Power assembly and electric vehicle

Abstract

The utility model provides a power assembly which comprises a shell, a motor controller and a motor, the shell comprises two sub-cavities and a partition plate which are integrally formed, the two sub-cavities are arranged in the first direction, the partition plate is used for separating the two sub-cavities, one sub-cavity is used for containing a bus capacitor and a radiator of the motor controller, and the other sub-cavity is used for containing the motor controller. And the other sub-cavity is used for fixing a stator of the motor and accommodating a rotor of the motor. The power assembly further comprises a heat dissipation plate, the heat dissipation plate is arranged between the bus capacitor and the partition plate in the first direction, and the interval between the heat dissipation plate and the partition plate is larger than the interval between the heat dissipation plate and the bus capacitor in the first direction. Based on the technical scheme, good heat dissipation of the bus capacitor can be realized under the scene that the motor controller and the motor share the same shell, and the service life of the bus capacitor is further prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of electric vehicles, and in particular to a powertrain and an electric vehicle. Background Art

[0002] At present, integrated powertrains are commonly used as drive systems for electric vehicles. In an integrated powertrain, the motor, reducer and motor controller share a housing to achieve integration, lightness and miniaturization of the powertrain. However, the motor and motor controller share a housing, and the motor controller housing is easily affected by the temperature of the motor housing, especially when the bus capacitor is located above the motor barrel, which will cause the temperature rise of the bus capacitor to increase, thereby affecting the life of the bus capacitor. Utility Model Content

[0003] The present application provides a power assembly that can achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0004] In a first aspect, a power assembly is provided, which includes: a housing, a motor controller and a motor, the housing including two integrally formed sub-cavities and a partition, the two sub-cavities are arranged along a first direction, the partition is used to separate the two sub-cavities, one of the sub-cavities is used to accommodate a bus capacitor and a radiator of the motor controller, and the other sub-cavity is used to fix the stator of the motor and accommodate the rotor of the motor; a heat sink, the heat sink is arranged between the bus capacitor and the partition along the first direction, and the spacing between the heat sink and the partition along the first direction is greater than the spacing between the heat sink and the bus capacitor.

[0005] In the technical solution of the present application, the heat sink is arranged between the bus capacitor and the partition along the first direction, and along the first direction, the distance between the heat sink and the partition is greater than the distance between the heat sink and the bus capacitor. On the one hand, the distance between the radiator, the heat sink and the bus capacitor along the first direction is small, which facilitates the radiator and the heat sink to better dissipate heat for the bus capacitor. On the other hand, the distance between the heat sink and the partition along the first direction is large, which can increase the heat conduction path between the partition and the heat sink, thereby better insulating the bus capacitor and extending the life of the bus capacitor.

