Patch mechanism

Abstract

The utility model discloses a patching mechanism, comprising a feeding device used for supplying a wafer carrying basket loaded with a silicon wafer; the identification device is used for identifying and detecting the silicon wafers in the wafer carrying basket; the patch repairing device comprises a patch repairing basket and a patch repairing table, the patch repairing table is used for bearing the patch repairing basket and the defective slide glass baskets, the silicon wafers in the patch repairing basket are used for repairing the defective slide glass baskets, and the patch repairing basket is a slide glass basket which does not have defects after identification and detection or a slide glass basket after patch repairing is completed; and the transfer device is at least used for moving the defective slide glass baskets and the patch repairing baskets to the patch repairing table, and is used for moving the patch-repaired slide glass baskets out of the patch repairing table. According to the patch patching mechanism, patch patching can be conducted on the patch carrying baskets through the patch patching baskets, the patch patching baskets are taken from the patch carrying baskets without defects, the empty patch patching baskets do not need to be manually patching, the production takt is not interrupted, and therefore the influence on the production efficiency can be avoided to a large extent.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic cell manufacturing, in particular to a patch mechanism. Background Art

[0002] In the production process of silicon wafers, it is generally necessary to use components such as wafer baskets to carry, transfer, clean or etch silicon wafers. In actual applications, if the silicon wafers in the wafer basket are missing or broken, a patch basket is required to be configured to use the silicon wafers in the patch basket to fill the wafer basket. However, if the silicon wafers in the patch basket are used up, the machine needs to be stopped and the silicon wafers in the patch basket need to be replenished manually, which will affect the production efficiency.

[0003] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects is still a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] The utility model aims to provide a patching mechanism, which can patch a carrier basket through a patching basket, and the patching basket is taken from a carrier basket without defects, and there is no need to manually replenish the emptied patching basket, and the production rhythm will not be interrupted, which can avoid the impact on production efficiency to a large extent.

[0005] In order to solve the above technical problems, the utility model provides a patching mechanism, comprising: a loading device, used to supply a wafer carrier basket, the wafer carrier basket is loaded with silicon wafers; an identification device, used to identify and detect the silicon wafers in the wafer carrier basket; a patching device, comprising a patching basket and a patching table, the patching table is used to carry the patching basket and the defective wafer carrier basket, the silicon wafers in the patching basket are used to patch the defective wafer carrier basket, the patching basket is the wafer carrier basket that does not have defects after the identification and detection, or the wafer carrier basket after patching is completed; a transfer device, at least used to move the defective wafer carrier basket and the patching basket to the patching table, and used to move the wafer carrier basket after patching is completed out of the patching table.

[0006] By adopting this scheme, through the cooperation of the loading device, the identification device, the patching device and the transfer device, the identification and detection of the silicon wafers in the carrier basket can be better realized. For the defective carrier basket, the silicon wafers in the patching basket can be used for patching, so that the defects can be better eliminated to avoid the defects from flowing into the downstream process; and, the carrier basket and the patching basket are basically automatically transported by the transport device, the degree of automation of the equipment is relatively high, and the manual labor intensity can be relatively low; at the same time, the patching basket is directly taken from the carrier basket without defects, so that after the patching basket is emptied, a carrier basket without defects can be directly moved to the patching table with the help of the transfer device to replace the emptied patching basket, without the need to manually replenish the patching basket, the patching mechanism does not need to be shut down, and the production rhythm will not be interrupted, which can largely avoid the impact on production efficiency.

[0007] Optionally, the patch device further comprises a patch moving component, and the patch moving component is at least configured to be able to perform the patch.

[0008] Optionally, the sheet moving component includes a picking-up portion and a position adjusting portion, the position adjusting portion is connected to the picking-up portion, and the position adjusting portion is used to adjust the position of the picking-up portion.

[0009] Optionally, the position adjustment portion includes a plurality of adjustment members, each of which is configured to drive the picking portion to move, and each of the adjustment members has a different displacement adjustment direction.

[0010] Optionally, the identification detection includes missing detection and residual chip detection, the missing detection specifically detects whether the silicon wafer in the wafer carrier basket is missing and the missing position, and the residual chip detection specifically detects whether there are residual chips of the silicon wafer in the wafer carrier basket and the residual chip position; when the residual chip detection identifies the presence of residual chips, the residual chips can be taken out and then repaired.

[0011] Optionally, the patch stage is further provided with a displacement component, and the displacement component is configured to drive the carrier basket and the patch basket to move on the patch stage.

