Host device

Abstract

The utility model provides host equipment which comprises a shell, a control panel assembly, a fan assembly and a radiator, the shell is provided with a containing cavity, the control panel assembly and the fan assembly are both arranged in the containing cavity, the shell is provided with an air outlet and a plurality of air inlets, and the fan assembly and the air outlet are oppositely arranged; the plurality of air inlets are respectively communicated with the air outlet, and a plurality of heat dissipation air channels are formed in the accommodating cavity; different positions of the control panel assembly are respectively located in the plurality of heat dissipation air channels; the radiator is arranged in at least part of the heat dissipation air channel, so that heat dissipation can be carried out on different heating areas in the host equipment, and the heat dissipation efficiency can be improved by arranging the radiator to be matched with the heat dissipation air channel in an area with higher power and larger heat productivity.

Description

Technical Field

[0001] The present application relates to the technical field of circuit devices, and in particular to a host device. Background Art

[0002] With the development of science and technology, the integration of circuit boards is getting higher and higher, and the computing power of chips is further improved. However, chips with high computing power also bring about the problem of high thermal power consumption. Chips will generate heat during high-speed computing. When this part of heat is close to or exceeds the maximum temperature of the chip, if it is not dissipated in time, it may damage the chip and even bring safety hazards.

[0003] In the related technologies, the host devices in new energy vehicles have increasingly higher product integration, and the space inside the host devices is limited. There are many heat sources inside the host devices, and some chips have high power consumption and heat generation, so heat dissipation is required in multiple places during operation.

[0004] However, currently the heat dissipation pathway in the host device is single and the heat dissipation effect is poor. Utility Model Content

[0005] The embodiment of the present application provides a host device to solve the technical problem that the heat dissipation path in the current host device is single and the heat dissipation effect is poor.

[0006] The present application provides a host device, which includes a shell, a control panel assembly, a fan assembly and a radiator. The shell has a receiving cavity, and the control panel assembly and the fan assembly are both arranged in the receiving cavity.

[0007] Among them, the shell has an air outlet and multiple air inlets, and the fan assembly is arranged opposite to the air outlet; the multiple air inlets are respectively connected to the air outlet, and multiple heat dissipation ducts are formed in the accommodating cavity; different positions of the control panel assembly are respectively located in the multiple heat dissipation ducts; the radiator is arranged in at least part of the heat dissipation duct.

[0008] The host device provided in the embodiment of the present application is provided with a fan assembly and a plurality of heat dissipation ducts in the accommodating cavity of the control board assembly, so that heat dissipation airflow can flow through the plurality of heat dissipation ducts respectively and simultaneously, thereby dissipating heat to different heating areas inside the host device, and improving the heat dissipation efficiency by providing a radiator in combination with the heat dissipation ducts for areas with higher power and greater heat generation.

[0009] In some embodiments, the control board assembly may include a main board and a core module connected to the main board, the multiple heat dissipation ducts may include a first heat dissipation duct and a second heat dissipation duct, the core module is located in the first heat dissipation duct; at least part of the main board structure is arranged in the second heat dissipation duct and is located on the side of the first heat dissipation duct.

[0010] With such a configuration, the area on the mainboard where the core module is disposed and the area where the core module is not disposed can be cooled separately through different heat dissipation ducts, so that the heat dissipation position is more targeted and the heat dissipation efficiency is improved.

[0011] In some embodiments, the multiple air inlets may include a first air inlet and a second air inlet, a first heat dissipation duct is formed between the first air inlet and the air outlet, and a second heat dissipation duct is formed between the second air inlet and the air outlet; the first air inlet and the second air inlet are located on the same side of the shell; and the air outlet is located on the side of the shell away from the first air inlet and the second air inlet.

[0012] Such an arrangement allows the first heat dissipation duct and the second heat dissipation duct to take in air from the same side of the shell, so that the flow directions of the airflows can be nearly the same, thereby improving the smoothness of the airflow and avoiding airflow interference.

[0013] In some embodiments, the radiator may include a first radiator, which is disposed in a first heat dissipation duct and is in contact with the core module; the first radiator has an air inlet side and an air outlet side, the air inlet side faces the first air inlet, and the air outlet side faces the air outlet.

[0014] With such an arrangement, the first radiator can be used to dissipate heat in a targeted manner on the core module, thereby improving the heat dissipation efficiency of the core module.

