Heat dissipation mechanism capable of conducting heat in grading mode

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to a graded heat conduction heat dissipation mechanism. The heat dissipation mechanism comprises a heat absorption assembly, a heat dissipation module and a heat pipe module, the heat pipe module is arranged between the heat absorption assembly and the heat dissipation module, the heat dissipation module comprises a plurality of first heat dissipation assemblies and a plurality of second heat dissipation assemblies, the first heat dissipation assemblies are sequentially arranged in the first direction, and at least one side of each first heat dissipation assembly is provided with a containing groove in the first direction; the heat pipe module is partially arranged in the containing groove, the second heat dissipation assemblies are arranged at the end, away from the heat absorption assembly, of the first heat dissipation assembly, the multiple second heat dissipation assemblies are arranged at intervals in the first direction, the first heat dissipation assembly conducts first-stage heat dissipation, and the extrusion continuity of the second heat dissipation assemblies is achieved at the non-heat-conduction position of the far end of the heat pipe module. The heat conduction effect of the material of the second heat dissipation assembly is utilized for secondary heat conduction and dissipation, graded heat conduction is achieved, the whole heat dissipation area of the heat dissipation module is fully utilized, and the heat dissipation efficiency of the heat dissipation module is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation mechanism with graded heat conduction. Background Art

[0002] At present, heat dissipation mechanisms with graded heat conduction are widely used in heat-generating parts such as lamps and heat-generating electronic components to ensure that these heat-generating parts can work stably at a suitable temperature.

[0003] Commonly used heat dissipation mechanisms with graded heat conduction include a heat absorbing component, a heat pipe module and a heat dissipation module. The heating element is arranged on the heat absorbing component, the heat pipe module is connected to the heat absorbing component and absorbs heat from the heat absorbing component, and the heat dissipation module is arranged on the heat pipe module and dissipates heat for the heat pipe module.

[0004] However, in the prior art, when the heat generated by the heating element is large, the heat conduction distance of the heat pipe module increases accordingly. Since a 2mm-15mm long seal is set at the far end of the heat pipe module, and the heat conduction efficiency of the seal of the heat pipe module is very low due to process limitations, or it is equivalent to losing the heat conduction efficiency, so that the heat dissipation module in contact with this part of the heat pipe cannot participate in the heat dissipation, resulting in a decrease in the heat dissipation efficiency of the heat dissipation module.

[0005] In order to solve the above problems, it is urgent to provide a heat dissipation mechanism with graded heat conduction to solve the problem that the heat dissipation module corresponding to the sealing part of the heat pipe module cannot participate in the heat dissipation, resulting in reduced heat dissipation efficiency of the heat dissipation module. Utility Model Content

[0006] The utility model aims to provide a heat dissipation mechanism with graded heat conduction, in which the first heat dissipation component plays a primary heat dissipation role, and utilizes the continuity of the extrusion of the second heat dissipation component to realize secondary heat dissipation by utilizing the heat conduction effect of the material of the second heat dissipation component itself at the non-heat-conducting position at the far end of the heat pipe module, thereby realizing graded heat conduction of the first heat dissipation component and the second heat dissipation component, making full use of the entire heat dissipation area of ​​the heat dissipation module, and being beneficial to improving the heat dissipation efficiency of the heat dissipation module.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] A heat dissipation mechanism with graded heat conduction, comprising a heat absorption component, a heat dissipation module and a heat pipe module, wherein the heat absorption component is configured as a fixed heat source, the heat pipe module is arranged between the heat absorption component and the heat dissipation module, and the heat dissipation module comprises:

[0009] A plurality of first heat dissipation components, wherein the plurality of first heat dissipation components are sequentially arranged along a first direction, a receiving groove is arranged on at least one side of the first heat dissipation component along the first direction, and a part of the heat pipe module is arranged in the receiving groove; and

[0010] A plurality of second heat dissipation components are provided at one end of the first heat dissipation component away from the heat absorption component, and a plurality of the second heat dissipation components are spaced apart along the first direction, and the second heat dissipation components are extruded.

[0011] As an optional solution, the first heat dissipation component is extruded, or the first heat dissipation component includes a plurality of heat dissipation elements, and the plurality of heat dissipation elements are stacked and riveted together along the second direction.

[0012] As an optional solution, along the third direction, V-shaped grooves are provided on both sides of the first heat dissipation component, and in the third direction, the width of the V-shaped grooves gradually decreases along the direction approaching the center of the first heat dissipation component.

