Etching-resistant circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to an anti-etching circuit board, which comprises a board body, a plurality of components are arranged at the upper end of the board body, and an anti-corrosion layer is sprayed on the upper surface of the board body. The bottom of the board body is also provided with a heat dissipation mechanism which actively absorbs heat to cool components on the board body. According to the utility model, the heat dissipation mechanism is arranged at the bottom of the circuit board, and through the design of the heat conduction layer, the heat absorption plate, the heat conduction columns and the through holes, heat on the board body can be quickly absorbed and conducted to the heat absorption plate, and the heat is quickly dissipated, so that high temperature is prevented from being generated in the working process of the circuit board, and components welded on the circuit board are protected.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an etching-resistant circuit board. Background Art

[0002] Circuit board usually refers to printed circuit board, which is an infrastructure used to support and connect electronic components. Circuit board has one or more layers of conductive tracks, which are printed or plated on the surface. These tracks provide connections between electronic components, thus forming circuits. Circuit board plays a vital role in electronic devices.

[0003] After searching, a Chinese patent discloses an anti-etching circuit board (authorization announcement number CN219919258U), including a circuit board body, a breathable plate is arranged inside the circuit board body, a mounting frame is arranged on the top of the circuit board body, a protective plate is arranged on the top of the mounting frame, and an observation glass is arranged on the inner side of the protective plate. The beneficial effect is that the anti-etching circuit board can perform ventilation treatment on the bottom of the circuit board by arranging the breathable plate to achieve a certain degree of heat dissipation effect. By arranging the mounting frame and the protective plate, the surface of the circuit board can be protected to prevent liquid from entering the surface of the protective plate, and a certain degree of drying can be achieved to reduce the occurrence of corrosion. By arranging the observation glass, the inside of the circuit board after the protection is installed can be observed, which is convenient for understanding the circuit board fault. By arranging the three-proof paint and the insulating paint, the insulation effect and corrosion resistance of the circuit board can be guaranteed.

[0004] The above technical solution only realizes heat dissipation by arranging a breathable plate at the bottom of the circuit board, and its heat dissipation effect is limited, so it can be further improved. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides an anti-etching circuit board, including a board body, a plurality of components are arranged on the upper end of the board body, and an anti-corrosion layer is sprayed on the upper surface of the board body;

[0006] The bottom of the board is also provided with a heat dissipation mechanism which actively absorbs heat to cool the components thereon.

[0007] Preferably: the anti-corrosion layer is processed onto the plate body by a spraying process, and the anti-corrosion layer is specifically a three-proof paint.

[0008] Preferably: both left and right sides of the plate body are provided with fixing seats, and fixing holes are provided on the fixing seats.

[0009] Preferably: the heat dissipation mechanism comprises a heat absorbing plate, which is fixed to the bottom of the plate body by screws, and the screws are made of plastic material.

[0010] Preferably: a heat-conducting layer is further provided between the heat-absorbing plate and the plate body, and the heat-conducting layer is specifically a heat-conducting glue, which covers the bottom of the plate body and the upper end of the heat-absorbing plate.

[0011] Preferably: a groove is further provided on the upper end of the heat absorbing plate, a plurality of heat conducting columns are provided in the groove, the heat conducting columns are embedded in the heat conducting layer, and the heat absorbing plate is made of copper.

[0012] Preferably: a plurality of insulating pads are arranged at the lower end of the heat absorbing plate, and the insulating pads are made of rubber material.

[0013] Preferably: a plurality of through holes penetrating the front and rear side walls of the heat absorbing plate are formed at the bottom of the heat absorbing plate below the groove, and the through holes are distributed transversely.

[0014] Technical effects and advantages of the utility model:

[0015] In the utility model, a heat dissipation mechanism is arranged at the bottom of the circuit board, which can quickly absorb the heat on the board body and conduct it to the heat absorbing plate through the design of the heat conductive layer, the heat absorbing plate, the heat conductive column and the through hole, and quickly dissipate the heat, thereby avoiding the circuit board from generating high temperature during operation and protecting the components soldered thereon. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of an anti-etching circuit board provided in an embodiment of the present application. Figure 1 ;

[0017] Figure 2 This is a schematic diagram of the structure of an anti-etching circuit board provided in an embodiment of the present application. Figure 2 ;

[0018] Figure 3 The invention provides an anti-etching circuit board explosion-proof Figure 1 ;

[0019] Figure 4 The invention provides an anti-etching circuit board explosion-proof Figure 2 ;

[0020] Figure 5 The present invention provides an anti-etching circuit board. Figure 3 Schematic diagram of the structure at A in the middle.

[0021] In the figure:

[0022] 1. Board body; 2. Components; 3. Anti-corrosion layer; 4. Fixing seat; 5. Heat dissipation mechanism; 51. Heat absorbing plate; 52. Heat conducting layer; 53. Screws; 54. Grooves; 55. Heat conducting column; 56. Insulating pad; 57. Through hole. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific purposes.

