Substrate cutting device for semiconductor material processing
By designing a hydraulic rod-controlled substrate cutting device, the problem of position shift during the cutting process of semiconductor substrate is solved, and the accuracy of cutting size and product quality are achieved.
Patent Information
- Application Number
- CN202421263607.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-06-04
AI Technical Summary
During the processing of semiconductor substrates, the substrate is prone to positional deviation during the cutting process, resulting in cutting size deviation and affecting product quality.
A substrate cutting device for semiconductor material processing is designed, and the baffle and frame are driven to move by controlling the hydraulic rod, and the position and compression force of the substrate are adjusted to avoid substrate deviation and shaking.
It effectively avoids positional deviation and shaking of the substrate during the cutting process, ensuring the accuracy of cutting size and the stability of product quality.
Smart Images
Figure CN222450461U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor processing, in particular to a substrate cutting device for semiconductor material processing. Background Art
[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. During the manufacturing of single-sided and double-sided printed circuit boards, hole processing, chemical copper plating, electroplating copper, etching and other processing are selectively performed on the copper-clad laminate of the substrate material to obtain the required circuit pattern. During the processing of the semiconductor substrate, it is necessary to cut it into the required size. Then, during the process of cutting the substrate with a common cutting device, the substrate is prone to shift position, which will cause the cutting size of the substrate to deviate, thereby affecting the production quality of the substrate. For this reason, the present application proposes a substrate cutting device for semiconductor material processing. Utility Model Content
[0003] In order to solve the problems raised in the above-mentioned background technology, the utility model provides the following technical solutions: a substrate cutting device for semiconductor material processing, comprising a base plate, a knife groove is provided on the top of the base plate, support columns are fixedly installed on both sides of the base plate and at both ends of the knife groove, a lifting plate is arranged at the top of the two support columns, a movable groove is provided at the bottom of the lifting plate, a movable plate is fixedly installed in the movable groove, a screw hole is provided on the side of the movable plate, a first motor is fixedly installed at one end of the lifting plate, a screw extending into the movable groove is fixedly installed at the output end of the first motor, the screw thread is inserted in the screw hole on the side of the movable plate, a groove is provided at the bottom of the movable plate, a rotatable cutting knife is arranged in the groove, the bottom end of the cutting knife extends out of the groove, and the cutting knife is located directly above the knife groove at the top of the base plate, two notches are provided on the sides of the two support columns, a liftable frame is movably inserted in the notches of the two support columns, and a horizontally movable baffle is provided at one end of the top of the base plate.
[0004] Preferably, a through opening is opened between the frames, the through opening in the middle of the frame is located directly above the knife groove, and the two ends of the two sides of the frame are respectively inserted into the grooves on the sides of the two support columns, and a third hydraulic rod is fixedly installed on the outer side of the two support columns, and the telescopic ends of the two third hydraulic rods are respectively fixedly connected to the tops of the two frames.
[0005] Preferably, two first hydraulic rods are fixedly mounted on the top of the bottom plate near one end of the baffle plate, and telescopic ends of the two first hydraulic rods are respectively fixedly connected to the two ends of the side surface of the baffle plate.
[0006] Preferably, storage grooves are provided at the tops of the two support columns, and second hydraulic rods are fixedly installed in the two storage grooves, and telescopic ends of the two second hydraulic rods are respectively fixedly connected to the two ends of the bottom of the lifting plate.
[0007] Preferably, a second motor is fixedly mounted on the side of the movable plate, and an output end of the second motor extends into the groove and is fixedly connected to the axis of one side of the cutting knife.
[0008] Preferably, a bearing groove is formed at one end of the movable groove away from the first motor, a bearing is fixedly installed in the bearing groove, and one end of the screw rod passes through the movable plate and is fixedly connected to the inner ring wall of the bearing.
