Air floatation device

Abstract

The air floatation device includes: a first table on which a substrate is placed; a transfer picker which is adjacent to the first stage and supports the substrate; and a transfer air knife which is adjacent to the transfer picker and sprays air to the back surface of the substrate to float the substrate from the first stage.

Description

Technical Field

[0001] The present disclosure relates to an air flotation device. Background Art

[0002] The air floating device is a device that uses air to float a substrate during the manufacturing process of a display.

[0003] The air floating device in the prior art includes a workbench, and the workbench includes air holes for spraying air to float the substrate.

[0004] The air flotation device in the prior art ejects air through the air holes of the workbench to float the substrate on the workbench, or uses the air holes of the workbench to form a vacuum to adsorb the substrate to the workbench for fixation.

[0005] However, when the conventional air flotation apparatus includes a plurality of stages for performing different substrate processes, it is difficult to set the flow rates of air ejected through the air holes of the plurality of stages to be the same. Utility Model Content

[0006] The present disclosure provides an air flotation apparatus that floats a substrate on each of a plurality of stages with the same air flow rate while minimizing the presence of foreign matter on the surface of the stage.

[0007] One side provides an air flotation device, including: a first workbench for placing a substrate; a transfer sorter adjacent to the first workbench for supporting the substrate; and a transfer air knife adjacent to the transfer sorter for spraying air onto the back of the substrate to float the substrate from the first workbench.

[0008] The first workbench may include a plurality of vacuum holes for adsorbing the back side of the substrate.

[0009] The substrate may include a substrate body and a flexible printed circuit board connected to an end of the substrate body, and the transfer sorter may support the flexible printed circuit board of the substrate.

[0010] The transfer sorting machine may adsorb the flexible printed circuit substrate.

[0011] The transfer picker may be moved upward from the first workbench.

[0012] The transfer picker may include a plurality of pickers spaced apart from each other, and the intervals between the plurality of pickers may be adjusted corresponding to the flexible printed circuit substrate.

[0013] The transfer air knife may eject the air toward the back surface of the substrate body, thereby floating the substrate body from the first stage.

[0014] The transfer air knife may include: an air jetting unit configured to jet the air toward the back surface of the substrate; and an angle adjusting unit configured to adjust an air jetting angle of the air jetting unit.

[0015] The width of the nozzle of the air injection portion may be adjusted by adjusting the thickness of a spacer located inside the air injection portion.

[0016] It may further include: a transfer unit supporting the transfer sorter and the transfer air knife.

[0017] The method may further include: a second workbench spaced apart from the first workbench in a direction.

[0018] The transfer unit may include: a support portion supporting the transfer sorter and the transfer air knife; and a guide rail portion spaced apart from the first workbench and the second workbench, extending in the one direction, and guiding the support portion in the one direction.

[0019] In addition, one side provides an air flotation method, including: a step of supporting a substrate placed on a first workbench by a transfer sorter; and a step of spraying air from a transfer air knife adjacent to the transfer sorter to the back of the substrate to float the substrate from the first workbench.

[0020] The step of supporting the substrate by the transfer sorter may be performed by the transfer sorter sucking the flexible printed circuit substrate of the substrate.

[0021] The step of floating the substrate from the first worktable may include the step of moving the transfer sorter upward from the first worktable to move the flexible printed circuit substrate of the substrate upward from the first worktable.

[0022] The step of floating the substrate from the first stage may further include the step of ejecting the air between the flexible printed circuit board of the substrate moving upward from the first stage and the first stage to float the substrate from the first stage.

[0023] The method may further include: in a state where the substrate is floated by the air, transferring the transfer sorter and the transfer air knife supporting the substrate from the first work station to a second work station spaced apart in one direction.

[0024] The step of transferring the transfer sorter and the transfer air knife from the first work station to the second work station spaced apart in the one direction may be performed by moving a transfer unit supporting the transfer sorter and the transfer air knife in the one direction.

[0025] The substrate supported by the transfer sorter may be placed on the second workbench.