[0015] In some embodiments, the first heat sink may include a plurality of heat sink fins, which are spaced apart above the core module; the first end of the heat sink fin in the length direction is the air inlet side, and the second end of the heat sink fin in the length direction is the air outlet side.

[0016] The first heat sink may further include foam, which is arranged on a side of the heat dissipation fin away from the core module, and the foam abuts against the top wall of the shell.

[0017] Such an arrangement can increase the heat dissipation surface of the first heat sink and the contact surface with the airflow in the first heat dissipation duct.

[0018] In some embodiments, the top wall of the shell may be provided with a groove, the bottom of the groove abuts against the foam; the bottom of the groove and the heat dissipation fins are arranged to form a closed ventilation cavity.

[0019] With such an arrangement, the airflow in the first heat dissipation duct can flow through the first radiator, thereby improving the heat dissipation effect of the first radiator.

[0020] In some embodiments, the first heat sink is connected to the housing, a heat dissipation protrusion is provided on the first heat sink, and the heat dissipation protrusion is in contact with the upper surface of the core module.

[0021] Such an arrangement can improve the heat dissipation effect of the airflow in the first heat dissipation duct on the core module on the mainboard.

[0022] In some embodiments, the multiple heat dissipation ducts may also include a third heat dissipation duct, the air inlet includes a third air inlet, the third air inlet is located on the bottom wall of the shell, a third heat dissipation duct is formed between the mainboard and the bottom wall of the shell, a power amplifier chip is provided on the side of the mainboard facing away from the core module, the core module is located on the side of the mainboard facing away from the third heat dissipation duct, and the power amplifier chip is located in the third heat dissipation duct.

[0023] With such an arrangement, the power amplifier chip can be cooled by air through the independent third heat dissipation air duct, thereby improving the heat dissipation efficiency of the power amplifier chip.

[0024] In some embodiments, the heat sink may include a second heat sink connected to the bottom wall of the shell, and the second heat sink constitutes at least part of the side wall of the third heat dissipation duct; the power amplifier chip contacts the convex bump on the second heat sink.

[0025] With such an arrangement, the heat of the power amplifier chip can be diffused to the outside of the housing by means of heat conduction, thereby achieving a combination of active and passive heat dissipation.

[0026] In some embodiments, the air inlet may include a third air inlet, the third air inlet is located on the bottom wall of the shell, and a third heat dissipation duct is formed between the third air inlet and the air outlet.

[0027] Such an arrangement can ensure the rationality of the distribution of multiple air inlets, thereby fully utilizing the space inside the accommodating cavity.

[0028] In some embodiments, the fan assembly includes a fan and a mounting bracket, the mounting bracket is connected to the housing, and the fan is connected to the mounting bracket.

[0029] The present application provides a host device, which includes a shell, a control board assembly, a fan assembly and a radiator. The shell has a accommodating cavity, and the control board assembly and the fan assembly are both arranged in the accommodating cavity. The shell has an air outlet and multiple air inlets, and the fan assembly is arranged opposite to the air outlet; the multiple air inlets are respectively connected to the air outlet, and multiple heat dissipation ducts are formed in the accommodating cavity; the airflows in the multiple heat dissipation ducts flow through different positions of the control board assembly respectively; a radiator can be arranged in at least part of the heat dissipation ducts, so that different heating areas inside the host device can be cooled, and the heat dissipation efficiency can be improved by arranging a radiator in combination with the heat dissipation ducts for areas with higher power and greater heat generation.

[0030] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by the host device provided by the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of the structure of the host device provided in the embodiment of the present application Figure 1 ;

[0033] Figure 2 A schematic diagram of the structure of the host device provided in the embodiment of the present application Figure 2 ;

[0034] Figure 3 A schematic diagram of the structure of the host device provided in the embodiment of the present application Figure 3 ;

[0035] Figure 4 An exploded diagram of a host device provided in an embodiment of the present application;

[0036] Figure 5 A top view of a host device provided in an embodiment of the present application;

[0037] Figure 6 A cross-sectional view of a host device provided in an embodiment of the present application Figure 1 ;

[0038] Figure 7 A cross-sectional view of a host device provided in an embodiment of the present application Figure 2 .

