Water cooling device of integrated heat exchanger

Abstract

The utility model discloses a water cooling device of an integrated heat exchanger, which belongs to the technical field of radiators, and comprises a substrate and a liquid cooling pipe, one side or two opposite sides of the substrate are provided with groove bodies, and the liquid cooling pipe is embedded in the groove bodies; a heat exchanger is arranged on the substrate, the heat exchanger is provided with a fan and a heat exchange tube, and the heat exchange tube is connected with the liquid cooling tube in series or in parallel; a copper plate is further embedded in the substrate, and the copper plate is arranged corresponding to the power device and used for cooling the power device. The copper plate is embedded in the substrate, the position of the copper plate corresponds to the position of the power device to be cooled, heat of the power device can be fully and timely dissipated, and air in the space to which the device belongs is circularly dissipated through the heat exchanger, so that the heat dissipation effect on components mounted on the water cooling plate is better, and the heat dissipation efficiency is improved. The phenomenon that the power device is damaged due to heating is effectively avoided, and the failure rate is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a water cooling device with an integrated heat exchanger. Background Art

[0002] The existing copper tube water cooling plate is usually grooved on one side and embedded with liquid cooling tubes, which is mainly used to dissipate heat and cool the heat-generating power devices installed on the surface of the water cooling plate. However, in the process of using the existing copper tube water cooling plate for heat dissipation, due to the large number of certain power devices (such as MOS tubes, etc.), the heat generated during operation is relatively large. When the power devices are installed on both sides of the water cooling plate, the existing water cooling plate cannot fully and evenly dissipate heat for these devices. If the heat dissipation is not sufficient, the service life of the device will be reduced, and the device may be easily damaged by heat. In addition, the heat dissipation effect of the entire space is not ideal with simple water cooling, which may easily lead to overheating during long-term use, thereby causing failures or safety accidents.

[0003] It is necessary to provide an integrated water cooling device that can dissipate heat evenly and assist in dissipating heat in the space where the heat-generating power device belongs, so as to solve the shortcomings of uneven heat dissipation and single heat dissipation of the water cooling plate in the prior art. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art that power devices with large heat generation cannot achieve uniform and sufficient heat dissipation, and that simple water cooling has a poor heat dissipation effect on the entire device, and to provide a water cooling device with an integrated heat exchanger.

[0005] In order to achieve the above-mentioned utility model purpose, the utility model provides the following technical solutions:

[0006] A water cooling device with integrated heat exchanger, comprising a base plate and a liquid cooling tube, wherein one side or two opposite sides of the base plate are provided with a tank body, and the liquid cooling tube is embedded in the tank body; a heat exchanger is provided on the base plate, and the heat exchanger is provided with a fan and a heat exchange tube, and the heat exchange tube is connected in series or in parallel with the liquid cooling tube;

[0007] A copper plate is also embedded on the substrate, and the copper plate is arranged corresponding to the power device and is used for dissipating heat from the power device.

[0008] By adopting the above technical solution, a copper plate is embedded on the substrate, and the position of the copper plate is set corresponding to the position of the power device to be cooled, so that the power device can be cooled fully and timely, and the air in the space to which the device belongs is circulated through the heat exchanger to cool the air, so that the heat dissipation effect of the components installed on the water-cooled plate is better, and the power device can be effectively avoided from being damaged by heat, which greatly reduces the failure rate.

[0009] As a preferred solution of the utility model, the copper plate is arranged above the liquid cooling tube and / or between adjacent liquid cooling tubes.

[0010] As a preferred solution of the utility model, the copper plate is provided with a channel, and the liquid cooling pipe on the same surface of the substrate and the channel are connected in series through a bend pipe.

[0011] As a preferred solution of the utility model, through holes for welding elbows are provided at positions on the base plate corresponding to the water inlet and the water outlet of the copper plate.

[0012] As a preferred solution of the utility model, ventilation holes are also provided on the substrate, and the substrate is an aluminum substrate.

[0013] As a preferred solution of the utility model, the grooves on both sides of the substrate are staggered and evenly distributed in the heat dissipation area.

[0014] As a preferred solution of the utility model, the path of the trough body is M-shaped or serpentine-shaped.

[0015] As a preferred solution of the utility model, it includes N liquid cooling tubes, where 0<N, N is an even number, which are respectively embedded in the grooves arranged on both sides of the substrate, and the number of liquid cooling tubes on both sides is the same, one end of the liquid cooling tube is connected to a water inlet, and the other end is connected to a water outlet, and the liquid cooling tube is a copper tube.

