Integrated module package

Abstract

The utility model provides an integrated module package, which relates to the technical field of module integration, and comprises an input capacitor and at least one input inductor which are integrated in an accommodating shell; the first power module is arranged on the outer side surface of the accommodating shell, and the height difference between the first power module and the accommodating shell does not exceed 50mm; the pouring sealant is used for immersing the input capacitor, so that the input capacitor and the input inductor are sealed in the accommodating shell; the input capacitor, the input inductor and the first power module are electrically connected through busbars, and the height difference between the busbars does not exceed 50mm; and the heat dissipation water channel is arranged in the circumferential side wall of the accommodating shell and is used for synchronously dissipating heat of the input capacitor, the input inductor and the first power module, so that the problems of relatively large water resistance, relatively large occupied area and relatively high cost due to the fact that the inductor and the capacitor are independently distributed in each box body and the water channel is independently arranged in the existing motor control are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of module integration, in particular to an integrated module package. Background Art

[0002] In recent years, with the rapid development of new energy vehicle technology, new energy vehicles are increasingly being used. Due to the increase in power, single-motor electric vehicles must be equipped with higher-power drive motors and motor controllers. In order to meet usage requirements and improve the efficiency of the vehicle drive system, some adopt the "dual-motor + dual-electric control" technical solution, using a single motor drive under low-power conditions and dual motor drive under high-power conditions to ensure that the vehicle drive system operates in the high-efficiency zone under different conditions.

[0003] The existing dual-motor controller increases power by installing a BOOST inductor in the housing. However, due to the connection relationship and the limitations of the current power module layout, the existing BOOST inductor, BOOST capacitor and power module are installed in separate housings, and heat dissipation water channels are separately provided. They have large water resistance and require multiple packaging, which makes the operation cumbersome and the multiple housings occupy a large area. Utility Model Content

[0004] In order to overcome the above technical defects, the purpose of the utility model is to provide an integrated module package to solve the problem that in the existing motor control, the inductor and capacitor are independently distributed in each box and the water channels are arranged separately, resulting in large water resistance, large area occupation and high cost.

[0005] The utility model discloses an integrated module package, comprising:

[0006] An input capacitor and at least one input inductor are integrated in a housing;

[0007] The first power module is arranged on the outer side of the accommodating shell, and the height difference with the accommodating shell does not exceed 50mm;

[0008] A potting glue is used to immerse the input capacitor and the input inductor so as to seal them in the accommodating shell;

[0009] The input capacitor, the input inductor and the first power module are electrically connected via busbars, and the height difference between the busbars does not exceed 50 mm;

[0010] It also includes a heat dissipation water channel, which is arranged in the circumferential side wall of the accommodating shell to dissipate heat for the input capacitor, the input inductor and the first power module simultaneously.

[0011] Preferably, the input capacitor, the input inductor and the busbar between the first power module are connected by laser welding or bolts.

[0012] Preferably, the accommodating shell is an aluminum alloy shell.

[0013] Preferably, the potting glue partially or completely immerses the input inductor.

[0014] Preferably, it further comprises a DC support capacitor, which is electrically connected to the input capacitor and the input inductor; the DC support capacitor is also connected to at least one second power module.

[0015] Preferably, the DC support capacitor is arranged outside the accommodating housing, and is connected to the input capacitor / input inductor located in the accommodating housing via a busbar.

[0016] Preferably, the DC support capacitor is integrated in the accommodating housing and connected to the piezo capacitor / input inductor via a busbar.

[0017] Preferably, the DC support capacitor, input capacitor and input inductor are arranged in a straight line along a certain direction.

[0018] Preferably, the DC support capacitor is connected to one side of the input inductor, and the input capacitor is arranged on a side of the input inductor away from the DC support capacitor;

[0019] The busbar on the input capacitor is extended to both sides and connected to the input inductor and the high-voltage input interface respectively.

[0020] Preferably, the DC support capacitor is connected to one side of the input capacitor, and the input inductor is arranged on a side of the input capacitor away from the DC support capacitor;

[0021] One side of the input inductor is connected to the input capacitor through a busbar, and the other side is connected to the high-voltage input interface through another busbar.