[0026] The step of placing the substrate on the second workbench may include: the step of turning off the air ejected from the transfer air knife; and the step of positioning the transfer sorter at the second workbench to place the substrate on the second workbench.

[0027] (Effect of utility model)

[0028] According to an embodiment, an air floating apparatus and an air floating method are provided for floating a substrate on each of a plurality of stages with the same air flow rate while minimizing the presence of foreign matter on the surface of the stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a perspective view showing an air flotation device according to an embodiment.

[0030] Figure 2 It is a side view showing the first worktable side of the air flotation device involved in one embodiment.

[0031] Figure 3 It is a perspective view showing a transfer air knife of an air flotation device according to an embodiment.

[0032] Figure 4 It is a side view showing an air jet portion of a transfer air knife of an air flotation device according to an embodiment.

[0033] Figures 5 to 7 It is a side view for explaining that a substrate is floated by an air flotation device according to an embodiment.

[0034] Figure 8 It is a sequence diagram showing an air flotation method according to another embodiment.

[0035] Figures 9 to 13 It is a diagram for explaining an air flotation method according to another embodiment.

[0036] Explanation of symbols:

[0037] 100: first workbench; 200: second workbench; 300: transfer sorter; 400: transfer air knife; 500: transfer unit. DETAILED DESCRIPTION

[0038] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0039] In order to clearly explain the present invention, parts not related to the description are omitted, and the same or similar components are given the same symbols throughout the specification.

[0040] In addition, in the drawings, for the sake of convenience of explanation, the size and thickness of each structure are arbitrarily shown, and the present invention is not necessarily limited to the illustrated situation. In the drawings, the thickness is enlarged to clearly show each layer and region. In addition, in the drawings, for the sake of convenience of explanation, the thickness of some layers and regions is exaggerated.

[0041] In addition, when a layer, film, region or other part is located on or above another part, it includes not only the case where it is directly located on the other part, but also the case where there is another part in between. On the contrary, when a part is directly located on another part, it means that there is no other part in between. In addition, being located on or above a part that becomes a reference means being located above or below the part that becomes a reference, and does not necessarily mean being located above or above in the opposite direction of gravity.

[0042] Furthermore, in the entire specification, when a certain part includes a certain constituent element, unless otherwise stated, it does not exclude other constituent elements but indicates that other constituent elements may be included.

[0043] Below, refer to Figures 1 to 7 , describing an air flotation device involved in an embodiment. Hereinafter, the air flotation device may include a device for placing and transferring a substrate that performs a plurality of substrate processing steps in a manufacturing process of a display panel, but is not limited thereto. Here, the substrate processing step may include a step of forming an optical resin layer through the entire substrate, but is not limited thereto, and may include a step of forming various known layers through the entire substrate.

[0044] Figure 1 It is a perspective view showing an air flotation device according to an embodiment.

[0045] Reference Figure 1 The air flotation device 1000 according to one embodiment can float the substrate 10 manufactured into a display panel by air, transfer and place it on each of a plurality of workbenches, and perform various known substrate processing steps on the substrates 10 placed on the respective workbenches. Here, the air flotation device 1000 can include various known substrate processing components for performing the substrate processing steps.

[0046] As an example, the substrate 10 may include a substrate body 11 and a flexible printed circuit substrate 12 connected to an end of the substrate body 11, but is not limited thereto. The substrate body 11 may include a flexible substrate containing at least one of glass and resin, but is not limited thereto. The flexible printed circuit substrate 12 may be connected to various known driving parts mounted on the substrate body 11, but is not limited thereto.

[0047] As an example, the air floating device 1000 may form an optical resin layer on the entire surface of the substrate body 11 , but is not limited thereto, and various well-known structures may be formed on the entire surface of the substrate body 11 .

[0048] The air flotation device 1000 includes a first workbench 100, a second workbench 200, a transfer sorter 300, a transfer air knife 400, and a transfer unit 500. The air flotation device 1000 involved in one embodiment includes two workbenches including the first workbench 100 and the second workbench 200, but is not limited thereto. As an example, the air flotation device involved in other embodiments may include one workbench or more than three workbenches.

