Soaking sheet
By adding multiple conveues on the heating plate body, the problem of insufficient stability installation of the average hot tablet has been solved, and a more stable connection with the substrate is realized, Use flexibility.
Patent Information
- Application Number
- CN202421088462.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-04-18
- Filing Date
- 2024-05-17
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-17
AI Technical Summary
When installed in electronic products, the existing heat sinks are insufficient in stability, making it difficult to meet the improvement of the heat dissipation needs of electronic products.
By adding multiple conveues on the body of the average hot tablet, the connection position and area between the substrates are increased, thereby improving the stability. The convex can be added after production after production to reduce costs.
Effectively improve the connection stability between the average heat tablet and the substrate, enhance the heat dissipation capacity of electronic products, and improve the flexibility of the use of the average heat film.
Smart Images
Figure CN222424561U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat spreader. Background Art
[0002] With the advancement of electronic technology, the development of electronic products is advancing by leaps and bounds. Correspondingly, in order to cope with the improvement of electronic products' functions, the heat dissipation requirements in electronic products are becoming higher and higher, so the application of heat spreaders is becoming more and more popular.
[0003] In practical applications, heat spreaders can effectively remove the internal heat generated by electronic products during operation. However, as the size of heat spreaders is gradually increasing, how to improve the stability of heat spreaders installed in electronic products at a low cost to improve the quality of electronic products is undoubtedly a topic of great importance in the industry. Utility Model Content
[0004] One of the purposes of the utility model is to provide a heat spreader, which can increase the number of bosses at a low cost in a post-production manner to improve the stability of the connection with the substrate.
[0005] According to one embodiment of the utility model, a heat spreader comprises a plate body, a frame body and a plurality of bosses. The plate body has a plurality of grooves. The frame body is connected to the plate body and defines a space together with the plate body. The bosses are arranged on the plate body and located in the above-mentioned space, and each of the grooves is adjacent to a corresponding one of the bosses. The frame body and the bosses are respectively configured to connect to the substrate.
[0006] In one or more embodiments of the present invention, the bosses are separated from each other.
[0007] In one or more embodiments of the present invention, the boss and the frame are separated from each other.
[0008] In one or more embodiments of the present invention, the boss and the plate body are an integrally formed structure.
[0009] In one or more embodiments of the present invention, the plate has a first surface, the bosses are disposed on the first surface, each of the bosses has a second surface, each of the second surfaces is located on a side of a corresponding one of the bosses away from the first surface, and the second surface is parallel to the first surface.
[0010] In one or more embodiments of the present invention, the frame is connected to the first surface and has a third surface. The third surface is located on a side of the frame away from the first surface and is parallel to the first surface.
[0011] In one or more embodiments of the present invention, a first height is defined between each of the second surfaces and the first surface, a second height is defined between the third surface and the first surface, and the first height is smaller than the second height.
[0012] In one or more embodiments of the present invention, the second surface and the first surface are respectively flat surfaces.
[0013] In one or more embodiments of the present invention, the plate body and the frame body are an integrally formed structure.
[0014] According to another embodiment of the utility model, a heat spreader comprises a plate body, a frame body, a plurality of bosses and a plurality of solders. The frame body is connected to the plate body and defines a space together with the plate body. The bosses are arranged on the plate body and located in the above-mentioned space. The solders are respectively connected between one of the bosses and the plate body. The frame body and the bosses are respectively configured to connect to the substrate.
[0015] The above-mentioned embodiment of the utility model has at least the following advantages:
[0016] (1) Since the boss helps to increase the position and area of the connection between the heat spreader and the substrate, it can effectively improve the stability of the connection between the heat spreader and the substrate.
[0017] (2) Since the boss is formed by extruding part of the material from the first surface of the plate, the boss can be formed on the plate in a post-production manner. In other words, even if the heat spreader has been produced, the user can still add the boss to the heat spreader according to the actual situation at a low cost, thereby effectively improving the flexibility of the use of the heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A top view of a heat spreader according to an embodiment of the present invention is shown;
[0019] Figure 2 To draw the Figure 1 A cross-sectional view of line segment AA;
[0020] Figure 3 To illustrate Figure 2 An enlarged schematic diagram of a range M;
[0021] Figures 4 to 6 To draw the Figure 3 Schematic diagram of the production process of the boss;
[0022] Figure 7 The figure is a schematic diagram showing the installation process of the boss according to another embodiment of the present invention.
