Workbench for wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses a wafer processing workbench, which comprises a rack and a driving mechanism, a support plate is arranged in the middle of the rack, drain holes and a placing table for placing wafers are arranged on the support plate, and the driving mechanism is used for driving the placing table to rotate. And the upper part of the rack is provided with a flushing pipe corresponding to the placing table. According to the wafer processing workbench provided by the utility model, the drain hole and the placing table for placing the wafer are arranged on the supporting plate, the driving mechanism is arranged to drive the placing table to rotate, and the flushing pipe is arranged at the upper part of the rack corresponding to the placing table, so that after the wafer is polished, the wafer is firstly placed on the placing table, and then the placing table is driven to rotate; and meanwhile, the flushing pipe flushes and cleans the wafer on the placing table, so that the timely flushing of the wafer is realized, the surface quality problem caused by untimely flushing is avoided, and the surface quality of the wafer is effectively ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a workbench for wafer processing. Background Art

[0002] Gallium arsenide has different physical and chemical properties in its crystal structure and energy band structure than single-element semiconductors such as germanium and silicon. As a result, the surface quality requirements of the wafers processed from it are very strict. The quality of its surface will directly affect the back-end application of the wafer.

[0003] The main production process of GaAs wafers includes slicing, grinding, polishing and cleaning. If the wafers are not rinsed and cleaned in time after polishing, the surface quality of the wafers will be directly affected. However, the existing wafer processing workbench cannot be rinsed and cleaned in time, resulting in quality problems on the surface of the wafers. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a wafer processing workbench, which can realize timely washing of the wafer, thereby ensuring the surface quality of the wafer.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A workbench for wafer processing comprises a frame and a driving mechanism, wherein a support plate is provided in the middle of the frame, a water flow hole and a placement table for placing wafers are provided on the support plate, the driving mechanism is used to drive the placement table to rotate, and a flushing pipe is provided on the upper part of the frame corresponding to the placement table.

[0007] Preferably, a protrusion is provided in the middle of the placement platform, and a block is provided at the edge of the placement platform, and a placement area for placing wafers is formed between the block and the protrusion.

[0008] Preferably, the cross section of the placement platform is circular, and there are a plurality of the barriers, which are arranged in a circular array on the placement platform.

[0009] Preferably, the cross section of the protrusion is circular and is coaxially arranged with the placement platform.

[0010] Preferably, the surface of the block close to the protrusion is a locking surface, and the locking surface is arc-shaped.

[0011] Preferably, the driving mechanism comprises a first foot pedal arranged at the bottom of the platform, and the first foot pedal is connected to the placement table through a rotating assembly.

[0012] Preferably, a second foot pedal is provided at the bottom of the stand, and the second foot pedal is connected to the flushing pipe to drive the flushing pipe to move.

[0013] Preferably, the flushing pipe comprises a pipe body, one end of the pipe body is open for connecting to a water pipe, the other end of the pipe body is closed, and a plurality of flushing ports are provided on the pipe body along its length direction.

[0014] Preferably, a hook is provided on the stand.

[0015] Compared with the prior art, a workbench for wafer processing in an embodiment of the utility model has the following beneficial effects: a water flow hole and a placement table for placing wafers are arranged on a support plate, and a driving mechanism is arranged to drive the placement table to rotate, and a flushing pipe is arranged on the upper part of the stand corresponding to the placement table. When the wafer is polished, the wafer is placed on the placement table, and then the placement table is driven to rotate, and at the same time, the flushing pipe flushes and cleans the wafer on the placement table, thereby achieving timely flushing of the wafer, avoiding surface quality problems caused by untimely flushing, and effectively ensuring the surface quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a wafer processing workbench of the present utility model.

[0017] Figure 2 It is a structural schematic diagram of a wafer processing workbench of the utility model in which one of the flushing pipes rotates.

[0018] Among them: 1-stand, 2-support plate, 3-placing table, 4-flushing pipe, 5-protrusion, 6-block, 7-first foot pedal, 8-second foot pedal, 9-hook, 10-water hole, 100-wafer. DETAILED DESCRIPTION

[0019] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0020] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0022] like Figure 1-2 As shown, a wafer processing workbench of a preferred embodiment of the utility model comprises a stand 1 and a driving mechanism, a support plate 2 is provided in the middle of the stand 1, a water flow hole 10 and a placement table 3 for placing a wafer 100 are provided on the support plate 2, the driving mechanism is used to drive the placement table 3 to rotate, and a flushing pipe 4 is provided at the upper part of the stand 1 corresponding to the placement table 3. The flushing pipe 4 corresponds to the placement table 3 one by one, and multiple flushing pipes 4 can be provided on the stand 1 to improve the flushing efficiency. In addition, a hook 9 can be provided on the stand 1 for hanging parts.

[0023] The wafer processing workbench based on the above technical features is provided with a water hole 10 and a placement table for placing the wafer 100 on the support plate 2, and a driving mechanism is provided to drive the placement table 3 to rotate, and at the same time, a flushing pipe 4 is provided at the upper part of the stand 1 corresponding to the placement table 3. After the wafer 100 is polished, the wafer 100 is placed on the placement table 3, and then the placement table 3 is driven to rotate, and at the same time, the flushing pipe 4 flushes the wafer 100 on the placement table 3 with water, thereby achieving timely flushing of the wafer 100, avoiding surface quality problems caused by untimely flushing, and thus effectively ensuring the surface quality of the wafer 100.