[0006] In combination with the first aspect, in an implementation of the first aspect, the bus capacitor is arranged between the radiator and the heat sink along the first direction. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0007] In combination with the first aspect, in an implementation of the first aspect, the distance between the heat sink and the bus capacitor along the first direction is smaller than the distance between the heat sink and the partition along the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0008] In combination with the first aspect, in an implementation of the first aspect, the heat sink is arranged adjacent to the bus capacitor along a second direction, and the second direction is perpendicular to the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0009] In combination with the first aspect, in an implementation of the first aspect, the distance between the heat sink and the bus capacitor along the second direction is smaller than the distance between the heat sink and the partition along the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0010] In combination with the first aspect, in an implementation of the first aspect, the radiator and the bus capacitor are stacked on the heat sink along the first direction, and the heat sink is stacked on the partition along the first direction. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0011] In combination with the first aspect, in an implementation of the first aspect, the interval between the radiator and the heat sink along the first direction is smaller than the interval between the heat sink and the partition along the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0012] In combination with the first aspect, in an implementation of the first aspect, the heat sink includes an internal flow channel, the internal flow channel of the heat sink is used to transmit coolant to dissipate heat for the bus capacitor or at least one of the partitions, and the radiator includes an internal flow channel, the internal flow channel of the radiator is used to transmit coolant to dissipate heat for the power module of the motor controller or at least one of the bus capacitors. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0013] In combination with the first aspect, in an implementation of the first aspect, the internal flow channel of the heat sink is used to connect to the internal flow channel of the radiator, and the heat sink includes two side surfaces, which are opposite to each other along the first direction, wherein: one side surface is used to fix the partition; the other side surface includes an inlet and an outlet of the internal flow channel of the heat sink, and the inlet and the outlet of the internal flow channel of the heat sink are respectively used to connect to the internal flow channel of the radiator. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0014] In combination with the first aspect, in an implementation of the first aspect, the spacing between the inlet and outlet of the internal flow channel of the heat sink along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink is greater than the size of the bus capacitor along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink, and is smaller than the size of the radiator along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0015] In combination with the first aspect, in an implementation of the first aspect, the internal flow channel of the radiator and the internal flow channel of the radiator are connected in series, wherein: the inlet of the internal flow channel of the heat sink is used to connect to the outlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat sink is used to connect to the inlet of the internal flow channel of the radiator. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0016] In combination with the first aspect, in an implementation of the first aspect, the internal flow channel of the radiator and the internal flow channel of the radiator are connected in parallel, wherein: the inlet of the internal flow channel of the heat sink is used to connect to the inlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat sink is used to connect to the outlet of the internal flow channel of the radiator. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0017] In combination with the first aspect, in an implementation of the first aspect, the working fluid of the coolant transmitted by the internal flow channel of the heat sink is different from the working fluid of the coolant transmitted by the internal flow channel of the radiator. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0018] In combination with the first aspect, in an implementation of the first aspect, the internal flow channel of the heat sink is used to connect to the internal oil channel of the shell, and the internal flow channel of the radiator is used to connect to the internal water channel of the shell. Based on the above technical solution, in the scenario where the motor controller and the motor share a shell, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0019] In combination with the first aspect, in an implementation of the first aspect, the heat sink includes two side surfaces, the two side surfaces are opposite to each other along the first direction, wherein: one side surface faces the bus capacitor; the other side surface includes an inlet and an outlet of the internal flow channel of the heat sink, and the inlet and the outlet of the internal flow channel of the heat sink are respectively used to connect to the internal flow channel of the shell. Based on the above technical solution, in the scenario where the motor controller and the motor share a shell, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0020] In combination with the first aspect, in an implementation of the first aspect, at least one of the partition or the heat sink includes at least one support column, and each of the support columns is used to fix the heat sink and the partition. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0021] In combination with the first aspect, in an implementation of the first aspect, the partition further includes an internal flow channel, and at least one of the support columns includes an internal flow channel, and the internal flow channel of the support column is used to connect the internal flow channel of the heat sink and the internal flow channel of the partition. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0022] In combination with the first aspect, in an implementation of the first aspect, the internal flow channel of the heat sink includes multiple flow channels along at least one of the third direction or the second direction, and the first direction, the second direction, and the third direction are perpendicular to each other. Based on the above technical solution, in the scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0023] In combination with the first aspect, in an implementation of the first aspect, the projected area of ​​the heat sink along the first direction is greater than or equal to the projected area of ​​the bus capacitor along the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0024] In a second aspect, an electric vehicle is provided, comprising wheels, a transmission mechanism, and a powertrain as described in the first aspect and any one of the implementations of the first aspect, wherein the powertrain drives the wheels through the transmission mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of an electric vehicle provided in an embodiment of the present application.

[0026] Figure 2 A schematic structural diagram of a powertrain 300 provided in an embodiment of the present application.

[0027] Figure 3 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0028] Figure 4 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0029] Figure 5 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0030] Figure 6 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0031] Figure 7 A schematic diagram of a cross section of an internal flow channel of a heat sink provided in an embodiment of the present application along a second direction.

[0032] Figure 8 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0033] Fig. 9 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0034] Fig.10 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0035] Reference numerals:

[0036] 10-vehicle; 100-body; 200-wheel; 300-powertrain; 310-housing; 311-sub-cavity; 312-sub-cavity; 320-busbar capacitor; 330-radiator; heat sink-340; 350-partition; 360-thermal conductive material; 370-support column; 380-internal flow channel of heat sink; 381-inlet; 382-outlet. DETAILED DESCRIPTION

[0037] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0038] The "perpendicular" mentioned in this application is not perpendicular in the strict sense, but within the allowable error range. The "parallel" is not parallel in the strict sense, but within the allowable error range.

[0039] In the embodiments of the present application, the same reference numerals represent the same component or the same part. In the embodiments of the present application, for multiple identical parts, only one of the parts may be marked with a reference numeral in the drawings as an example. The same reference numerals apply to other identical parts or components.

[0040] To facilitate understanding of the present application, before introducing the embodiments of the present application, the professional terms involved in the embodiments of the present application are first introduced in detail.

