Silicon wafer demolding mechanism and production equipment

Abstract

The silicon wafer demolding mechanism and production equipment are at least provided with a demolding assembly, the demolding assembly comprises at least one group of rubber mat layers which are arranged in an aligned manner, and a jacking plate is arranged below the rubber mat layers; a cavity used for placing a silicon wafer group is arranged between the rubber cushion layer and the top supporting plate in a surrounding mode. Controlling the silicon chip group with the plastic packaging film to enable the plastic film end of the silicon chip group to be inserted into the cavity, enabling the rubber cushion layer to be in contact with the plastic packaging film and enabling the plastic packaging film to be fixed through friction force between the rubber cushion layer and the plastic packaging film; the jacking plate abuts against the side vertical face of the lower end of the silicon wafer group to move upwards, so that the silicon wafer group can be separated from the plastic packaging film. According to the silicon wafer demolding mechanism, the plastic film wrapping the silicon wafer can be rapidly and accurately demolded, the stacking consistency of the silicon wafer before and after demolding can be kept, and the silicon wafer demolding mechanism is simple in overall structure, accurate in matching, high in demolding efficiency and high in stability.

Description

Technical Field

[0001] The present application belongs to the technical field of silicon wafer unpacking, and in particular, relates to a silicon wafer demolding mechanism and production equipment provided with the demolding mechanism. Background Art

[0002] There are two types of existing silicon wafer packaging films. One is a fully wrapped packaging, which wraps all the silicon wafers and sets the film opening on a plane on one side; the other is a semi-wrapped packaging, which means that the silicon wafers are wrapped into a U-shaped packaging film with only a small portion of the top exposed. For the fully wrapped film removal mechanism, a horizontally placed friction block is mainly used. The silicon wafer group with the packaging film is placed on the friction block with the film opening facing downward in contact with the friction block. The friction block is then shaken to rub the plastic film to loosen the film opening, and then the film is manually removed. This method is not only slow, but also requires manual assistance in film removal. In addition, this method is not suitable for the removal of semi-wrapped packaging films, which can easily scratch the unwrapped silicon wafers and cannot guarantee the surface quality of the silicon wafers. Summary of the invention

[0003] The present application provides a silicon wafer demolding mechanism and a production device equipped with the demolding mechanism, which is particularly suitable for automatic demolding of semi-wrapped thin film silicon wafers, solving the technical problems that existing demolding mechanisms cannot automatically demold the film and are extremely likely to damage the surface quality of the silicon wafer.

[0004] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0005] A silicon wafer demolding mechanism is provided with at least a demolding component, wherein:

[0006] The demoulding assembly comprises at least one set of rubber pad layers arranged in opposite positions, and a top supporting plate is arranged below the rubber pad layers;

[0007] A cavity for placing a silicon wafer group is enclosed between the rubber pad layer and the top supporting plate;

[0008] The silicon wafer group with plastic film is controlled so that the plastic film end is inserted into the cavity, the rubber pad layer contacts the plastic film and keeps the plastic film immobile through the friction between it and the plastic film; the top support plate pushes against the lower side elevation of the silicon wafer group and moves up to separate the silicon wafer group from the plastic film.

[0009] Furthermore, the demolding assembly is provided with two groups of the rubber cushion layers arranged side by side, the two groups of the rubber cushion layers are equipped with a common top supporting plate, and the adjacent cavities are interconnected.

[0010] Furthermore, the film stripping assembly further comprises a film stripping frame, which is constructed in a "J"-shaped structure, and an opening is provided in the middle of the top thereof for the silicon wafer group to pass through;

[0011] The rubber pad layer is arranged on the inner side of the film stripping frame through a pair of clamping plates, and the pair of clamping plates are arranged side by side along the length direction of the film stripping frame;

[0012] The pair of clamping plates passes through the open opening and is partially protruded above the film stripping frame.

[0013] Furthermore, a fixing plate for fixing the position of the clamping plates is provided on a side of the clamping plates away from the rubber pad layer, and the fixing plate is connected to the clamping plates via a connecting rod.

[0014] Furthermore, a gap is provided between the clamping plates and the fixing plates, and an elastic member is sleeved on the connecting rod;

[0015] The elastic member is disposed between the clamping plates and the fixing plates, and is connected to the clamping plates and the fixing plates respectively.

