PCB structure for improving network signal quality backflow of DIP device
By connecting the GND signal return path of the DIP device on the PCB board, the signal interference and attenuation problems caused by the long GND signal return path of the DIP device are solved, and a significant improvement in signal quality is achieved.
Patent Information
- Application Number
- CN202420762147.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-12
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-12
AI Technical Summary
The GND signal return path of DIP devices in PCB boards is long, which causes signals to be easily disturbed and attenuated during transmission, affecting signal quality and the performance and stability of electronic products.
By setting a pin through hole on the N-layer substrate of the PCB board and connecting the GND copper skin of the M-th layer to the pin through hole, the GND signal of the DIP device is recently reflowed, shortening the return path, reducing signal interference and attenuation.
It effectively improves signal integrity and stability, reduces signal delay and distortion, enhances signal strength, and significantly improves the signal quality of DIP devices.
Smart Images
Figure CN222464899U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a PCB structure for improving the quality of network signal return of a DIP device. Background Art
[0002] As the core component of electronic products, printed circuit boards (PCBs) play the dual roles of physical support and signal transmission. They are like a bridge, connecting various electronic components to ensure that signals can be accurately transmitted from the transmitter to the receiver. Among the many applications of PCBs, DIP devices (through-hole devices) are particularly widely used, and their stability and performance directly affect the operation of the entire electronic product. However, with the continuous advancement of integrated circuit technology, signal transmission on PCBs faces unprecedented challenges. Signal integrity and stability have become key links that must be considered in PCB design. Especially in the application of DIP devices, the problem of signal reflux is often overlooked, but its impact on signal transmission quality cannot be ignored.
[0003] In terms of design, most DIP devices only make connections on the bottom layer, while the GND signal pads on the inner layer are often not connected for processing and heat dissipation considerations. This design simplifies the manufacturing process to a certain extent, but it also brings about the problem of signal return. When the signal routing of the DIP device is connected on the inner layer, its GND return cannot be achieved through the closest return and can only be returned through the bottom layer. This not only increases the return path, making the signal more susceptible to interference and attenuation during transmission, but may also cause signal delays and distortion. As modern electronic products have higher and higher requirements for signal transmission rates, the impact of the GND signal return problem of DIP devices has become increasingly prominent. If the return is not handled properly, it will not only cause the return signal to be damaged, but may also affect the signal quality of the entire DIP device, and then affect the performance and stability of the entire electronic product.
[0004] Therefore, it is necessary to conduct in-depth research and optimization on the signal return problem of DIP devices in PCB boards. Utility Model Content
[0005] In order to overcome the problem in the prior art that the GND signal return flow of the DIP device on the PCB board is poor, which affects the signal quality of the entire DIP device, the utility model provides a PCB structure for improving the return flow quality of the DIP device network signal.
[0006] The technical solution of the utility model is as follows:
[0007] A PCB structure for improving the quality of DIP device network signal backflow, comprising an N-layer substrate, wherein the N-layer substrate is provided with a pin through hole for connecting the DIP device, the M-layer substrate is provided with a signal routing of the DIP device, and the GND copper foil on the M-layer substrate is connected to the pin through hole, 1 <M<N,3≤N。
[0008] As a preferred solution of the present invention, the GND copper foil on the substrate of the M-1th layer is connected to the pin through hole.
[0009] As a preferred solution of the present invention, the GND copper foil on the substrate of the M+1th layer is connected to the pin through hole.
[0010] As a preferred solution of the present invention, the GND copper foils on the substrate of the M-1th layer and the M+1th layer are both connected to the pin through holes.
[0011] As a preferred solution of the present invention, the GND copper foil is connected to the pin through-hole via at least one GND trace.
[0012] As a preferred solution of the present invention, the line width of the GND line is 0.5 mm.
[0013] As a preferred solution of the present invention, the GND copper sheet is connected to the pin through-hole via two GND wires, and the two GND wires are arranged opposite to each other.
[0014] As a preferred solution of the present invention, the GND copper sheet is connected to the pin through hole through three GND wires, and the three GND wires are evenly distributed along the circumference of the pin through hole.