[0049] The substrate 10 is placed on the first workbench 100. One of various well-known substrate processing processes can be performed on the substrate 10 placed on the first workbench 100. The first workbench 100 includes a plurality of first vacuum holes 110 for adsorbing the back side of the substrate body 11 of the substrate 10. A vacuum can be formed inside the plurality of first vacuum holes 110 to adsorb and fix the back side of the substrate body 11 to the first workbench 100. Various well-known structures can be formed through the entire substrate body 11 of the substrate 10 placed on the first workbench 100. As an example, an optical resin layer can be formed through the entire substrate body 11 of the substrate 10 placed on the first workbench 100, but it is not limited thereto. The first workbench 100 may include aluminum, but it is not limited thereto, and may include various well-known metals and various ceramics, etc.

[0050] The second workbench 200 is arranged to be spaced apart from the first workbench 100 in one direction. The substrate 10 on which a substrate processing process is performed on the first workbench 100 is transferred from the first workbench 100 and placed on the second workbench 200. Others of various known substrate processing processes can be performed on the substrate 10 placed on the second workbench 200. The second workbench 200 includes a plurality of second vacuum holes 210 for adsorbing the back side of the substrate body 11 of the substrate 10. Vacuum is formed inside the plurality of second vacuum holes 210, so that the back side of the substrate body 11 is adsorbed and fixed to the second workbench 200. Various known structures can be formed through the entire substrate body 11 of the substrate 10 placed on the second workbench 200. As an example, other optical resin layers can be formed through the entire substrate body 11 of the substrate 10 placed on the second workbench 200, but it is not limited thereto. The second workbench 200 may include aluminum, but it is not limited thereto, and may include various known metals and various ceramics, etc.

[0051] The substrate 10 may be transferred from the first stage 100 to the second stage 200 in a floating state by the transfer sorter 300 and the transfer air knife 400 and may be placed on the second stage 200 .

[0052] Figure 2 It is a side view showing the first worktable side of the air flotation device involved in one embodiment.

[0053] Reference Figure 1 and Figure 2 , the transfer sorting machine 300 is arranged adjacent to the first workbench 100. The transfer sorting machine 300 is supported by the transfer unit 500. The transfer sorting machine 300 supports the substrate 10 when transferring the substrate 10. The transfer sorting machine 300 can adsorb the flexible printed circuit substrate 12 of the substrate 10 to support it. The transfer sorting machine 300 adsorbs the flexible printed circuit substrate 12 of the substrate 10 to support it, thereby suppressing the situation where the transfer sorting machine 300 interferes with or damages various known structures formed through the entire substrate body 11 through the substrate processing process. The transfer sorting machine 300 can move up and down UD in the direction toward the first workbench 100. The transfer sorting machine 300 can move from the first workbench 100 toward the upper side in a state of supporting the flexible printed circuit substrate 12 of the substrate 10. The transfer sorting machine 300 includes a plurality of pickers 310. The plurality of pickers 310 may be spaced apart from each other, and the intervals between the plurality of pickers 310 may be adjusted corresponding to the width of the flexible printed circuit substrate 12. The plurality of pickers 310 of the transfer picker 300 may directly adsorb the flexible printed circuit substrate 12 of the substrate 10 to support the substrate 10.

[0054] The transfer air knife 400 is adjacent to the transfer sorter 300. The transfer air knife 400 is located at the lower side of the transfer sorter 300, but is not limited to this. The transfer air knife 400 is supported by the transfer unit 500 together with the transfer sorter 300. Through the movement MO of the transfer unit 500 in one direction, the transfer air knife 400 and the transfer sorter 300 move together MO. The transfer air knife 400 sprays air between the substrate 10 and the first workbench 100 to float the substrate 10 from the first workbench 100. The transfer air knife 400 sprays air toward the back side of the substrate 10 to float the substrate 10 from the first workbench 100. The transfer air knife 400 sprays air toward the back side of the substrate body 11 of the substrate 10 to float the substrate body 11 from the first workbench 100. With the transfer sorting machine 300 supporting the flexible printed circuit substrate 12 of the substrate 10, the substrate 10 moves toward the upper side from the first workbench 100, so that the flexible printed circuit substrate 12 is separated from the first workbench 100, and the transfer air knife 400 sprays air toward the back side of the substrate body 11 of the substrate 10, so that the substrate body 11 of the substrate 10 floats from the first workbench 100.

