Epoxy resin copper-clad plate

Abstract

An epoxy resin copper-clad plate relates to the technical field of copper-clad plates. Buffering heat conduction layers are arranged at the top and the bottom of a substrate, epoxy resin layers are arranged at the ends, away from the substrate, of the two buffering heat conduction layers, copper foil layers are arranged at the ends, away from the buffering heat conduction layers, of the two epoxy resin layers, and corner breakage prevention mechanisms are arranged on the surfaces of the copper foil layers. The buffer heat conduction layer is made of wave-shaped metal plates, a plurality of arc-shaped through grooves are formed in one surface, close to the buffer heat conduction layer, of the epoxy resin layer, and the distance between every two adjacent arc-shaped through grooves formed in the epoxy resin layer is 8mm. Therefore, the effects of increasing the heat dissipation area and improving the heat dissipation efficiency are achieved, the copper-clad plate has a pressed buffering function, the heat dissipation rate is further improved, and the stability of the copper-clad plate is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of copper clad laminates, in particular to an epoxy resin copper clad laminate. Background Art

[0002] Copper clad laminate - also known as base material, is a plate-shaped material made by impregnating the reinforcing material with resin, covering one or both sides with copper foil, and hot pressing. It is the basic material for making PCBs, often called base material. When it is used in the production of multi-layer boards, it is also called core board.

[0003] The utility model with publication number CN216820234U discloses an epoxy resin copper clad laminate, comprising a substrate, wherein buffer heat conductive layers are arranged on the top and bottom of the substrate, epoxy resin layers are arranged on the top of the buffer heat conductive layer above the substrate and on the bottom of the buffer heat conductive layer below the substrate, a copper foil layer is arranged on one side of the epoxy resin layer away from the buffer heat conductive layer, and a plurality of arcuate through grooves are equidistantly provided on the contact surface between the epoxy resin layer and the buffer heat conductive layer. In the above application document, the arcuate through grooves are provided on the epoxy resin layer, which not only increases the heat dissipation area and improves the heat dissipation efficiency, but also makes it easy for the four corners of the copper foil layer to be transported. Utility Model Content

[0004] The utility model aims to provide an epoxy resin copper clad plate to solve the existing problems.

[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0006] The utility model discloses an epoxy resin copper clad plate, comprising a substrate having a buffer heat-conducting layer arranged on the top and the bottom, two ends of the buffer heat-conducting layers away from the substrate are provided with an epoxy resin layer, two ends of the epoxy resin layers away from the buffer heat-conducting layers are provided with a copper foil layer, and the surface of the copper foil layer is provided with an anti-chipping mechanism.

[0007] Furthermore, a plurality of arc-shaped grooves are provided on one side of the epoxy resin layer close to the buffer thermal conductive layer, and the spacing between adjacent arc-shaped grooves on the epoxy resin layer is eight millimeters. The arc-shaped grooves on the epoxy resin layer increase the heat dissipation area and improve the heat dissipation efficiency.

[0008] Furthermore, the buffer heat-conducting layer is a metal plate arranged in a wave shape, and the buffer heat-conducting layer enables the copper-clad laminate to have a pressure buffering function and further improves the heat dissipation rate.

[0009] Furthermore, the anti-broken corner mechanism includes a corner protector and a slot, a groove is provided on the inner wall of the corner protector, a telescopic spring is arranged inside the groove, an arc block is slidably connected inside the groove through the telescopic spring, a pull rod passes through and is slidably connected to the surface of the corner protector, the end of the pull rod away from the surface of the corner protector is fixedly connected to the arc block, and the slot is provided on the surface of the copper foil layer.

[0010] Furthermore, the corner protector is in the shape of a hollow cube as a whole, and is made of rubber. The rubber corner protector has a certain elasticity and can protect the four corners of the copper clad laminate.

[0011] Furthermore, the opening size of the slot is the same as the opening size of the groove, and two-thirds of the arc block is in the slot in the initial state. The arc block is stuck in the slot so that the corner protector cannot be separated from the surface of the copper foil layer.

[0012] Furthermore, the arc surface of the arc block faces the opening direction of the corner protector, the depth of the groove is greater than the length of the arc block, and the arc surface of the arc block will move into the groove when squeezed, and the arc block can be completely retracted into the groove.

[0013] The utility model has the following beneficial effects:

[0014] The utility model achieves the effect of increasing the heat dissipation area and improving the heat dissipation efficiency by providing a buffer heat-conducting layer made of a corrugated metal plate material and an epoxy resin layer with a plurality of arc-shaped through grooves, and enables the copper-clad laminate to have a pressure buffering function, further improving the heat dissipation rate and improving the stability of the copper-clad laminate.

[0015] The utility model is provided with an anti-corner chipping mechanism, so that the cooperation of components such as an arc block, a telescopic spring, and a card slot can make the corner protector firmly mounted on the surface of the copper foil layer and not easy to fall off. The four corners are protected by the corner protector to prevent the corners from being chipped due to collisions during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a three-dimensional cross-sectional view of the overall structure of the utility model;

[0018] Figure 3 It is a three-dimensional cross-sectional view of the anti-shattering corner mechanism structure of the utility model;

[0019] Figure 4 It is a three-dimensional schematic diagram of the partial structure of the anti-corner breaking mechanism of the utility model.

[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0021] 1. Base plate; 2. Buffer thermal conductive layer; 3. Epoxy resin layer; 4. Copper foil layer; 5. Anti-shattering corner mechanism; 51. Corner protector; 52. Groove; 53. Telescopic spring; 54. Arc block; 55. Pull rod; 56. Card slot. DETAILED DESCRIPTION

[0022] An epoxy resin copper clad laminate comprises a substrate 1, the top and bottom of which are both provided with a buffer heat conductive layer 2, the ends of the two buffer heat conductive layers 2 away from the substrate 1 are both provided with an epoxy resin layer 3, the ends of the two epoxy resin layers 3 away from the buffer heat conductive layer 2 are both provided with a copper foil layer 4, and the surface of the copper foil layer 4 is provided with an anti-chipping mechanism 5.