[0039] Description of reference numerals:

[0040] 100-housing;

[0041] 101-accommodating chamber;

[0042] 102-air outlet;

[0043] 103-groove;

[0044] 110- first heat dissipation duct;

[0045] 111-first air inlet;

[0046] 120- second heat dissipation duct;

[0047] 121- second air inlet;

[0048] 130-third heat dissipation duct;

[0049] 131- third air inlet;

[0050] 140-middle frame;

[0051] 150-back panel;

[0052] 160-upper cover;

[0053] 200-control panel assembly;

[0054] 210- Mainboard;

[0055] 211-heat dissipation protrusion;

[0056] 220-Core module;

[0057] 230-power amplifier chip;

[0058] 300-Fan assembly;

[0059] 310-Mounting bracket;

[0060] 400-Radiator;

[0061] 410-first radiator;

[0062] 411- heat sink fin;

[0063] 412-Foam;

[0064] 420 - Second radiator. DETAILED DESCRIPTION

[0065] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0066] First, those skilled in the art should understand that these implementations are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0067] Secondly, it should be noted that in the description of the present application, terms such as "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present application.

[0068] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0069] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0070] Chips generate heat during high-speed computing. When this heat approaches or exceeds the maximum temperature of the chip, if it is not dissipated in time, it may damage the chip or even cause safety hazards. Therefore, heat dissipation is required during operation. At present, the host equipment in new energy vehicles has a higher and higher degree of product integration, and the space inside the host equipment is limited. There are many heat sources in the host equipment, and some chips have high power consumption and heat generation. Therefore, heat dissipation is required in multiple places during operation. However, the heat dissipation path in the host equipment is currently single, and the heat sources are scattered. It is impossible to achieve the same good heat dissipation efficiency in different areas at the same time, and the heat dissipation effect is poor.

[0071] An embodiment of the present application provides a host device, which provides a fan assembly and multiple heat dissipation ducts in a housing cavity of a control board assembly, so that heat dissipation airflows can flow through the multiple heat dissipation ducts at the same time, thereby dissipating heat for different heating areas inside the host device. In addition, a radiator can be provided in combination with heat dissipation ducts for areas with higher power and greater heat generation, thereby combining active heat dissipation and passive heat dissipation to improve heat dissipation efficiency.

[0072] To facilitate understanding, an application scenario of the host device provided in an embodiment of the present application is first illustrated by way of example.

[0073] The host device provided in the embodiment of the present application can be applied to various occasions where chip heat dissipation is required, and can be specifically applied to various electronic devices or smart terminals, including but not limited to mobile terminals, communication base stations, new energy vehicles, computers, etc. In addition, the heat dissipation device can adopt a combination of various heat dissipation methods such as natural heat dissipation, air cooling, water cooling, etc., and the embodiment of the present application does not make specific limitations on this.

[0074] Figure 1 A schematic diagram of the structure of the host device provided in the embodiment of the present application Figure 1 , Figure 2 A schematic diagram of the structure of the host device provided in the embodiment of the present application Figure 2 , Figure 3 A schematic diagram of the structure of the host device provided in the embodiment of the present application Figure 3 , Figure 4 An exploded diagram of a host device provided in an embodiment of the present application, Figure 5 A top view of a host device provided in an embodiment of the present application, Figure 6 A cross-sectional view of a host device provided in an embodiment of the present application Figure 1 , Figure 7 A cross-sectional view of a host device provided in an embodiment of the present application Figure 2 .

[0075] like Figures 1 to 7 As shown, an embodiment of the present application provides a host device, which includes a shell 100, a control board assembly 200, a fan assembly 300 and a heat sink 400, the shell 100 has a accommodating cavity 101, and the control board assembly 200 and the fan assembly 300 are both arranged in the accommodating cavity 101.

[0076] It can be understood that the housing of the host device plays a role in installing and protecting the control panel assembly 200, the fan assembly 300 and the radiator 400. The control panel assembly 200 serves as a control unit. When the host device is applied to products such as new energy vehicles, the control panel assembly 200 plays a control role. The fan assembly 300 is used to generate airflow in the accommodating cavity 101 to achieve the effect of air cooling and heat dissipation. The radiator 400 can cooperate with the air cooling and heat dissipation of the fan assembly 300 to improve the local heat dissipation effect of the control panel assembly 200.

