Diode die bonding equipment

Abstract

The utility model discloses a diode die bonding device, which relates to the technical field of diode die bonding and comprises a workbench, two fixing blocks are arranged on the upper surface of the workbench, first clamping grooves are formed in the opposite surfaces of the two fixing blocks, and limiting blocks are movably clamped in the two first clamping grooves. According to the utility model, when die bonding operation needs to be carried out on the circuit board, the circuit board is placed between the two limiting blocks, the handle is rotated to drive the screw rod fixed with the handle to rotate together, and the two fixing blocks sleeved on the screw rod move towards opposite surfaces under the action of threads in the rotating process of the screw rod, so that the circuit board is fixed on the circuit board. The two fixing blocks drive the two limiting blocks to move together in the moving process, the distance between the two limiting blocks is adjusted, the limiting blocks move towards the opposite faces under pressure in the moving process, the two springs are compressed, and the elastic force of the two springs also pushes the limiting blocks to fix the circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of diode solid crystal, in particular to a diode solid crystal device. Background Art

[0002] Diode light sources are widely used in various fields due to their small size, long life and energy saving. For example, in the automobile manufacturing field, the process of fixing the diode on the circuit board is called die bonding.

[0003] At present, an existing diode solid crystal device (such as patent number: CN202120404839.7) discloses a device for light-emitting diode crystal grain extraction and solid crystal, including a mounting base plate, a pressure plate is arranged on the top of the mounting base plate, a circuit board is arranged on the bottom of the pressure plate, a placement groove adapted to the circuit board is opened on the top of the mounting base plate, a linear array of several mounting grooves is arranged on the top of the pressure plate, the pressure plate and the circuit board are arranged parallel to each other, and the size of the pressure plate is larger than the size of the circuit board, and the four corners of the top of the mounting base plate are fixedly connected with guide rods. The utility model ensures the accuracy of fixation, improves the installation quality, and is simple and practical.

[0004] However, during the implementation of the above technical solution, the following technical problems were found: during the implementation of the above solution, the placement slots are fixed and lack limiters, and can only be applied to circuit boards of the same size, which reduces the practicality. The lack of limiters cannot guarantee the stability of the solid crystal process, and requires too much manual intervention and adjustment. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a diode die-bonding device, which solves the problem that the placement slot is fixed and lacks limit, can only be applied to circuit boards of the same size, reduces practicality, and lacks limit and cannot ensure stability during the die-bonding process.

[0007] (II) Technical solution

[0008] To achieve the above purpose, the utility model is implemented through the following technical solutions: a diode solid crystal device, including a workbench, two fixed blocks are arranged on the upper surface of the workbench, and the opposite surfaces of the two fixed blocks are provided with a slot one, and the two slots one are movably connected with a limit block, and a circuit board is movably connected between the two limit blocks, a screw is rotatably connected in the workbench, and a handle is fixedly connected to the right surface of the screw, and the left and right sides of the workbench are fixedly connected with support frames, a cylinder is fixedly installed between the two support frames, a pressure plate is arranged above the circuit board, and the front surfaces of the two support frames are provided with T-slots, and the back surfaces of the two limit blocks are fixedly connected with springs, and the two springs are respectively fixedly connected to the two slots one.

[0009] As a preferred technical solution of the utility model, a connecting block is fixedly connected to the rear surface of the pressure plate, and the connecting block is fixedly connected to the cylinder output shaft.

[0010] As a preferred technical solution of the utility model, the left and right sides of the pressure plate are fixedly connected with fixing rods, the rear surfaces of the two fixing rods are fixedly connected with T-blocks, and the two T-blocks are slidably connected to the two T-slots respectively.

[0011] As a preferred technical solution of the utility model, threaded holes are formed through the opposite surfaces of the two fixing blocks, and the two threaded holes are threadably sleeved with the screw rods.

[0012] As a preferred technical solution of the utility model, the upper surfaces of the two limit blocks are each provided with a slot three, and the two slots three are respectively movably connected to the two fixed rods; the upper surfaces of the two fixed blocks are each provided with a slot two, and the two slots two are respectively movably connected to the two fixed rods.

[0013] (III) Beneficial effects

[0014] 1. The two fixed blocks will drive the two limit blocks to move together during the movement, and adjust the distance between the two limit blocks. The limit blocks are pressed to move toward the opposite sides during the movement, compressing the two springs, and the elastic force of the two springs also pushes the limit blocks to fix the circuit board, ensuring the stability during the crystal bonding process. The overall flexibility and adjustability meet the needs of use and improve practicality.

