Stress relieving device for strip-shaped structural member of semiconductor rack module
By designing a semiconductor frame module stress relief device including positioning components, the problem of the lack of a regulating mechanism in the prior art is solved, and high-efficiency stress relief suitable for rack modules of different thicknesses is achieved.
Patent Information
- Application Number
- CN202421237113.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-01
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-06-01
AI Technical Summary
The prior art lacks a adjustment mechanism when eliminating stress in semiconductor frame modules, resulting in the inability to maintain contact between the ultrasonic exciter matrix and the workpiece on workpieces of different thicknesses, reducing the effect of stress removal.
A stress relief device for strip-shaped structural parts of semiconductor frame modules is designed, including a positioning component. The positioning component drives the double-headed screw to rotate through the turntable, and the double-headed screw drives the sliding seat to slide in the limit slot through the thread. The seat drives the ultrasonic exciter matrix to approach each other, and defines the position of the frame module main body through the locking screw and the contact block, ensuring that the ultrasonic exciter matrix remains in contact with the frame module main body.
Through this device, it can be applied to frame module main bodies of different thicknesses, ensuring that the ultrasonic exciter matrix remains in contact with the frame module main body, and improving the stress relief effect.
Smart Images

Figure CN222476695U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor rack modules, in particular to a stress elimination device for a strip-shaped structural member of a semiconductor rack module. Background Art
[0002] Semiconductor rack modules are usually made of metal or other alloy materials, which may generate internal stress due to external forces during processing. The elastic modulus, yield strength and other properties of the material will affect the stress distribution and concentration. In the prior art, ultrasonic superposition matrix stress control devices are often used to eliminate the stress of components.
[0003] A known Chinese public invention (publication number: CN117845043A) discloses an ultrasonic stress control device for a guide rail of a high-precision lithography machine, which uses ultrasonic stress control technology to homogenize and control the stress distribution of the guide rail, thereby avoiding the mechanical damage and deformation problems that may exist in traditional stress reduction methods, and improving the service life and precision stability of the guide rail of the high-precision lithography machine;
[0004] In the process of eliminating stress, ultrasonic exciter matrices are set on both sides and the bottom of the workpiece to eliminate the internal stress of the workpiece. However, the device is not provided with an adjustment mechanism. Therefore, when eliminating stress on workpieces of different thicknesses, the ultrasonic exciter matrix cannot maintain contact with the workpiece, reducing the effect of stress elimination. Therefore, a stress elimination device for a strip structure of a semiconductor rack module is proposed. Utility Model Content
[0005] In view of this, the utility model provides a stress relief device for a strip-shaped structural member of a semiconductor rack module to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.
[0006] The technical solution of the embodiment of the utility model is implemented as follows: a stress relief device for a strip-shaped structural member of a semiconductor rack module, comprising a positioning assembly, wherein the positioning assembly comprises two first ultrasonic exciter matrices, two L-shaped limit blocks, a locking screw, a contact block, a push rod, two sliding seats, two guide rods and a double-headed screw;
[0007] The two sliding seats are symmetrically fixedly connected to the lower surfaces of the two first ultrasonic exciter matrices, the two guide rods are symmetrically slidably connected to the inside of the sliding seats, the two sliding seats are symmetrically threadedly connected to the outer side walls of the double-headed screw, the adjacent surfaces of the two L-shaped limit blocks are symmetrically fixedly connected to the front surface and the rear surface of the first ultrasonic exciter matrix, the bottom end of the locking screw is rotatably connected to the upper surface of the contact block, and one end of the top rod is fixedly connected to one side of the inner wall of the L-shaped limit block.
[0008] Further preferably, the locking screw is threadedly connected to the inside of the L-shaped limit block, and one end of the double-headed screw is fixedly connected to a turntable.
[0009] Further preferably, a support assembly is installed on the lower surface of the first ultrasonic exciter matrix, and the support assembly includes a workbench and two limit grooves;
[0010] The two limiting grooves are symmetrically arranged on the upper surface of the workbench, and the two first ultrasonic exciter matrices are symmetrically located above the workbench.
[0011] Further preferably, the outer side wall of the sliding seat is slidably connected to the inner side wall of the limiting groove, and the two ends of the guide rod are symmetrically fixedly connected to the two sides of the inner wall of the limiting groove.
[0012] Further preferably, the double-headed screw is rotatably connected to the inside of the workbench, and the turntable is located outside the workbench.
[0013] Further preferably, a second ultrasonic exciter matrix is fixedly connected to the middle of the upper surface of the workbench, and the second ultrasonic exciter matrix is located between the two first ultrasonic exciter matrices.
[0014] Further preferably, the upper surface of the second ultrasonic exciter matrix is attached to the frame module body, and two sides of the frame module body are attached to adjacent surfaces of the two first ultrasonic exciter matrices.
