DTU module control device with rapid assembly structure

Abstract

The utility model discloses a DTU module control device with a rapid assembly structure, which comprises a device main body, a carrier plate, a controller, a support bracket and clamping plates, the carrier plate is arranged in the device main body, the clamping plates are welded on the two sides of the bottom end of the carrier plate, the outer wall of one side of each clamping plate is provided with a positioning hole, and the outer wall of the other side of each clamping plate is provided with a positioning hole. The supporting brackets are welded to the two inner walls of the device body below the carrying plate, the supporting brackets and the clamping plates are clamped, threaded holes are formed in the positions, at the positioning holes, of the supporting brackets, bolts are in threaded connection with the interiors of the threaded holes, one ends of the bolts extend into the positioning holes, and the other ends of the bolts extend into the clamping plates. A movable plate is arranged at the top of the carrying plate, the two sides of the movable plate are slidably connected with the carrying plate through sliding blocks, and the controller is installed at the top end of the movable plate. According to the utility model, the assembly is simple and fast, the heat dissipation effect of the device is improved, and the convenience of overhaul and maintenance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of DTU modules, in particular to a DTU module control device with a quick assembly structure. Background Art

[0002] The DTU module (data transmission unit) is a wireless terminal device used to convert serial port data into IP data, convert IP data into serial port data, and transmit it through a wireless communication network. The DTU module has the characteristics of rapid and flexible networking, short construction period, low cost, wide network coverage, good security and confidentiality, link support always online, flow-based billing, and low user cost. It is widely used in electricity, environmental protection, LED information release, logistics, hydrology, meteorology, etc. The DTU module is controlled by a control device when in use.

[0003] DTU module control devices are generally installed using screws during assembly. This method requires the use of multiple sets of screws for fixing and different installation tools. It is not only cumbersome to operate and time-consuming to assemble, but also requires the collaboration of multiple people to complete. Therefore, improvement is urgently needed. Utility Model Content

[0004] The purpose of the utility model is to provide a DTU module control device with a quick assembly structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a DTU module control device with a quick assembly structure, comprising a device body, a carrier plate, a controller, a support bracket and a card plate, the carrier plate is arranged inside the device body, the card plates are welded to both sides of the bottom end of the carrier plate, and positioning holes are arranged on the outer wall of one side of the card plate, the support brackets are welded to the two inner walls of the device body below the carrier plate, and the support brackets are engaged with the card plate, a threaded hole is arranged inside the support bracket at the position of the positioning hole, and the internal thread of the threaded hole is connected with a bolt, and one end of the bolt extends to the inside of the positioning hole, a movable plate is arranged on the top of the carrier plate, and both sides of the movable plate are slidably connected to the carrier plate through sliders, and the controller is installed on the top of the movable plate.

[0006] Preferably, first cooling fans are installed on both inner walls of the device body above the carrier plate, and cooling windows are provided on the side walls of the device body at the position of the first cooling fans, which speeds up the air flow rate inside the device body and facilitates heat dissipation.

[0007] Preferably, a radiator is welded between the support brackets, the top of the radiator is in contact with the bottom of the movable plate, and a heat exchange tube is installed inside the radiator, and both ends of the heat exchange tube extend to the bottom of the radiator for heat exchange below the controller.

[0008] Preferably, a liquid storage tank is provided at the bottom of the device body below the radiator, and a drain pipe and a liquid inlet pipe are respectively installed on the outer wall of one side of the liquid storage tank, and one end of the drain pipe and the liquid inlet pipe both extend to the outside of the device body, which are used for adding and discharging coolant inside the liquid storage tank.

[0009] Preferably, a circulation pipe is installed on one side of the top of the liquid storage tank, and the top of the circulation pipe is connected to one end of the heat exchange tube, so as to facilitate pumping the coolant inside the liquid storage tank into the heat exchange tube.

[0010] Preferably, a circulation pump is installed at the bottom of the device body on one side of the liquid storage tank, and the input end of the circulation pump is connected to the liquid storage tank through a liquid extraction pipe, and the output end of the circulation pump is connected to the other end of the heat exchange tube through a liquid filling pipe, so that the coolant circulates.