[0022] Compared with the prior art, the above technical solution has the following beneficial effects:

[0023] The input capacitor, input inductor and power module are integrated in the housing, which can be used as an independent packaging module connected to other modules of the vehicle, and a heat dissipation water channel is set in the circumferential side wall of the housing to synchronize the input capacitor, input inductor and power module. There is no need to set up independent water channels, which reduces water resistance. The heat dissipation water channel directly transfers heat through the potting glue, with less heat loss, reducing the processing technology, and reducing the number and cost of cooling structural parts. At the same time, the DC support capacitor can be connected to simplify the busbar design inside the electronic control, which solves the problem that the inductor and capacitor in the existing motor control are independently distributed in each box and have separate water channels, resulting in large water resistance, large area occupation and high cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of an integrated module packaging embodiment of the utility model;

[0025] Figure 2 This is a structural schematic diagram of a DC support capacitor arranged outside the housing in an integrated module packaging embodiment of the utility model;

[0026] Figure 3 This is another structural schematic diagram of a DC support capacitor arranged outside the housing in an integrated module packaging embodiment of the utility model;

[0027] Figure 4 A schematic diagram of a structure in which a DC support capacitor is integrated in a housing in an integrated module packaging embodiment of the utility model;

[0028] Figure 5 Another structural schematic diagram of a DC support capacitor integrated in a housing in an embodiment of an integrated module seal of the utility model;

[0029] Figure 6 It is a structural schematic diagram of a heat dissipation channel in an integrated module packaging embodiment of the utility model.

[0030] Reference numerals:

[0031] 1-housing; 2-input capacitor; 3-input inductor; 4-heat dissipation channel; 5-busbar; 51-busbar; 6-DC support capacitor; 7-first power module; 8-potting glue; 9-second power module. DETAILED DESCRIPTION

[0032] The advantages of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.

[0033] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0034] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0035] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. Depending on the context, the word "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determining".

[0036] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0038] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and they themselves have no specific meaning. Therefore, "module" and "component" can be used interchangeably.

[0039] Embodiment 1: This embodiment discloses an integrated module package, which is used to integrate multiple modules / components in motor control, such as BOOST inductors, BOOST capacitors, and power modules (components), which are integrated on a housing 1, and a heat dissipation channel 4 is provided in the circumferential side wall of the housing 1 to dissipate heat synchronously for each module / component, so as to reduce thermal resistance and cost. The integrated module package can be applied to the motor controller of the whole vehicle, specifically as follows Figure 1-Figure 6 , including the following:

[0040] An input (BOOST) capacitor and at least one input (BOOST) inductor are integrated in a housing 1; specifically, the housing 1 is a rectangular parallelepiped structure, and the input (BOOST) capacitor and the input (BOOST) inductor are arranged in parallel and parallel to each other. Optionally, when two or more input inductors 3 are arranged, the two or more input inductors 3 are placed relative to each other and their respective busbars 5 (copper bars) are respectively placed toward opposite sides of the housing 1, thereby facilitating the connection between the busbar 5 and the first power module 7 / input capacitor 2. Further optionally, the housing 1 is an aluminum alloy housing.

[0041] One or more first power modules 7 may be provided. Preferably, the number of first power modules 7 is equal to the number of input inductors 3. The first power modules 7 are arranged on the outer side (surface) of the accommodating shell 1, and the height difference with the accommodating shell 1 does not exceed 50 mm. Specifically, the first power module 7 is flat on the outer walls of the two opposite sides of the accommodating shell 1, and the position of the first power module 7 can be adjusted according to the orientation or distribution of the busbars 5 on the input capacitor 2 and the input inductor 3 in the actual scenario, and the busbars on the input capacitor 2 and the input inductor 3 can also be bent toward the first power module 7 to facilitate the reasonable occupation of each busbar 5 connection between each module (input capacitor 2, input inductor 3, first power module 7).

[0042] The potting glue 8 immerses the input capacitor 2 so that the input capacitor 2 and the input inductor 3 are enclosed in the housing 1; optionally, the potting glue 8 partially or completely immerses the input inductor 3, which can be selected according to the specific real-time scenario. The potting glue 8 can be fixed after the above-mentioned modules (input capacitor 2, input inductor 3, first power module 7) are arranged in the housing 1. The input capacitor 2 and the input inductor 3 are integrated and enclosed in the housing 1 through the potting glue 8. Optionally, in order to improve the heat dissipation effect, a potting glue 8 with higher thermal conductivity can be selected.

[0043] The input capacitor 2, the input inductor 3 and the first power module 7 are connected via a busbar 5 (such as Figure 1-5 The small squares similar to the mark 5 are all busbars. The input capacitor 2, the input inductor 3, the first power module 7 and the DC support capacitor 6 and the second power module 9 described below are all provided with busbars for electrical connection between the modules (not marked one by one), and in order to achieve a stable connection, the height difference between the busbars 5 does not exceed 50 mm; specifically, as an option, the busbar 5 between the input capacitor 2, the input inductor 3 and the first power module 7 is connected by laser welding or bolts, and other existing electrical connection methods can also be applied here.