[0041] Powertrain: refers to a series of components that generate power on a vehicle and transmit it to the road. The powertrain includes a motor, a motor controller, and a reducer, and the motor controller is used to control the motor.

[0042] Motor controller: As one of the core components of electric vehicles, it is the decisive factor in the vehicle's power performance. The motor controller obtains the vehicle's requirements from the vehicle controller, obtains power from the power battery pack, and obtains the current and voltage required to control the motor through modulation of its own inverter, and provides it to the motor, so that the motor's speed and torque meet the requirements of the vehicle.

[0043] In the integrated powertrain, the motor, reducer and motor controller share a housing to achieve integration, lightness and miniaturization of the powertrain. However, the motor and motor controller share a housing, and the motor controller housing is easily affected by the temperature of the motor housing, especially when the bus capacitor is located above the motor barrel, which will cause the bus capacitor temperature to rise, thereby affecting the life of the bus capacitor.

[0044] Based on this, an embodiment of the present application aims to provide a powertrain that can solve the heat dissipation problem of the bus capacitor, thereby extending the life of the bus capacitor.

[0045] Combine the following Figure 1 and Figure 2 The vehicle 10 provided in the embodiment of the present application is first described in detail.

[0046] Figure 1 This is a schematic diagram of the structure of the vehicle 10 provided in the embodiment of the present application. Figure 1As shown, the vehicle 10 includes a body 100, wheels 200, a battery (not shown), a transmission mechanism (not shown), and one or more power assemblies 300. The wheels 200 are rotatably connected to the body 100, the power assembly 300 is accommodated in the body 100, and the power assembly 300 is also transmission-connected to the wheels 200, and the power assembly 300 drives the wheels 200 through the transmission mechanism.

[0047] The powertrain 300 includes a motor controller, a motor and a reducer (not shown). The motor controller is used to connect to the battery and receive the DC power transmitted by the battery through the DC input interface, and then convert the DC power into AC power and transmit it to the terminal of the motor winding through the AC output interface to control the start or stop, forward or reverse rotation, speed increase or decrease, increase or decrease of the driving torque, increase or decrease of the braking torque, etc. of the motor. The output end of the motor shaft of the motor transmits power to the wheels of the vehicle 10 through the reducer to drive the wheels 200 to rotate relative to the body 100 and provide power for the vehicle 10 to travel.

[0048] It should be understood that the vehicle 10 provided in the embodiment of the present application includes a pure electric vehicle or a hybrid vehicle.

[0049] It should also be understood that the vehicle 10 provided in the embodiment of the present application includes a pure electric vehicle, a hybrid electric vehicle, an extended-range electric vehicle, a plug-in hybrid electric vehicle or a new energy vehicle, etc. Among them, a pure electric vehicle is also referred to as a pure electric vehicle / battery electric vehicle, or simply pure EV / battery EV. A hybrid electric vehicle is also referred to as a hybrid electric vehicle, or simply HEV. An extended-range electric vehicle is also referred to as a range extended electric vehicle, or simply REEV. A plug-in hybrid electric vehicle is also referred to as a plug-in hybrid electric vehicle, or simply PHEV. A new energy vehicle is also referred to as a new energy vehicle, or simply NEV.

[0050] The present application embodiment provides a powertrain, as shown below Figures 2 to 10 The powertrain 300 provided in the embodiment of the present application is described in detail.

[0051] Figure 2 A schematic structural diagram of a powertrain 300 provided in an embodiment of the present application.

[0052] like Figure 2As shown, the powertrain 300 includes a housing 310, a motor controller and a motor (not shown). In the embodiment of the present application, the housing 310 includes two integrally formed sub-cavities and a partition 350, the two sub-cavities are arranged along a first direction, and the partition 350 is used to separate the two sub-cavities.

[0053] like Figure 2 As shown, the sub-cavity 311 and the sub-cavity 312 are arranged along the first direction, and the partition 350 is used to separate the sub-cavity 311 and the sub-cavity 312. Among them, one sub-cavity (for example, 311) is used to accommodate the motor controller, the bus capacitor 320 and the heat sink 330 of the motor controller, and the other sub-cavity (for example, 312) is used to fix the stator of the motor and accommodate the rotor of the motor, that is, the other sub-cavity is used to accommodate the motor.

