Printed circuit board (PCB) packaging structure compatible with direct insertion and horizontal installation electrolytic capacitors

Abstract

The utility model discloses a PCB packaging structure compatible with direct-insertion and horizontal-installation electrolytic capacitors, which comprises a first welding area and a second welding area which are arranged on a circuit board, and the orthographic projection of the first welding area and the orthographic projection of the second welding area are at least partially overlapped, so that the first welding area and the second welding area form a compatible welding area. By means of the design, the problem that space conflicts exist when the electrolytic capacitor is converted into horizontal installation from direct insertion in traditional PCB packaging is solved, the electrolytic capacitor can be switched between direct insertion and horizontal installation due to the arrangement of the compatible welding area, welding can be conducted in the direct insertion mode when part feeding testing is conducted, the stability and reliability of the electrolytic capacitor are ensured, and the reliability of the electrolytic capacitor is improved. After the test is completed, when horizontal installation is needed due to the installation height limitation, horizontal installation can be realized only by bending the electrolytic capacitor to enable the electrolytic capacitor to be located in the second welding area, and the PCB does not need to be replaced or complicated modification does not need to be carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB packaging, and more specifically, to a PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation. Background Art

[0002] Electrolytic capacitor is a kind of capacitor. The metal foil is the positive electrode (aluminum or tantalum), and the oxide film (aluminum oxide or tantalum pentoxide) close to the positive electrode is the dielectric. The cathode is composed of conductive materials, electrolytes (the electrolyte can be liquid or solid) and other materials. Because the electrolyte is the main part of the cathode, the electrolytic capacitor is named after it. At the same time, the positive and negative electrodes of the electrolytic capacitor cannot be connected incorrectly. Aluminum electrolytic capacitors can be divided into four categories: lead-type aluminum electrolytic capacitors; horn-type aluminum electrolytic capacitors; bolt-type aluminum electrolytic capacitors; solid-state aluminum electrolytic capacitors.

[0003] When designing PCB boards, we often encounter the application of electrolytic capacitors. Depending on the specific situation, electrolytic capacitors sometimes need to be installed horizontally on the PCB board, and sometimes not. For example, when the board is tested, electrolytic capacitors can be directly soldered to meet the needs. However, after the test is completed, due to the height limit of the installation, the electrolytic capacitors need to be installed horizontally on the board. However, when installing horizontally, there will be other devices around the electrolytic capacitors, resulting in insufficient space and unable to install horizontally smoothly. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a PCB packaging structure of an electrolytic capacitor that is compatible with both direct insertion and horizontal installation, which can take into account the space requirements of direct insertion and horizontal installation of the electrolytic capacitor and ensure that the electrolytic capacitor can be installed smoothly.

[0005] The technical solution of the utility model is as follows: A PCB packaging structure compatible with direct-insertion and horizontal-mounted electrolytic capacitors, including a first welding area and a second welding area arranged on the circuit board, the orthographic projection of the first welding area and the orthographic projection of the second welding area at least partially overlapping so that the first welding area and the second welding area form a compatible welding area.

[0006] Furthermore, the first welding area is circular in shape, and a first welding pad and a second welding pad are disposed in the first welding area, and the first welding pad and the second welding pad are spaced apart from each other along the Y-axis direction.

[0007] Furthermore, the second welding area is in a strip shape and extends along the X-axis direction.

[0008] Furthermore, the width of the second welding area is equal to the diameter of the first welding area.

[0009] Furthermore, the second welding area includes two oppositely arranged long sides and a short side connected to the two long sides, and the two long sides are tangent to the first welding area respectively.

[0010] Further, the first welding area includes a first region and a second region, the first pad is arranged in the first region, the second pad is arranged in the second region, and a silk screen is arranged in the second region and located at the periphery of the second pad.

[0011] Furthermore, a positive electrode identification line is arranged on the outer side of the first welding area, and the positive electrode identification line is arranged close to the first welding pad.

[0012] Furthermore, the diameters of the first pad and the second pad are both 30 mil.

[0013] Furthermore, the second welding area includes a non-silk-screen printing area and a silk-screen printing area, the silk-screen printing area is provided with silk-screen printing, the non-silk-screen printing area is provided correspondingly to the first area, and the silk-screen printing area is provided correspondingly to the second area.