[0077] The housing 100 has an air outlet 102 and a plurality of air inlets, and the fan assembly 300 is arranged opposite to the air outlet 102; the plurality of air inlets are respectively connected to the air outlet 102, and a plurality of heat dissipation air ducts are formed in the accommodating cavity 101. The airflow in the plurality of heat dissipation air ducts flows through different positions of the control board assembly 200 respectively. Different positions of the control board assembly 200 are respectively located in the plurality of heat dissipation air ducts. A radiator 400 may be arranged in at least part of the heat dissipation air duct. The radiator 400 is arranged in at least part of the heat dissipation air duct.

[0078] It is understandable that when the fan assembly 300 starts to work and generates negative pressure in the accommodating chamber 101, the airflow outside the housing 100 can flow into the accommodating chamber 101 from multiple air inlets at the same time, and the airflow can flow along multiple heat dissipation ducts respectively. For the heat dissipation ducts corresponding to the areas with higher power and greater heat generation in the control board assembly 200, a radiator 400 can be provided to improve the heat dissipation effect in a targeted manner.

[0079] It should be noted that in the host device provided in the embodiment of the present application, a fan assembly 300 is arranged in the accommodating cavity 101 where the control board assembly 200 is arranged, and a plurality of heat dissipation ducts are arranged, so that heat dissipation airflows can flow through the plurality of heat dissipation ducts respectively and simultaneously, thereby dissipating heat to different heating areas inside the host device, and the heat dissipation efficiency can be improved by arranging a radiator 400 in conjunction with the heat dissipation ducts in areas with higher power and greater heat generation.

[0080] In addition, in some embodiments, the fan assembly 300 may include a fan and a mounting bracket 310, the mounting bracket 310 is connected to the housing 100, and the fan is connected to the mounting bracket 310. The mounting bracket 310 may be provided inside the accommodating cavity 101 of the housing 100 opposite to the air outlet 102, and the fan assembly 300 may be fixed in the accommodating cavity 101 by the mounting bracket 310. Exemplarily, the fan assembly 300 may be connected to the mounting bracket 310 by bolts.

[0081] The heat dissipation methods of different areas and components on the control board assembly 200 are described in detail below.

[0082] Please continue to refer to Figures 1 to 7 In some embodiments, the control board assembly 200 may include a main board 210 and a core module 220, wherein the core module 220 is connected to the main board 210. The main board 210 may be a printed circuit board (PCB), and the core module 220 may be a control chip. The embodiment of the present application does not limit the specific circuit functions implemented by the main board 210 and the control chip.

[0083] The plurality of heat dissipation ducts may include a first heat dissipation duct 110 and a second heat dissipation duct 120, and the first heat dissipation duct 110 is opposite to the core module 220. The core module 220 is located in the first heat dissipation duct 110. The second heat dissipation duct 120 flows through the mainboard 210, and the second heat dissipation duct 120 is located on the side of the first heat dissipation duct 110, and at least part of the structure of the mainboard 210 is arranged in the second heat dissipation duct 120. Thus, the area where the core module 220 is arranged and the area where the core module 220 is not arranged on the mainboard 210 can be cooled respectively through different heat dissipation ducts, so that the heat dissipation position is more targeted and the heat dissipation efficiency is improved.

[0084] In some embodiments, the plurality of air inlets may include a first air inlet 111 and a second air inlet 121, a first heat dissipation duct 110 is formed between the first air inlet 111 and the air outlet 102, and a second heat dissipation duct 120 is formed between the second air inlet 121 and the air outlet 102. The heat dissipation airflows in the first heat dissipation duct 110 and the second heat dissipation duct 120 are relatively independent, and when the air is inlet, they enter from the first air inlet 111 and the second air inlet 121 respectively, and when the air is out, they converge from the air outlet 102 after passing through the fan assembly 300 and flow out together.

[0085] The first air inlet 111 and the second air inlet 121 are located on the same side of the housing 100, so that the first heat dissipation duct 110 and the second heat dissipation duct 120 can take in air from the same side of the housing 100, so that the airflow direction can be almost the same, improving the smoothness of the airflow and avoiding airflow interference. The air outlet 102 is located on the side of the housing 100 away from the first air inlet 111 and the second air inlet 121, improving the smoothness of the airflow.