[0054] In one embodiment, the housing 310, the two sub-cavities and the partition 350 are an integrally formed structure. The housing 310, the two sub-cavities and the partition 350 are made by an integral die-casting process.

[0055] like Figure 2 As shown, the powertrain 300 further includes a heat sink 340. The heat sink 340 is arranged between the bus capacitor 320 and the partition 350 along a first direction, and the interval between the heat sink 340 and the partition 350 along the first direction is greater than the interval between the heat sink 340 and the bus capacitor 320.

[0056] The heat sink 340 is arranged between the bus capacitor 320 and the partition 350 along the first direction.

[0057] In one embodiment, the bus capacitor 320 , the heat sink 340 , and the partition 350 are arranged adjacent to each other in sequence along the first direction.

[0058] In one embodiment, the projected area of ​​the heat sink 340 along the first direction is larger than the projected area of ​​the bus capacitor 320 along the first direction. Figure 2 (a).

[0059] In one embodiment, the projected area of ​​the heat sink 340 along the first direction is equal to the projected area of ​​the bus capacitor 320 along the first direction. Figure 2 (b).

[0060] In one embodiment, a thermal conductive material 360 , such as a thermal conductive pad, is further disposed between the bus capacitor 320 and the heat sink 340 .

[0061] like Figure 2As shown, the heat sink 330 is arranged on the side of the partition 350 facing the motor controller. Along the first direction, the heat sink 330 is stacked on the partition 350 and is not stacked on the heat sink 340. In one embodiment, a heat conductive material 360 is also provided between the heat sink 330 and the partition 350.

[0062] Figure 3 This is a schematic diagram of a powertrain provided in an embodiment of the present application. Figure 3 As shown, the bus capacitor 320 is arranged along the first direction between the heat sink 330 and the heat sink 340. The heat sink 340, the bus capacitor 320 and the heat sink 330 are sequentially stacked on the partition 350 along the first direction.

[0063] In one embodiment, the distance between the radiator 330 and the bus capacitor 320 along the first direction is smaller than the distance between the heat sink 340 and the partition 350 along the first direction, that is, the distance between the heat sink 340 and the partition 350 along the first direction is greater than the distance between the radiator 330 and the bus capacitor 320 along the first direction.

[0064] In the embodiment of the present application, the interval between the heat sink 340 and the partition 350 along the first direction is greater than the interval between the heat sink 340 and the bus capacitor 320, and the interval between the radiator 330 and the bus capacitor 320. On the one hand, the interval between the radiator 330, the heat sink 340 and the bus capacitor 320 along the first direction is small, which facilitates the radiator 330 and the heat sink 340 to better dissipate heat for the bus capacitor 320. On the other hand, the interval between the heat sink 340 and the partition 350 along the first direction is large, which can increase the heat conduction path between the partition 350 and the heat sink 340, thereby better insulating the bus capacitor 320.

[0065] In one embodiment, the projected area of ​​the heat sink 340 along the first direction is larger than the projected area of ​​the bus capacitor 320 along the first direction. Figure 3 (a).

[0066] In one embodiment, the projected area of ​​the heat sink 340 along the first direction is equal to the projected area of ​​the bus capacitor 320 along the first direction. Figure 3 (b).

[0067] Figure 4 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0068] like Figure 4 As shown, along the second direction, the heat sink 330 is arranged adjacent to the bus capacitor 320. In one embodiment, the second direction is perpendicular to the first direction.

[0069] In one embodiment, the heat sink 330 and the bus capacitor 320 are stacked on the heat sink 340 along the first direction, and the heat sink 340 is stacked on the partition 350 along the first direction. The heat sink 330 and the bus capacitor 320 are adjacently arranged along the second direction, and the heat sink 330 and the bus capacitor 320 are both arranged on the heat sink 340 along the first direction.

[0070] like Figure 2 As shown in (b), the bus capacitor 320 and the heat sink 340 are stacked on the partition 350 along the first direction, and the radiator 330 is stacked on the partition 350 along the first direction. The radiator 330 and the bus capacitor 320 are adjacently arranged along the second direction, the bus capacitor 320 is stacked on the heat sink 340 along the first direction, and the radiator 330 is stacked on the partition 350 along the first direction.

[0071] In one embodiment, the distance between the heat sink 330 and the bus capacitor 320 along the second direction is smaller than the distance between the heat sink 340 and the partition 350 along the first direction. In one embodiment, the distance between the heat sink 340 and the partition 350 along the first direction is larger than the distance between the heat sink 330 and the bus capacitor 320 along the second direction.