[0023]
Explanation of symbols
[0024] 100:Heat spreader
[0025] 110:Plate body
[0026] 110P: protrusion
[0027] 110S: First surface
[0028] 120:Frame
[0029] 120S: Third surface
[0030] 130: Boss
[0031] 130S: Second surface
[0032] 140: Solder
[0033] 210: Extrusion tool
[0034] 220: Pressing tool
[0035] 310: Positioning tool
[0036] 320:Welding tools
[0037] AA: Line segment
[0038] DC: Pressing direction
[0039] DG: Extrusion direction
[0040] G: Groove
[0041] H1: First Height
[0042] H2: Second Height
[0043] M: Range
[0044] SP: Space DETAILED DESCRIPTION
[0045] The following will disclose multiple embodiments of the utility model with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the utility model. That is to say, in some embodiments of the utility model, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and elements will be illustrated in a simple schematic manner in the drawings, and in all drawings, the same reference numerals will be used to represent the same or similar elements. And if it is possible in practice, the features of different embodiments can be applied interchangeably.
[0046] Unless otherwise defined, all words (including technical and scientific terms) used herein have their usual meanings, which are understood by those familiar with the field. Furthermore, the definitions of the above words in commonly used dictionaries should be interpreted in the content of this specification as consistent with the meanings of the relevant fields of the utility model. Unless otherwise clearly defined, these words will not be interpreted as idealized or overly formal.
[0047] Please refer to Figure 1 to Figure 3 . Figure 1 FIG. 1 is a top view of a heat spreader 100 according to an embodiment of the present invention. Figure 2 To draw the Figure 1 Cross-sectional view of line segment AA. Figure 3 To illustrate Figure 2 In this embodiment, as shown in FIG. Figure 1 to Figure 3 As shown, a heat spreader 100 includes a plate body 110, a frame body 120 and a plurality of bosses 130. The frame body 120 is connected to the plate body 110 and defines a space SP together with the plate body 110. The boss 130 is disposed on the plate body 110 and is located in the space SP. The frame body 120 and the boss 130 are respectively configured to connect to a substrate (not shown) so that the heat spreader 100 can dissipate heat from the substrate on which the chip is disposed. Since the boss 130 helps to increase the position and area of the connection between the heat spreader 100 and the substrate, the stability of the connection between the heat spreader 100 and the substrate can be effectively improved. For example, the heat spreader 100 and the substrate can be connected by adhesive, but the utility model is not limited to this.
[0048] like Figure 1-2 As shown, in this embodiment, the bosses 130 are separated from each other, and the bosses 130 and the frame 120 are also separated from each other. In other words, the bosses 130 do not contact the frame 120, and the bosses 130 do not contact each other. Figure 1 As shown, the bosses 130 may be evenly distributed on the plate body 110. In other embodiments, the bosses 130 may be irregularly distributed on the plate body 110 according to actual conditions, but the present invention is not limited thereto.
[0049] Furthermore, if Figure 3 As shown, the plate 110 has a first surface 110S, and the boss 130 is disposed on the first surface 110S of the plate 110. Furthermore, the boss 130 has a second surface 130S, and the second surface 130S is located on the side of the boss 130 away from the first surface 110S. In this embodiment, the second surface 130S of the boss 130 is parallel to the first surface 110S of the plate 110. More specifically, the second surface 130S of the boss 130 and the first surface 110S of the plate 110 are both flat surfaces, so as to facilitate the connection between the heat spreader 100 and the substrate.
[0050] Furthermore, if Figure 2 As shown, the frame 120 is connected to the first surface 110S of the plate 110 and has a third surface 120S, and the third surface 120S is located on the side of the frame 120 away from the first surface 110S. In this embodiment, the third surface 120S of the frame 120 is parallel to the first surface 110S of the plate 110. In other words, the first surface 110S of the plate 110, the second surface 130S of the boss 130 and the third surface 120S of the frame 120 are parallel to each other. In practical applications, the plate 110 and the frame 120 are an integrally formed structure, that is, the plate 110 and the frame 120 are manufactured from the same piece of raw material.
[0051] Please refer to Figure 3 .like Figure 3 As shown, a second height H2 is defined between the third surface 120S of the frame 120 and the first surface 110S of the plate 110, and a first height H1 is defined between the second surface 130S of the boss 130 and the first surface 110S of the plate 110. In this embodiment, the first height H1 is less than the second height H2, that is, the frame 120 is higher than the boss 130 relative to the first surface 110S of the plate 110.
[0052] Please refer to Figures 4 to 6 . Figures 4 to 6 To draw the Figure 3 Schematic diagram of the manufacturing process of the boss 130. In this manufacturing process, first, as Figure 4 As shown, the user uses the pressing tool 210 to press toward the first surface 110S of the plate 110 along the pressing direction DG (from the position of the pressing tool 210 indicated by the dotted line), and the pressing direction DG is inclined to the first surface 110S. Figure 5 As shown, at least part of the material of the plate body 110 is squeezed out from the first surface 110S by the squeezing tool 210 to form the protrusion 110P. Figure 6 As shown, the user removes the pressing tool 210 and then applies pressure to the protrusion 110P along the pressing direction DC (from the position of the pressing tool 220 indicated by the dotted line), so that the protrusion 110P forms a flat upper surface, i.e., the second surface 130S mentioned above, and the pressing direction DC is substantially perpendicular to the first surface 110S of the plate 110. At this point, the production of the boss 130 is also completed, as shown in FIG. Figure 3 It is worth noting that in this embodiment, Figure 3 to Figure 6 As shown, the boss 130 and the plate 110 are an integrally formed structure. More specifically, the boss 130, the plate 110 and the frame 120 are an integrally formed structure, and the heat spreader 100 can actually be made of a metal material with good ductility.