[0016] Furthermore, the top supporting plate is arranged below the pair of clamping plates and in the middle between the pair of clamping plates, and is driven to move vertically up and down by a movable connecting rod laterally fixed on the stripping frame;

[0017] A lifting motor for driving the movable connecting rod to move up and down is provided at the lower section of the film stripping frame, and the movable connecting rod is connected to the lower end surface of the lifting plate;

[0018] A top rod for supporting the lateral width of the film stripping frame is also provided on the inner side of the film stripping frame.

[0019] Furthermore, a group of opposing sensors are provided at both ends of the length of the top of the stripping frame to monitor whether the silicon wafer group is inserted into the cavity;

[0020] A baffle bar inclined toward one side of the silicon wafer group is also provided on the inner side of the sensor, and a gap is arranged between the upper end of the baffle bar and the outer wall surface of the silicon wafer group.

[0021] Furthermore, a detection component is provided on the outside of the film stripping component, including:

[0022] A shell frame having a penetration hole therein;

[0023] A camera, located directly below the penetration hole, is fixed to the support rod;

[0024] When the silicon wafer group is suspended and placed above the housing, the camera can emit a light beam through the penetration hole toward the lower surface of the silicon wafer group to take a picture to detect whether the outer side of the silicon wafer group is wrapped with a plastic film.

[0025] Furthermore, a light strip is disposed on the upper end surface of the housing frame. The light strips are disposed along the length direction of the housing frame and are placed on both sides of the through hole.

[0026] A production device adopts the film stripping mechanism as described above.

[0027] The silicon wafer demolding mechanism designed by the present application can quickly and accurately demold the plastic film wrapped around the silicon wafer, and can maintain the consistency of the stacking of the silicon wafer before and after demolding. The overall structure is simple, the coordination is precise, the demolding efficiency is high and the stability is strong. The present application also proposes a production device equipped with the demolding mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a three-dimensional diagram of the film stripping mechanism in the present application;

[0029] Figure 2 is a side view of the demoulding mechanism in the present application;

[0030] Figure 3 is a top view of the demolding mechanism in the present application;

[0031] Figure 4 It is a front view of the demolding assembly in this application.

[0032] In the figure:

[0033] 100, demolding mechanism 10, detection component 11, camera

[0034] 12. Light strip 13. Frame 14. Through hole

[0035] 20. Demolding assembly 21. Demolding rack 22. Rubber pad layer

[0036] 23. Clamping plate 24. Top support plate 25. Fixing plate

[0037] 26, cavity 27, connecting rod 28, sensor

[0038] 29. Baffle bar 210, movable connecting rod 211, jacking motor DETAILED DESCRIPTION

[0039] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] This embodiment provides a silicon wafer demolding mechanism 100, such as Figure 1 As shown, it includes a detection component 10 for checking whether the silicon wafer group is covered with a plastic film, and a demolding component 20 for demolding the vertical silicon wafer group, wherein the detection component 10 is arranged beside the demolding component 20 and is independently arranged from the demolding component 20.

[0041] like Figure 2As shown, the detection component 10 includes a camera 11 for taking pictures, which is arranged in a shell frame 13 of a "J"-shaped structure and is arranged upward. The two side feet of the shell frame 13 are fixed on the mounting surface, and a through hole 14 is provided in the middle position of the top. The camera 11 is fixed to the bottom of the shell frame 13 through a bracket rod, and is fixedly arranged directly below the through hole 14 in the middle position of the shell frame 13, and its lens is arranged upward and through the through hole. When the silicon wafer group is suspended and placed directly above the shell frame 13, the camera 11 can emit a light beam through the through hole 14 to irradiate the lower bottom surface of the silicon wafer group, so as to take pictures to detect whether the outer side of the silicon wafer group is wrapped with a plastic film. After confirming that there is a plastic film, the plastic films of multiple stacks of silicon wafer groups are removed synchronously through the film stripping component 20.

[0042] Specifically, the detection component 10 can detect two groups of two stacks of silicon wafers arranged side by side at a time. In the present embodiment, only one camera 11 is provided, and the camera 11 and the middle part located at the housing frame 13 can visually inspect the adjacent bottom corners of the two stacks of silicon wafers arranged side by side. When taking pictures, as long as the adjacent bottom corners of the two vertical silicon wafers clamped by the clamping component 16 are placed just above the camera 11 and covered by the upward shooting range of the camera 11, the camera 11 can capture whether they contain plastic film wrapping. Of course, two or more cameras 11 can also be provided to take pictures of the two silicon wafer groups separately, as long as the plastic film on the outer surface of the silicon wafer group can be captured quickly and accurately.