[0072] In the embodiment of the present application, the interval between the heat sink 340 and the partition 350 along the first direction is greater than the interval between the radiator 330 and the bus capacitor 320 along the second direction and the interval between the heat sink 340 and the bus capacitor 320 along the first direction. On the one hand, the interval between the radiator 330 and the bus capacitor 320 along the second direction is small, which facilitates the radiator 330 to better dissipate heat for the bus capacitor 320. In addition, the interval between the heat sink 340 and the bus capacitor 320 along the first direction is small, which can also better achieve heat dissipation for the bus capacitor 320. On the other hand, the interval between the heat sink 340 and the partition 350 along the first direction is large, which can increase the heat conduction path between the partition 350 and the heat sink 340, thereby better insulating the bus capacitor 320.

[0073] like Figure 4 As shown, the distance between the radiator 330 and the heat dissipation plate 340 along the first direction is smaller than the distance between the heat dissipation plate 340 and the partition 350 along the first direction. In one embodiment, the distance between the heat dissipation plate 340 and the partition 350 along the first direction is larger than the distance between the radiator 330 and the heat dissipation plate 340 along the first direction.

[0074] In the embodiment of the present application, the interval between the heat sink 330 and the heat sink 340 along the first direction is small, and the heat sink 330 can quickly take away the heat on the heat sink 340 to achieve heat dissipation for the bus capacitor 320. On the other hand, the interval between the heat sink 340 and the partition 350 along the first direction is large, which can increase the heat conduction path between the partition 350 and the heat sink 340, thereby better insulating the bus capacitor 320.

[0075] In one embodiment, at least one of the heat sink 340 or the partition 350 includes one or more support columns 370, and each support column 370 is used to fix the heat sink 340 and the partition 350 so that a gap is provided between the heat sink 340 and the partition 350, thereby achieving thermal insulation of the bus capacitor 320.

[0076] In one embodiment, at least one of the partition 350 or the heat sink 340 includes one or more support columns 370. In one embodiment, the partition 350 includes one or more support columns 370. In one embodiment, the side of the partition 350 facing the heat sink 340 includes one or more support columns 370. Figure 5 As shown, the side of the partition 350 facing the heat dissipation plate 340 includes two support columns 370 .

[0077] In one embodiment, the heat sink 340 includes a plurality of support columns 370. In one embodiment, the heat sink 340 includes a plurality of support columns 370 on a side facing the partition 350. Figures 2 to 4 As shown, the heat dissipation plate 340 includes two support columns 370 on one side facing the partition plate 350 .

[0078] In one embodiment, both the partition 350 and the heat sink 340 include one or more support columns 370. In one embodiment, the side of the partition 350 facing the heat sink 340 includes one or more support columns 370, and the side of the heat sink 340 facing the partition 350 also includes one or more support columns 370.

[0079] In one embodiment, the number of support columns 370 included in the partition plate 350 and the number of support columns 370 included in the heat dissipation plate 340 are equal. In one embodiment, the number of support columns 370 included in the partition plate 350 and the number of support columns 370 included in the heat dissipation plate 340 are not equal.

[0080] It should be noted that the partition 350 includes one or more support columns 370. In one embodiment, the partition 350 and the one or more support columns 370 are an integrally formed structure. In one embodiment, the partition 350 and the support columns 370 are formed by one process. In one embodiment, the partition 350 and the one or more support columns 370 are formed by an integral casting process. In one embodiment, the partition 350 and the support columns 370 are two separately formed structures, and the support columns 370 are welded on the surface of the partition 350 by welding or the like.

[0081] In one embodiment, the heat sink 340 includes one or more support columns 370. In one embodiment, the heat sink 340 and the one or more support columns 370 are an integrally formed structure. In one embodiment, the heat sink 340 and the support columns 370 are formed by one process. In one embodiment, the heat sink 340 and the support columns 370 are formed by an integral casting process. In one embodiment, the heat sink 340 and the support columns 370 are two separately formed structures, and the support columns 370 are welded on the surface of the heat sink 340 by welding or the like.

[0082] In one embodiment, the distance between two adjacent support pillars in the plurality of support pillars 370 is equal. In one embodiment, the distance between two adjacent support pillars in the plurality of support pillars 370 is not equal. In one embodiment, the plurality of support pillars 370 are arranged in a single row on at least one of the partition 350 or the heat sink 340. In one embodiment, the plurality of support pillars 370 are arranged in multiple rows on at least one of the partition 350 or the heat sink 340.