[0015] As a preferred solution of the present invention, the GND copper foil is connected to the pin through-hole via four GND wires, and the four GND wires are distributed in a cross shape.
[0016] As a preferred solution of the present invention, the signal routing includes a clock signal routing, a single-line signal routing and a power signal routing.
[0017] Compared with the prior art, the beneficial effects of the present invention are:
[0018] 1. By standardizing the connection of the GND network of the DIP device, the GND copper foil on the substrate of the layer where the signal routing is located is connected to the pin through-hole, so as to achieve the closest return of the GND signal of the DIP device, effectively shorten the return path, reduce the interference and attenuation of the signal during the transmission process, thereby improving the integrity and stability of the signal. The optimized return path not only reduces the delay and distortion of the signal, but also enhances the strength of the signal, which can ensure that the signal quality of the DIP device is significantly improved;
[0019] 2. In addition to connecting the GND copper foil on the substrate of the layer where the signal routing is located with the pin through-hole, the GND copper foil on the upper and lower substrates of the layer where the signal routing is located can also be directly connected with the pin through-hole, so that the GND return of the DIP device is the closest and the best. This not only effectively improves the signal quality problem caused by the return problem, but also significantly reduces the interference and attenuation of the signal during the transmission process, ensuring the integrity and stability of the signal. It also takes into account the needs of the DIP device in processing heat dissipation, and can effectively disperse and conduct heat;
[0020] 3. Regarding the connection of the GND network, the GND copper foil is connected to the pin through-hole through at least one GND trace, and the line width of the GND trace is limited to 0.5mm, ensuring that the GND signal of the DIP device can have a stable and efficient return path, which helps to reduce signal attenuation and interference during transmission and improve signal integrity and quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 This is a structural schematic diagram of an M-layer substrate of a PCB structure for improving the quality of network signal return of a DIP device in one embodiment of the utility model;
[0023] Figure 2 This is a structural schematic diagram of the M-1 layer substrate of a PCB structure for improving the quality of network signal return of a DIP device in one embodiment of the utility model;
[0024] Figure 3 This is a structural schematic diagram of the M+1th layer substrate of a PCB structure for improving the quality of network signal return of a DIP device in one embodiment of the utility model.
[0025] In the figure,
[0026] 1. Substrate; 2. Pin through-hole; 3. Signal routing; 31. Clock signal routing; 32. Single-line signal routing; 33. Power signal routing; 4. GND copper foil; 5. GND routing. DETAILED DESCRIPTION
[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model more clearly understood, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. At the same time, it is stated that the embodiments described below are only used to explain the utility model and are not used to limit the utility model.
[0028] It should be noted that the terms "install", "set", "connect", "fix" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. The indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the application product is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. "Multiple" means two or more, unless otherwise clearly defined. "Several" means one or more, unless otherwise clearly defined.
[0029] In terms of design, most DIP devices only make connections on the bottom layer, while the GND signal pads on the inner layer are often not connected for processing and heat dissipation considerations. This design simplifies the manufacturing process to a certain extent, but it also brings about the problem of signal return. When the signal routing of the DIP device is connected on the inner layer, its GND return cannot be achieved through the closest return and can only be returned through the bottom layer. This not only increases the return path, making the signal more susceptible to interference and attenuation during transmission, but may also cause signal delays and distortion. As modern electronic products have higher and higher requirements for signal transmission rates, the impact of the GND signal return problem of DIP devices has become increasingly prominent. If the return is not handled properly, it will not only cause the return signal to be damaged, but may also affect the signal quality of the entire DIP device, and then affect the performance and stability of the entire electronic product.
[0030] To solve the above problems, this embodiment provides a PCB structure for improving the return of the network signal quality of DIP devices.