[0043] In order to improve the accuracy of the camera 11 taking pictures, a set of aligned light strips 12 are provided on the top of the housing 13 for supplementary lighting of the camera 11 when taking pictures. The light strips 12 are mounted on the housing 13 by a support frame and span the position of the camera 11, and are arranged along the length direction of the housing 13 and are placed on both sides of the penetration hole 14. During the inspection, two stacks of silicon wafer groups placed vertically are clamped by a manipulator, wherein the manipulator clamping the silicon wafer group is a conventional product and is omitted in the drawings; the wrapped end of the silicon wafer group is arranged close to the camera 11, and its lower end passes through the light beam emitted by the aligned light strip 12 and is placed close to the camera 11, and is suspended and positioned directly above the camera 11. The camera 11 takes pictures and compares the lower bottom surface of the silicon wafer group to determine whether the outer surface of the silicon wafer group is wrapped with a plastic film.

[0044] If the comparison of the photographs shows that the outer surface of the silicon wafer group is not wrapped with plastic film, no film stripping operation is required. If the outer surface of the silicon wafer group is detected to be covered with plastic film, the robot drives the two stacks of silicon wafer groups to be directly transferred to the film stripping assembly 20 for film stripping.

[0045] like Figure 2 , 4As shown, the film stripping assembly 20 includes a film stripping frame 21, two sets of opposed rubber pad layers 22, clamping plates 23 arranged in contact with the rubber pad layers 22, and a top support plate 24, wherein the rubber pad layers 22 are placed on the inner side of the film stripping frame 21 through the clamping plates 23 and are arranged side by side along the length direction of the film stripping frame 21; the clamping plates 23 are indirectly connected to the film stripping frame 21 through the fixing plates 25.

[0046] The top support plate 24 is located below the clamping plate 23, connected to the film stripping frame 21 through a movable connecting rod 27, fixed to the lower end of the film stripping frame 21, and together with the rubber pads on both sides, encloses a cavity 26 for placing the silicon wafer group. The film stripping frame 21 is constructed as a "J"-shaped structure, which can be an integrated structure or a detachable assembly structure, which is not specifically limited here. An open opening is provided in the middle of the top of the film stripping frame 21 for the silicon wafer group to pass through; the clamping plate 23 passes through the open opening and is partially protruded above the film stripping frame 21. The silicon wafer group with plastic film is controlled so that its plastic film end is inserted into the cavity 26, and the rubber pad 22 contacts the plastic film and keeps the plastic film immobile through the friction between it and the plastic film; the top support plate 24 pushes against the lower end side elevation of the silicon wafer group and moves up, so that the silicon wafer group can be separated from the plastic film.

[0047] In this embodiment, the demolding assembly 20 is provided with two sets of rubber pad layers 22 arranged side by side, the two sets of rubber pad layers 22 are equipped with a top support plate 24, and the cavity 26 formed by the two sets of aligned rubber pad layers 22 and the top support plate 24 is a structure that is arranged in communication with each other.

[0048] The clamping plates 23 are arranged vertically across the upper end surface of the stripping frame, that is, a part of the clamping plates 23 is built under the stripping frame, and a part of the clamping plates 23 is protruded above the stripping frame. The clamping plates 23 are arranged side by side with gaps along the length direction of the stripping frame, and the width between each set of clamping plates 23 can accommodate a stack of silicon wafers to be inserted vertically.

[0049] A fixing plate 25 for fixing the position of the fixing plate 23 is provided on the side of the fixing plate 23 away from the rubber pad layer 22. A gap is provided between the fixing plate and the fixing plate 23, and they are connected by a connecting rod 27 perpendicular to the fixing plate 25. An elastic member is sleeved on the connecting rod 27 between the fixing plate 23 and the fixing plate 25; the elastic member is a spring, which is respectively connected to the fixing plate 23 and the fixing plate 25.

[0050] A set of sensors 28 are provided at both ends of the length of the top of the stripping frame 21 and at the midline of its width to monitor whether the silicon wafer group is inserted into the cavity 26. A baffle 29 is provided inside the sensor 28, which is inclined toward one side of the silicon wafer group. That is, the upper end of the baffle 29 is inclined toward one side of the silicon wafer group and there is a certain distance from the silicon wafer group, that is, the upper end of the baffle 29 is configured with a gap from the outer wall of the silicon wafer group to prevent the plastic film from moving up again with the silicon wafer group after stripping. The light beams directed by the sensor 28 are shown as dotted lines in the attached figure.