[0012] Optionally, the identification device includes an identification component and an identification table, and the transfer device is further used to move the wafer carrier basket to the identification table and move it out from the identification table.

[0013] Optionally, the recognition component includes a recognition camera and a recognition light source, and the number of the recognition camera is one or more.

[0014] Optionally, a material unloading device is further included, and the transfer device is also used to move the emptied patch basket to the material unloading device, and the material unloading device is used to transport the emptied patch basket away.

[0015] Optionally, the loading device and the unloading device are integrated. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the layout of the patch mechanism provided by the utility model;

[0017] Figure 2 It is a relative position diagram of the loading device, unloading device, film carrier basket, and empty film basket;

[0018] Figure 3 It is a schematic diagram of the structure of the film carrier basket and the film patching basket on the film patching table in one position;

[0019] Figure 4 It is a schematic diagram of the structure of the film carrier basket on the film patching table and the film patching basket in another position;

[0020] Figure 5 It is a structural schematic diagram of the sheet moving component;

[0021] Figure 6 The present invention is a flowchart of a method for using the patch mechanism provided by the present invention.

[0022] Figure 1-Figure 5 The reference numerals in the figures are described as follows:

[0023] 100 loading and unloading device, 110 loading device, 120 unloading device;

[0024] 200 slide baskets;

[0025] 300 identification device, 310 identification component, 320 identification platform;

[0026] 400 patch device, 410 patch basket, 420 patch table, 421 shifting component, 430 patch moving component, 431 picking up part, 432 position adjusting part, 432a first adjusting part, 432b second adjusting part;

[0027] 500 transfer devices;

[0028] A silicon wafer. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] In the embodiments of the present invention, the terms "first", "second", and "third" are used only for descriptive purposes and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features.

[0031] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0032] In the description of the embodiments of the present utility model, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0033] Please refer to Figure 1-Figure 5 , Figure 1 This is a schematic diagram of the layout of the patch mechanism provided by the utility model. Figure 2 The relative position diagram of the loading device, unloading device, film carrier basket, and empty film basket is shown in the figure. Figure 3 This is a schematic diagram of the structure of the film carrier basket and the film patching basket on the film patching table in one position. Figure 4 This is a schematic diagram of the structure of the film carrier basket on the patching table and the patching basket in another position. Figure 5 It is a structural schematic diagram of the sheet moving component.

[0034] like Figure 1 and Figure 2 As shown, the utility model provides a patch mechanism, including a feeding device 110 , an identification device 300 , a patch device 400 and a transfer device 500 .

[0035] The loading device 110 may be, for example, a conveying component in the form of a belt conveyor, etc. The loading device 110 is used to supply a wafer carrier basket 200 , in which a certain number of silicon wafers A are loaded.

[0036] The recognition device 300 includes a recognition component 310, which may be, for example, a recognition camera. The recognition camera may be equipped with a recognition light source, which may provide illumination. The recognition camera may photograph the silicon wafer A in the wafer carrier basket 200 to complete the recognition detection of the silicon wafer A in the wafer carrier basket 200. The number of recognition cameras and recognition light sources may not be limited, and in practical applications, those skilled in the art may determine them according to specific needs; for example, there may be three recognition cameras, and there may be only one recognition light source, so that the three recognition cameras may share the one recognition light source, which is conducive to simplifying the structure of the recognition device 300.

[0037] It should be understood that the recognition component 310 is not limited to a recognition camera, and it can also be a sensor device in the form of a photoelectric sensor or the like. In short, as long as the recognition component 310 can complete the recognition and detection of the silicon wafer A in the wafer carrier basket 200 , it will be sufficient.

[0038] In some implementations, the identification device 300 can be installed on the feeding device 110, for example, it can be installed on the frame of the feeding device 110. In this way, the identification device 300 can be integrated and assembled on the feeding device 110, the integration degree of the device can be higher, the structure of the device can be more compact, and the installation space occupied by the patch mechanism can be effectively reduced, so that the patch mechanism provided by the utility model can also be used in an environment with relatively small space, thereby broadening the applicable scenarios of the patch mechanism provided by the utility model.

[0039] In this implementation, the identification device 300 can directly complete the detection of the carrier basket 200 in the loading device 110, and can also omit the transportation process of the carrier basket 200 between the loading device 110 and the identification device 300. In other words, a process can be omitted, which can greatly improve the operating efficiency of the patch mechanism provided by the utility model, thereby achieving an increase in production capacity and a reduction in cost.