[0011] Preferably, semiconductor refrigerators are installed on the outer walls on both sides of the liquid storage tank, and a second cooling fan is installed on the outer wall of the semiconductor refrigerator away from the liquid storage tank, so as to cool the liquid storage tank.

[0012] Preferably, the bottom of the carrier plate below the movable plate is provided with a strip groove, and rollers with equal spacing are installed inside the strip groove, so as to facilitate guiding the movable plate and reduce the friction resistance between the movable plate and the carrier plate.

[0013] Compared with the prior art, the beneficial effects of the utility model are: the DTU module control device with a quick assembly structure is not only simple and quick to assemble, but also improves the heat dissipation effect of the device and improves the convenience of overhaul and maintenance;

[0014] (1) By providing a carrier plate, a card plate, a positioning hole, a support bracket, a threaded hole, and a bolt, the carrier plate is placed on the support bracket inside the device body, and the card plate at the bottom of the carrier plate is engaged with the support bracket, and then the bolt inside the threaded hole is screwed into the positioning hole on the outer wall of the card plate, so that the carrier plate can be fixed, and then the controller is installed on the movable plate on the top of the carrier plate to complete the assembly of the control device. This design does not require the use of cumbersome screws. The control device has its own assembly structure and does not require the use of tools. The assembly work can be completed by one person, which is simple to operate, short in time, and efficient and convenient;

[0015] (2) A first cooling fan, a cooling window, a radiator, a heat exchange tube, a circulation pump, a liquid adding tube, a liquid extraction tube, a liquid storage tank, a semiconductor refrigerator, a second cooling fan, a liquid discharge tube, a liquid inlet tube, and a circulation tube are provided. When the control device is working, the first cooling fan operates to accelerate the air flow rate inside the device body, so that the heat is dissipated to the outside through the cooling window. The circulation pump extracts the coolant inside the liquid storage tank through the liquid extraction tube and introduces it into the heat exchange tube inside the radiator through the liquid adding tube. When the coolant passes through the heat exchange tube, the heat under the controller is taken away, and the cooling flows back into the liquid storage tank through the circulation tube, forming a circulating flow state. The cold end of the semiconductor refrigerator contacts the liquid storage tank to cool the liquid storage tank. The second cooling fan dissipates heat from the hot end of the semiconductor refrigerator to ensure the heat dissipation effect of the coolant. Through multiple heat dissipation methods, the heat dissipation effect of the device is improved.

[0016] (3) By providing a movable plate, a slider, a strip groove, and a roller, when the controller needs to be inspected and maintained, the movable plate is pulled to slide under the action of the slider, and the roller inside the strip groove guides the movable plate, while reducing the friction resistance between the movable plate and the carrier plate. The movable plate drives the controller to move horizontally, and the controller can be moved out of the device body, so that the controller does not need to be disassembled for inspection and maintenance, thereby improving the convenience of inspection and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;

[0018] Figure 2 For the utility model Figure 1 The enlarged structural diagram at A in the middle;

[0019] Figure 3 It is a cross-sectional enlarged structural schematic diagram of the carrier plate of the utility model;

[0020] Figure 4 For the utility model Figure 3 The enlarged structural diagram at B in the middle;

[0021] Figure 5 It is a schematic diagram of an enlarged top view of the cross section of the radiator of the utility model.

[0022] In the figure: 1. device body; 2. carrier board; 3. controller; 4. first cooling fan; 5. heat dissipation window; 6. support bracket; 7. radiator; 8. circulation pump; 9. liquid adding pipe; 10. liquid extraction pipe; 11. liquid storage tank; 12. semiconductor refrigerator; 13. second cooling fan; 14. liquid discharge pipe; 15. liquid inlet pipe; 16. circulation pipe; 17. threaded hole; 18. bolt; 19. clamping plate; 20. positioning hole; 21. movable plate; 22. strip groove; 23. roller; 24. slider; 25. heat exchange tube. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. All other embodiments obtained by ordinary technicians in the field without creative work based on the embodiments of the utility model shall fall within the scope of protection of the utility model.