[0013] As an optional solution, along the third direction, there are a plurality of the accommodating grooves, and the plurality of the accommodating grooves are arranged at intervals.

[0014] As an optional solution, the heat pipe module includes a plurality of heat pipe assemblies, the heat pipe assemblies include a plurality of first heat pipes in a U-shaped structure, and the first heat pipes include:

[0015] a heat absorbing portion extending along a third direction and arranged on the heat absorbing assembly, wherein a plurality of the heat absorbing portions of each group of the heat pipe assemblies are arranged in contact with each other along the first direction; and

[0016] The heat conducting part is connected to the heat absorbing part in a U-shape, the heat conducting part extends along the second direction, and the heat conducting part is located in the accommodating groove, and the multiple heat conducting parts of each group of the heat pipe assemblies are arranged on the same plane.

[0017] As an optional solution, the heat conducting part includes at least one extension tube, and when the number of the extension tubes is greater than two, two adjacent extension tubes are spliced ​​end to end along the second direction, and the extension tube away from the heat absorption component can at least partially abut against the side wall of the second heat dissipation component.

[0018] As an optional solution, the heat pipe assembly further includes:

[0019] A plurality of second heat pipes are arranged in parallel and in contact with each other along a third direction in the middle of the first heat pipe of a U-shaped structure, the second heat pipe is an L-shaped structure, a portion of the second heat pipe extends along the first direction and is arranged on the heat absorption component, and a portion of the second heat pipe extends along the second direction and is arranged coplanar with the heat conducting portion.

[0020] As an optional solution, the heat pipe assembly further includes:

[0021] The third heat pipe is a U-shaped structure, and the third heat pipe is arranged coplanar with the heat conducting part. The opening direction of the third heat pipe of the U-shaped structure is opposite to the opening direction of the first heat pipe, so that the bottom of the third heat pipe abuts against the distal ends of the plurality of heat conducting parts.

[0022] As an optional solution, the graded heat conduction heat dissipation mechanism further includes:

[0023] A fan is arranged on one side or both sides of the heat dissipation module along the third direction.

[0024] As an optional solution, a mounting portion is provided on the fan, and a plurality of avoidance spaces are provided on the heat dissipation module, and the avoidance spaces are configured to avoid the position of the mounting portion of the fan.

[0025] The beneficial effects of the utility model are:

[0026] The utility model provides a heat dissipation mechanism with graded heat conduction, which comprises a heat absorption component, a heat dissipation module and a heat pipe module, wherein the heat absorption component is configured as a fixed heat source, the heat pipe module is arranged between the heat absorption component and the heat dissipation module, the heat dissipation module comprises a plurality of first heat dissipation components and a plurality of second heat dissipation components, the plurality of first heat dissipation components are arranged in sequence along a first direction, a first heat dissipation component is provided with a receiving groove on at least one side along the first direction, a part of the heat pipe module is arranged in the receiving groove, the second heat dissipation component is arranged at one end of the first heat dissipation component away from the heat absorption component, and a plurality of second heat dissipation components are arranged at intervals along the first direction, and the second heat dissipation component is extruded. The heat dissipation module utilizes the continuity of the extrusion of the second heat dissipation component, and utilizes the heat conduction effect of the material of the second heat dissipation component itself to realize heat conduction at the non-heat-conducting position at the far end of the heat pipe module, thereby making full use of the entire heat dissipation area of ​​the heat dissipation module, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0028] Figure 1 It is a structural schematic diagram of a heat dissipation mechanism with graded heat conduction provided in an embodiment of the utility model;

[0029] Figure 2 It is a structural schematic diagram of a second heat dissipation assembly provided in an embodiment of the utility model;

[0030] Figure 3It is a structural schematic diagram of a first heat dissipation assembly provided in an embodiment of the utility model;

[0031] Figure 4 It is a structural schematic diagram of a heat pipe module provided by an embodiment of the utility model.