[0014] The utility model according to the above scheme has the beneficial effect that: a PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation includes a first welding area and a second welding area arranged on a circuit board, and the orthographic projection of the first welding area and the orthographic projection of the second welding area overlap at least in part so that the first welding area and the second welding area form a compatible welding area. This design solves the problem of space conflict when the electrolytic capacitor is converted from direct insertion to horizontal installation in the traditional PCB packaging, so that the electrolytic capacitor can be flexibly installed according to different needs; secondly, the setting of the compatible welding area enables the electrolytic capacitor to switch between direct insertion and horizontal installation, and when performing the upper part test, the direct insertion method can be used for welding to ensure the stability and reliability of the electrolytic capacitor. After the test is completed, when horizontal installation is required due to the height limit of the installation, it is only necessary to bend the electrolytic capacitor so that the electrolytic capacitor is located in the second welding area, and horizontal installation can be achieved without replacing the PCB board or making complex changes. In addition, since the switching between direct insertion and horizontal installation of the electrolytic capacitor can be achieved without replacing the PCB board or making complex changes, the production cycle can be greatly shortened and the production cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1This is one of the structural schematic diagrams of a PCB packaging structure of an electrolytic capacitor that is compatible with direct insertion and horizontal installation in an embodiment of the utility model;

[0017] Figure 2 This is the second structural schematic diagram of a PCB packaging structure of an electrolytic capacitor that is compatible with both direct insertion and horizontal installation in an embodiment of the utility model.

[0018] In the figure, 1, compatible welding area; 11, first welding area; 111, first area; 112, second area; 113, first pad; 114, second pad; 12, second welding area; 121, non-silk screen area; 122, silk screen area; 2, positive electrode identification line;

[0019] D1, diameter of the first pad; D2, diameter of the second pad; W, width of the second welding area; D3, diameter of the first welding area. DETAILED DESCRIPTION

[0020] The following detailed description and drawings of the embodiments of the present invention are used to illustrate the principle of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the embodiments described.

[0021] In order to better understand the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0022] See also Figure 1 As shown, a PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation includes a first welding area 11 and a second welding area 12 arranged on a circuit board, and the orthographic projection of the first welding area 11 and the orthographic projection of the second welding area 12 overlap at least in part so that the first welding area 11 and the second welding area 12 form a compatible welding area 1. This design solves the problem of space conflict when the electrolytic capacitor is converted from direct insertion to horizontal installation in the traditional PCB packaging, so that the electrolytic capacitor can be flexibly installed according to different needs; secondly, the setting of the compatible welding area 1 enables the electrolytic capacitor to switch between direct insertion and horizontal installation. When performing the upper part test, the direct insertion method can be used for welding to ensure the stability and reliability of the electrolytic capacitor. After the test is completed, when horizontal installation is required due to the height limit of the installation, it is only necessary to bend the electrolytic capacitor so that the electrolytic capacitor is located in the second welding area 12, and horizontal installation can be achieved without replacing the PCB board or making complex changes. In addition, since the switching between direct insertion and horizontal installation of the electrolytic capacitor can be achieved without replacing the PCB board or making complex changes, the production cycle can be greatly shortened and the production cost can be reduced.

[0023] Preferably, the first welding area 11 is circular in shape, and a first welding pad 113 and a second welding pad 114 are arranged in the first welding area 11, and the first welding pad 113 and the second welding pad 114 are arranged at intervals along the Y-axis direction; the first welding area 11 includes a first area 111 and a second area 112, the first welding pad 113 is arranged in the first area 111, the second welding pad 114 is arranged in the second area 112, and a silk screen is arranged in the second area 112 and is located outside the second welding pad 114.

[0024] The first welding area 11 is circular, which is convenient for accurate alignment and fixation of the electrolytic capacitor, and improves the accuracy of welding. Secondly, the first welding pad 113 and the second welding pad 114 are arranged in the first welding area 11, and the first welding pad 113 and the second welding pad 114 are arranged at intervals along the Y-axis direction, and the second welding pad 114 is provided with a silk screen on the periphery. This layout mode not only ensures the independence between the first welding pad 113 and the second welding pad 114, but also avoids mutual interference during welding. It also provides enough space for the pins of the electrolytic capacitor and improves welding efficiency. Furthermore, the existence of silk screen can clearly identify the position and size of the pad, provides intuitive guidance for welding operations, and reduces the difficulty of operation and error rate. In addition, silk screen also plays a role in identification, further deepens the identification of the negative area, and avoids the problem of incorrect placement of positive and negative electrodes of the electrolytic capacitor when it is directly inserted.

[0025] Preferably, the second welding area 12 is in a strip shape and extends along the X-axis direction. Specifically, the width W of the second welding area 12 is equal to the diameter D3 of the first welding area 11 .

[0026] Preferably, the second welding area 12 includes two oppositely disposed long sides and a short side connected to the two long sides, and the two long sides are tangent to the first welding area 11 respectively.