[0086] Exemplarily, the first air inlet 111 and the second air inlet 121 can be air inlet grilles opened on the side wall of the shell 100, and the first air inlet 111 and the second air inlet 121 can respectively include multiple ventilation holes, and the shape of the ventilation holes can be circular, square or other shapes. The embodiment of the present application does not limit the specific number and shape of the ventilation holes.

[0087] Since the power and heat generation of the core module 220 in the embodiment of the present application are greater than other areas on the mainboard 210 during operation, the core module 220 can improve the heat dissipation efficiency by providing a heat sink 400 when the core module 220 is cooled by the first heat dissipation duct 110. This is described in detail below.

[0088] In some embodiments, the heat sink 400 may include a first heat sink 410, which is disposed in the first heat dissipation air duct 110 and contacts the core module 220. The first heat sink 410 has an air inlet side and an air outlet side, the air inlet side faces the first air inlet 111, and the air outlet side faces the air outlet 102, so that the first heat sink 410 can be used to dissipate heat in a targeted manner on the core module 220, thereby improving the heat dissipation efficiency of the core module 220.

[0089] It can be understood that the heat of the core module 220 can be transferred to the first radiator 410 by heat conduction. After absorbing the heat of the core module 220, the first radiator 410 can use the airflow in the first heat dissipation duct 110 to take away the absorbed heat. The first radiator 410 can serve as an extension of the core module 220 to diffuse the heat dissipation area and the heat dissipation region, and make full use of the airflow flowing through the first heat dissipation duct 110, thereby improving the heat dissipation efficiency.

[0090] Exemplarily, the first heat sink 410 may include a plurality of heat dissipation fins 411, which are arranged at intervals above the core module 220. The first end of the heat dissipation fin 411 in the length direction is the air inlet side, which is arranged toward the first air inlet 111; the second end of the heat dissipation fin 411 in the length direction is the air outlet side, which is arranged toward the air outlet 102.

[0091] The first heat sink 410 may further include a foam 412, which is disposed on a side of the heat sink 411 away from the core module 220, and the foam 412 abuts against the top wall of the housing 100, thereby increasing the heat dissipation surface of the first heat sink 410 and the contact surface with the airflow in the first heat dissipation duct 110. The specific number and area of ​​the heat sink 411 are not limited in the embodiment of the present application.

[0092] In some embodiments, the top wall of the housing 100 may be provided with a groove 103, and the bottom of the groove 103 abuts against the foam 412. The bottom of the groove 103 and the heat dissipation fins 411 are arranged to form a closed ventilation cavity. In this way, the airflow in the first heat dissipation duct 110 can flow through the first heat sink 410, thereby improving the heat dissipation effect of the first heat sink 410.

[0093] It should be noted that the foam 412 can protect the top of the heat sink fin 411. While the first heat sink 410 and the top wall of the shell 100 can form a sealed ventilation cavity, it can also prevent the top of the heat sink fin 411 from being deformed due to rigid contact with the shell 100.

[0094] In some embodiments, the first heat sink 410 is connected to the shell, and a heat dissipation protrusion 211 may be provided on the first heat sink 410. The heat dissipation protrusion 211 contacts the upper surface of the core module 220, thereby improving the heat dissipation effect of the airflow in the first heat dissipation duct 110 on the core module 220 on the mainboard 210.

[0095] Exemplarily, the heat dissipation protrusion 211 can be integrally formed with the first heat sink 410 , welded, or connected in other ways. The embodiment of the present application does not limit the specific connection method between the heat dissipation protrusion 211 and the first heat sink 410 .

[0096] Exemplarily, the heat dissipation protrusion 211 may be in indirect contact with the upper surface of the core module 220 , and elastic thermally conductive foam is disposed between the heat dissipation protrusion 211 and the core module 220 .

[0097] It should be noted that the second air inlet 121 and the inner cavity of the entire device and the air outlet 102 form a second heat dissipation duct 120 , and the cold air passing through takes away the heat of the remaining heat sources on the mainboard 210 .

[0098] The first air inlet 111, the heat dissipation fins 411, the grooves of the upper cover 160 and the air outlet 102 form a first heat dissipation duct 110. The cold air entering from the first air inlet 111 into the channel between the heat dissipation fins 411 and the groove part of the upper cover 160 can take away the heat from the first radiator 410, so that the heat of the chip on the core module 220 can be transferred to the heat dissipation fins 411 through the heat dissipation protrusions 211.