[0009] Compared with the prior art, the beneficial effects of the utility model are:
[0010] By controlling the first hydraulic rod to push the baffle plate to move its position on the bottom plate and changing the distance from the baffle plate to the knife groove, the cutting size of the substrate can be freely adjusted. When cutting the substrate, the frame is pushed downward by controlling the third hydraulic rod to press the frame on the top of the substrate, thereby avoiding position displacement and shaking of the substrate during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0013] Figure 2 It is a structural schematic diagram of the bottom plate of the utility model;
[0014] Figure 3 It is a structural schematic diagram of a partial side of the utility model;
[0015] Figure 4 This is a schematic diagram of the cross-sectional structure of the connection between the support column and the lifting plate of the utility model;
[0016] Figure 5 This is a schematic diagram of the connection structure between the support column and the frame of the utility model;
[0017] Figure 6 It is a structural schematic diagram of the framework of the utility model;
[0018] In the figure: 1, bottom plate; 2, knife groove; 3, baffle; 4, first hydraulic rod; 5, support column; 6, lifting plate; 7, moving groove; 8, moving plate; 9, first motor; 10, screw; 11, bearing; 12, cutting knife; 13, second hydraulic rod; 14, notch; 15, frame; 16, third hydraulic rod; 17, second motor. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0020] Depend on Figure 1-6 The utility model includes a bottom plate 1, a knife groove 2 is provided on the top of the bottom plate 1, support columns 5 are fixedly installed on both sides of the bottom plate 1 and at both ends of the knife groove 2, a lifting plate 6 is arranged at the top of the two support columns 5, a moving groove 7 is provided at the bottom of the lifting plate 6, a moving plate 8 is fixedly installed in the moving groove 7, a screw hole is provided on the side of the moving plate 8, a first motor 9 is fixedly installed at one end of the lifting plate 6, a screw rod 10 extending into the moving groove 7 is fixedly installed at the output end of the first motor 9, the screw rod 10 is threadedly inserted in the screw hole on the side of the moving plate 8, a groove is provided at the bottom of the moving plate 8, a rotatable cutting knife 12 is arranged in the groove, the bottom end of the cutting knife 12 extends out of the groove, and the cutting knife 12 is located directly above the knife groove 2 at the top of the bottom plate 1, two notches 14 are provided on the sides of the two support columns 5, and the grooves of the two support columns 5 A liftable frame 15 is movably inserted in the opening 14, and a horizontally movable baffle 3 is provided at one end of the top of the bottom plate 1. When cutting a substrate placed above the bottom plate 1, it is first necessary to control the first hydraulic rod 4 to adjust the position of the baffle 3, and then control the third hydraulic rod 16 to push the frame 15 downward to press it on the top of the substrate, and then control the second hydraulic rod 13 to drive the lifting plate 6 to move downward, so that the cutting knife 12 at the bottom of the moving plate 8 passes through the opening between the frames 15 and contacts the substrate, and then control the second motor 17 to drive the cutting knife 12 to rotate at the bottom of the moving plate 8, and finally control the first motor 9 to drive the screw 10 to rotate in the moving groove 7 and the screw hole on the side of the moving plate 8, so as to drive the moving plate 8 to move in the moving groove 7 at the bottom of the lifting plate 6, and then the cutting knife 12 at the bottom of the moving plate 8 cuts the fixed substrate.
[0021] At the same time, a through opening is opened between the frames 15, and the through opening in the middle of the frame 15 is located directly above the knife groove 2, and the two ends of the two sides of the frame 15 are respectively inserted into the notches 14 on the sides of the two support columns 5, and the outer sides of the two support columns 5 are fixedly installed with a third hydraulic rod 16, and the telescopic ends of the two third hydraulic rods 16 are respectively fixedly connected to the tops of the two frames 15. By controlling the third hydraulic rod 16, the frame 15 can be pushed up and down in the notches 14 on the sides of the two support columns 5. In this way, when cutting the substrate, the bottom of the frame 15 can be pressed on the top of the substrate, and then the cutting knife 12 can be used to cut it.
[0022] In addition, two first hydraulic rods 4 are fixedly installed on the top of the bottom plate 1 near one end of the baffle 3, and the telescopic ends of the two first hydraulic rods 4 are respectively fixedly connected to the two ends of the side of the baffle 3. The baffle 3 is pushed to move its position on the bottom plate 1 by controlling the first hydraulic rods 4, so that the distance between the baffle 3 and the knife groove 2 on the top of the bottom plate 1 can be changed, so that the substrate can be blocked by the baffle 3 to achieve cutting of different sizes of the substrate.