[0032] The following are marked in the figure:

[0033] 100-heat absorbing component;

[0034] 200-heat dissipation module; 210-first heat dissipation assembly; 211-accommodation groove; 212-heat dissipation element; 2121-side plate; 2122-second fin; 213-V-shaped groove; 220-second heat dissipation assembly; 221-bottom plate; 222-first fin; 230-avoidance space;

[0035] 300 - heat pipe module; 310 - heat pipe assembly; 311 - first heat pipe; 3111 - heat absorption part; 3112 - heat conduction part; 3112a - extension pipe; 312 - second heat pipe; 313 - third heat pipe; 314 - fourth heat pipe. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only partial structures related to the present invention are shown in the accompanying drawings, rather than the entire structure.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the connection of the internal structures of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] like Figure 1 As shown, this embodiment provides a heat dissipation mechanism with graded heat conduction, which includes a heat absorption component 100, and heat-generating lamps, heat-generating electronic components and other heat-generating components are arranged on the heat absorption component 100. On the one hand, the heat absorption component 100 is used to fix the heat-generating component, and on the other hand, the heat absorption component 100 can absorb and conduct the heat generated by the operation of the heat-generating component. Specifically, the heat absorption component 100 can be made of any material with high thermal conductivity, so as to ensure the efficiency of the heat absorption component 100 in absorbing heat from the heat-generating component.

[0041] Please continue to see Figure 1 The heat dissipation mechanism of graded heat conduction also includes a heat pipe module 300 and a heat dissipation module 200. The heat pipe module 300 is arranged between the heat absorption component 100 and the heat dissipation module 200. The heat pipe module 300 acts as a bridge for heat conduction between the heat absorption component 100 and the heat dissipation component. The heat pipe module 300 can conduct the heat absorbed by the heat absorption component 100 from the heating element to the far end, and the heat dissipation module 200 dissipates the heat of the heat pipe module 300.

[0042] Since a seal of 2mm-15mm in length is provided at the far end of the heat pipe module 300, and the seal of the heat pipe module 300 has very low heat conduction efficiency due to process limitations, or is equivalent to losing heat conduction efficiency, the heat dissipation module 200 in contact with this part of the heat pipe cannot participate in heat dissipation, resulting in reduced heat dissipation efficiency of the heat dissipation module 200. In order to solve the above problems, the heat dissipation module 200 in this embodiment includes a plurality of first heat dissipation components 210 and a plurality of second heat dissipation components 220, the plurality of first heat dissipation components 210 are arranged in sequence along the X direction (first direction), the first heat dissipation components 210 are provided with a receiving groove 211 on at least one side along the X direction, the heat pipe module 300 is partially arranged in the receiving groove 211, the second heat dissipation component 220 is arranged at one end of the first heat dissipation component 210 away from the heat absorption component 100, and the plurality of second heat dissipation components 220 are arranged at intervals along the X direction, and the second heat dissipation components 220 are extruded. The first heat dissipation component 210 of the heat dissipation module 200 plays a primary heat dissipation role. At the same time, the continuity of the extrusion of the second heat dissipation component 220 is utilized. At the non-heat-conducting position at the far end of the heat pipe module 300, the thermal conductivity of the material of the second heat dissipation component 220 itself is utilized to perform secondary heat conduction heat dissipation, thereby realizing graded heat conduction of the first heat dissipation component 210 and the second heat dissipation component 220, making full use of the entire heat dissipation area of ​​the heat dissipation module 200, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module 200.

[0043] For further information, see Figure 1 and Figure 2 , the second heat dissipation component 220 includes a base plate 221 and a plurality of first fins 222, the plurality of first fins 222 extend along the Y direction (third direction), and the plurality of first fins 222 are arranged parallel and spaced on the base plate 221 along the Z direction (second direction). Here, the second heat dissipation component 220 can be composed of a group of base plates 221 and a plurality of first fins 222, or two groups of base plates 221 and first fins 222 are relatively arranged and assembled to form the second heat dissipation component 220. Exemplarily, the thickness of the second fin 2122 is greater than 0.5 mm, and the thickness of the base plate 221 is greater than 1 mm, so as to ensure the structural strength of the second heat dissipation component 220. At the same time, both sides of the second heat dissipation component 220 along the X direction can be abutted against the heat pipe module 300 to increase the heat conduction area and improve the heat conduction efficiency. In this embodiment, the first direction, the second direction and the third direction are only used as one of the examples to illustrate the relative position of the structure. The first direction, the second direction and the third direction are perpendicular to each other.