[0027] The structure of the electrolytic capacitor determines that its positive and negative electrodes have different characteristics. The positive electrode is usually made of materials such as metal oxides and has a higher potential; while the negative electrode is composed of electrolyte and carbon materials and has a lower potential. This structural difference makes the positive and negative electrodes play different roles in the circuit and jointly maintain the normal operation of the electrolytic capacitor. Secondly, the working principle of the electrolytic capacitor also depends on the correct connection of its positive and negative electrodes. In the circuit, the electrolytic capacitor balances the voltage fluctuation by storing and releasing charges. When the positive and negative electrodes are correctly connected, the electrolytic capacitor can charge and discharge normally and play a role in stabilizing the circuit. However, if the positive and negative electrodes of the electrolytic capacitor are connected in reverse, the current may increase abnormally, resulting in a short circuit, which will not only damage the electrolytic capacitor itself, but also affect the normal operation of other components in the circuit. Secondly, it is easy to cause abnormal internal pressure of the electrolytic capacitor, thereby causing the risk of electrolyte leakage, which will not only affect the performance of the electrolytic capacitor, but also may cause damage to other components in the circuit. In extreme cases, if the internal pressure of the electrolytic capacitor is too large or the temperature is too high, it may explode, posing a serious threat to equipment and personnel.

[0028] Therefore, in this embodiment, a positive electrode identification line 2 is provided outside the first welding area 11, and the positive electrode identification line 2 is provided close to the first welding pad 113. This design not only enhances the positive electrode identification of the first welding area 11, but also enables the electrolytic capacitor to quickly and accurately identify the position of the positive electrode when inserting and placing, thereby avoiding the problem of errors in the positive and negative electrodes of the electrolytic capacitor when inserting.

[0029] Preferably, the diameter D1 of the first pad 113 and the diameter D2 of the second pad 114 are both 30mil. Designed in this way, the welding area of ​​the first pad 113 and the electrolytic capacitor and the welding area of ​​the second pad 114 and the electrolytic capacitor are increased, thereby enhancing the firmness and stability of welding. When the electrolytic capacitor is installed horizontally, the connection between the first pad 113, the second pad 114 and the electrolytic capacitor needs to withstand a certain bending force, and the diameter D1 of the first pad 113 and the diameter D2 of the second pad 114 are equal, and are both 30mil, which can better disperse these forces, reduce the stress concentration of the welding point, thereby improving the reliability of welding. In addition, designed in this way, the electrolytic capacitor is bent more firmly when installed horizontally, and when the electrolytic capacitor is installed horizontally, its pins need to bend to adapt to the layout of the circuit board, if the welding area is insufficient, it may cause the connection between the electrolytic capacitor and the PCB board to be not firm, and the pins may be loose or fall off during bending, affecting the use of the electrolytic capacitor.

[0030] Preferably, the second welding area 12 includes a non-silk-screen printing area 121122 and a silk-screen printing area 122 , silk-screen is arranged in the silk-screen printing area 122 , the non-silk-screen printing area 121122 and the first area 111 are arranged correspondingly, and the silk-screen printing area 122 and the second area 112 are arranged correspondingly.

[0031] The indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the application is usually placed when used, or the orientation or position relationship commonly understood by technical personnel in this field, or the orientation or position relationship in which the product of the application is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0032] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0033] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A PCB packaging structure of electrolytic capacitors compatible with direct insertion and horizontal installation, characterized in that: The invention comprises a first welding area (11) and a second welding area (12) arranged on a circuit board, wherein the orthographic projection of the first welding area (11) and the orthographic projection of the second welding area (12) at least partially overlap so that the first welding area (11) and the second welding area (12) form a compatible welding area (1).

2. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 1, characterized in that: The first welding area (11) is circular in shape, and a first welding pad (113) and a second welding pad (114) are arranged in the first welding area (11), and the first welding pad (113) and the second welding pad (114) are arranged at intervals along the Y-axis direction.

3. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 1, characterized in that: The second welding area (12) is in the shape of an elongated strip and the second welding area (12) is extended along the X-axis direction.

4. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 1, characterized in that: The width of the second welding area (12) is equal to the diameter of the first welding area (11).

5. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 1, characterized in that: The second welding area (12) comprises two oppositely arranged long sides and a short side connected to the two long sides, and the two long sides are respectively tangent to the first welding area (11).

6. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 2, characterized in that: The first welding area (11) comprises a first region (111) and a second region (112), the first solder pad (113) is arranged in the first region (111), the second solder pad (114) is arranged in the second region (112), and a silk screen is arranged in the second region (112) and is located outside the second solder pad (114).

7. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 6, characterized in that: A positive electrode identification line (2) is arranged outside the first welding area (11), and the positive electrode identification line (2) is arranged close to the first welding pad (113).

8. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 6, characterized in that: The diameter of the first pad (113) and the diameter of the second pad (114) are both 30 mil.

9. A PCB packaging structure of an electrolytic capacitor compatible with direct insertion and horizontal installation as claimed in claim 6, characterized in that: The second welding area (12) comprises a non-silk-screen printing area (121122) and a silk-screen printing area (122), the silk-screen printing area (122) is provided with silk-screen printing, the non-silk-screen printing area (121122) and the first area (111) are provided correspondingly, and the silk-screen printing area (122) and the second area (112) are provided correspondingly.

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