[0023] In addition, storage grooves are provided at the tops of the two support columns 5, and second hydraulic rods 13 are fixedly installed in the two storage grooves. The telescopic ends of the two second hydraulic rods 13 are respectively fixedly connected to the two ends of the bottom of the lifting plate 6. By controlling the two second hydraulic rods 13 to push the lifting plate 6, the position height of the lifting plate 6 can be changed, so that the lifting plate 6 drives the moving plate 8 and the cutting knife 12 to move up and down together.
[0024] In addition, a second motor 17 is fixedly installed on the side of the movable plate 8, and the output end of the second motor 17 extends into the groove and is fixedly connected to the axis of one side of the cutting knife 12. By controlling the operation of the second motor 17, its output end can enable the cutting knife 12 to rotate in the groove at the bottom of the movable plate 8, so that the bottom end of the cutting knife 12 passes through the opening in the middle of the frame 15 to cut the substrate.
[0025] In addition, a bearing groove is opened at the end of the movable groove 7 away from the first motor 9, and a bearing 11 is fixedly installed in the bearing groove. One end of the screw 10 passes through the movable plate 8 and is fixedly connected to the inner ring wall of the bearing 11. The bearing 11 can fix the position of one end of the screw 10, thereby preventing the screw 10 from shaking when rotating.
[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0027] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A substrate cutting device for semiconductor material processing, comprising a base plate (1), characterized in that: The top of the bottom plate (1) is provided with a knife groove (2), support columns (5) are fixedly installed on both sides of the bottom plate (1) and at both ends of the knife groove (2), a lifting plate (6) is arranged at the top of the two support columns (5), a moving groove (7) is provided at the bottom of the lifting plate (6), a moving plate (8) is fixedly installed in the moving groove (7), a screw hole is provided on the side of the moving plate (8), a first motor (9) is fixedly installed at one end of the lifting plate (6), and a screw rod (10) extending into the moving groove (7) is fixedly installed at the output end of the first motor (9), The screw rod (10) is threadedly inserted into a screw hole on the side of the movable plate (8); a groove is provided at the bottom of the movable plate (8); a rotatable cutting knife (12) is arranged in the groove; the bottom end of the cutting knife (12) extends out of the groove, and the cutting knife (12) is located directly above the knife groove (2) at the top of the bottom plate (1); two notches (14) are provided on the sides of the two support columns (5); a liftable frame (15) is movably inserted in the notches (14) of the two support columns (5); and a horizontally movable baffle (3) is arranged at one end of the top of the bottom plate (1).
2. A substrate cutting device for semiconductor material processing according to claim 1, characterized in that: A through opening is opened between the frames (15), the through opening at the middle position of the frame (15) is located directly above the knife groove (2), and the two ends of both sides of the frame (15) respectively penetrate through the notches (14) inserted into the sides of the two support columns (5), and the outer sides of the two support columns (5) are fixedly installed with third hydraulic rods (16), and the telescopic ends of the two third hydraulic rods (16) are respectively fixedly connected to the tops of the two frames (15).
3. A substrate cutting device for semiconductor material processing according to claim 1, characterized in that: Two first hydraulic rods (4) are fixedly mounted on the top of the bottom plate (1) near one end of the baffle plate (3), and the telescopic ends of the two first hydraulic rods (4) are respectively fixedly connected to the two ends of the side surface of the baffle plate (3).
4. A substrate cutting device for semiconductor material processing according to claim 1, characterized in that: The tops of the two support columns (5) are each provided with a storage groove, in which a second hydraulic rod (13) is fixedly installed, and the telescopic ends of the two second hydraulic rods (13) are respectively fixedly connected to the two ends of the bottom of the lifting plate (6).
5. The semiconductor material processing substrate cutting device according to claim 1, characterized in that: A second motor (17) is fixedly mounted on the side of the movable plate (8), and an output end of the second motor (17) extends into the groove and is fixedly connected to the axis of one side of the cutting blade (12).
6. The semiconductor material processing substrate cutting device according to claim 1, characterized in that: A bearing groove is formed at one end of the movable groove (7) away from the first motor (9), a bearing (11) is fixedly installed in the bearing groove, and one end of the screw rod (10) passes through the movable plate (8) and is fixedly connected to the inner ring wall of the bearing (11).