant high-density interconnection circuit board to solve the problems existing in the background technology.

[0005] The utility model anti-corrosion high-density interconnection circuit board is realized by the following technical solutions, including:

[0006] A mounting bracket, wherein the mounting bracket is provided with a fixing cavity, and a fixing mechanism having a fixing function around the fixing cavity;

[0007] A high-density interconnection circuit board body, wherein the high-density interconnection circuit board body is arranged in the fixed cavity, and the leads of the high-density interconnection circuit board body pass through the bottom of the mounting bracket and are connected to the external device; the high-density interconnection circuit board body is sprayed with an anti-corrosion coating;

[0008] The cooling mechanism is arranged below the mounting bracket, and the cooling end of the cooling mechanism is in contact with the high-density interconnection circuit board body.

[0009] As a preferred technical solution, a hollow groove is provided at the bottom of the fixed cavity, and the cooling end of the cooling mechanism passes through the hollow groove and contacts with the high-density interconnection circuit board body.

[0010] As a preferred technical solution, the cooling mechanism includes a temperature conducting plate and a semiconductor refrigerator;

[0011] The thermal conduction plate is installed below the mounting bracket, and thermal conduction silicone is installed on the thermal conduction plate, and the thermal conduction silicone passes through the hollow groove and contacts with the high-density interconnection circuit board body; the semiconductor refrigerator is magnetically adsorbed below the thermal conduction plate, and the high-density interconnection circuit board body is cooled by the semiconductor refrigerator.

[0012] As a preferred technical solution, a cover plate is provided above the fixing cavity of the mounting bracket, and a sealing rubber ring is provided between the cover plate and the mounting bracket; when the cover plate is closed on the fixing cavity, the sealing rubber ring is used for sealing.

[0013] As a preferred technical solution, the fixing mechanism includes a fixing rubber needle and fixing holes arranged around the fixing cavity;

[0014] The high-density interconnection circuit board body is provided with through holes corresponding to the fixing holes around it, and the fixing rubber needle passes through the through holes of the high-density interconnection circuit board body and is clamped in the fixing holes, thereby realizing the installation of the high-density interconnection circuit board body.

[0015] As a preferred technical solution, the bottom of the cover plate is arranged at a avoidance groove corresponding to the fixed rubber needle.

[0016] The beneficial effects of the utility model are:

[0017] 1. The utility model provides a stable installation environment, enhances the overall stability, and ensures stable signal transmission.

[0018] 2. The utility model enhances its anti-corrosion performance by spraying an anti-corrosion coating.

[0019] 3. The utility model adopts a cooling mechanism to achieve heat dissipation effect and ensure the normal operation of electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 It is a schematic diagram of the explosion structure of the utility model;

[0023] Figure 3 It is a schematic diagram of the fixing structure of the utility model.

[0024] Description of reference numerals:

[0025] 1. Mounting bracket; 2. High-density interconnection circuit board; 3. Cooling mechanism; 4. Fixed cavity; 5. Hollow groove; 6. Thermal conduction plate; 7. Semiconductor refrigerator; 8. Thermal conductive silicone; 9. Sealing rubber ring; 10. Fixed rubber needle; 11. Fixed hole; 12. Through hole; 13. Cover plate. DETAILED DESCRIPTION

[0026] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0027] like Figure 1-Figure 3 As shown, the utility model is a corrosion-resistant high-density interconnection circuit board, comprising:

[0028] The mounting bracket 1 is provided with a fixing cavity 4, which not only provides a stable mounting environment for the high-density interconnection circuit board body 2, but also the fixing mechanisms around it further enhance the overall stability;

[0029] A high-density interconnection circuit board body 2, wherein the high-density interconnection circuit board body 2 is disposed in the fixing cavity 4, and the leads of the high-density interconnection circuit board body 2 pass through the bottom of the mounting bracket 1 and are connected to the external device, thereby ensuring stable signal transmission; in order to enhance its anti-corrosion performance, an anti-corrosion coating is sprayed on the high-density interconnection circuit board body 2;

[0030] The cooling mechanism 3 is arranged below the mounting bracket 1 , and a cooling end of the cooling mechanism 3 is in contact with the high-density interconnection circuit board body 2 .

[0031] In this embodiment, a hollow groove 5 is provided at the bottom of the fixing cavity 4 , and the cooling end of the cooling mechanism 3 passes through the hollow groove 5 and contacts the high-density interconnection circuit board body 2 .