[0024] See also Figure 1-5 The utility model provides an embodiment: a DTU module control device with a quick assembly structure, including a device body 1, a carrier board 2, a controller 3, a support bracket 6 and a card board 19, the carrier board 2 is arranged inside the device body 1, the card board 19 is welded on both sides of the bottom end of the carrier board 2, and a positioning hole 20 is arranged on the outer wall of one side of the card board 19, the support bracket 6 is welded on the two inner walls of the device body 1 below the carrier board 2, and the support bracket 6 is engaged with the card board 19, a threaded hole 17 is arranged inside the support bracket 6 at the position of the positioning hole 20, and the internal thread of the threaded hole 17 is connected with a bolt 18, and one end of the bolt 18 extends to the inside of the positioning hole 20;

[0025] A movable plate 21 is provided on the top of the carrier plate 2, and both sides of the movable plate 21 are slidably connected to the carrier plate 2 through sliders 24, and the controller 3 is installed on the top of the movable plate 21;

[0026] First cooling fans 4 are installed on both inner walls of the device body 1 above the carrier board 2, and cooling windows 5 are provided on the side walls of the device body 1 at the position of the first cooling fans 4, which speed up the air flow rate inside the device body 1 and facilitate heat dissipation;

[0027] A radiator 7 is welded between the support brackets 6, the top of the radiator 7 contacts the bottom of the movable plate 21, and a heat exchange tube 25 is installed inside the radiator 7, and both ends of the heat exchange tube 25 extend to the bottom of the radiator 7, which is used for heat exchange work under the controller 3;

[0028] A liquid storage tank 11 is provided at the bottom of the device body 1 below the radiator 7, and a liquid discharge pipe 14 and a liquid inlet pipe 15 are respectively installed on the outer wall of one side of the liquid storage tank 11, and one end of the liquid discharge pipe 14 and the liquid inlet pipe 15 are extended to the outside of the device body 1, for adding and discharging the coolant in the liquid storage tank 11;

[0029] A circulation pipe 16 is installed on one side of the top of the liquid storage tank 11, and the top of the circulation pipe 16 is connected to one end of the heat exchange pipe 25, so as to facilitate the pumping of the coolant inside the liquid storage tank 11 into the heat exchange pipe 25;

[0030] A circulation pump 8 is installed at the bottom of the device body 1 on one side of the liquid storage tank 11, and the input end of the circulation pump 8 is connected to the liquid storage tank 11 through the liquid extraction pipe 10, and the output end of the circulation pump 8 is connected to the other end of the heat exchange pipe 25 through the liquid addition pipe 9, so that the coolant circulates;

[0031] Semiconductor refrigerators 12 are installed on the outer walls of both sides of the liquid storage tank 11, and a second cooling fan 13 is installed on the outer wall of the semiconductor refrigerator 12 away from the liquid storage tank 11, so as to cool the liquid storage tank 11;

[0032] The bottom of the carrier plate 2 below the movable plate 21 is provided with a strip groove 22 , and rollers 23 with equal spacing are installed inside the strip groove 22 , which is convenient for guiding the movable plate 21 and reducing the friction resistance between the movable plate 21 and the carrier plate 2 .

[0033] When the embodiment of the present application is in use: first, place the carrier plate 2 on the support bracket 6 inside the device body 1, and make the card plate 19 at the bottom of the carrier plate 2 engage with the support bracket 6, then screw the bolt 18 inside the threaded hole 17 into the positioning hole 20 on the outer wall of the card plate 19, so that the carrier plate 2 can be fixed, and then the controller 3 is installed on the movable plate 21 on the top of the carrier plate 2 to complete the assembly of the control device. This design does not require the use of cumbersome screws. The control device has its own assembly structure and does not require the use of tools. The assembly work can be completed by one person, which is simple to operate, short in time, efficient and convenient. Then, the controller 3 controls the DTU module. When the control device is working, the first cooling fan 4 runs to accelerate the air flow rate inside the device body 1, so that the heat is dissipated to the outside through the heat dissipation window 5. At the same time, the circulating pump 8 extracts the coolant in the liquid storage tank 11 through the liquid extraction pipe 10 and introduces it into the In the heat exchange tube 25 inside the radiator 7, when the coolant passes through the heat exchange tube 25, the heat under the controller 3 is taken away, and the cooling flows back to the liquid storage tank 11 through the circulation tube 16, forming a circulating flow state, and the cold end of the semiconductor refrigerator 12 contacts the liquid storage tank 11 to cool the liquid storage tank 11, and the second cooling fan 13 dissipates heat from the hot end of the semiconductor refrigerator 12 to ensure the heat dissipation effect of the coolant. Through multiple heat dissipation methods, the heat dissipation effect of the device is improved, and when the controller 3 needs to be inspected and maintained, the movable plate 21 is pulled to slide under the action of the slider 24, and the roller 23 inside the strip groove 22 guides the movable plate 21, while reducing the friction resistance between the movable plate 21 and the carrier plate 2, and the movable plate 21 drives the controller 3 to translate, so that the controller 3 can be moved out of the device body 1, so that the controller 3 does not need to be disassembled for inspection and maintenance, which improves the convenience of inspection and maintenance.