[0053] In practical applications, when the extrusion tool 210 is extruded toward the first surface 110S of the plate 110 along the extrusion direction DG, the force applied by the extrusion tool 210 to the first surface 110S must be accurately controlled to avoid the force applied by the extrusion tool 210 to the first surface 110S being too great and damaging the structure of the plate 110, or the force applied by the extrusion tool 210 to the first surface 110S being too small and failing to form the protrusion 110P.
[0054] On the other hand, in this embodiment, since the boss 130 is formed by extruding part of the material from the first surface 110S of the plate body 110, the position where the material extruded by the extrusion tool 210 of the plate body 110 is originally located forms a groove G on the first surface 110S (see the groove G). Figure 1 , Figure 3 , Figure 6 ). In other words, the groove G is adjacent to the boss 130.
[0055] Furthermore, as described above, since the boss 130 is formed by extruding a portion of material from the first surface 110S of the plate 110, the boss 130 can be formed on the plate 110 in a post-production manner. In other words, even if the heat spreader 100 has been manufactured, the user can still add the boss 130 to the heat spreader 100 according to actual conditions at a low cost, thereby effectively improving the flexibility of use of the heat spreader 100.
[0056] Please refer to Figure 7 . Figure 7 FIG. 1 is a schematic diagram showing the installation process of the boss 130 according to another embodiment of the present invention. Figure 7 As shown, the user first uses the positioning tool 310 to position the boss 130 on the first surface 110S of the plate 110, and then uses the welding tool 320 to form the solder 140 between the boss 130 and the first surface 110S, so as to weld and fix the boss 130 to the plate 110. In other words, in this installation process, the boss 130 and the plate 110 are not an integrally formed structure, and the first surface 110S of the plate 110 does not have the above-mentioned groove G, and the boss 130 is not adjacent to the above-mentioned groove G. In this embodiment, the plate 110 and the boss 130 are both made of metal materials.
[0057] In summary, the technical solution disclosed in the above embodiments of the present invention has at least the following advantages:
[0058] (1) Since the boss helps to increase the position and area of the connection between the heat spreader and the substrate, it can effectively improve the stability of the connection between the heat spreader and the substrate.
[0059] (2) Since the boss is formed by extruding part of the material from the first surface of the plate, the boss can be formed on the plate in a post-production manner. In other words, even if the heat spreader has been produced, the user can still add the boss to the heat spreader according to the actual situation at a low cost, thereby effectively improving the flexibility of the use of the heat spreader.
[0060] Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.
Claims
1. A heat spreader, characterized in that: Include: A plate body having a plurality of grooves; a frame body connected to the plate body and defining a space together with the plate body; and A plurality of bosses are disposed on the plate and located in the space, each of the plurality of grooves is adjacent to a corresponding one of the plurality of bosses, The frame and the plurality of bosses are respectively configured to be connected to a substrate.
2. The heat spreader according to claim 1, wherein: The plurality of bosses are separated from each other.
3. The heat spreader according to claim 1, wherein: The plurality of bosses are separated from the frame.
4. The heat spreader according to claim 1, wherein: The plurality of bosses and the plate body are an integrally formed structure.
5. The heat spreader according to claim 1, wherein: The plate body has a first surface, the plurality of bosses are arranged on the first surface, each of the plurality of bosses has a second surface, each of the plurality of second surfaces is located on a side of a corresponding one of the plurality of bosses away from the first surface, and the second surface is parallel to the first surface.
6. The heat spreader according to claim 5, wherein: The frame is connected to the first surface and has a third surface. The third surface is located at a side of the frame away from the first surface and is parallel to the first surface.
7. The heat spreader according to claim 6, wherein: A first height is defined between each of the second surfaces and the first surface, a second height is defined between the third surface and the first surface, and the first height is smaller than the second height.
8. The heat spreader according to claim 5, wherein: The second surface and the first surface are flat surfaces respectively.
9. The heat spreader according to claim 1, wherein: The plate body and the frame body are an integrally formed structure.
10. A heat spreader, characterized in that: Include: A plate body; a frame body, connected to the plate body and defining a space together with the plate body; A plurality of bosses are disposed on the plate and located in the space; and A plurality of solders are respectively connected between one of the plurality of bosses and the plate body, The frame and the plurality of bosses are respectively configured to be connected to a substrate.