Radio frequency circuit board adjustable crimping device with self-locking function

By designing an adjustable crimping device for RF circuit board with self-locking function, the pressure control and automatic unloading of RF circuit boards is achieved by using lifting mechanisms and elastic parts, the time-consuming and labor-consuming installation of RF circuit board molds in the prior art is solved. The problem of this paper improves bonding efficiency and simplifies the press mold structure.

CN222479169UActive Publication Date: 2025-02-14SOUTHWEST INST OF APPLIED MAGNETICS
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Patent Information

Application Number
CN202420007033.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-03
Publication Date
2025-02-14
Estimated Expiration
2034-01-03

AI Technical Summary

Technical Problem

The mold installation method of existing RF circuit boards requires multiple screws, which makes installation and disassembly time-consuming and labor-intensive, inefficient assembly, and increases product processing cycle, economy and material loss.

Method used

A radio frequency circuit board adjustable crimping device with self-locking function is designed, and the base, first pressure plate, second pressure plate, prepressure adjustment plate and adjustment screw are used to realize the pressing mold through the lifting mechanism and elastic parts. Pressure control and automatic unloading.

Benefits of technology

The pressure control is realized when bonding the RF board, the operation is simple and flexible, and the pressure mold is subjected to uniform force, which avoids the risk of RF board crushing, improves the bonding efficiency, and simplifies the compression mold structure, shortens the processing cycle, and reduces consumables. and machine-plus cost.

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Abstract

The utility model discloses a radio frequency circuit board adjustable crimping device with a self-locking function, which belongs to the field of radio frequency circuit boards and comprises a base (1), a first pressing plate (4), a second pressing plate (6) and a pre-pressure adjusting plate (7) are sequentially arranged above the base (1) from bottom to top, a gap for placing a product is arranged between the base (1) and the first pressing plate (4), and the pre-pressure adjusting plate (7) is arranged on the first pressing plate (4). A first elastic piece is arranged between the first pressing plate (4) and the second pressing plate (6), an adjusting screw (9) is arranged on the pre-pressure adjusting plate (7), and the adjusting screw (9) penetrates through the pre-pressure adjusting plate (7) and is connected with the second pressing plate (6). A lifting mechanism used for controlling the second pressing plate (6) to ascend and descend is further arranged. The radio frequency board bonding pressure control device can realize pressure control during radio frequency board bonding, is simple and flexible to operate and uniform in pressing die stress, avoids the risk of crushing of the radio frequency board, improves the bonding efficiency, and reduces consumables and machining cost.
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Description

Technical Field

[0001] The utility model relates to the field of radio frequency circuit boards, in particular to an adjustable crimping device for radio frequency circuit boards with a self-locking function. Background Art

[0002] The RF circuit board bonding process is an important part of the development process of microwave products such as components, modules and extensions. As a microstrip board made of extremely thin polytetrafluoroethylene glass fiber reinforced material, the RF circuit board is generally bonded in the product RF cavity by high-temperature curing of conductive glue. During the heating and curing process of the conductive glue, a die is required to apply constant surface pressure to the RF board to ensure that the RF board is firmly bonded.

[0003] At present, the die is installed by screw fastening. Since the structure of the RF cavity is generally complex, many screws need to be installed to achieve the compression effect. The installation and removal of the screws need to be done manually, which is time-consuming and labor-intensive, and the assembly efficiency is low. In addition, in the die processing, it is necessary to increase the machining process of opening the screw installation holes, which has an impact on the product processing cycle, economy and material loss. Utility Model Content

[0004] The purpose of the utility model is to provide an adjustable crimping device for a radio frequency circuit board with a self-locking function to solve the above-mentioned problem.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows: an adjustable crimping device for a radio frequency circuit board with a self-locking function, comprising a base, a first pressing plate, a second pressing plate and a pre-pressure adjustment plate are arranged above the base from bottom to top in sequence, a gap for placing products is arranged between the base and the first pressing plate, a first elastic member is arranged between the first pressing plate and the second pressing plate, an adjusting screw is arranged on the pre-pressure adjustment plate, the adjusting screw is connected to the pre-pressure adjustment plate through a threaded pair, the adjusting screw passes through the pre-pressure adjustment plate and is connected to the second pressing plate; a lifting mechanism for controlling the lifting and lowering of the second pressing plate is also provided, and the lifting mechanisms on the left and right sides are used for lifting and lowering the second pressing plate.

[0006] As a preferred technical solution, the first elastic member is a pressure spring, and is further provided with a lifting guide rod, which passes through the pre-pressure adjustment plate, the second pressure plate and the pressure spring in sequence from top to bottom.

[0007] As a further preferred technical solution, there are four pressure springs and four lifting guide rods, which are symmetrically arranged.

[0008] As a preferred technical solution, there are two lifting mechanisms, which are symmetrically arranged on the left and right sides of the second pressure plate; the lifting mechanism is composed of a slide rail, a lifting hinge, a second elastic member and a slider, wherein the slide rail is vertically arranged, and its top end is connected to the bottom surface of the pre-pressure adjustment plate, the upper end of the lifting hinge is connected to the second pressure plate, and the lower end is laterally connected to the second elastic member, and the middle pivot part of the lifting hinge cooperates with the slide rail.