[0024] In this embodiment, a protrusion 5 is provided in the middle of the placing table 3, and a block 6 is provided at the edge of the placing table 3. A placement area for placing the wafer 100 is formed between the block 6 and the protrusion 5. Thus, collision between the wafers 100 can be avoided during the rotation of the placing table 3, and the surface quality of the wafer 100 can be ensured. At the same time, since the wafer 100 is circular, the cross section of the placing table 3 is also set to be circular, and there are multiple blocks 6, which are arranged on the placing table 3 in a circular array. The cross section of the protrusion 5 is also circular and is coaxially arranged with the placing table 3. The surface of the block 6 close to the protrusion 5 is a clamping surface, and the clamping surface is an arc. Therefore, the wafer 100 is in arc contact with the protrusion 5 and the block 6, which will not affect the side quality of the wafer.

[0025] In addition, when possible, such as when wafers 100 of the same specification are mass-produced, or when a workbench only produces wafers 100 of the same specification, the diameter of the arc-shaped clamping surface of the block 6 can be set to be the same as the diameter of the wafer 100, so that it fits perfectly with the outer side of the wafer 100, thereby ensuring the stability of the wafer 100.

[0026] In this embodiment, the driving mechanism includes a first pedal 7 disposed at the bottom of the stand 1, and the first pedal 7 is connected to the placement table 3 through a rotating assembly. The placement table 4 can be rotated by stepping on the first pedal 7. The rotating assembly can first adopt any existing mechanism, such as a pedal rotary dehydration barrel structure (such as CN201710312U, CN201691879U, etc.).

[0027] In this embodiment, in order to further improve the flushing effect, the flushing pipe 4 can be set to be movable. Specifically, a second foot pedal 8 can be set at the bottom of the stand 1, and the second foot pedal 8 is connected to the flushing pipe 4 to drive the flushing pipe 4 to move. Preferably, the outer wall of one end of the flushing pipe 4 is connected to a rotating rod, and the middle part of the second foot pedal 8 is hinged to the stand 1, one end is for stepping on, and the other end is connected to the rotating rod through a connecting rod. When the second foot pedal 8 is stepped on, the flushing pipe 4 rotates around the rotating rod, so that the angle of the flushing pipe 4 can be adjusted as needed to achieve the best flushing effect.

[0028] Of course, a motor may be directly used to connect the placement table 3 and the flushing pipe 4 to realize their rotation. The first foot pedal 7 and the second foot pedal 8 serve as switches for starting and stopping the motor, and an infrared sensor is arranged on the stand 1 and electrically connected to the motor. During the flushing process, if a person approaches the infrared sensing area, the motor stops rotating, thereby improving operational safety.

[0029] In this embodiment, one of the placing platforms 3 corresponds to one of the first footrests 7 and one of the second footrests 8 .

[0030] In this embodiment, the flushing pipe 4 includes a tube body, one end of which is open for connecting a water pipe connected to a water source, and the other end of the tube body is closed. The tube body is provided with a plurality of flushing ports along its length direction. The plurality of flushing ports can expand the flushing area and improve the flushing efficiency.

[0031] There are multiple water holes 10 to facilitate the rapid discharge of sewage after flushing. At the same time, a water collecting funnel can be arranged inside the stand 1 below the support plate 2, and a drain pipe is arranged at the bottom of the water collecting funnel to discharge sewage through the drain pipe to ensure a clean and hygienic working environment.

[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A wafer processing workbench, characterized in that: The invention comprises a stand and a driving mechanism, wherein a support plate is arranged in the middle of the stand, water holes and a placement table for placing wafers are arranged on the support plate, the driving mechanism is used to drive the placement table to rotate, and a flushing pipe is arranged on the upper part of the stand corresponding to the placement table.

2. The wafer processing workbench according to claim 1, wherein: A protrusion is arranged in the middle of the placing platform, a block is arranged at the edge of the placing platform, and a placing area for placing wafers is formed between the block and the protrusion.

3. The wafer processing workbench according to claim 2, wherein: The cross section of the placement platform is circular, and there are a plurality of the barriers, which are arranged on the placement platform in a circular array.

4. The wafer processing workbench according to claim 3, wherein: The cross section of the protrusion is circular and is coaxially arranged with the placement platform.

5. The wafer processing workbench according to claim 2, wherein: The surface of the block close to the protrusion is a clamping surface, and the clamping surface is arc-shaped.

6. The wafer processing workbench according to any one of claims 1 to 5, characterized in that: The driving mechanism comprises a first foot pedal arranged at the bottom of the platform, and the first foot pedal is connected to the placement platform through a rotating assembly.

7. The wafer processing workbench according to any one of claims 1 to 5, characterized in that: A second foot pedal is provided at the bottom of the stand, and the second foot pedal is connected to the flushing pipe and is used for driving the flushing pipe to move.

8. The wafer processing workbench according to any one of claims 1 to 5, characterized in that: The flushing pipe comprises a pipe body, one end of which is open for connecting a water pipe, and the other end of which is closed. The pipe body is provided with a plurality of flushing ports along its length direction.

9. The wafer processing workbench according to any one of claims 1 to 5, characterized in that: A hook is provided on the stand.

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