[0055] Figure 3 It is a perspective view showing a transfer air knife of an air flotation device according to an embodiment.

[0056] Reference Figure 3 The transfer air knife 400 includes an air injection portion 410 and an angle adjustment portion 420 .

[0057] The air injection unit 410 injects air toward the back side of the substrate 10. The air injection unit 410 includes a nozzle 411 extending in one direction corresponding to the frame of the substrate 10. The air is injected toward the back side of the substrate 10 by the nozzle 411 of the air injection unit 410, so that the substrate 10 floats from the first workbench 100.

[0058] The angle adjustment part 420 adjusts the air injection angle of the air injection part 410. The angle adjustment part 420 may rotate about an axis while supporting an end of the air injection part 410, thereby adjusting the air injection angle of the air injection part 410, but is not limited thereto.

[0059] Figure 4 It is a side view showing an air jet portion of a transfer air knife of an air flotation device according to an embodiment.

[0060] Reference Figure 4 The air injection unit 410 includes a nozzle 411 and a shim 412. The width of the nozzle 411 of the air injection unit 410 can be adjusted by adjusting the thickness of the shim 412 located inside the air injection unit 410, but the invention is not limited thereto. The shim 412 can have various known shapes corresponding to the shape of the air injection unit 410.

[0061] Reference Figure 1 and Figure 2 The transfer unit 500 supports the transfer sorter 300 and the transfer air knife 400. The transfer unit 500 is spaced apart from the first workbench 100 and the second workbench 200 and moves in one direction MO.

[0062] The transfer unit 500 includes a support portion 510 and a guide rail portion 520 .

[0063] The support part 510 supports the transfer sorter 300 and the transfer air knife 400. The support part 510 can be guided by the guide rail part 520 to move MO from the first workbench 100 along one direction toward the second workbench 200. The support part 510 can include various known moving parts such as wheels and motors that can move along the guide rail part 520.

[0064] The guide rail portion 520 is spaced apart from the first workbench 100 and the second workbench 200 and extends in a direction from the first workbench 100 to the second workbench 200. The guide rail portion 520 guides the support portion 510 in a direction.

[0065] While the transfer sorter 300 supports the flexible printed circuit substrate 12 of the substrate 10 and the transfer air knife 400 floats the substrate body 11 of the substrate 10, the transfer unit 500 moves in one direction MO so that the substrate 10 can be transferred from the first workbench 100 to the second workbench 200.

[0066] Figures 5 to 7 It is a side view for explaining that a substrate is floated by an air flotation device according to an embodiment.

[0067] Reference Figure 5 , the first workbench 100 releases the adsorption of the substrate 10 on which a substrate processing step has been performed, and the transfer sorter 300 performs a descent DN toward the flexible printed circuit substrate 12 of the substrate 10 , thereby adsorbing and supporting the flexible printed circuit substrate 12 .

[0068] Reference Figure 6 , the transfer sorter 300 is lifted up from the first workbench 100 in a state where the flexible printed circuit substrate 12 of the substrate 10 is supported, so that the flexible printed circuit substrate 12 of the substrate 10 is spaced apart from the first workbench 100. By spacing the flexible printed circuit substrate 12 of the substrate 10 apart from the first workbench 100, the end of the substrate body 11 of the substrate 10 can be spaced apart from the first workbench 100 by a predetermined interval. The transfer air knife 400 sprays air AR toward the back side of the substrate body 11 located between the first workbench 100 and the flexible printed circuit substrate 12 of the substrate 10.