[0031] Please refer to Figure 1 , the PCB structure for improving the return of the network signal quality of DIP devices includes an N-layer substrate 1. There are pin vias 2 for connecting DIP devices on the N-layer substrate 1. Signal traces 3 of DIP devices are provided on the substrate 1 of the Mth layer. The GND copper foil 4 on the substrate 1 of the Mth layer is connected to the pin vias 2, where 1 < M < N and 3 ≤ N. Taking a 6-layer substrate 1 as an example, when the signal trace 3 of the DIP device is arranged on the 3rd layer, the GND copper foil 4 on the substrate 1 of the 3rd layer is connected to the pin vias 2, so that the GND return of the DIP device is the closest, and thus the signal quality problem caused by the return problem can be effectively improved. The PCB structure for improving the return of the network signal quality of DIP devices provided in this embodiment, by standardizing the connection of the GND network of DIP devices, directly connects the GND copper foil 4 on the substrate 1 of the Mth layer (the layer where the signal trace 3 is located) to the pin vias 2, realizing the closest return of the GND signal of the DIP device. This design effectively shortens the return path, reduces the interference and attenuation of the signal during transmission, thereby improving the integrity and stability of the signal. The optimized return path not only reduces the delay and distortion of the signal, but also enhances the signal strength. This is crucial for the increasing signal transmission rate requirements in modern electronic products and can ensure a significant improvement in the signal quality of DIP devices.
[0032] Please refer to Figure 2 , Figure 3 , in a preferred embodiment, in addition to the GND copper foil 4 on the substrate 1 of the Mth layer being connected to the pin vias 2, the GND copper foils 4 on the substrates 1 of the M - 1th layer and the M + 1th layer are also connected to the pin vias 2. Taking a 6-layer substrate 1 as an example, when the signal trace 3 of the DIP device is arranged on the 3rd layer, not only the GND copper foil 4 on the substrate 1 of the 3rd layer is connected to the pin vias 2, but also the GND copper foils 4 on the substrates 1 of the 2nd layer and the 4th layer are connected to the pin vias 2, making the GND return of the DIP device the closest and also the best. It not only effectively improves the signal quality problem caused by the return problem, significantly reduces the interference and attenuation of the signal during transmission, ensures the integrity and stability of the signal, but also takes into account the processing and heat dissipation requirements of DIP devices and can effectively disperse and conduct heat. In addition, considering the processing and heat dissipation needs of DIP devices, when the GND signal pins of DIP devices are connected on the inner layer (at least connected to more than 2 layers), the GND network signals of DIP devices can be not connected on the top and bottom layers.
[0033] Please refer to Figure 2In a preferred embodiment, in addition to the GND copper foil 4 on the substrate 1 of the Mth layer being connected to the pin through hole 2, the GND copper foil 4 on the substrate 1 of the M-1th layer is also connected to the pin through hole 2. Taking the 6-layer substrate 1 as an example, when the signal trace 3 of the DIP device is set on the 3rd layer, not only the GND copper foil 4 on the substrate 1 of the 3rd layer is connected to the pin through hole 2, but also the GND copper foil 4 on the substrate 1 of the 2nd layer is connected to the pin through hole 2, so that the GND reflux of the DIP device is the closest and better, which not only effectively improves the signal quality problem caused by the reflux problem, significantly reduces the interference and attenuation of the signal during the transmission process, ensures the integrity and stability of the signal, but also takes into account the needs of the DIP device in processing heat dissipation, and can effectively disperse and conduct heat.
[0034] See also Figure 3 In a preferred embodiment, in addition to the GND copper foil 4 on the substrate 1 of the Mth layer being connected to the pin through hole 2, the GND copper foil 4 on the substrate 1 of the M+1th layer is also connected to the pin through hole 2. Taking the 6-layer substrate 1 as an example, when the signal trace 3 of the DIP device is set on the 3rd layer, not only the GND copper foil 4 on the substrate 1 of the 3rd layer is connected to the pin through hole 2, but also the GND copper foil 4 on the substrate 1 of the 4th layer is connected to the pin through hole 2, so that the GND reflux of the DIP device is the closest and better, which not only effectively improves the signal quality problem caused by the reflux problem, significantly reduces the interference and attenuation of the signal during the transmission process, ensures the integrity and stability of the signal, but also takes into account the needs of the DIP device in processing heat dissipation, and can effectively disperse and conduct heat.
