Flexible semiconductor thermoelectric module

Abstract

A flexible semiconductor thermoelectric module comprises a heat-conducting flexible substrate, a plurality of cooling NP elements are fixed on the heat-conducting flexible substrate, cold surfaces and hot surfaces of two adjacent NP elements are connected in series through diversion strips, and the plurality of cooling NP elements form a series circuit. And the heat-conducting flexible substrate is fixed on the same side of the plurality of refrigeration NP elements. According to the semiconductor refrigeration module, an existing integral refrigeration NP module and a refrigeration NP element form are arranged on a heat conduction flexible substrate, a plurality of refrigeration NP elements are connected in series through a diversion strip to form a circuit, on the basis that existing functions are not lost, the semiconductor refrigeration module can be subjected to curved-surface design, and therefore the semiconductor refrigeration module can be applied to curved-surface products.

Description

Technical Field

[0001] The utility model relates to a semiconductor thermoelectric module, in particular to a flexible semiconductor thermoelectric module which can be suitable for a fixed installation position on a curved surface. Background Art

[0002] The existing semiconductor thermoelectric module is composed of cold surface ceramic sheet, guide sheet, semiconductor cooling NP element, hot surface ceramic sheet and positive and negative electrode leads. Due to the high hardness and brittle material of cold / hot surface ceramic sheet, it can only be installed on flat products, which limits the scope of use. Utility Model Content

[0003] In order to solve the problems in the prior art, the utility model provides a flexible semiconductor thermoelectric module which can be suitable for a fixed installation position on a curved surface.

[0004] A flexible semiconductor thermoelectric module, a heat-conducting flexible substrate, a plurality of cooling NP elements are fixed on the heat-conducting flexible substrate, the cold surface and the hot surface of two adjacent NP elements are connected in series by a guide bar, the plurality of cooling NP elements form a series circuit, and the heat-conducting flexible substrate is fixed on the same side of the plurality of cooling NP elements.

[0005] Through the above technical solution, the existing integral refrigeration NP module is arranged on a thermally conductive flexible substrate in the form of a refrigeration NP element, and several refrigeration NP elements are connected in series using guide bars to form a circuit. In this way, the semiconductor refrigeration module can be designed in a curved shape without losing the existing functions, so as to be applied to curved products.

[0006] Furthermore, the guide bar is a copper guide bar.

[0007] Furthermore, the thermally conductive flexible substrate is a copper thermally conductive flexible substrate.

[0008] Furthermore, the guide bar is connected to the thermally conductive flexible substrate by a welding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a structural schematic diagram of the utility model;

[0010] Figure 2 It is another structural schematic diagram of the utility model.

[0011] In the figure: 1. Thermally conductive flexible substrate; 2. Cooling NP element; 3. Guide strip. DETAILED DESCRIPTION

[0012] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0013] like Figure 1 and Figure 2 A flexible semiconductor thermoelectric module shown has a thermally conductive flexible substrate 1, which is not available in the prior art. Secondly, a number of cooling NP elements 2 are fixed on the thermally conductive flexible substrate 1. The cold surface and the hot surface of each two adjacent NP elements are connected in series by a guide bar 3. These several cooling NP elements 2 constitute a series circuit, which is also an innovative aspect that is different from the prior art as a whole. Finally, the thermally conductive flexible substrate 1 is fixed on the same side of the several cooling NP elements 2. In order to more specifically clarify the material issues of each component, a conventional disposal solution is adopted: the guide bar 3 is a copper guide bar, the thermally conductive flexible substrate 1 is a copper thermally conductive flexible substrate, and the guide bar 3 and the thermally conductive flexible substrate 1 are connected by welding technology.

[0014] This specific implementation method is to arrange the existing integral refrigeration NP module in the form of a refrigeration NP element 2 on a thermally conductive flexible substrate 1, and connect several refrigeration NP elements 2 in series using a guide bar 3 to form a circuit. In this way, without losing the existing functions, the semiconductor refrigeration module can be designed in a curved surface, so as to be applied to curved products.

Claims

1. A flexible semiconductor thermoelectric module, characterized in that: A thermally conductive flexible substrate, on which a plurality of cooling NP elements are fixed, the cold surface and the hot surface of two adjacent NP elements are connected in series by a guide bar, the plurality of cooling NP elements form a series circuit, and the thermally conductive flexible substrate is fixed on the same side of the plurality of cooling NP elements.

2. A flexible semiconductor thermoelectric module according to claim 1, characterized in that: The guide bar is a copper guide bar.

3. A flexible semiconductor thermoelectric module according to claim 1, characterized in that: The thermally conductive flexible substrate is a copper thermally conductive flexible substrate.

4. A flexible semiconductor thermoelectric module according to claim 1, characterized in that: The guide bar is connected to the thermally conductive flexible substrate by a welding process.

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