[0023] A plurality of arcuate grooves are provided on one side of the epoxy resin layer 3 close to the buffer thermal conductive layer 2, and the spacing between adjacent arcuate grooves provided on the epoxy resin layer 3 is eight millimeters. The arcuate grooves provided on the epoxy resin layer 3 increase the heat dissipation area and improve the heat dissipation efficiency.

[0024] The buffer heat-conducting layer 2 is a metal plate arranged in a wave shape. The buffer heat-conducting layer 2 enables the copper-clad laminate to have a pressure buffering function and further improves the heat dissipation rate.

[0025] The anti-broken corner mechanism 5 includes a corner protection sleeve 51 and a slot 56. A groove 52 is opened on the inner wall of the corner protection sleeve 51. A telescopic spring 53 is arranged inside the groove 52. An arc block 54 is slidably connected to the inside of the groove 52 through the telescopic spring 53. A pull rod 55 passes through and is slidably connected to the surface of the corner protection sleeve 51. The end of the pull rod 55 away from the surface of the corner protection sleeve 51 is fixedly connected to the arc block 54. The slot 56 is opened on the surface of the copper foil layer 4.

[0026] The corner protector 51 is in the shape of a hollow cube as a whole, and is made of rubber. The corner protector 51 made of rubber has a certain elasticity and can protect the four corners of the copper clad laminate.

[0027] The opening size of the slot 56 is the same as that of the groove 52 . In the initial state, two-thirds of the arc block 54 is in the slot 56 . The arc block 54 is stuck in the slot 56 so that the corner protector 51 cannot be separated from the surface of the copper foil layer 4 .

[0028] The arc surface of the arc block 54 faces the opening direction of the corner protector 51 , and the depth of the groove 52 is greater than the length of the arc block 54 . When the arc surface of the arc block 54 is squeezed, it will move into the groove 52 , and the arc block 54 can be completely retracted into the groove 52 .

[0029] Embodiment: The overall copper clad laminate is composed of a substrate 1, two buffer heat-conducting layers 2, two epoxy resin layers 3 and two copper foil layers 4. The arc-shaped through grooves on the epoxy resin layer 3 increase the heat dissipation area and improve the heat dissipation efficiency. The buffer heat-conducting layer 2 made of a corrugated metal plate enables the copper clad laminate to have a pressure buffering function, and further improves the heat dissipation rate and enhances the stability of the overall copper clad laminate. In the transportation process, the corner guards 51 can be inserted at the four corners of the copper clad laminate. The arc surface of the arc block 54 will be squeezed by the edge of the copper foil layer 4 and retracted into the groove 52, and the telescopic spring 53 will be tightened. When the groove 52 is in contact with the card slot 56, the telescopic spring 53 will rebound and drive the arc block 54 to be stuck in the card slot 56. At this time, the corner protector 51 cannot fall off the surface of the copper foil layer 4 to prevent the corners from being damaged by bumps during transportation. When the corner protector 51 needs to be removed, the pull rods 55 at the upper and lower ends are pulled to drive the arc block 54 to leave the card slot 56 to remove the corner protector 51.

Claims

1. An epoxy resin copper clad laminate, comprising a substrate (1), characterized in that: The top and bottom of the substrate (1) are both provided with a buffer heat-conducting layer (2), the ends of the two buffer heat-conducting layers (2) away from the substrate (1) are both provided with an epoxy resin layer (3), the ends of the two epoxy resin layers (3) away from the buffer heat-conducting layer (2) are both provided with a copper foil layer (4), and the surface of the copper foil layer (4) is provided with an anti-chipping mechanism (5).

2. The epoxy resin copper clad laminate according to claim 1, characterized in that: A plurality of arc-shaped through grooves are provided on one side of the epoxy resin layer (3) close to the buffer heat-conducting layer (2), and the spacing between adjacent arc-shaped through grooves provided on the epoxy resin layer (3) is eight millimeters.

3. The epoxy resin copper clad laminate according to claim 2, characterized in that: The buffer heat-conducting layer (2) is a metal plate arranged in a wave shape.

4. The epoxy resin copper clad laminate according to claim 3, characterized in that: The anti-crushed corner mechanism (5) comprises a corner protection sleeve (51) and a clamping groove (56); a groove (52) is provided on the inner side wall of the corner protection sleeve (51); a telescopic spring (53) is arranged inside the groove (52); an arc block (54) is slidably connected to the inside of the groove (52) via the telescopic spring (53); a pull rod (55) passes through and is slidably connected to the surface of the corner protection sleeve (51); one end of the pull rod (55) away from the surface of the corner protection sleeve (51) is fixedly connected to the arc block (54); and the clamping groove (56) is provided on the surface of the copper foil layer (4).

5. The epoxy resin copper clad laminate according to claim 4, characterized in that: The corner protection sleeve (51) is in the shape of a hollow cube as a whole, and the corner protection sleeve (51) is made of rubber.

6. The epoxy resin copper clad laminate according to claim 5, characterized in that: The opening size of the clamping slot (56) is the same as the opening size of the groove (52), and two thirds of the arc-shaped block (54) is located in the clamping slot (56) in the initial state.

7. The epoxy resin copper clad laminate according to claim 6, characterized in that: The arc surface of the arc block (54) faces the opening direction of the corner protection sleeve (51), and the depth of the groove (52) is greater than the length of the arc block (54).

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