[0040] In other implementations, the identification device 300 and the feeding device 110 may also be independent of each other, for example Figure 1 As shown in , the identification device 300 can be located on one side of the feeding device 110. In this way, both the identification device 300 and the feeding device 110 can have a relatively large installation space, which can facilitate the installation and subsequent maintenance of the two; and during the disassembly and subsequent use, the possibility of interference between the identification device 300 and the feeding device 110 can also be relatively low, which is also of positive significance for ensuring the stable operation of the equipment.

[0041] In this implementation, the identification device 300 may further include an identification table 320 for receiving the film basket 200. Of course, the film basket 200 may also be directly received by the installation surface of the identification device 300, such as the ground or floor surface, so that the structure of the identification device 300 and the patch mechanism provided by the utility model can be relatively simple. For ease of description, the following embodiments of the utility model are all described by taking the identification table 320 as an example.

[0042] Combination Figure 1 In practical applications, the transfer device 500 can be used to transfer the carrier basket 200 to transfer the carrier basket 200 from the loading device 110 to the recognition table 320, and then the recognition component 310 performs recognition detection. Since the recognition device 300 is independently provided relative to the loading device 110, the structure of the loading device 110 itself, such as the frame, will not substantially interfere with the recognition component 310, especially when the recognition component 310 is a recognition camera, the complexity of the background of the image information collected by the recognition component 310 can be relatively simple, so that the recognition detection can be performed more accurately.

[0043] The above-mentioned identification detection may at least include missing detection, and the missing detection may specifically be to detect the number of silicon wafers A in the carrier basket 200 to determine whether there is a missing silicon wafer A in the carrier basket 200. If there is a missing, the missing position needs to be detected to facilitate the subsequent filling of the carrier basket 200.

[0044] Combination Figure 3 and Figure 4 The patching device 400 includes a patching basket 410 and a patching stage 420. The patching stage 420 is used to carry the patching basket 410 and the wafer carrier basket 200 with defects (the defect form is, for example, missing). The silicon wafers A in the patching basket 410 are used to patch the wafer carrier basket 200 with defects, so as to eliminate the defects of the wafer carrier basket 200 in time, thereby largely avoiding the impact on subsequent production caused by the defects of the wafer carrier basket 200.

[0045] The patch basket 410 is specifically a carrier basket 200 that has been identified and detected as not having defects; or, the patch basket 410 can also be a carrier basket 200 after patching, that is, a carrier basket 200 after defects have been eliminated by patching. In short, the patch basket 410 is directly taken from the carrier basket 200 that has no defects. In this way, after the patch basket 410 is emptied, a carrier basket 200 that has no defects can be directly moved to the patch table 420 by means of the transfer device 500 to replace the emptied patch basket 410, without the need to manually replenish the patch basket 410, the patch mechanism does not need to be stopped, and the production rhythm will not be interrupted, which can largely avoid the impact on production efficiency.

[0046] It should be understood that a detection component (not shown in the figure) may also be provided at the patching station 420 to detect the number of silicon wafers A in the patching basket 410 in real time, so that when the silicon wafers A in the patching basket 410 are empty, the transfer device 500 can replace the new patching basket 410 in time. The type of the detection component is not limited here. In practical applications, those skilled in the art can select it according to specific needs, as long as it can meet the requirements of use; for example, the type of the detection component can be the same as the aforementioned identification component 310. In fact, whether the patching basket 410 is empty can also be judged by manual observation, which is also feasible.

[0047] After the patch basket 410 is emptied, it can be removed from the patch table 420 by the transfer device 500, so that the automation level of the equipment can be higher and the labor intensity of the on-site staff can be relatively low. Of course, the weight of the emptied patch basket 410 itself is not very large, and it can also be removed manually by the on-site staff.

[0048] Furthermore, the patch mechanism provided by the present invention may also include a material discharge device 120, and the emptied patch basket 410 may be transported to the material discharge device 120 manually or by a transfer device 500. The structure of the material discharge device 120 may be consistent with the aforementioned material discharge device 110, and it may also adopt a conveying component in the form of a belt conveyor to transport the emptied patch basket 410.

[0049] like Figure 1 and Figure 2 As shown, in the embodiment of the present invention, the loading device 110 and the unloading device 120 can be integrated to form the loading and unloading device 100. In this way, the integration of the device can be higher, the structure is more compact, and the installation space occupied by the patch mechanism can be effectively reduced, so that the patch mechanism provided by the present invention can be used in a relatively small space environment, thereby broadening the applicable scenarios of the patch mechanism provided by the present invention.