[0083] In one embodiment, the heat sink 330 is arranged adjacent to the bus capacitor 320. In one embodiment, a gap is provided between the heat sink 330 and the bus capacitor 320. In one embodiment, there is no gap between the heat sink 330 and the bus capacitor 320. The gap is also referred to as a gap or a gap.

[0084] Figure 6 A schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application. Figure 6 The heat sink 340 , the bus capacitor 320 , and the heat sink 330 are stacked on the partition 350 along the first direction as an example for description.

[0085] like Figure 6 As shown, the heat sink 340 also includes an internal flow channel 380. The internal flow channel 380 is used to transmit coolant to dissipate heat for at least one of the bus capacitor 320 or the partition 350. The radiator 330 also includes an internal flow channel (not shown in the figure), and the internal flow channel of the radiator 330 is used to transmit coolant to dissipate heat for at least one of the power module (not shown in the figure) of the motor controller or the bus capacitor 320.

[0086] In one embodiment, the internal flow channel 380 of the heat sink 340 includes a plurality of flow channels along at least one of the second direction or the third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0087] It should be noted that the arrangement structure of the internal flow channels 380 of the heat dissipation plate 340 is a three-dimensional structure. Figure 7 A schematic diagram of a cross section of an internal flow channel of a heat sink provided in an embodiment of the present application along a second direction.

[0088] like Figure 7 As shown in (a)-(c), the cross-section of the internal flow channel 380 of the heat dissipation plate 340 along the second direction includes an S-shape, an L-shape or a ring-shape.

[0089] In one embodiment, the working medium of the coolant transmitted by the internal flow channel 380 of the heat sink 340 is different from the working medium of the coolant transmitted by the internal flow channel of the radiator 330. In one embodiment, when the internal flow channel 380 of the heat sink 340 is not connected to the internal flow channel of the radiator 330, the working medium of the coolant transmitted by the internal flow channel 380 of the heat sink 340 is different from the working medium of the coolant transmitted by the internal flow channel of the radiator 330.

[0090] In one embodiment, the internal flow channel 380 of the heat sink 340 is used to connect to the internal oil channel of the housing 310, and the internal flow channel of the radiator 330 is used to connect to the internal water channel of the housing 310. In this case, the internal flow channel 380 of the heat sink 340 is used to transmit cooling oil, and the internal flow channel of the radiator 330 is used to transmit cooling liquid.

[0091] In one embodiment, the internal flow channel 380 of the heat sink 340 is used to communicate with the internal flow channel of the radiator 330. For example, the internal flow channel 380 of the heat sink 340 is connected with the internal flow channel of the radiator 330 through a pipeline.

[0092] Figure 8 A schematic structural diagram of a powertrain 300 provided as another embodiment of the present application is provided, taking as an example a radiator 330 , a bus capacitor 320 , and a heat sink 340 stacked on a partition 350 along a first direction.

[0093] like Figure 8 As shown, the heat sink 340 includes two side surfaces, and the two side surfaces are opposite to each other along a first direction. One side surface (e.g., S1) is used to fix and connect the partition 350, and the other side surface (e.g., S2) includes an inlet 381 and an outlet 382 of an internal flow channel 380 of the heat sink 340, and the inlet 381 and the outlet 382 are respectively used to connect to the internal flow channel (not shown) of the radiator 330.

[0094] In one embodiment, the internal flow channel 380 of the heat sink 340 and the internal flow channel of the heat sink 330 are connected in series.

[0095] In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is used to connect to the outlet 382 of the internal flow channel of the radiator 330, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is used to connect to the inlet 381 of the internal flow channel of the radiator 330. In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is connected to the outlet 382 of the internal flow channel of the radiator 330 through a pipe, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is connected to the inlet 381 of the internal flow channel of the radiator 330 through another pipe.

[0096] In one embodiment, the internal flow channel 380 of the heat sink 340 and the internal flow channel of the heat sink 330 are connected in parallel.

[0097] In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is used to communicate with the inlet 381 of the internal flow channel of the radiator 330, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is used to communicate with the outlet 382 of the internal flow channel of the radiator 330. In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is connected to the inlet 381 of the internal flow channel of the radiator 330 through a pipe, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is connected to the outlet 382 of the internal flow channel of the radiator 330 through another pipe.