[0015] 2. When the cylinder is started, its output shaft will drive the connecting block fixed to it to move. During the movement of the connecting block, it will drive the pressing plate fixed to it to move. The pressing plate is connected to the two support frames through two fixing rods and two T-blocks, which ensures the stability of the pressing plate during movement. During the descent of the pressing plate, it fits with the upper surface of the circuit board. The multiple mounting grooves on the pressing plate can accurately fix the grain on the circuit board, which ensures the accuracy of fixation and improves the installation quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.

[0017] Figure 1 It is the overall structure diagram of the utility model;

[0018] Figure 2 This is a structural diagram of the workbench in the utility model;

[0019] Figure 3This is a structural diagram of a fixed block in the utility model;

[0020] Figure 4 This is a structural diagram of the support frame in the utility model.

[0021] Legend: 1. Workbench; 2. Circuit board; 3. Fixing block; 4. Press plate; 5. Support frame; 6. Cylinder; 7. Handle; 8. Screw; 9. Limit block; 10. Slot 1; 11. Slot 2; 12. Spring; 13. Slot 3; 14. Threaded hole; 15. Connecting block; 16. T-slot; 17. T-block; 18. Fixing rod. DETAILED DESCRIPTION

[0022] The embodiment of the present application provides a diode die-bonding device, which effectively solves the problem that the placement slot is fixed and lacks limit, and can only be applied to circuit boards of the same size, which reduces practicality. The lack of limit cannot ensure the stability in the die-bonding process. The two fixed blocks 3 will drive the two limit blocks 9 to move together during the movement, and the distance between the two limit blocks 9 is adjusted. The limit blocks 9 are pressed toward the opposite sides during the movement, compressing the two springs 12, and the elastic force of the two springs 12 also pushes the limit blocks 9 to fix the circuit board 2, thereby ensuring the stability in the die-bonding process. The overall flexibility and adjustability meet the needs of use and improve practicality.

[0023] Example

[0024] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the technical solution in the embodiment of the present application effectively solves the problem that the placement slot is fixed and lacks limit, and can only be applied to circuit boards of the same size, which reduces practicality. The lack of limit cannot ensure the stability of the die bonding process. The overall idea is as follows:

[0025] In view of the problems existing in the prior art, the utility model provides a diode solid crystal device, including a workbench 1, wherein two fixing blocks 3 are arranged on the upper surface of the workbench 1, and the opposite surfaces of the two fixing blocks 3 are provided with a card slot 10, and the two card slots 10 are both movably connected with a limit block 9, and a circuit board 2 is movably connected between the two limit blocks 9, a screw rod 8 is rotatably connected in the workbench 1, and a handle 7 is fixedly connected to the right surface of the screw rod 8, and the left and right sides of the workbench 1 are both fixedly connected with support frames 5, and a cylinder 6 is fixedly installed between the two support frames 5, a pressing plate 4 is arranged above the circuit board 2, and the front surfaces of the two support frames 5 are both provided with a T-slot 16, and the back surfaces of the two limit blocks 9 are both fixedly connected with springs 12, and the two springs 12 They are fixedly connected to the two card slots 10 respectively. When the circuit board 2 needs to be solidified, the circuit board 2 is placed between the two limit blocks 9, and the handle 7 is turned to drive the screw 8 fixed thereto to rotate together. During the rotation of the screw 8, the two fixed blocks 3 sleeved thereon are moved toward opposite surfaces by the action of the threads. During the movement, the two fixed blocks 3 will drive the two limit blocks 9 to move together, and the spacing between the two limit blocks 9 is adjusted. During the movement, the limit blocks 9 are pressed to move toward opposite back surfaces, compressing the two springs 12, and the elastic force of the two springs 12 also pushes the limit blocks 9 to fix the circuit board 2, thereby ensuring the stability during the solidification process. The overall flexibility and adjustability meet the needs of use and improve practicality.

[0026] A connecting block 15 is fixedly connected to the rear surface of the pressing plate 4, and the connecting block 15 is fixedly connected to the output shaft of the cylinder 6. Fixed rods 18 are fixedly connected to the left and right sides of the pressing plate 4. T-blocks 17 are fixedly connected to the rear surfaces of the two fixing rods 18. The two T-blocks 17 are slidingly connected to two T-slots 16 respectively. When the cylinder 6 is started, its output shaft will drive the connecting block 15 fixed thereto to move. During the movement of the connecting block 15, the pressing plate 4 fixed thereto will be driven to move. The pressing plate 4 is connected to the two support frames 5 via two fixing rods 18 and two T-blocks 17, thereby ensuring the stability of the pressing plate 4 during movement.