[0035] See also Figures 1 to 3 In one embodiment, regarding the connection of the GND network, the GND copper foil 4 is connected to the pin through hole 2 through at least one GND trace 5, and the line width of the GND trace 5 is 0.5 mm, which ensures that the GND signal of the DIP device can have a stable and efficient return path. This helps to reduce the attenuation and interference of the signal during transmission and improve the integrity and quality of the signal. Preferably, the GND copper foil 4 is connected to the pin through hole 2 through four GND traces 5, and the four GND traces 5 are distributed in a cross shape. This design further enhances the stability and reliability of the GND network. Multiple traces share the return current, reduce the load of a single trace, reduce the risk of failure due to excessive current, and can also assist in heat dissipation to a certain extent. The trace itself can serve as a heat conduction path to help disperse the heat generated by the DIP device to a larger area and improve the overall heat dissipation efficiency.
[0036] In a preferred embodiment, the GND copper foil 4 is also connected to the pin through hole 2 through two GND traces 5, and the two GND traces 5 are arranged opposite to each other. The two oppositely arranged GND traces 5 can ensure the balance of the signal return path. When the DIP device is working, the GND signal can return evenly through these two paths, avoiding signal interference or attenuation caused by path imbalance. Compared with the design of four traces, two traces are simpler and reduce manufacturing complexity and cost. At the same time, it can still provide sufficient return capacity to meet the working requirements of most DIP devices.
[0037] In a preferred embodiment, the GND copper sheet 4 is connected to the pin through hole 2 through three GND wires 5, and the three GND wires 5 are evenly distributed along the circumference of the pin through hole 2. The three wires are evenly distributed around the pin through hole 2, making the return path of the GND signal more balanced, which helps to reduce signal interference and attenuation caused by unbalanced return paths and improve signal stability and quality. The three wires not only provide a good return path, but also assist heat dissipation to a certain extent.
[0038] See also Figure 1 In some specific embodiments, the signal routing 3 includes a clock signal routing 31 , a single-line signal routing 32 , and a power signal routing 33 .
[0039] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
[0040] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.
Claims
1. A PCB structure for improving the quality of DIP device network signal return, characterized in that: The invention comprises an N-layer substrate, wherein the N-layer substrate is provided with a pin through hole for connecting a DIP device, the M-layer substrate is provided with a signal line of the DIP device, and the GND copper sheet on the M-layer substrate is connected to the pin through hole, 1 <M<N,3≤N。 2. The PCB structure for improving the quality of DIP device network signal return according to claim 1, characterized in that: The GND copper foil on the substrate of the M-1th layer is connected to the pin through-hole.
3. The PCB structure for improving the quality of DIP device network signal return according to claim 1, characterized in that: The GND copper foil on the substrate of the M+1th layer is connected to the pin through-hole.
4. The PCB structure for improving the quality of DIP device network signal return according to claim 1, characterized in that: The GND copper foils on the substrate of the M-1th layer and the M+1th layer are both connected to the pin through-holes.
5. The PCB structure for improving the quality of DIP device network signal return according to claim 1, characterized in that: The GND copper foil is connected to the pin through-hole via at least one GND wire.
6. The PCB structure for improving the quality of DIP device network signal return according to claim 5, characterized in that: The GND line width is 0.5 mm.
7. The PCB structure for improving the quality of DIP device network signal return according to claim 5, characterized in that: The GND copper foil is connected to the pin through-hole via two GND wires, and the two GND wires are arranged opposite to each other.
8. The PCB structure for improving the quality of DIP device network signal return according to claim 5, characterized in that: The GND copper foil is connected to the pin through hole through the three GND wires, and the three GND wires are evenly distributed along the circumference of the pin through hole.
9. The PCB structure for improving the quality of DIP device network signal return according to claim 5, characterized in that: The GND copper foil is connected to the pin through-hole via four GND wires, and the four GND wires are distributed in a cross shape.
10. The PCB structure for improving the quality of DIP device network signal return according to claim 1, characterized in that: The signal routing includes a clock signal routing, a single-line signal routing and a power signal routing.