[0098] like Figure 8 As shown, along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340, the interval between the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340 is greater than the size of the bus capacitor 320 along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340. When the internal flow channel 380 of the heat sink 340 is passed through the coolant, the bus capacitor 320 can be better cooled.

[0099] In one embodiment, along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340, the interval between the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340 is greater than the size of the bus capacitor 320 along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340.

[0100] Fig. 9 A schematic structural diagram of a powertrain 300 provided in an embodiment of the present application is taken as an example that a radiator 330 and a bus capacitor 320 are arranged adjacent to each other along the second direction, and the radiator 330 and the bus capacitor 320 are stacked and arranged on a heat sink 340 along the first direction.

[0101] like Fig. 9As shown, along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340, the interval between the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340 is larger than the dimension of the bus capacitor 320 along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel of the heat sink 340, and smaller than the dimension of the radiator 330 along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel of the heat sink 340.

[0102] In one embodiment, the heat sink 340 includes two side surfaces, and the two side surfaces are opposite to each other along a first direction. One side surface (e.g., S2) faces the bus capacitor 320, and the other side surface (e.g., S1) includes an inlet 381 and an outlet 382 of an internal flow channel 380 of the heat sink 340, and the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340 are respectively used to connect to the internal flow channel of the housing 310.

[0103] In one embodiment, the partition 350 includes an internal flow channel, and at least one support column 370 also includes an internal flow channel. The internal flow channel of the support column 370 is used to connect the internal flow channel of the heat dissipation plate 340 and the internal flow channel of the partition 350 .

[0104] In one embodiment, the heat sink 340 is made of a metal material with good thermal conductivity, and the material of the heat sink 340 includes metal materials such as aluminum and copper. In one embodiment, the heat sink 340 is called a heat sink metal plate, a metal plate or a metal tray.

[0105] In one embodiment, a thermally conductive material 360 is disposed between the bus capacitor 320 , the heat sink 330 , and the heat sink 340 .

[0106] In one embodiment, a thermally conductive material 360 is disposed between the bus capacitor 320 and the heat sink 340 , and a thermally conductive material 360 is also disposed between the heat sink 330 and the heat sink 340 .

[0107] In one embodiment, a thermally conductive material 360 is disposed between the bus capacitor 320 and the heat sink 340 , and a thermally conductive material 360 is also disposed between the heat sink 330 and the bus capacitor 320 .

[0108] In one embodiment, the radiator 330 is a single-sided liquid-cooled radiator. In one embodiment, the radiator 330 is a double-sided liquid-cooled radiator.

[0109] In one embodiment, the motor controller further includes a circuit board and a power module (not shown in the figure). The circuit board is used to fix the power module, and the power module is used to package at least one power tube.

[0110] In the embodiment of the present application, the circuit board is also referred to as a printed circuit board assembly, wherein the printed circuit board assembly is also referred to as a printed circuit board assembly, or PCBA for short.

[0111] The power tube involved in the embodiment of the present application includes but is not limited to power semiconductor devices, devices with heat dissipation, etc. For example, the power tube is an insulated gate bipolar transistor or a power inductor. Among them, the insulated gate bipolar transistor is also called insulated gate bipolar transistor, or abbreviated as IGBT.

[0112] In one embodiment, the motor controller mentioned above further includes a connector (not shown in the figure), and the connector is used to electrically connect the circuit board and the motor.

[0113] In one embodiment, the power assembly 300 mentioned above further includes a reducer, and an input shaft of the reducer is drivingly connected to a motor shaft of the motor.

[0114] According to the powertrain provided in the embodiment of the present application, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0115] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A powertrain, characterized in that: The powertrain comprises: A housing, a motor controller and a motor, wherein the housing comprises two integrally formed sub-cavities and a partition, wherein the two sub-cavities are arranged along a first direction, and the partition is used to separate the two sub-cavities, wherein one sub-cavity is used to accommodate a bus capacitor and a heat sink of the motor controller, and the other sub-cavity is used to fix the stator of the motor and accommodate the rotor of the motor; A heat sink is arranged between the bus capacitor and the partition along the first direction, and a distance between the heat sink and the partition along the first direction is greater than a distance between the heat sink and the bus capacitor.

2. The powertrain according to claim 1, characterized in that: The bus capacitor is arranged between the heat sink and the heat dissipation plate along the first direction.