[0027] Threaded holes 14 are formed through the opposing surfaces of the two fixing blocks 3, and the two threaded holes 14 are threadedly sleeved with the screw rod 8. A three-slot 13 is formed on the upper surfaces of the two limit blocks 9, and the two three-slots 13 are movably engaged with the two fixing rods 18 respectively. A second slot 11 is formed on the upper surfaces of the two fixing blocks 3, and the two second slots 11 are movably engaged with the two fixing rods 18 respectively. During the descending process of the pressing plate 4, it fits with the upper surface of the circuit board 2. The multiple mounting grooves on the pressing plate 4 can accurately fix the grains on the circuit board 2, thereby ensuring the accuracy of fixation and improving the installation quality.

[0028] Working principle:

[0029] When the circuit board 2 needs to be solidified, the circuit board 2 is placed between the two limit blocks 9, and the handle 7 is turned to drive the screw 8 fixed thereto to rotate together. During the rotation of the screw 8, the two fixed blocks 3 sleeved thereon are moved toward the opposite sides by the action of the threads. During the movement, the two fixed blocks 3 will drive the two limit blocks 9 to move together, and the distance between the two limit blocks 9 is adjusted. During the movement, the limit blocks 9 are pressed to move toward the opposite back sides, compressing the two springs 12, and the elastic force of the two springs 12 also pushes the limit blocks 9 to fix the circuit board 2, ensuring the solidification process. Stability and overall flexibility and adjustability meet the needs of use and improve practicality. When the cylinder 6 is started, its output shaft will drive the connecting block 15 fixed thereto to move. During the movement of the connecting block 15, the pressing plate 4 fixed thereto will be driven to move. The pressing plate 4 is connected to the two support frames 5 through two fixing rods 18 and two T-blocks 17, which ensures the stability of the pressing plate 4 during movement. During the descent of the pressing plate 4, it fits with the upper surface of the circuit board 2. The multiple mounting grooves on the pressing plate 4 can accurately fix the grains on the circuit board 2, which ensures the accuracy of fixation and improves the installation quality.

[0030] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A diode die bonding device, comprising a workbench (1), characterized in that: The upper surface of the workbench (1) is provided with two fixed blocks (3), and opposite surfaces of the two fixed blocks (3) are provided with a card slot (10), and the two card slots (10) are both movably connected with a limit block (9), and a circuit board (2) is movably connected between the two limit blocks (9), and a screw rod (8) is rotatably connected inside the workbench (1); The right surface of the screw rod (8) is fixedly connected to a handle (7), the left and right sides of the workbench (1) are fixedly connected to support frames (5), a cylinder (6) is fixedly installed between the two support frames (5), a pressure plate (4) is arranged above the circuit board (2), and the front surfaces of the two support frames (5) are provided with T-shaped grooves (16).

2. The diode die bonding device according to claim 1, characterized in that: The back surfaces of the two limit blocks (9) are fixedly connected with springs (12); Wherein, the two springs (12) are respectively fixedly connected to the two slots (10).

3. The diode die bonding device according to claim 1, characterized in that: A connecting block (15) is fixedly connected to the rear surface of the pressing plate (4); Wherein, the connecting block (15) is fixedly connected to the output shaft of the cylinder (6).

4. The diode die bonding device according to claim 1, characterized in that: The left and right sides of the pressing plate (4) are fixedly connected with fixing rods (18), and the rear surfaces of the two fixing rods (18) are fixedly connected with T-shaped blocks (17); The two T-shaped blocks (17) are respectively slidably connected to the two T-shaped slots (16).

5. The diode die bonding device according to claim 1, characterized in that: The opposite surfaces of the two fixing blocks (3) are both penetrated by threaded holes (14); Wherein, the two threaded holes (14) are both threadably sleeved with the screw rod (8).

6. The diode die bonding device according to claim 1, characterized in that: The upper surfaces of the two limit blocks (9) are each provided with a third clamping groove (13), and the two third clamping grooves (13) are respectively movably clamped with the two fixing rods (18); Wherein, the upper surfaces of the two fixing blocks (3) are each provided with a second clamping groove (11), and the two second clamping grooves (11) are respectively movably clamped with the two fixing rods (18).

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