[0015] Further preferably, one end of the push rod away from the L-shaped limit block is attached to one side of the rack module body, and the lower surface of the contact block is attached to the upper surface of the rack module body.
[0016] Since the embodiment of the utility model adopts the above technical scheme, it has the following advantages: the utility model drives the double-headed screw to rotate through the turntable, and the double-headed screw drives the two sliding seats to slide in the limiting groove through the thread, and the two sliding seats drive the two first ultrasonic exciter matrices to approach each other, so that the two first ultrasonic exciter matrices are fitted with the frame module body, and the frame module body is fitted with the top rod at the same time. At this time, the left and right positions of the frame module body can be limited, and the contact block is pushed by the locking screw to press the top of the frame module body. At this time, the upper and lower positions of the frame module body can be limited. By setting an adjustable mechanism, it is suitable for frame module bodies of different thicknesses, so that the frame module body can maintain contact with the ultrasonic exciter matrix, ensuring the stress elimination effect.
[0017] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 It is a structural diagram of the utility model;
[0020] Figure 2 This is a schematic diagram of the connection between the first ultrasonic exciter matrix and the workbench of the utility model;
[0021] Figure 3 This is a structural diagram of the positioning component of the utility model;
[0022] Figure 4 This is a structural diagram of a workbench of the present utility model.
[0023] Figure numerals: 101, positioning assembly; 11, first ultrasonic exciter matrix; 12, L-shaped limit block; 13, locking screw; 14, contact block; 15, push rod; 16, sliding seat; 17, guide rod; 18, double-headed screw; 19, turntable; 301, support assembly; 31, workbench; 32, rack module body; 33, second ultrasonic exciter matrix; 34, limit groove. DETAILED DESCRIPTION
[0024] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.
[0025] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.
[0026] like Figure 1-4 As shown, the embodiment of the utility model provides a stress relief device for a strip-shaped structural member of a semiconductor rack module, including a positioning assembly 101, the positioning assembly 101 includes two first ultrasonic exciter matrices 11, two L-shaped limit blocks 12, a locking screw 13, a contact block 14, a push rod 15, two sliding seats 16, two guide rods 17 and a double-headed screw 18;
[0027] The two sliding seats 16 are symmetrically fixedly connected to the lower surfaces of the two first ultrasonic exciter matrices 11, the two guide rods 17 are symmetrically slidably connected to the inside of the sliding seats 16, the two sliding seats 16 are symmetrically threadedly connected to the outer side walls of the double-headed screw 18, the adjacent surfaces of the two L-shaped limit blocks 12 are symmetrically fixedly connected to the front surface and the rear surface of the first ultrasonic exciter matrix 11, the bottom end of the locking screw 13 is rotatably connected to the upper surface of the contact block 14, and one end of the push rod 15 is fixedly connected to one side of the inner wall of the L-shaped limit block 12.
[0028] In one embodiment, the locking screw 13 is threadedly connected to the inside of the L-shaped limit block 12, and one end of the double-headed screw 18 is fixedly connected to the turntable 19. When the locking screw 13 is rotated, the locking screw 13 pushes the contact block 14 to move downward, thereby limiting the position of the rack module body 32.
[0029] In one embodiment, a support assembly 301 is installed on the lower surface of the first ultrasonic actuator matrix 11, and the support assembly 301 includes a workbench 31 and two limiting grooves 34;
[0030] Two limit grooves 34 are symmetrically opened on the upper surface of the workbench 31, and the two first ultrasonic exciter matrices 11 are symmetrically located above the workbench 31. The outer wall of the sliding seat 16 is slidably connected to the inner wall of the limit groove 34. The two ends of the guide rod 17 are symmetrically fixedly connected to the two sides of the inner wall of the limit groove 34. The double-headed screw 18 is rotatably connected to the inside of the workbench 31. The turntable 19 is located outside the workbench 31. The position of the sliding seat 16 can be limited by the guide rod 17. When the double-headed screw 18 rotates clockwise, the two sliding seats 16 approach each other.
[0031] In one embodiment, a second ultrasonic exciter matrix 33 is fixedly connected to the middle of the upper surface of the workbench 31, and the second ultrasonic exciter matrix 33 is located between the two first ultrasonic exciter matrices 11. The upper surface of the second ultrasonic exciter matrix 33 is attached to the rack module body 32, and the two sides of the rack module body 32 are attached to the adjacent surfaces of the two first ultrasonic exciter matrices 11, so that the stress of the rack module body 32 can be eliminated by the first ultrasonic exciter matrix 11 and the second ultrasonic exciter matrix 33.