[0050] Of course, the loading device 110 and the unloading device 120 can also be independent of each other. In this way, both can have a relatively large installation space, which can be convenient for installation and subsequent maintenance; and during the process of disassembly and subsequent use, the possibility of interference between the loading device 110 and the unloading device 120 can also be relatively low, which is also of positive significance for ensuring the stable operation of the equipment.

[0051] like Figure 5As shown, in an embodiment of the utility model, the patching device 400 may further include a wafer moving component 430, which is configured to be able to move the silicon wafer A in the patching basket 410 to the defective wafer carrier basket 200, thereby realizing automatic patching, so as to further improve the degree of automation of the equipment and reduce the labor intensity of on-site staff.

[0052] The wafer moving component 430 may include a pick-up portion 431 and a position adjustment portion 432. The pick-up portion 431 may be configured with a pick-up element in the form of a suction cup, a clamp, etc., for picking up the silicon wafer A in the patch basket 410. The position adjustment portion 432 may be connected to the pick-up portion 431 and used to adjust the position of the pick-up portion 431, so that the pick-up portion 431 can pick up the silicon wafer A at different positions in the patch basket 410, and the silicon wafer A picked up by the pick-up portion 431 can be transferred to the missing position of the carrier basket 200, so that accurate patching can be achieved.

[0053] The position adjustment part 432 may include a plurality of adjustment members, each of which is configured to drive the pickup part 431 to move, and each adjustment member has a different displacement adjustment direction. In this way, the position adjustment part 432 can achieve displacement of the pickup part 431 in a plurality of different directions, which can further improve the degree of freedom of position adjustment, so as to better achieve the pickup and release of the silicon wafer A at different positions.

[0054] In the implementation of the accompanying drawings, Figure 5 As shown, the number of the adjusting members may be two, and the two adjusting members may be respectively referred to as a first adjusting member 432a and a second adjusting member 432b. Figure 5 According to the orientation and position relationship in the figure, the first adjusting member 432a can realize displacement adjustment in the left-right direction, and is used to move the picking-up part 431 to different positions of the patch basket 410 and the carrier basket 200, and the second adjusting member 432b can realize displacement adjustment in the up-down direction, and is used to relatively approach or move away from the silicon wafer A at the above-mentioned different positions in the up-down direction, so that the picking-up part 431 can conveniently pick up or release the silicon wafer A.

[0055] Here, the embodiments of the present invention do not limit the specific structural form of the adjusting member. In practical applications, those skilled in the art can select the adjusting member according to specific needs, as long as the requirements of use can be met.

[0056] In fact, there is a correlation between the specific structural form of the adjusting part and the displacement form it is to output. When the displacement form to be output by the adjusting part is rotational displacement, the adjusting part can adopt a rotary drive element such as a motor or a rotary cylinder that can directly output rotational displacement. When the displacement form to be output by the adjusting part is linear displacement, the adjusting part can adopt a linear drive element such as a linear cylinder or a linear oil cylinder that can directly output linear displacement; or, the adjusting part can also adopt a rotary drive element such as a motor or a rotary cylinder that can directly output rotational displacement. At this time, it can also be matched with a displacement conversion structure in the form of a gear rack structure, a screw structure, a belt structure, etc., so as to convert the rotational displacement output by the rotary drive element into the required linear displacement.

[0057] In some optional implementations, the identification detection in the embodiments of the utility model may also include debris detection. The debris detection may specifically be to detect the shape of the silicon wafer A in the wafer basket 200 to determine whether there are debris in the silicon wafer A in the wafer basket 200. If there are debris, the position of the debris must also be detected, so as to facilitate the subsequent cleaning of the debris and avoid the debris from flowing into the downstream process, as well as the resulting problems such as cards and more silicon wafers A being damaged.

[0058] When the debris detection and identification detects the presence of debris, the debris at the debris position must first be taken out to prevent the debris from flowing into the downstream process, and then the debris position needs to be filled to ensure the number of silicon wafers A in the wafer carrier basket 200.

[0059] The operation of removing the debris can be done manually, or the operation of removing the debris can be done automatically by the above-mentioned sheet moving component 430. The removed debris can be directly discarded, or a special collection box can be configured to collect the removed debris for centralized processing.

[0060] In some optional implementations, the patch stage 420 may also be configured with a shifting component 421, which is used to move the carrier basket 200 and the patch basket 410 so as to adjust the positions of the carrier basket 200 and the patch basket 410 on the patch stage 420, so that different operations can be conveniently performed on the carrier basket 200 and the patch basket 410.