[0099] In the host device provided in the embodiment of the present application, the control board assembly 200 may also include other chips and electrical components, and the heat dissipation methods of these components are exemplified below.

[0100] Please continue to refer to Figures 1 to 7 In some embodiments, the multiple heat dissipation ducts may further include a third heat dissipation duct 130, the air inlet includes a third air inlet 131, the third air inlet 131 is located on the bottom wall of the shell 100, and the third heat dissipation duct 130 is formed between the mainboard 210 and the bottom wall of the shell 100. A power amplifier chip 230 is provided on the side of the mainboard 210 away from the core module 220. The third heat dissipation duct 130 is located on the side of the mainboard 210 away from the core module 220, and the airflow in the third heat dissipation duct 130 flows through the power amplifier chip 230.

[0101] The power amplifier chip 230 has the function of a power amplifier.

[0102] The third air inlet 131 is arranged on one side of the second radiator 420 , and the third air inlet 131 and the mainboard 210 , the bottom of the shell 100 and the air outlet 102 form a third heat dissipation duct 130 , so that the cold air entering from the third air inlet 131 passes through the power amplifier chip 230 and dissipates the heat through the third heat dissipation duct 130 .

[0103] It is understandable that the upper and lower sides of the mainboard 210 can be layered to form different heat dissipation ducts to fully utilize the space in the accommodating cavity 101, and the power amplifier chip 230 can be air-cooled through an independent third heat dissipation duct 130 to improve the heat dissipation efficiency of the power amplifier chip 230.

[0104] In some embodiments, the heat sink 400 may include a second heat sink 420, which is connected to the bottom wall of the housing 100, and the second heat sink 420 constitutes at least part of the side wall of the third heat dissipation duct 130. The power amplifier chip 230 is in contact with the convex bump on the second heat sink 420. In this way, the heat of the power amplifier chip 230 can be diffused to the outside of the housing 100 by heat conduction, realizing a combination of active heat dissipation and passive heat dissipation.

[0105] The power amplifier chip contacts the convex bump of the second heat sink, actively transferring the heat to the heat sink. Since the power amplifier is a large heat source, active heat dissipation requires a relatively large heat sink. In order to save space and cost, a small heat sink is used to actively remove part of the heat, and at the same time, the function of the system fan is fully utilized to remove part of the heat from the third channel.

[0106] Among them, the second radiator 420 can be a heat sink, which can be connected to the bottom wall of the shell 100 and constitute a part of the bottom wall of the shell 100, that is, one side of the second radiator 420 is opposite to the space in the accommodating cavity 101, and the other side of the second radiator 420 is opposite to the external space of the shell 100. After the heat of the power amplifier chip 230 is transferred to the second radiator 420, the second radiator 420 can transfer part of the heat to the outside of the shell 100 by natural heat dissipation.

[0107] It should be noted that the heat dissipation airflow in the third heat dissipation duct 130 can take away part of the heat from the second heat sink 420 and the power amplifier chip 230 at the same time.

[0108] In some embodiments, the air inlet may include a third air inlet 131, which is located on the bottom wall of the shell 100. A third heat dissipation duct 130 is formed between the third air inlet 131 and the air outlet 102, thereby ensuring the rationality of the distribution of multiple air inlets and making full use of the space inside the accommodating cavity 101.

[0109] It is understandable that the third air inlet 131 and the first air inlet 111 and the second air inlet 121 are located on different sides of the housing 100, so that the third air inlet 131 can have a sufficiently large air inlet area. Exemplarily, the first air inlet 111 and the second air inlet 121 are located on the right side wall of the housing 100, the air outlet 102 is located on the left side wall of the housing 100, and the third air inlet 131 is located on the bottom wall of the housing 100 near the right side wall.

[0110] In addition, in some embodiments, the housing 100 may include a middle frame 140, a back plate 150, and an upper cover 160, which are arranged to form an accommodating cavity 101, so that the convenience of installing components such as the control board assembly 200, the fan assembly 300, and the radiator 400 in the accommodating cavity 101 can be improved. Exemplarily, the middle frame 140, the back plate 150, and the upper cover 160 can be fixedly connected by fasteners such as screws and bolts.