Claims

1. A DTU module control device with a quick assembly structure, characterized in that: The device comprises a device body (1), a carrier plate (2), a controller (3), a support bracket (6) and a card plate (19), wherein the carrier plate (2) is arranged inside the device body (1), the card plate (19) is welded to both sides of the bottom end of the carrier plate (2), and a positioning hole (20) is arranged on the outer wall of one side of the card plate (19), the support bracket (6) is welded to both inner walls of the device body (1) below the carrier plate (2), and the support bracket (6) is engaged with the card plate (19), A threaded hole (17) is provided inside the support bracket (6) at the position of the positioning hole (20), and a bolt (18) is connected to the internal thread of the threaded hole (17), and one end of the bolt (18) extends to the inside of the positioning hole (20). A movable plate (21) is provided on the top of the carrier plate (2), and both sides of the movable plate (21) are slidably connected to the carrier plate (2) through sliders (24), and the controller (3) is installed on the top of the movable plate (21).

2. A DTU module control device with a quick assembly structure according to claim 1, characterized in that: First heat dissipation fans (4) are installed on both inner walls of the device body (1) above the carrier plate (2), and heat dissipation windows (5) are arranged on the side walls of the device body (1) at the positions of the first heat dissipation fans (4).

3. The DTU module control device with a quick assembly structure according to claim 1, characterized in that: A radiator (7) is welded between the support brackets (6), the top end of the radiator (7) contacts the bottom end of the movable plate (21), and a heat exchange tube (25) is installed inside the radiator (7), and both ends of the heat exchange tube (25) extend to the bottom of the radiator (7).

4. The DTU module control device with a quick assembly structure according to claim 3, characterized in that: A liquid storage tank (11) is provided at the bottom of the device body (1) below the radiator (7), and a liquid discharge pipe (14) and a liquid inlet pipe (15) are respectively installed on the outer wall of one side of the liquid storage tank (11), and one end of the liquid discharge pipe (14) and the liquid inlet pipe (15) both extend to the outside of the device body (1).

5. A DTU module control device with a quick assembly structure according to claim 4, characterized in that: A circulation pipe (16) is installed on one side of the top end of the liquid storage tank (11), and the top end of the circulation pipe (16) is connected to one end of the heat exchange pipe (25).

6. The DTU module control device with a quick assembly structure according to claim 4, characterized in that: A circulation pump (8) is installed at the bottom of the device body (1) on one side of the liquid storage tank (11), and the input end of the circulation pump (8) is connected to the liquid storage tank (11) through a liquid extraction pipe (10), and the output end of the circulation pump (8) is connected to the other end of the heat exchange tube (25) through a liquid addition pipe (9).

7. The DTU module control device with a quick assembly structure according to claim 4, characterized in that: Semiconductor refrigerators (12) are installed on the outer walls of both sides of the liquid storage tank (11), and a second heat dissipation fan (13) is installed on the outer wall of the semiconductor refrigerator (12) away from the liquid storage tank (11).

8. The DTU module control device with a quick assembly structure according to claim 1, characterized in that: The bottom of the carrier plate (2) below the movable plate (21) is provided with a strip groove (22), and rollers (23) with equal spacing are installed inside the strip groove (22).

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