[0069] Reference Figure 7The transfer air knife 400 sprays air AR toward the back side of the substrate body 11 of the substrate 10 , so that the substrate body 11 of the substrate 10 floats from the first workbench 100 while the flexible printed circuit substrate 12 of the substrate 10 is supported by the transfer sorter 300 .

[0070] Reference Figure 1 When the transfer sorting machine 300 supports the flexible printed circuit substrate 12 of the substrate 10 and the transfer air knife 400 makes the substrate body 11 of the substrate 10 float from the first workbench 100, the transfer unit 500 can move in one direction MO, so that the substrate 10 can be transferred from the first workbench 100 to the second workbench 200 in a floating state.

[0071] For the substrate 10 transferred to the second workbench 200 in a floating state, the spraying of the air AR by the transfer air knife 400 is canceled, so that the substrate body 11 is placed on the second workbench 200, the transfer sorter 300 is lowered to the second workbench 200, thereby placing the flexible printed circuit substrate 12 on the second workbench 200, and the adsorption of the flexible printed circuit substrate 12 by the transfer sorter 300 is canceled, and the adsorption of the substrate body 11 by the second workbench 200 is performed, so that the substrate 10 including the substrate body 11 and the flexible printed circuit substrate 12 can be placed and fixed on the second workbench 200. Other substrate processing processes can be performed on the substrate 10 at the second workbench 200.

[0072] As an example, an air flotation device 1000 involved in one embodiment includes a transfer sorter 300 that supports a substrate 10 and a transfer air knife 400 that sprays air AR toward the back side of the substrate 10 to float the substrate 10 from the first workbench 100, thereby separating foreign matter on the surface of the first workbench 100 from the surface of the first workbench 100 through the air AR of the transfer air knife 400, and at the same time, floating the substrate 10 on the first workbench 100 with the same air flow rate of the transfer air knife 400.

[0073] In addition, the air flotation device 1000 according to one embodiment includes a transfer sorter 300 for supporting a substrate 10 and a transfer air knife 400 for ejecting air AR to the back of the substrate 10 to float the substrate 10 from the first worktable 100, and the substrate 10 is transferred from the first worktable 100 to the second worktable 200 in a state where the substrate 10 is floating, so that foreign matter on the surfaces of the first worktable 100 and the second worktable 200 is separated from the surfaces of the first worktable 100 and the second worktable 200 by the air AR of the transfer air knife 400, and the substrate 10 is floated on the first worktable 100 and the second worktable 200 respectively by the same air flow rate of the transfer air knife 400. Thus, the substrate 1 can be transferred from the first worktable 100 to the second worktable 200 without a height change while floating the substrate 10 at the same height on the first worktable 100 and the second worktable 200 respectively.

[0074] In addition, the air flotation device 1000 involved in one embodiment floats the substrate body 11 from the first workbench 100 by spraying air AR toward the back side of the substrate body 11 of the substrate 10 through the transfer air knife 400 when the transfer sorting machine 300 supports the flexible printed circuit substrate 12 of the substrate 10. Therefore, even if various structures are formed on the entire surface of the substrate body 11 on the first workbench 100, it is possible to prevent the structures from being interfered with or damaged by the transfer sorting machine 300 and the transfer air knife 400.

[0075] In addition, the air flotation device 1000 according to one embodiment floats the substrate 100 by transferring the air AR of the air knife 400, so that metals such as aluminum, which have a low risk of breakage and are easy to manage, can be selected as the materials included in the first workbench 100 and the second workbench 200, rather than ceramics, which are brittle and have a risk of breakage. As an example, when the substrate is floated by the air holes of the workbench, since the air holes of the workbench should have a set size, the material included in the workbench should include ceramics formed by sintering (for example, alumina, etc.).

[0076] An air flotation device 1000 is provided, which minimizes foreign matter on the surfaces of a plurality of worktables and simultaneously transfers the substrate 10 by floating the substrate 10 on each of the plurality of worktables with the same air flow rate.