[0111] An embodiment of the present application provides a host device, which includes a shell 100, a control board assembly 200, a fan assembly 300 and a radiator 400. The shell 100 has a accommodating cavity 101, and the control board assembly 200 and the fan assembly 300 are both arranged in the accommodating cavity 101. The shell 100 has an air outlet 102 and a plurality of air inlets, and the fan assembly 300 is arranged opposite to the air outlet 102; the plurality of air inlets are respectively connected to the air outlet 102, and a plurality of heat dissipation ducts are formed in the accommodating cavity 101; the airflows in the plurality of heat dissipation ducts flow through different positions of the control board assembly 200 respectively; the radiator 400 can be arranged in at least part of the heat dissipation ducts, so that different heating areas inside the host device can be cooled, and the heat dissipation efficiency can be improved by arranging the radiator 400 in combination with the heat dissipation ducts for areas with higher power and greater heat generation.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A host device, characterized in that: It comprises a housing, a control panel assembly, a fan assembly and a radiator, wherein the housing has a receiving cavity, and the control panel assembly and the fan assembly are both arranged in the receiving cavity; The shell has an air outlet and multiple air inlets, and the fan assembly is arranged opposite to the air outlet; the multiple air inlets are respectively connected to the air outlet, and multiple heat dissipation ducts are formed in the accommodating cavity; different positions of the control panel assembly are respectively located in the multiple heat dissipation ducts; the radiator is arranged in at least part of the heat dissipation ducts.

2. The host device according to claim 1, characterized in that: The control board assembly includes a main board and a core module connected to the main board. The multiple heat dissipation ducts include a first heat dissipation duct and a second heat dissipation duct. The core module is located in the first heat dissipation duct. At least part of the structure of the main board is arranged in the second heat dissipation duct and is located on the side of the first heat dissipation duct.

3. The host device according to claim 2, characterized in that: The multiple air inlets include a first air inlet and a second air inlet, the first heat dissipation duct is formed between the first air inlet and the air outlet, and the second heat dissipation duct is formed between the second air inlet and the air outlet; the first air inlet and the second air inlet are located on the same side of the shell; the air outlet is located on the side of the shell away from the first air inlet and the second air inlet.

4. The host device according to claim 3, characterized in that: The radiator includes a first radiator, which is arranged in the first heat dissipation duct and contacts the core module; the first radiator has an air inlet side and an air outlet side, the air inlet side faces the first air inlet, and the air outlet side faces the air outlet.

5. The host device according to claim 4, characterized in that: The first heat sink includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged above the core module at intervals; the first end of the heat dissipation fin in the length direction is the air inlet side, and the second end of the heat dissipation fin in the length direction is the air outlet side.

6. The host device according to claim 5, characterized in that: The first heat sink further includes foam, which is arranged on a side of the heat dissipation fin away from the core module, and the foam abuts against a top wall of the shell.

7. The host device according to claim 6, characterized in that: The top wall of the shell is provided with a groove, the bottom of the groove abuts against the foam; the bottom of the groove and the heat dissipation fins are surrounded to form a closed ventilation cavity.

8. The host device according to any one of claims 4 to 7, characterized in that: The first heat sink is connected to the housing, and a heat dissipation protrusion is provided on the first heat sink, and the heat dissipation protrusion is in contact with the upper surface of the core module.

9. The host device according to any one of claims 2 to 7, characterized in that: The multiple heat dissipation ducts also include a third heat dissipation duct, the air inlet includes a third air inlet, the third air inlet is located on the bottom wall of the shell, the third heat dissipation duct is formed between the mainboard and the bottom wall of the shell, a power amplifier chip is provided on the side of the mainboard away from the core module, the core module is located on the side of the mainboard away from the third heat dissipation duct, and the power amplifier chip is located in the third heat dissipation duct.

10. The host device according to claim 9, characterized in that: The heat sink includes a second heat sink, which is connected to the bottom wall of the shell and constitutes at least a part of the side wall of the third heat dissipation duct; the power amplifier chip is in contact with the convex bump on the second heat sink.

11. The host device according to any one of claims 2 to 7, characterized in that: The fan assembly comprises a fan and a mounting bracket, wherein the mounting bracket is connected to the housing, and the fan is connected to the mounting bracket.

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