[0051] The clamping plate 23 on each side is connected to the fixing plate 25 through two connecting rods 27 arranged diagonally, and the elastic member is located between the clamping plate 23 and the fixing plate 25, and one end of the elastic member is embedded in the outer wall surface of the clamping plate 23, and the external hanging end passes through the fixing plate 25 and is fixed to the fixing plate 25 through the fixing ring outside the fixing plate 25, so that the clamping plate 23 and the fixing plate 25 are vertically connected in parallel. The setting of the elastic member can increase the deformation force of the clamping plate 23 along the thickness direction of the silicon wafer group, thereby buffering the contact pressure of the clamping plate 23 on the outer wall surface of the silicon wafer group.

[0052] Furthermore, the clamping plate 23 is a structure made of hard material; the rubber pad layer 22 is a structure made of silicone material, and its size is slightly smaller than the size of the clamping plate 23. The rubber pad layer 22 is mainly arranged on the inner side of the demolding frame 21, and the thickness of the rubber pad layer 22 can be selected to be 3-5mm. The side plane of the rubber pad layer 22 directly contacts the plastic film on the surface of the silicon wafer group, which not only ensures that the quality of the silicon wafer group surface is not affected, but also increases the contact friction between the rubber pad layer and the plastic film during the process of the silicon wafer group being lifted by the top support plate 24, so as to improve the demolding efficiency and quality. At the same time, since sulfur-free paper packaging is also provided on the outer surfaces of both sides of the silicon wafer group, the plastic film is more likely to contact the rubber pad layer and can be quickly separated from the packaging paper of the sulfur-free paper, thereby completing the demolding work of the silicon wafer group.

[0053] The top supporting plate 24 is arranged below the clamping plates 23 and in the middle of the gap between the clamping plates 23. It is driven to move vertically up and down by the movable connecting rod 210 fixed laterally on the film stripping frame 21. A top supporting motor 211 for driving the movable connecting rod 210 to move up and down is provided at the lower section of the film stripping frame 21. The movable connecting rod 210 is directly connected to the lower end surface of the top supporting plate 24. A top rod for supporting the lateral width of the film stripping frame 21 is also provided on the inner side of the film stripping frame 21. The initial position of the top supporting plate 24 is located at its lower limit position. It is driven by the top supporting motor 211 and driven by the movable connecting rod 210, and can move up and down in the vertical direction, thereby driving the silicon wafer group located thereon to move upward, and then the plastic film of the silicon wafer group can be directly contacted with the rubber pad layer 22, and the lower end side elevation of the silicon wafer group can be pushed up to make it rise and separate from the plastic film.

[0054] When stripping, the robot can clamp multiple stacks of silicon wafers at a time and arrange them side by side vertically, and each clamps the end of the silicon wafer that is not wrapped by the plastic film, and the end of the silicon wafer wrapped by the plastic film is suspended downward. The silicon wafer group is controlled to move to the detection component 10 first, and is suspended just above the camera 11, and the silicon wafer group is photographed and compared for the first time to determine whether the silicon wafer group is wrapped with a plastic film. If so, the silicon wafer group is controlled to move to the stripping component 20.

[0055] The silicon wafer group is controlled to move down synchronously and inserted into the cavity 26 surrounded by the clamping plate 23 and the top support plate 24, and the rubber pad layer 22 is directly in contact with the plastic film of the silicon wafer group, and the plastic film is fixed by the friction between the rubber pad layer and the top support plate 24. Since the two sides of the silicon wafer group are clamped by the rubber pad layer 22, and the bottom is supported by the top support plate 24, there will be no shaking or tilting. Then the top support motor 211 controls the top support plate 24 to move up through the movable connecting rod 210 to push against the lower end side elevation of the two stacks of silicon wafer groups, so that the two silicon wafer groups move vertically upward along the space clamped by the clamping plate 23. When demoulding begins, the manipulator first releases the silicon wafer group, and after the silicon wafer group is pushed up by the top support plate 24, the silicon wafer group is clamped by the manipulator. Then the manipulator drives the silicon wafer group to move up, and the top support plate 24 moves down. The plastic film is still in a motionless state in contact with the rubber pad layer, and then the silicon wafer group is separated from the plastic film.