[0077] Below, refer to Figures 8 to 13 , describing the air flotation method involved in other embodiments. The air flotation method involved in other embodiments can be performed using the air flotation device 1000 involved in the above-mentioned embodiment, but is not limited thereto.

[0078] Figure 8 It is a sequence diagram showing an air flotation method according to another embodiment. Figures 9 to 13 It is a diagram for explaining an air flotation method according to another embodiment.

[0079] First, refer to Figures 8 to 10 The substrate 10 placed on the first workbench 100 is supported by the transfer sorter 300 (S100).

[0080] Specifically, the first workbench 100 releases the substrate 10 on which a substrate processing step has been performed, and the transfer sorter 300 descends DN toward the flexible printed circuit substrate 12 of the substrate 10, thereby adsorbing and supporting the flexible printed circuit substrate 12. The transfer sorter 300 adsorbs the flexible printed circuit substrate 12 of the substrate 10, thereby supporting the substrate 10.

[0081] Next, refer to Fig.11 and Fig.12 , air AR is sprayed toward the back side of the substrate 10 from the transfer air knife 400 adjacent to the transfer sorter 300, so that the substrate 10 floats from the first stage 100 (S200).

[0082] Specifically, the transfer sorter 300 is moved upward from the first workbench 100, so that the flexible printed circuit substrate 12 of the substrate 10 is moved upward from the first workbench 100. The flexible printed circuit substrate 12 of the substrate 10 is lifted up from the first workbench 100 while being supported by the transfer sorter 300, so that the flexible printed circuit substrate 12 of the substrate 10 is separated from the first workbench 100. By separating the flexible printed circuit substrate 12 of the substrate 10 from the first workbench 100, the end of the substrate body 11 of the substrate 10 can be separated from the first workbench 100 by a predetermined interval.

[0083] Air AR is sprayed between the flexible printed circuit board 12 of the substrate 10 moving upward from the first workbench 100 and the first workbench 100, so that the substrate 10 floats from the first workbench 100. The transfer air knife 400 sprays air AR toward the back side of the substrate body 11 located between the first workbench 100 and the flexible printed circuit board 12 of the substrate 10. The transfer air knife 400 sprays air AR toward the back side of the substrate body 11 of the substrate 10, so that the substrate body 11 of the substrate 10 floats from the first workbench 100 while the flexible printed circuit board 12 of the substrate 10 is supported by the transfer sorter 300.

[0084] Next, refer to Fig.13 , in a state where the substrate 10 is floated by the air AR, the transfer sorter 300 and the transfer air knife 400 supporting the substrate 10 are transferred from the first stage 100 to the second stage 200 spaced apart in one direction (S300).

[0085] Specifically, the transfer unit 500 supporting the transfer sorter 300 and the transfer air knife 400 is moved MO from the first workbench 100 toward the second workbench 200 in one direction, so that the transfer sorter 300 and the transfer air knife 400 are moved from the first workbench 100 to the second workbench 200 spaced apart in one direction. In a state where the transfer sorter 300 supports the flexible printed circuit substrate 12 of the substrate 10 and the transfer air knife 400 floats the substrate body 11 of the substrate 10 from the first workbench 100, the transfer unit 500 is moved MO in one direction, so that the substrate 10 can be transferred from the first workbench 100 to the second workbench 200 in a floating state.

[0086] Next, the substrate 10 supported by the transfer sorter 300 is set on the second stage 200 (S400).

[0087] Specifically, the air AR ejected from the transfer air knife 400 is turned off, and the transfer sorter 300 is moved to the second workbench 200, so that the substrate 10 is placed on the second workbench 200. For the substrate 10 transferred in a state of floating on the second workbench 200, the ejection of the air AR by the transfer air knife 400 can be released, so that the substrate body 11 is placed on the second workbench 200, the transfer sorter 300 descends to the second workbench 200, so that the flexible printed circuit substrate 12 is placed on the second workbench 200, the transfer sorter 300 releases the adsorption of the flexible printed circuit substrate 12, and the second workbench 200 performs the adsorption of the substrate body 11, so that the substrate 10 including the substrate body 11 and the flexible printed circuit substrate 12 can be placed and fixed on the second workbench 200. Other substrate processing steps can be performed on the substrate 10 on the second workbench 200.