[0016] As a preferred solution of the utility model, the water outlet of the heat exchange tube in the heat exchanger is connected to the water inlet, or the water outlet is connected to the water inlet of the heat exchange tube in the heat exchanger; the heat exchange tube is a copper tube.

[0017] As a preferred solution of the utility model, the water inlet and the water outlet are arranged on the side of the base plate.

[0018] The power devices include but are not limited to power tubes (IGBT, MOS tube, diode), transformers, inductors, and rectifier modules.

[0019] Compared with the prior art, the utility model has the following beneficial effects: liquid cooling tubes are evenly arranged on one side, or evenly and staggeredly arranged on both sides, and copper plates are embedded in the substrate. The positions of the copper plates correspond to the positions of the power devices, so that the power devices can be fully, evenly and timely cooled. At the same time, the air inside the space to which the power devices belong is circulated and cooled by the heat exchanger, so that the cooling effect of the components installed on the water-cooled plate is better, the power devices are prevented from being damaged by heat and overheating, and the failure rate is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A top view of a water cooling device with an integrated heat exchanger according to the utility model;

[0021] Figure 2 It is a cross-sectional view of a base plate of a water cooling device with integrated heat exchanger according to the utility model;

[0022] Figure 3 It is a side view of a water cooling device with integrated heat exchanger according to the utility model;

[0023] Figure 4 A top view of another structural form of a water cooling device with an integrated heat exchanger according to the utility model;

[0024] Figure 5 This is a cross-sectional view of a water cooling device of an integrated heat exchanger according to the utility model, in which a copper plate is arranged above a liquid cooling tube;

[0025] Figure 6 This is a cross-sectional view of a water cooling device of an integrated heat exchanger according to the utility model, in which the copper plates are arranged above the liquid cooling tubes and are embedded in the base plate;

[0026] Figure 7 A top view of another structural form of a water cooling device with an integrated heat exchanger according to the utility model;

[0027] Figure 8 for Figure 7 Side view of

[0028] Markings in the figure: 1-base plate, 2-liquid cooling tube, 3-tank, 4-heat exchanger, 5-fan, 6-heat exchange tube, 7-copper plate, 8-channel, 9-bend pipe, 10-through hole, 11-ventilation hole, 12-water inlet of liquid cooling tube, 13-water outlet of liquid cooling tube, 14-water outlet of copper tube, 15-water inlet of copper tube. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in combination with test examples and specific implementation methods. However, this should not be understood as the scope of the above subject matter of the present invention being limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention. Example 1

[0030] A water cooling device with an integrated heat exchanger (4), such as Figure 1 and Figure 2 As shown, it comprises a substrate (1) and a liquid cooling tube (2), wherein one side (such as Figure 2 (a)), or opposite sides (such as Figure 2 (b) A tank body (3) is provided, and the liquid cooling pipe (2) is embedded in the tank body (3);

[0031] like Figure 3As shown, a heat exchanger (4) is provided on the substrate (1), and the heat exchanger (4) is provided with a fan (5) and a heat exchange tube (6), and the heat exchange tube (6) is connected in series or in parallel with the liquid cooling tube (2);

[0032] Preferably, the heat exchange tube (6) is a copper tube.

[0033] A copper plate (7) is also embedded in the substrate (1); the copper plate (7) is arranged corresponding to the power device and is used to dissipate heat from the power device.

[0034] The copper plate (7) is arranged around the liquid cooling tube (2);

[0035] Preferably, Figure 4 and Figure 5 As shown, the copper plate (7) is arranged above the liquid cooling tube (2) and / or between adjacent liquid cooling tubes (2).

[0036] Preferably, Figure 6 As shown, the copper plates (7) are arranged above the liquid cooling tubes (2) and are embedded in the base plate (1).

[0037] By embedding a copper plate (7) on the base plate (1), the position of the copper plate (7) is arranged to correspond to the position of the power device to be cooled, so that the power device can be cooled fully and timely, and the air in the space to which the device belongs is circulated and cooled through the heat exchanger (4), so that the cooling effect of the components installed on the water cooling plate is better, and the phenomenon of power device damage due to heat is effectively avoided, thereby greatly reducing the failure rate. Example 2

[0038] This embodiment is a water cooling device with an integrated heat exchanger (4), which differs from Embodiment 1 in that: Figure 7 and Figure 8 As shown, the copper plate (7) is provided with a channel (8), and the liquid cooling tube (2) and the channel (8) on the same surface of the substrate (1) are connected in series via a bent tube (9). By using a copper plate (7) with a channel (8), cold water passes through the through hole (8), which can better remove the heat on the copper plate (7), thereby making the copper plate (7) have a better heat dissipation effect on the power device.