[0032] In one embodiment, one end of the top rod 15 away from the L-shaped limit block 12 is affixed to one side of the rack module body 32, and the lower surface of the contact block 14 is affixed to the upper surface of the rack module body 32. The top rod 15 can limit the left and right positions of the rack module body 32, and the contact block 14 can limit the upper and lower positions of the rack module body 32.
[0033] When the utility model is working, the frame module body 32 is placed on the surface of the second ultrasonic exciter matrix 33, and then the turntable 19 is rotated clockwise, the turntable 19 drives the double-headed screw 18 to rotate, and the double-headed screw 18 drives the two sliding seats 16 to slide in the limiting groove 34 through the thread, and the two sliding seats 16 drive the two first ultrasonic exciter matrices 11 to approach each other, and the first ultrasonic exciter matrix 11 drives the top rod 15 through the L-shaped limiting block 12, so that the two first ultrasonic exciter matrices 11 are fitted with the frame module body 32, and at the same time, the frame module The main body 32 is fitted with the top rod 15. Through the cooperation of the two first ultrasonic exciter matrices 11 and the top rod 15, the left and right positions of the rack module main body 32 can be limited. The locking screw 13 is rotated clockwise, and the locking screw 13 pushes the contact block 14 to press the top of the rack module main body 32. At this time, the upper and lower positions of the rack module main body 32 can be limited. The first ultrasonic exciter matrix 11 and the second ultrasonic exciter matrix 33 are controlled to work through an external ultrasonic exciter power supply and control system, so that the stress in the rack module main body 32 can be eliminated.
[0034] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A stress relief device for a strip-shaped structural member of a semiconductor rack module, comprising a positioning assembly (101), characterized in that: The positioning assembly (101) comprises two first ultrasonic exciter matrices (11), two L-shaped limit blocks (12), a locking screw (13), a contact block (14), a push rod (15), two sliding seats (16), two guide rods (17) and a double-headed screw (18); The two sliding seats (16) are symmetrically fixedly connected to the lower surfaces of the two first ultrasonic exciter matrices (11), the two guide rods (17) are symmetrically slidably connected to the inside of the sliding seats (16), the two sliding seats (16) are symmetrically threadedly connected to the outer side walls of the double-headed screw (18), the adjacent surfaces of the two L-shaped limit blocks (12) are symmetrically fixedly connected to the front surface and the rear surface of the first ultrasonic exciter matrix (11), the bottom end of the locking screw (13) is rotatably connected to the upper surface of the contact block (14), and one end of the top rod (15) is fixedly connected to one side of the inner wall of the L-shaped limit block (12).
2. The stress relief device for a strip-shaped structural member of a semiconductor rack module according to claim 1, characterized in that: The locking screw (13) is threadedly connected to the inside of the L-shaped limit block (12), and one end of the double-headed screw (18) is fixedly connected to a rotating disk (19).
3. The stress relief device for a strip-shaped structural member of a semiconductor rack module according to claim 1, characterized in that: A support assembly (301) is installed on the lower surface of the first ultrasonic exciter matrix (11), and the support assembly (301) comprises a workbench (31) and two limiting grooves (34); The two limiting grooves (34) are symmetrically arranged on the upper surface of the workbench (31), and the two first ultrasonic exciter matrices (11) are symmetrically located above the workbench (31).
4. The stress relief device for a strip-shaped structural member of a semiconductor rack module according to claim 3, characterized in that: The outer wall of the sliding seat (16) is slidably connected to the inner wall of the limiting groove (34), and the two ends of the guide rod (17) are symmetrically fixedly connected to the two sides of the inner wall of the limiting groove (34).
5. The stress relief device for a strip-shaped structural member of a semiconductor rack module according to claim 2, characterized in that: The double-ended screw rod (18) is rotatably connected to the inside of the workbench (31), and the turntable (19) is located outside the workbench (31).
6. The stress relief device for a strip-shaped structural member of a semiconductor rack module according to claim 5, characterized in that: A second ultrasonic exciter matrix (33) is fixedly connected to the middle of the upper surface of the workbench (31), and the second ultrasonic exciter matrix (33) is located between the two first ultrasonic exciter matrices (11).
7. The stress relief device for a strip-shaped structural member of a semiconductor rack module according to claim 6, characterized in that: The upper surface of the second ultrasonic exciter matrix (33) is bonded to a frame module body (32), and two sides of the frame module body (32) are bonded to adjacent surfaces of two first ultrasonic exciter matrices (11).
8. The stress relief device for a strip-shaped structural member of a semiconductor rack module according to claim 7, characterized in that: One end of the push rod (15) away from the L-shaped limit block (12) is attached to one side of the frame module body (32), and the lower surface of the contact block (14) is attached to the upper surface of the frame module body (32).
Citation Information
Patent Citations
Ultrasonic stress regulation and control device of high-precision photoetching machine guide rail
CN117845043A