[0044] In the above examples, see Figure 1 and Figure 3The first heat dissipation component 210 includes a plurality of heat dissipation elements 212, and the plurality of heat dissipation elements 212 are stacked and riveted together along the Z direction. At this time, the first heat dissipation component 210 is in partial contact with the heat pipe module 300 for normal heat conduction, thereby dissipating heat for the heat pipe module 300. At this time, the overall wall thickness of the heat dissipation element 212 can be less than 0.4 mm, which is conducive to achieving lightweight of the heat dissipation module 200 and reducing the overall weight of the heat dissipation mechanism with graded heat conduction. Specifically, the heat dissipation element 212 is formed by stamping fins, and then a plurality of heat dissipation fins are riveted together in multiple layers, which has high molding efficiency, and the first heat dissipation component 210 formed in this way can be directly processed to form the accommodating groove 211 structure.

[0045] Furthermore, the heat sink 212 includes a side plate 2121 and a second fin 2122, the side plate 2121 and the second fin 2122 extend along the Y direction, and the side plate 2121 is arranged on both sides of the second fin 2122 along the X direction. When the multi-layer heat sink is stacked and riveted to form, the side plate 2121 of one of the two adjacent heat sinks is riveted to the end surface of the second fin 2122 of the other heat sink. At this time, although there is a gap between the two adjacent heat sinks 212, since the side plate 2121 can contact with the heat pipe module 300 for heat conduction, the gap has little effect on the heat dissipation efficiency of the first heat dissipation assembly 210. In this structure, the heat sink also includes at least two protrusions 2123 at the position corresponding to the accommodating groove 211, and at least two protrusions 2123 are arranged on the side plate 2121 along the Y direction, so that a gap is retained between the two adjacent protrusions 2123. When the plurality of heat sinks are stacked and riveted together, the protrusions 2123 of the plurality of heat sinks extend along the Z direction, thereby forming a receiving groove 211 between two adjacent protrusions 2123 .

[0046] In another embodiment, the first heat dissipation component 210 may be formed by extrusion, and the structures of the first heat dissipation component 210 and the second heat dissipation component 220 may be arranged in the same manner. At this time, the structure of the receiving groove 211 of the first heat dissipation component 210 is processed by secondary molding.

[0047] like Figure 3 As shown, along the Y direction, there are a plurality of accommodating grooves 211 , and the plurality of accommodating grooves 211 are arranged at intervals to provide a plurality of accommodating spaces for the heat pipe module 300 .

[0048] Along the Y direction, V-shaped grooves 213 are provided on both sides of the first heat dissipation component 210, and in the Y direction, along the direction close to the center of the first heat dissipation component 210, the width of the V-shaped grooves 213 gradually decreases, so that the V-shaped grooves 213 are used to reduce the wind resistance from both sides of the heat dissipation module 200, which is beneficial to increase the wind speed flowing through the gap between the first fins 222 and the second fins 2122 of the heat dissipation module 200, thereby improving the heat dissipation performance of the graded heat conduction heat dissipation mechanism.

[0049] See also Figure 1 and Figure 4 The heat pipe module 300 includes a plurality of heat pipe assemblies 310, and the heat pipe assemblies 310 include a plurality of first heat pipes 311 in a U-shaped structure. The first heat pipes 311 include a heat absorbing portion 3111 and a heat conducting portion 3112. The heat absorbing portion 3111 extends along the Y direction and is arranged on the heat absorbing assembly 100. The plurality of heat absorbing portions 3111 of each heat pipe assembly 310 are arranged in contact with each other along the X direction. The heat conducting portion 3112 is connected to the heat absorbing portion 3111 in a U-shaped manner. The heat conducting portion 3112 extends along the Z direction, and the heat conducting portion 3112 is located in the receiving groove 211, thereby forming a heat conduction process in which the heat absorbing portion 3111 absorbs heat from the heat absorbing module, and then uses the heat conducting portion 3112 to conduct the heat to the heat dissipation module 200. At the same time, the multiple heat-conducting parts 3112 of each heat pipe assembly 310 are arranged on the same plane to ensure that the multiple heat-conducting parts 3112 of each heat pipe assembly 310 can contact the side of the heat dissipation module 200 for heat conduction, which is beneficial to improve the heat conduction efficiency.

[0050] Since the heat dissipation component has a large size in the Z direction and a large heat dissipation area, the conventional heat conduction part 3112 is affected by gravity, and the temperature difference between the distal end and the proximal end of the heat conduction part 3112 is large, which reduces the heat conduction power. In order to avoid this problem, the heat conduction part 3112 includes at least one extension tube 3112a, and when the number of extension tubes 3112a is greater than two, two adjacent extension tubes 3112a are spliced ​​end to end along the Z direction, and the extension tube 3112a away from the heat absorption component 100 can at least partially abut against the side wall of the second heat dissipation component 220, so that the temperature difference between the distal end and the proximal end of the heat conduction part 3112 is reduced by using the end-to-end spliced ​​extension tubes 3112a, which is conducive to ensuring the anti-gravity heat conduction power of the heat conduction part 3112.