[0044] The integrated module package also includes a heat dissipation channel 4 (such as Figure 6), arranged in the circumferential side wall of the housing 1, for example, arranged in any four-sided side wall and / or bottom wall and / or top wall of the housing 1, to dissipate heat for the input capacitor 2, input inductor 3 and first power module 7 simultaneously. Optionally, the heat dissipation channel 4 can be distributed on two side surfaces of the housing 1 along the length direction, and a water inlet and a water outlet are respectively provided on the side surfaces in the width direction. Alternatively, the heat dissipation channel 4 can be arranged around the input capacitor 2, input inductor 3 and first power module 7 along the circumference of the housing 1, and a water inlet and a water outlet are provided on the same side surface of the housing 1. Alternatively, the heat dissipation channel 4 can be arranged to bend or otherwise shape in the housing 1 to increase the length or effective area of ​​the heat dissipation channel 4, thereby improving the heat dissipation effect on each module. Furthermore, a heat dissipation device such as a radiator can be integrated to improve the heat dissipation effect.

[0045] Based on the above, in this embodiment, the input capacitor 2, the input inductor 3, and the first power module 7 are integrated in the accommodating shell 1, which can be used as an independent packaging module connected to other modules of the whole vehicle, and a heat dissipation water channel 4 is arranged on the accommodating shell 1, and the input capacitor 2, the input inductor 3, and the first power module 7 are synchronously arranged without independently setting water channels, thereby reducing water resistance, and the heat dissipation water channel 4 directly transfers heat through the potting glue 8, with less heat loss and better heat dissipation effect, thereby solving the problem that in the existing motor control, the inductor and the capacitor are independently distributed in each box, and the water channels are arranged separately, resulting in large water resistance, large area occupation and high cost.

[0046] In a preferred embodiment, a DC link capacitor 6 (Dclink capacitor, Figure 1 (not shown), the DC support capacitor 6 is electrically connected to the input capacitor 2 and the input inductor 3, and the DC support capacitor 6 is also connected to at least one second power module 9 through the busbar 5 arranged thereon. As a supplement, the first power module and the above-mentioned first power module 7 are both power modules, and can be power modules of the same type. The difference is that the connection positions are different. The first and second are only used for distinction and can be interchangeable. The second power module 9 can also be arranged on the outer side of the DC support capacitor 6 similar to the first power module 7, and the height difference with the DC support capacitor 6 does not exceed 50mm. Multiple ones can be arranged at intervals, such as 3 at intervals on both sides.

[0047] The DC support capacitor 6 can be independently connected to the housing 1, or can be further integrated in the housing 1. Based on this, as an option, the DC support capacitor 6 can be arranged outside the housing 1 and connected to the input capacitor 2 / input inductor 3 located in the housing 1 through a busbar 51 (busbar), and the second power module 9 can be arranged on the outer side wall of the DC support capacitor 6 (such as Figure 2As another option, the DC support capacitor 6 is integrated in the housing 1 and connected to the pressure capacitor / input inductor 3 through the busbar 5. When the DC support capacitor 6 is integrated in the housing 1, the second power module 9 is also arranged on the outer wall of the housing 1, parallel to the first power module 7 (such as Figure 4 ), so that the input capacitor 2, the input inductor 3, the first power module 7 and the second power module 9 can be cooled synchronously through the heat dissipation water channel on the accommodating shell 1.

[0048] Specifically, the DC support capacitor 6, the input capacitor 2, and the input inductor 3 can be arranged along a straight line in the housing 1, or any two of them can be arranged in parallel with another, or they can be arranged in a triangle. Preferably, the DC support capacitor 6, the input capacitor 2, and the input inductor 3 are arranged in a straight line in a certain direction. As an example, the side of the DC support capacitor 6 in the width direction is connected to the side of the housing 1 in the width direction (that is, the DC support capacitor 6, the input capacitor 2, and the input inductor 3 are arranged in parallel in sequence or respectively along the length direction of the housing 1). At this time, the busbar 5 on the DC support capacitor 6 can be arranged to face both sides along the length direction, and the first power module 7 is flatly attached to both sides of the housing 1 along the length direction. The second power module 9 is flatly attached to both sides of the DC support capacitor 6 along the length direction. The input capacitor 2 and the input inductor 3 can be conveniently electrically connected to the first power module 7 through the busbar 5 on the side of the housing 1, and the DC support capacitor 6 is electrically connected to the second power module 9 through the busbar 5 on the side thereof.

[0049] In this embodiment, in order to meet the needs of different usage scenarios, the input capacitor 2 can be set between the DC support capacitor 6 and the input inductor 3, and the high-voltage input interface is connected through the output of the input inductor 3. The input inductor 3 can also be set between the DC support capacitor 6 and the input capacitor 2, and the high-voltage input interface is connected through the output of the input capacitor 2. The distribution of the busbar 5 on the input capacitor is slightly different in the above two scenarios, and the layout can be selected according to the module distribution of the whole vehicle and the application scenario.