[0061] In detail, the carrier basket 200 and the patch basket 410 are in the following Figure 3 When the film carrier basket 200 is in the position shown in the figure, it can be relatively close to the edge of the patching platform 420, which can facilitate manual film taking and patching operations and help ensure the safety of manual operations; after the manual film taking and patching operations are completed, the film carrier basket 200 and the patching basket 410 can be moved to the position shown in the figure by the shifting component 421. Figure 4The position shown is for the transport device 500 to carry the film basket 200 and the patch basket 410. When the film moving component 430 is used to perform the film taking and patching operations, the shifting component 421 can perform the same operations as above. Of course, the shifting component 421 can also be not started, which is specifically related to the installation position of the film moving component 430 relative to the patch stage 420 and the travel of the transport device 500.

[0062] In summary, by setting the above-mentioned shifting component 421, the degree of freedom of the patch mechanism provided by the present invention during use can be improved. At the same time, it can also facilitate the movement of the shifting component 430 and the transfer device 500, and can greatly reduce the possibility of interference between the shifting component 430 and the transfer device 500.

[0063] The transfer device 500 may be a manipulator, etc., on which a pick-up element in the form of a clamp or a suction cup may be configured to pick up the carrier basket 200 and the patch basket 410, so that the carrier basket 200 and the patch basket 410 can be conveniently transported. The carrier basket 200 that has no defects detected by the identification device 300 or the carrier basket 200 that has been eliminated by the patch device 400 can be transported by the transfer device 500 to a downstream device, such as a wafer insertion and unloading platform.

[0064] As can be seen from the above, the patching mechanism provided by the utility model can automatically realize the identification and detection of the silicon wafer A in the wafer carrier basket 200, and the identification and detection can take into account both missing detection and residual chip detection, which can better eliminate the defects in the wafer carrier basket 200 to reduce the impact on the downstream process; and the degree of automation of the patching mechanism is relatively high, the wafer carrier basket 200 and the patching basket 410 are basically automatically transported by the transport device 500, and the manual labor intensity can be relatively low; at the same time, the patching mechanism uses a wafer carrier basket 200 without defects as a patching basket 410 to replace the manual replenishment of the patching basket 410 in the prior art, which can not interrupt the production rhythm and has a positive significance for improving production efficiency.

[0065] Please refer to Figure 6 , Figure 6 The present invention is a flowchart of a method for using the patch mechanism provided by the present invention.

[0066] like Figure 6 As shown, the utility model also provides a method for using a patch mechanism, which is applicable to the patch mechanisms involved in the aforementioned implementations.

[0067] Specifically, the method of use comprises at least the following steps: a loading step S100, controlling the loading device 110 to supply a wafer carrier basket 200 loaded with silicon wafers A, wherein the loading device 110 may be a conveying component in the form of a belt conveyor or the like; an identification and detection step S200, controlling the identification device 300 to identify and detect the silicon wafers A in the wafer carrier basket 200; a first shifting step S300, controlling the transfer device 500 to move the defective wafer carrier basket 200 to the patching station 420 when the identification device 300 identifies that the wafer carrier basket 200 has defects; and patching the wafers. Step S400, using the silicon wafer A in the patch basket 410 to patch the wafer carrier basket 200, the patch basket 410 is a wafer carrier basket 200 that has been identified as having no defects, or a wafer carrier basket 200 after patching. In short, the patch basket 410 is taken from a wafer carrier basket 200 that has no defects; the second shifting step S500, controlling the transfer device 500 to move the wafer carrier basket 200 after patching out of the patching table 420; the patch basket replacement step S600, after a patch basket 410 is emptied, controlling the transfer device 500 to replace a new patch basket 410.

[0068] By adopting this scheme, through the cooperation of the loading device 110, the identification device 300, the patching device 400 and the transfer device 500, the identification and detection of the silicon wafer A in the carrier basket 200 can be better realized, and the defective carrier basket 200 can be patched with the silicon wafer A in the patching basket 410, so that the defects can be better eliminated to prevent the defects from flowing into the downstream process; and the patching basket 410 is directly taken from the carrier basket 200 without defects. In this way, after the patching basket 410 is emptied, a carrier basket 200 without defects can be directly moved to the patching table 420 with the help of the transfer device 500 to replace the emptied patching basket 410, without the need for manual replenishment of the patching basket 410, the patching mechanism does not need to be stopped, and the production rhythm will not be interrupted, which can largely avoid the impact on production efficiency.