[0051] Furthermore, a heat-conducting portion 3112 including one extension tube 3112a and a heat-conducting portion 3112 including multiple extension tubes 3112a are alternately arranged, and the heat pipe assembly 310 also includes a fourth heat pipe 314. The fourth heat pipe 314 is a linear structure. The fourth heat pipe 314 is selectively arranged on one side of the heat-conducting portion 3112 including one extension tube 3112a, and the fourth heat pipe 314 and the heat-conducting portion 3112 are arranged coplanarly, so that the length of the fourth heat pipe 314 is utilized to conduct heat and dissipate heat for the heat-conducting portion 3112 including only one extension tube 3112a, thereby compensating for the thermal conductivity of the heat-conducting portion 3112 with only one extension tube 3112a being affected by gravity.

[0052] Optionally, the heat pipe assembly 310 further includes a plurality of second heat pipes 312, which are parallel and in contact with each other along the Y direction. The second heat pipe 312 is arranged in the middle of the first heat pipe 311 of the U-shaped structure. The second heat pipe 312 is an L-shaped structure. Part of the second heat pipe 312 extends along the X direction and is arranged on the heat absorption assembly 100. Part of the second heat pipe 312 extends along the Z direction and is arranged coplanar with the heat conducting portion 3112. The heat pipe assembly 310 uses the second heat pipe 312 to compensate for the thermal conductivity of the middle position of the first heat pipe 311 of the U-shaped structure, so that the side wall area of ​​the heat dissipation module 200 can be fully in contact with the first heat pipe 311 or the second heat pipe 312, increasing the contact area between the heat pipe module 300 and the heat dissipation module 200, thereby improving the heat dissipation performance of the heat dissipation mechanism of graded heat conduction.

[0053] Furthermore, the two groups of second heat pipes 312 of two adjacent groups of heat pipe assemblies 310 can be arranged facing each other. At this time, the two adjacent groups of second heat pipes 312 can be arranged alternately on the heat absorption component 100, which is beneficial to simplify the number of second heat pipes 312 and improve the heat equalization effect between adjacent heat pipe modules 300 and heat dissipation modules 200.

[0054] The heat pipe assembly 310 further includes a third heat pipe 313, which is a U-shaped structure, and the third heat pipe 313 is arranged coplanar with the heat conducting portion 3112. The opening direction of the U-shaped third heat pipe 313 is opposite to the opening direction of the first heat pipe 311, so that the bottom of the third heat pipe 313 abuts against the distal ends of the plurality of heat conducting portions 3112. The third heat pipe 313 can conduct heat at the distal end of the first heat pipe 311, so that the plurality of first heat pipes 311, the second heat pipe 312 and the third heat pipe 313 form a heat conducting whole, reduce the temperature difference between the distal end and the proximal end, and ensure the anti-gravity heat conducting power.

[0055] As an optional solution, the graded thermal conductive heat dissipation mechanism also includes a fan (not shown in the figure), which is arranged on one side or both sides of the heat dissipation module 200 along the Y direction, so as to increase the air flow speed in the gap between the first fin 222 and the second fin 2122, thereby improving the heat dissipation efficiency of the graded thermal conductive heat dissipation mechanism.

[0056] The fan is provided with a mounting portion, which is used to fix the fan, resulting in a large windproof area at the mounting portion. Under the shielding of the mounting portion, the internal heat dissipation effect of the heat dissipation module 200 corresponding to the position is weakened. In order to avoid this problem, the heat dissipation module 200 is provided with a plurality of avoidance spaces 230, which are used to avoid the mounting portion of the fan.

[0057] Furthermore, at least one fan is arranged on either side of the heat dissipation module 200 along the Y direction. When more than two fans are arranged on one side, an avoidance space 230 may be arranged on the heat dissipation module 200 at a position corresponding to the mounting portion between two adjacent fans.