3. The powertrain according to claim 2, characterized in that: The distance between the heat sink and the bus capacitor along the first direction is smaller than the distance between the heat sink and the partition along the first direction.

4. The powertrain according to claim 1, characterized in that: The heat sink is arranged adjacent to the bus capacitor along a second direction, and the second direction is perpendicular to the first direction.

5. The powertrain according to claim 4, characterized in that: The distance between the heat sink and the bus capacitor along the second direction is smaller than the distance between the heat sink and the partition along the first direction.

6. The powertrain according to claim 4 or 5, characterized in that: The heat sink and the bus capacitor are stacked and arranged on the heat sink plate along the first direction, and the heat sink plate is stacked and arranged on the partition along the first direction.

7. The powertrain according to claim 6, characterized in that: The interval between the heat sink and the heat dissipation plate along the first direction is smaller than the interval between the heat dissipation plate and the partition along the first direction.

8. The powertrain according to claim 1, characterized in that: The heat sink includes an internal flow channel, and the internal flow channel of the heat sink is used to transport coolant to dissipate heat for at least one of the bus capacitor or the partition. The radiator includes an internal flow channel, and the internal flow channel of the radiator is used to transport coolant to dissipate heat for the power module of the motor controller or at least one of the bus capacitor.

9. The powertrain according to claim 8, characterized in that: The internal flow channel of the heat dissipation plate is used to communicate with the internal flow channel of the radiator, and the heat dissipation plate includes two side surfaces, and the two side surfaces are opposite to each other along the first direction, wherein: The one side surface is used for fixedly connecting the partition; The other side surface includes an inlet and an outlet of the internal flow channel of the heat dissipation plate, and the inlet and the outlet of the internal flow channel of the heat dissipation plate are respectively used to communicate with the internal flow channel of the radiator.

10. The powertrain according to claim 9, characterized in that: The spacing between the inlet and outlet of the internal flow channel of the heat sink along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink is larger than the size of the bus capacitor along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink, and smaller than the size of the radiator along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink.

11. The powertrain according to claim 9, characterized in that: The internal flow channel of the heat sink and the internal flow channel of the radiator are connected in series, wherein: The inlet of the internal flow channel of the heat dissipation plate is used to communicate with the outlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat dissipation plate is used to communicate with the inlet of the internal flow channel of the radiator.

12. The powertrain according to claim 9, characterized in that: The internal flow channel of the radiator and the internal flow channel of the radiator are connected in parallel, wherein: The inlet of the internal flow channel of the heat dissipation plate is used to communicate with the inlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat dissipation plate is used to communicate with the outlet of the internal flow channel of the radiator.

13. The powertrain according to claim 8, characterized in that: The working medium of the coolant transmitted by the internal flow channel of the heat sink is different from the working medium of the coolant transmitted by the internal flow channel of the radiator.

14. The powertrain according to claim 13, characterized in that: The internal flow channel of the heat sink is used to communicate with the internal oil channel of the shell, and the internal flow channel of the radiator is used to communicate with the internal water channel of the shell.

15. The powertrain according to claim 13, characterized in that: The heat dissipation plate includes two side surfaces, and the two side surfaces are opposite to each other along the first direction, wherein: The one side faces the bus capacitor; the other side includes an inlet and an outlet of the internal flow channel of the heat sink, and the inlet and the outlet of the internal flow channel of the heat sink are respectively used to connect to the internal flow channel of the shell.

16. The power assembly according to claim 1 or 13, characterized in that: At least one of the partition plate or the heat sink plate comprises at least one supporting column, and each supporting column is used for fixedly connecting the heat sink plate and the partition plate.

17. The powertrain according to claim 16, characterized in that: The partition includes an internal flow channel, and at least one of the support columns includes an internal flow channel. The internal flow channel of the support column is used to connect the internal flow channel of the heat dissipation plate and the internal flow channel of the partition.

18. The powertrain according to claim 8, characterized in that: The internal flow channel of the heat dissipation plate includes a plurality of flow channels along at least one of the third direction or the second direction, and the first direction, the second direction and the third direction are perpendicular to each other.

19. The powertrain according to claim 1, characterized in that: A projected area of ​​the heat sink along the first direction is greater than or equal to a projected area of ​​the bus capacitor along the first direction.

20. An electric vehicle, characterized in that: The electric vehicle comprises wheels, a transmission mechanism and a powertrain according to any one of claims 1 to 19, wherein the powertrain drives the wheels via the transmission mechanism.

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