[0039] Through holes (10) for welding the bent pipe (9) are provided at positions on the base plate (1) corresponding to the water inlet (15) and the water outlet (14) of the copper plate (7). The bent pipe (9) is arranged at the through holes (10). The through holes (10) facilitate welding of the bent pipe (9) and can also achieve ventilation and heat dissipation.

[0040] The substrate (1) is also provided with ventilation holes (11); the substrate (1) is an aluminum substrate or other alloy substrate with good heat dissipation properties; the heat exchanger (4) cooperates with the ventilation holes (11) to achieve a better heat dissipation effect through air circulation in the device. Example 3

[0041] This embodiment is a water cooling device with an integrated heat exchanger (4), which differs from Embodiment 2 in that: Figure 2 As shown in (b), the grooves on both sides of the substrate (1) are staggered and evenly distributed in the heat dissipation area.

[0042] like Figure 4 and Figure 7 As shown, the path of the slot body (3) is M-shaped or serpentine-shaped and is evenly distributed in the intended heat dissipation area to achieve stable heat dissipation.

[0043] The invention comprises N liquid cooling tubes (2), wherein 0<N and N is an even number, which are respectively embedded in the groove bodies (3) arranged on the two sides of the substrate (1), and the number of the liquid cooling tubes (2) on the two sides is the same. One end of the liquid cooling tube (2) is connected to a water inlet (12), and the other end is connected to a water outlet (13). The water inlet (12) and the water outlet (13) are arranged on the side of the substrate. The liquid cooling tube (2) is a copper tube, which can realize synchronous and uniform heat dissipation on both sides of the substrate (1), thereby ensuring the thermal stability of the components on both sides of the substrate (1).

[0044] The water outlet of the heat exchange tube (6) in the heat exchanger (4) is connected to the water inlet (12), or the water outlet (13) is connected to the water inlet of the heat exchange tube (6) in the heat exchanger (4).

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A water cooling device with an integrated heat exchanger, comprising a base plate (1) and a liquid cooling tube (2), characterized in that: A groove body (3) is provided on one side or two opposite sides of the substrate (1), and the liquid cooling tube (2) is embedded in the groove body (3); A heat exchanger (4) is provided on the substrate (1), the heat exchanger (4) is provided with a fan (5) and a heat exchange tube (6), and the heat exchange tube (6) is connected in series or in parallel with the liquid cooling tube (2); A copper plate (7) is also embedded in the substrate (1); the copper plate (7) is arranged corresponding to the power device and is used to dissipate heat from the power device.

2. The water cooling device of the integrated heat exchanger according to claim 1, characterized in that: The copper plate (7) is arranged above the liquid cooling tube (2) and / or between adjacent liquid cooling tubes (2).

3. The water cooling device of the integrated heat exchanger according to claim 1, characterized in that: The copper plate (7) is provided with a channel (8), and the liquid cooling tube (2) and the channel (8) on the same surface of the base plate (1) are connected in series via a bent tube (9).

4. The water cooling device of the integrated heat exchanger according to claim 3, characterized in that: Through holes (10) for welding the elbow (9) are provided at positions on the base plate (1) corresponding to the water inlet (15) and the water outlet (14) of the copper plate (7).

5. A water cooling device with integrated heat exchanger according to any one of claims 1 to 4, characterized in that: The substrate (1) is also provided with ventilation holes (11), and the substrate is an aluminum substrate.

6. The water cooling device of the integrated heat exchanger according to claim 1, characterized in that: The grooves (3) on both sides of the substrate (1) are arranged in a staggered manner and are evenly distributed in the heat dissipation area.

7. The water cooling device of the integrated heat exchanger according to claim 6, characterized in that: The path of the trough body (3) is M-shaped or serpentine-shaped.

8. A water cooling device with integrated heat exchanger according to any one of claims 6-7, characterized in that: It comprises N liquid cooling tubes (2), wherein 0<N and N is an even number, which are respectively embedded in the groove bodies (3) arranged on both sides of the substrate (1), and the number of liquid cooling tubes (2) on both sides is the same, one end of the liquid cooling tube (2) is connected to a water inlet (12), and the other end is connected to a water outlet (13), and the liquid cooling tube (2) is a copper tube.

9. The water cooling device of the integrated heat exchanger according to claim 8, characterized in that: The water outlet of the heat exchange tube (6) in the heat exchanger (4) is connected to the water inlet (12), or the water outlet (13) is connected to the water inlet of the heat exchange tube (6) in the heat exchanger (4).

10. The water cooling device of the integrated heat exchanger according to claim 9, characterized in that: The water inlet (12) and the water outlet (13) are arranged on the side of the base plate (1).

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