[0058] Note that the above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected, and the scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation mechanism with graded heat conduction, characterized in that: The invention comprises a heat absorbing component (100), a heat dissipation module (200) and a heat pipe module (300), wherein the heat absorbing component (100) is configured as a fixed heat source, the heat pipe module (300) is arranged between the heat absorbing component (100) and the heat dissipation module (200), and the heat dissipation module (200) comprises: a plurality of first heat dissipation components (210), the plurality of first heat dissipation components (210) being arranged in sequence along a first direction, a receiving groove (211) being arranged on at least one side of the first heat dissipation component (210) along the first direction, and a part of the heat pipe module (300) being arranged in the receiving groove (211); and A plurality of second heat dissipation components (220), wherein the second heat dissipation components (220) are arranged at one end of the first heat dissipation component (210) away from the heat absorption component (100), and the plurality of second heat dissipation components (220) are arranged at intervals along the first direction, and the second heat dissipation components (220) are extruded.

2. The heat dissipation mechanism with graded heat conduction according to claim 1, characterized in that: The first heat dissipation component (210) is extruded, or the first heat dissipation component (210) comprises a plurality of heat dissipation elements (212), and the plurality of heat dissipation elements (212) are stacked and riveted together along the second direction.

3. The heat dissipation mechanism with graded heat conduction according to claim 1, characterized in that: Along the third direction, V-shaped grooves (213) are provided on both sides of the first heat dissipation component (210), and in the third direction, along a direction approaching the center of the first heat dissipation component (210), the width of the V-shaped grooves (213) gradually decreases.

4. The heat dissipation mechanism with graded heat conduction according to claim 1, characterized in that: Along the third direction, there are a plurality of the containing grooves (211), and the plurality of the containing grooves (211) are arranged at intervals.

5. The heat dissipation mechanism with graded heat conduction according to claim 1, characterized in that: The heat pipe module (300) comprises a plurality of heat pipe assemblies (310), wherein the heat pipe assemblies (310) comprise a plurality of first heat pipes (311) in a U-shaped structure, wherein the first heat pipes (311) comprise: a heat absorbing portion (3111) extending along a third direction and arranged on the heat absorbing assembly (100), wherein the plurality of heat absorbing portions (3111) of each group of the heat pipe assemblies (310) are arranged in contact with each other along the first direction; and The heat conducting portion (3112) is connected to the heat absorbing portion (3111) in a U-shape, the heat conducting portion (3112) extends along the second direction, and the heat conducting portion (3112) is located in the accommodating groove (211), and the multiple heat conducting portions (3112) of each group of the heat pipe assemblies (310) are arranged on the same plane.

6. The heat dissipation mechanism with graded heat conduction according to claim 5, characterized in that: The heat conducting portion (3112) includes at least one extension tube (3112a), and when the number of the extension tubes (3112a) is greater than two, two adjacent extension tubes (3112a) are spliced ​​end to end along the second direction, and the extension tube (3112a) away from the heat absorption component (100) is at least partially capable of abutting against the side wall of the second heat dissipation component (220).

7. The heat dissipation mechanism with graded heat conduction according to claim 5, characterized in that: The heat pipe assembly (310) further comprises: A plurality of second heat pipes (312), wherein the plurality of second heat pipes (312) are arranged in parallel and in contact with each other along a third direction in the middle of a first heat pipe (311) of a U-shaped structure, the second heat pipe (312) is an L-shaped structure, a portion of the second heat pipe (312) extends along the first direction and is arranged on the heat absorption component (100), and a portion of the second heat pipe (312) extends along the second direction and is arranged coplanar with the heat conducting portion (3112).

8. The heat dissipation mechanism with graded heat conduction according to claim 5, characterized in that: The heat pipe assembly (310) further comprises: A third heat pipe (313), the third heat pipe (313) is a U-shaped structure, and the third heat pipe (313) and the heat conducting part (3112) are arranged on the same plane, the opening direction of the third heat pipe (313) of the U-shaped structure is opposite to the opening direction of the first heat pipe (311), so that the bottom of the third heat pipe (313) abuts against the distal ends of the plurality of heat conducting parts (3112).

9. The heat dissipation mechanism with graded heat conduction according to any one of claims 1 to 8, characterized in that: The graded heat conduction heat dissipation mechanism also includes: A fan is arranged on one side or both sides of the heat dissipation module (200) along a third direction.

10. The heat dissipation mechanism with graded heat conduction according to claim 9, characterized in that: The fan is provided with a mounting portion, and the heat dissipation module (200) is provided with a plurality of avoidance spaces (230), wherein the avoidance spaces (230) are configured to avoid the position of the mounting portion of the fan.

Images