[0032] In this embodiment, the cooling mechanism 3 includes a temperature conducting plate 6 and a semiconductor refrigerator 7;

[0033] The thermal conductive plate 6 is installed below the mounting bracket 1, and thermal conductive silicone 8 is installed on the thermal conductive plate 6, and the thermal conductive silicone 8 passes through the hollow groove 5 and contacts the high-density interconnection circuit board body 2; the semiconductor refrigerator 7 is magnetically adsorbed below the thermal conductive plate 6, and the high-density interconnection circuit board body 2 is cooled by the semiconductor refrigerator 7; the heat on the circuit board can be quickly transferred out.

[0034] Among them, a cover plate 14 is arranged above the fixing cavity 4 of the mounting bracket 1, and a sealing rubber ring 9 is arranged between the cover plate and the mounting bracket 1; when the cover plate is closed on the fixing cavity 4, it is sealed by the sealing rubber ring 9, ensuring that the internal electronic components are protected from the influence of the external environment.

[0035] The fixing mechanism includes a fixing rubber needle 10 and fixing holes 11 arranged around the fixing cavity 4;

[0036] The high-density interconnection circuit board body 2 is provided with through holes 12 corresponding to the fixing holes 11 around it, and the fixing rubber needles 10 pass through the through holes 12 of the high-density interconnection circuit board body 2 and are clamped in the fixing holes 11, thereby realizing the installation of the high-density interconnection circuit board body 2.

[0037] In addition, the bottom of the cover plate is arranged at a avoiding groove corresponding to the fixed rubber needle 10 .

[0038] The anti-corrosion high-density interconnection circuit board of the utility model realizes high stability, anti-corrosion performance and heat dissipation effect; and can ensure the normal operation of electronic equipment no matter in harsh environmental conditions or in long-term working conditions.

[0039] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. A corrosion-resistant high-density interconnect circuit board, characterized in that: include: A mounting bracket (1), wherein a fixing cavity (4) is provided on the mounting bracket (1), and a fixing mechanism having a fixing function is provided around the fixing cavity (4); A high-density interconnection circuit board body (2), wherein the high-density interconnection circuit board body (2) is arranged in the fixed cavity (4), and the leads of the high-density interconnection circuit board body (2) pass through the bottom of the mounting bracket (1) and are connected to an external device; an anti-corrosion coating is sprayed on the high-density interconnection circuit board body (2); A cooling mechanism (3) is arranged below the mounting bracket (1), and a cooling end of the cooling mechanism (3) is in contact with a high-density interconnection circuit board body (2).

2. The corrosion-resistant high-density interconnect circuit board according to claim 1, characterized in that: The bottom of the fixed cavity (4) is provided with a hollow groove (5), and the cooling end of the cooling mechanism (3) passes through the hollow groove (5) and contacts the high-density interconnection circuit board body (2).

3. The corrosion-resistant high-density interconnect circuit board according to claim 1, characterized in that: The cooling mechanism (3) comprises a temperature conducting plate (6) and a semiconductor refrigerator (7); The thermal conductive plate (6) is installed below the mounting bracket (1), and thermal conductive silicone (8) is installed on the thermal conductive plate (6), and the thermal conductive silicone (8) passes through the hollow groove (5) and contacts the high-density interconnection circuit board body (2); the semiconductor refrigerator (7) is magnetically adsorbed below the thermal conductive plate (6), and the high-density interconnection circuit board body (2) is cooled by the semiconductor refrigerator (7).

4. The corrosion-resistant high-density interconnect circuit board according to claim 1, characterized in that: A cover plate (14) is arranged above the fixing cavity (4) of the mounting bracket (1), and a sealing rubber ring (9) is arranged between the cover plate and the mounting bracket (1); when the cover plate is closed on the fixing cavity (4), sealing is performed by the sealing rubber ring (9).

5. The corrosion-resistant high-density interconnect circuit board according to claim 1, characterized in that: The fixing mechanism comprises a fixing rubber needle (10) and fixing holes (11) arranged around the fixing cavity (4); The high-density interconnection circuit board body (2) is provided with through holes (12) corresponding to the fixing holes (11) on the four sides, and the fixing rubber needles (10) pass through the through holes (12) of the high-density interconnection circuit board body (2) and are clamped in the fixing holes (11), thereby realizing the installation of the high-density interconnection circuit board body (2).

6. The corrosion-resistant high-density interconnect circuit board according to claim 4, characterized in that: The bottom of the cover plate is arranged at a avoiding groove corresponding to the fixed rubber needle (10).

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