[0069] In some optional implementations, the patching device 400 may further include a wafer moving component 430. Thus, the patching step S400 may specifically be: controlling the wafer moving component 430 to patch the wafer carrier basket 200 using the silicon wafer A in the patching basket 410 to achieve automatic patching, thereby effectively improving the automation level and patching efficiency of the equipment.

[0070] It should be understood that in some other implementations, the patch operation may also be performed manually. In this case, the structure of the patch device 400 may be relatively simple.

[0071] In some optional implementations, the identification detection may include missing detection and debris detection. When the debris detection detects the presence of debris, the above method may further include, before the patching step S400, a chip taking step S700, taking out the corresponding debris according to the debris position. The chip taking step S700 can clean up the debris, and can prevent the debris from flowing into the downstream process, and thereby causing problems such as cards and more silicon wafers A being damaged.

[0072] The film taking step S700 may be completed manually or automatically by the film moving component 430 , which is not limited here.

[0073] In some optional implementations, the identification device 300 and the loading device 110 may be independent of each other, and the identification device 300 may include an identification table 320 and an identification component 310. The above-mentioned method of use may also include a third shifting step S800 before the identification detection step S200, controlling the transfer device 500 to move the wafer basket 200 to the identification table 320.

[0074] It should be understood that in some other implementations, the identification device 300 and the loading device 110 can also be integrated, so that the loading step S100 and the identification and detection step S200 can be basically executed synchronously, and the above-mentioned third shift step S800 can be omitted, which can simplify the process and further improve the operating efficiency of the patch mechanism provided by the utility model.

[0075] In some optional implementations, the patch mechanism provided by the present invention may further include a unloading device 120, and the above-mentioned control method may further include: an unloading step S900, controlling the transfer device 500 to move the empty patch basket 410 to the unloading device 120, and controlling the unloading device 120 to transport the empty patch basket 410 away.

[0076] The above are only preferred implementations of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A patch mechanism, characterized in that: include: A loading device, used for supplying a wafer carrier basket, wherein the wafer carrier basket is loaded with silicon wafers; An identification device, used for identifying and detecting the silicon wafer in the wafer basket; A patching device, comprising a patching basket and a patching stage, wherein the patching stage is used to carry the patching basket and the wafer carrier basket with defects, the silicon wafers in the patching basket are used to patch the wafer carrier basket with defects, and the patching basket is the wafer carrier basket that has no defects after the identification and detection, or the wafer carrier basket after patching is completed; The transfer device is used at least to move the defective carrier basket and the patch basket to the patch station, and to move the carrier basket after patching is completed out of the patch station.

2. The patch mechanism according to claim 1, characterized in that: The patch device further includes a patch moving component, which is at least configured to be able to perform the patching.

3. The patch mechanism according to claim 2, characterized in that: The sheet moving component comprises a picking-up portion and a position adjusting portion, wherein the position adjusting portion is connected to the picking-up portion and is used to adjust the position of the picking-up portion.

4. The patch mechanism according to claim 3, characterized in that: The position adjustment portion includes a plurality of adjustment members, each of which is configured to drive the pickup portion to move, and each of the adjustment members has a different displacement adjustment direction.

5. The patch mechanism according to claim 1, characterized in that: The identification detection includes missing detection and residual chip detection. The missing detection is specifically to detect whether there are missing silicon wafers in the wafer carrier basket and the missing position. The residual chip detection is specifically to detect whether there are residual chips in the wafer carrier basket and the residual chip position. When the debris detection and identification detects the existence of debris, the debris can be taken out and then repaired.

6. The patch mechanism according to claim 5, characterized in that: The patch stage is further provided with a displacement component, and the displacement component is configured to drive the carrier basket and the patch basket to move on the patch stage.

7. The patch mechanism according to any one of claims 1 to 6, characterized in that: The identification device includes an identification component and an identification platform, and the transfer device is also used to move the slide basket to the identification platform and move it out from the identification platform.

8. The patch mechanism according to claim 7, characterized in that: The recognition component includes a recognition camera and a recognition light source, and the number of the recognition camera is one or more.

9. The patch mechanism according to any one of claims 1 to 6, characterized in that: It also includes a material unloading device, and the transfer device is also used to move the emptied patch basket to the material unloading device, and the material unloading device is used to transport the emptied patch basket away.

10. The patch mechanism according to claim 9, characterized in that: The loading device and the unloading device are integrated.

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