[0024] Example

[0025] See also Figure 1 to Figure 5 In this embodiment, an anti-etching circuit board is provided, including a board body 1, a plurality of components 2 are arranged on the upper end of the board body 1, and an anti-corrosion layer 3 is sprayed on the upper surface of the board body 1, and the anti-corrosion layer 3 is processed on the board body 1 by a spraying process. At the same time, the anti-corrosion layer 3 is specifically a three-proof paint, which has good high and low temperature resistance, and has excellent insulation, moisture-proof, anti-leakage, shock-proof, dust-proof, anti-corrosion, anti-aging, corona resistance and other properties;

[0026] A fixing seat 4 is provided on both sides of the board body 1, and fixing holes are provided on the fixing seat 4, so that the circuit board and other structures can be installed and fixed. At the same time, a heat dissipation mechanism 5 is provided at the bottom of the board body 1, and the heat dissipation mechanism 5 can actively absorb the heat on the board body 1 and dissipate it, thereby having a cooling effect on the circuit board, avoiding overheating of the components 2 thereon during operation, and protecting them;

[0027] The heat dissipation mechanism 5 includes a heat absorbing plate 51, which is fixed to the bottom of the plate body 1 by screws 53. The threaded installation method is easy to disassemble, and the screws 53 are made of plastic material to avoid the occurrence of electrical conduction. At the same time, a heat conducting layer 52 is also provided between the heat absorbing plate 51 and the plate body 1. The heat conducting layer 52 can better conduct the heat of the plate body 1 to the heat absorbing plate 51, thereby achieving good heat dissipation.

[0028] The heat-conducting layer 52 is specifically a heat-conducting glue, which covers the bottom of the board body 1 and the upper end of the heat-absorbing plate 51. At the same time, a groove 54 is also provided on the upper end of the heat-absorbing plate 51. A plurality of heat-conducting columns 55 are provided in the groove 54. The heat-conducting columns 55 are embedded in the heat-conducting layer 52 to better absorb heat. The heat-absorbing plate 51 is made of copper, which has good heat absorption. The setting of the groove 54 can also make the installation of the heat-conducting layer 52 more convenient.

[0029] A plurality of insulating pads 56 are arranged at the lower end of the heat absorbing plate 51. The insulating pads 56 are made of rubber material. While providing insulation, they can also protect the plate body 1 during installation. Moreover, a plurality of through holes 57 penetrating the front and rear side walls of the heat absorbing plate 51 are arranged at the bottom of the heat absorbing plate 51 below the groove 54. The through holes 57 are distributed laterally. When air flows, the through holes 57 can better take away the heat absorbed by the heat absorbing plate 51, thereby achieving a rapid cooling effect.

[0030] In the utility model, a heat dissipation mechanism 5 is arranged at the bottom of the circuit board. Through the design of the heat-conducting layer 52, the heat-absorbing plate 51, the heat-conducting column 55 and the through hole 57, the heat on the board body 1 can be quickly absorbed and transferred to the heat-absorbing plate 51, and the heat can be quickly dissipated, thereby avoiding the circuit board from generating high temperature during operation and protecting the components 2 soldered thereon.

[0031] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.

Claims

1. An etching-resistant circuit board, comprising a board body (1), a plurality of components (2) being arranged at the upper end of the board body (1), and an anti-corrosion layer (3) being sprayed on the upper surface of the board body (1), characterized in that: The bottom of the plate body (1) is also provided with a heat dissipation mechanism (5) for actively absorbing heat to cool the components (2) thereon; The heat dissipation mechanism (5) comprises a heat absorbing plate (51), the heat absorbing plate (51) is fixed to the bottom of the plate body (1) via screws (53), and the screws (53) are made of plastic material; A heat-conducting layer (52) is also provided between the heat-absorbing plate (51) and the plate body (1). The heat-conducting layer (52) is specifically a heat-conducting glue, which covers the bottom of the plate body (1) and the upper end of the heat-absorbing plate (51); A groove (54) is also provided at the upper end of the heat absorbing plate (51), a plurality of heat conducting columns (55) are provided in the groove (54), and the heat conducting columns (55) are embedded in the heat conducting layer (52). The heat absorbing plate (51) is made of copper. A plurality of insulating pads (56) are arranged at the lower end of the heat absorbing plate (51), and the insulating pads (56) are made of rubber material. A plurality of through holes (57) penetrating the front and rear side walls of the heat absorbing plate (51) are arranged at the bottom of the heat absorbing plate (51) below the groove (54), and the through holes (57) are distributed in a transverse direction.

2. The etching-resistant circuit board according to claim 1, characterized in that: The anti-corrosion layer (3) is processed onto the plate body (1) by a spraying process, and the anti-corrosion layer (3) is specifically a three-proof paint.

3. The etching-resistant circuit board according to claim 2, characterized in that: The left and right sides of the plate body (1) are both provided with fixing seats (4), and fixing holes are provided on the fixing seats (4).

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