[0050] In a preferred embodiment, when the DC support capacitor 6 is connected to one side of the input inductor 3, the input capacitor 2 is arranged on the side of the input inductor 3 away from the DC support capacitor 6 (such as Figure 2 and Figure 5 ); The busbar 5 on the input capacitor 2 extends to both sides to connect to the input inductor 3 and the high-voltage input interface. In this embodiment, the two ends of the busbar 5 on the input capacitor 2 are respectively extended to connect to the input inductor 3 and the vehicle high-voltage vehicle.

[0051] In a preferred embodiment, the DC support capacitor 6 is connected to one side of the input capacitor 2, and the input inductor 3 is arranged on the side of the input capacitor 2 away from the DC support capacitor 6 (such as Figure 3 and Figure 4 ); one side of the input inductor 3 is connected to the input capacitor 2 through a busbar 5, and the other side is connected to the high-voltage input interface through another busbar 5. In this implementation, different from the above, when the input inductor 3 is connected to the high-voltage input interface, it is connected to the input capacitor 2 and the high-voltage input interface through two busbars 5 respectively.

[0052] In addition, two or more input inductors 3 may be used in this embodiment. For example, when two input inductors 3 are used, the two input inductors 3 may be stacked, and the busbars 5 thereon are respectively oriented toward the two sides of the housing 1 to respectively connect to the first power modules 7. Optionally, other modules that are available or applicable to the scene may be integrated in the housing 1, and the heat dissipation channels 4 may be used to simultaneously dissipate heat for each module to improve the heat dissipation effect.

[0053] This implementation method utilizes potting design to improve the working performance of power inductors, reduce design costs and working noise, which is different from the existing method of distributing capacitors and inductors in different cavities and potting them with different materials, which has the problems of high difficulty in cooling system design, poor cooling effect, and high parts cost. Potting input capacitor 2 and input inductor 3 in the same cavity reduces the processing technology, reduces the number and cost of cooling structural parts, simplifies the busbar design inside the electric control, and improves the overall power density of the (dual) electric control. It solves the problem that the input power brick cooling system cannot be integrated, improves cooling efficiency, and reduces the cost of the cooling circuit, and can be used in (dual) motor controller products.

[0054] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An integrated module package, characterized in that: include: An input capacitor and at least one input inductor are integrated in a housing; The first power module is arranged on the outer side of the accommodating shell, and the height difference with the accommodating shell does not exceed 50mm; A potting glue is used to immerse the input capacitor so that the input capacitor and the input inductor are enclosed in the accommodating shell; the input capacitor, the input inductor and the first power module are electrically connected through busbars, and the height difference between the busbars does not exceed 50 mm; It also includes a heat dissipation water channel, which is arranged in the circumferential side wall of the accommodating shell to dissipate heat for the input capacitor, the input inductor and the first power module simultaneously.

2. The integrated module package according to claim 1, characterized in that: The input capacitor, the input inductor and the busbar between the first power module are connected by laser welding or bolts.

3. The integrated module package according to claim 1, characterized in that: The accommodating shell is an aluminum alloy shell.

4. The integrated module package according to claim 1, characterized in that: The potting compound partially or completely immerses the input inductor.

5. The integrated module package according to claim 1, characterized in that: It also includes a DC support capacitor, which is electrically connected to the input capacitor and the input inductor; The DC support capacitor is also connected to at least one second power module.

6. The integrated module package according to claim 5, characterized in that: The DC support capacitor is arranged outside the accommodating shell and is connected to the input capacitor / input inductor located in the accommodating shell through a busbar.

7. The integrated module package according to claim 5, characterized in that: The DC support capacitor is integrated in the accommodating housing and is connected to the input capacitor / input inductor via a busbar.

8. The integrated module package according to claim 5, characterized in that: The DC support capacitor, input capacitor and input inductor are arranged in a straight line along a certain direction.

9. The integrated module package according to claim 5, characterized in that: The DC support capacitor is connected to one side of the input inductor, and the input capacitor is arranged on a side of the input inductor away from the DC support capacitor; The busbar on the input capacitor is extended to both sides and connected to the input inductor and the high-voltage input interface respectively.

10. The integrated module package according to claim 5, characterized in that: The DC support capacitor is connected to one side of the input capacitor, and the input inductor is arranged on a side of the input capacitor away from the DC support capacitor; One side of the input inductor is connected to the input capacitor through a busbar, and the other side is connected to the high-voltage input interface through another busbar.

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