[0088] As an example, other embodiments involve an air flotation method in which a transfer sorter 300 supports the substrate 10, and air AR is sprayed from a transfer air knife 400 toward the back side of the substrate 10 to float the substrate 10 from the first workbench 100, thereby separating foreign matter on the surface of the first workbench 100 from the surface of the first workbench 100 through the air AR of the transfer air knife 400, and at the same time, the substrate 10 is floated on the first workbench 100 with the same air flow rate of the transfer air knife 400.

[0089] In addition, the air flotation method according to other embodiments supports the substrate 10 by the transfer sorter 300, and floats the substrate 10 from the first workbench 100 by ejecting air AR from the transfer air knife 400 toward the back of the substrate 10, and transfers the substrate 10 from the first workbench 100 to the second workbench 200 in a floating state, thereby separating foreign matter on the surfaces of the first workbench 100 and the second workbench 200 from the surfaces of the first workbench 100 and the second workbench 200 by the air AR of the transfer air knife 400, and floats the substrate 10 on the first workbench 100 and the second workbench 200 respectively with the same air flow rate of the transfer air knife 400. Thus, the substrate 10 can be floated on the first workbench 100 and the second workbench 200 respectively at the same height, and the substrate 10 can be transferred from the first workbench 100 to the second workbench 200 without a height change.

[0090] In addition, the flotation method involved in other embodiments supports the substrate 10 by the transfer sorter 300, and sprays air AR from the transfer air knife 400 to the back side of the substrate 10 to float the substrate 10 from the first workbench 100, thereby preventing the structures from being interfered with or damaged by the transfer sorter 300 and the transfer air knife 400 even if various structures are formed on the entire surface of the substrate body 11 on the first workbench 100.

[0091] An air flotation method is provided, which minimizes foreign matter on the surfaces of a plurality of work stages while transferring the substrate 10 by floating the substrate 10 on each of the plurality of work stages with the same air flow rate.

[0092] The embodiments of the present invention are described in detail above, but the scope of the present invention is not limited thereto. Various deformations and improvements of the basic concepts of the present invention defined in the claims by those skilled in the art also fall within the scope of the present invention.

Claims

1. An air flotation device, characterized in that: include: The first workbench is used to place the substrate; a transfer sorter, adjacent to the first workbench, supporting the substrate; as well as A transfer air knife is adjacent to the transfer sorter and sprays air toward the back side of the substrate to float the substrate from the first stage.

2. The air flotation device according to claim 1, characterized in that: The first workbench includes a plurality of vacuum holes for adsorbing the back side of the substrate.

3. The air flotation device according to claim 1, characterized in that: The substrate comprises: a substrate body; and A flexible printed circuit substrate is connected to the end of the substrate body, The transfer sorter supports the flexible printed circuit substrate of the substrate.

4. The air flotation device according to claim 3, characterized in that: The transfer sorting machine absorbs the flexible printed circuit substrate.

5. The air flotation device according to claim 3, characterized in that: The transfer picker moves upward from the first workbench.

6. The air flotation device according to claim 3, characterized in that: The transfer picker includes a plurality of pickers spaced apart from each other, The intervals between the plurality of pickers are adjusted corresponding to the flexible printed circuit substrate.

7. The air flotation device according to claim 3, characterized in that: The transfer air knife sprays the air toward the back surface of the substrate body, thereby floating the substrate body from the first stage.

8. The air flotation device according to claim 1, characterized in that: The transfer air knife comprises: an air injection unit that injects the air toward the back surface of the substrate; and The angle adjustment unit adjusts the air injection angle of the air injection unit.

9. The air flotation device according to claim 8, characterized in that: The width of the nozzle of the air injection portion is adjusted by adjusting the thickness of a spacer located inside the air injection portion.

10. The air flotation device according to claim 1, characterized in that: Also includes: The transfer unit supports the transfer sorter and the transfer air knife.

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