[0056] After the silicon wafer assembly is demolded, it needs to be moved to the position of camera 11 to take a second photo to confirm whether the plastic film is successfully demolded. When camera 11 confirms that there is no plastic film for the second time, it indicates that the silicon wafer assembly is demolded, and the silicon wafer assembly can be controlled to proceed to the next process. If it is determined that the plastic film is still attached to the surface of the silicon wafer assembly, it will continue to be transferred to the demolding assembly 20 for a second demolding operation until camera 1 21 checks again that the demolding is qualified.

[0057] A production device is provided with the demolding mechanism 100 as described above.

[0058] The silicon wafer demolding mechanism designed by the present application can quickly and accurately demold the plastic film wrapped around the silicon wafer, and can maintain the consistency of the stacking of the silicon wafer before and after demolding. The overall structure is simple, the coordination is precise, the demolding efficiency is high and the stability is strong. The present application also proposes a production device equipped with the demolding mechanism.

[0059] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A silicon wafer demolding mechanism, characterized in that: At least a demolding assembly is provided, wherein the demolding assembly comprises at least one set of rubber pad layers arranged in opposite positions, and a top supporting plate is provided below the rubber pad layers; A cavity for placing a silicon wafer group is enclosed between the rubber pad layer and the top supporting plate; The silicon wafer group with plastic film is controlled so that the plastic film end is inserted into the cavity, the rubber pad layer contacts the plastic film and keeps the plastic film immobile through the friction between it and the plastic film; the top support plate pushes against the lower side elevation of the silicon wafer group and moves up to separate the silicon wafer group from the plastic film.

2. A silicon wafer demolding mechanism according to claim 1, characterized in that: The demolding assembly is provided with two groups of the rubber pad layers arranged side by side, the two groups of the rubber pad layers are equipped with a top supporting plate, and the adjacent cavities are interconnected.

3. A silicon wafer demolding mechanism according to claim 1 or 2, characterized in that: The film stripping assembly also includes a film stripping frame, which is constructed in a "J"-shaped structure, and an open opening is provided in the middle of the top of the frame for the silicon wafer group to pass through; The rubber pad layer is arranged on the inner side of the film stripping frame through a pair of clamping plates, and the pair of clamping plates are arranged side by side along the length direction of the film stripping frame; The pair of clamping plates passes through the open opening and is partially protruded above the film stripping frame.

4. A silicon wafer demolding mechanism according to claim 3, characterized in that: A fixing plate for fixing the position of the clamping plate is provided on one side of the clamping plate away from the rubber pad layer, and the fixing plate is connected to the clamping plate via a connecting rod.

5. A silicon wafer demolding mechanism according to claim 4, characterized in that: A gap is provided between the clamping plates and the fixing plates, and an elastic member is sleeved on the connecting rod; The elastic member is disposed between the clamping plates and the fixing plates, and is connected to the clamping plates and the fixing plates respectively.

6. A silicon wafer demolding mechanism according to claim 4 or 5, characterized in that: The top supporting plate is arranged below the pair of clamping plates and in the middle between the pair of clamping plates, and is driven to move vertically up and down by a movable connecting rod laterally fixed on the stripping frame; A lifting motor for driving the movable connecting rod to move up and down is provided at the lower section of the film stripping frame, and the movable connecting rod is connected to the lower end surface of the lifting plate; A top rod for supporting the lateral width of the film stripping frame is also provided on the inner side of the film stripping frame.

7. A silicon wafer demolding mechanism according to claim 6, characterized in that: A set of opposing sensors are provided at both ends of the length of the top of the stripping frame to monitor whether the silicon wafer group is inserted into the cavity; A baffle bar inclined toward one side of the silicon wafer group is also provided on the inner side of the sensor, and a gap is arranged between the upper end of the baffle bar and the outer wall surface of the silicon wafer group.

8. A silicon wafer demolding mechanism according to any one of claims 1-2, 4-5, and 7, characterized in that: A detection component is also provided on the outside of the film stripping component, including: A shell frame having a penetration hole therein; A camera, located directly below the penetration hole, is fixed to the support rod; When the silicon wafer group is suspended and placed above the housing, the camera can emit a light beam through the penetration hole toward the lower surface of the silicon wafer group to take a picture to detect whether the outer side of the silicon wafer group is wrapped with a plastic film.

9. A silicon wafer demolding mechanism according to claim 8, characterized in that: The upper end surface of the housing frame is also provided with a light strip arranged in a corresponding position. The light strips are arranged along the length direction of the housing frame and are placed on both sides of the penetration hole.

10. A production equipment, characterized in that: Adopt the demolding mechanism as described in any one of 1-9.

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