[0009] The above lifting mechanism is characterized in that the second elastic member acts as a tension spring and can provide a restoring force for the lifting device when unloading. That is, when the device unloads the pre-pressure, the lifting device will return to its original position under the action of the second elastic member, thereby driving the second pressing plate to return to its original position, and the first pressing plate and the second pressing plate are connected by the first elastic member, so they will also return to their original position, which is convenient for product replacement.

[0010] It should be noted that the above is only one embodiment of the lifting mechanism, and other existing structures that can achieve lifting are also applicable to the present application, such as a similar lifting mechanism disclosed in Chinese utility model patent CN211310736U.

[0011] As a further preferred technical solution, the second elastic member is a tension spring.

[0012] The above-mentioned device uses a pressure-adjustable pressure plate to apply pressure to the die instead of pre-tightening with screws, which can simplify the structure of the corresponding die and provide a high-efficiency and high-stability implementation plan for the RF circuit board bonding process of microwave products. When it is necessary to apply pre-pressure to the die, rotate the adjusting screw clockwise to make it move downward. The adjusting screw directly contacts the second pressure plate connected to the lifting device, and then controls the displacement and force of the first pressure plate through the pressure spring, and transmits the pre-pressure to the die. The adjusting screw has a locking effect on the pressure plate to ensure that the pressure of the die is constant. When the pre-pressure needs to be unloaded, it is only necessary to rotate the adjusting screw in the opposite direction, and the second pressure plate will automatically rise under the action of the lifting device. The power of the lifting device comes from the restoring force of the tension spring. In addition, the device can meet the bonding requirements of the RF circuit boards of microwave products, and can realize the simultaneous bonding of multiple module RF boards.

[0013] Compared with the prior art, the advantages of the utility model are: the device can realize pressure control during bonding of the RF board on the basis of ensuring the pre-pressure and stability of the die; the operation is simple and flexible; the die is evenly stressed, thus avoiding the risk of crushing the RF board; and it can replace the original lengthy process of installing and removing screws, thus improving the bonding efficiency while ensuring the bonding reliability; in addition, the die structure can be simplified, thus shortening the machining cycle of the die structure, reducing consumables and machining costs, and having a positive effect on the product development process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of an embodiment of the utility model;

[0015] Figure 2 This is a structural diagram of a die according to an embodiment of the utility model;

[0016] Figure 3 This is a diagram of the traditional die structure.

[0017] In the figure: 1. base; 2. product; 3. die; 4. first pressure plate; 5. pressure spring; 6. second pressure plate; 7. pre-pressure adjustment plate; 8. lifting guide rod; 9. adjustment screw; 10. slide rail; 11. lifting hinge; 12. tension spring; 13. slider. DETAILED DESCRIPTION

[0018] The utility model will be further described below in conjunction with the accompanying drawings.

[0019] Example:

[0020] See also Figure 1 , an adjustable crimping device for a radio frequency circuit board with a self-locking function, comprising a base 1, a first pressing plate 4, a second pressing plate 6 and a pre-pressure adjusting plate 7 are sequentially arranged on the base 1 from bottom to top, a gap for placing a product is arranged between the base 1 and the first pressing plate 4, a first elastic member is arranged between the first pressing plate 4 and the second pressing plate 6, an adjusting screw 9 is arranged on the pre-pressure adjusting plate 7, the adjusting screw 9 is connected to the pre-pressure adjusting plate 7 through a threaded pair, the adjusting screw 9 passes through the pre-pressure adjusting plate 7 and is connected to the second pressing plate 6; a lifting mechanism for controlling the lifting and lowering of the second pressing plate 6 is also arranged;

[0021] In this embodiment, the first elastic member is a pressure spring 5, and a lifting guide rod 8 is also provided. The lifting guide rod 8 passes through the pre-pressure adjustment plate 7, the second pressure plate 6 and the pressure spring 5 from top to bottom in sequence. The pressure spring 5 and the lifting guide rod 8 are both four and symmetrically arranged.

[0022] In this embodiment, there are two lifting mechanisms, which are symmetrically arranged on the left and right sides of the second pressing plate 6; the lifting mechanism is composed of a slide rail 10, a lifting hinge 11, a second elastic member and a slider 13, and correspondingly, a slide groove cooperating with the slider 13 is also provided, such as Figure 1 As shown, the slide rail 10 is vertically arranged, and its top end is connected to the bottom surface of the pre-pressure adjustment plate 7, the upper end of the lifting hinge 11 is connected to the second pressure plate 6, and the lower end is horizontally connected to the second elastic member, the middle pivot part of the lifting hinge 11 cooperates with the slide rail 10, and the second elastic member is a tension spring 12;

[0023] When using this device to bond and assemble the RF circuit board, first Figure 2 The die 3 shown is placed on the RF circuit board to be bonded, and then the microwave product 2 is placed on the base 1, and then the adjusting screw 9 is rotated to adjust the position of the first pressing plate 4 and the second pressing plate 6 of the device to achieve pre-pressing of the product RF circuit board;

[0024] The adjusting screw 9 is connected to the pre-pressure adjusting plate 7 fixed on the slide rail 10 through a threaded pair, and the bottom surface of the adjusting screw 9 directly contacts the second plate 6 connected to the lifting hinge 11, and then the displacement and force of the first plate 4 are controlled by the pressure spring 5, and the pre-pressure is transmitted to the die 3;

[0025] The size of the pre-pressure can be adjusted according to the deformation of the spring. Since the pitch of the thread on the adjusting screw 9 is determined, the pressure on the first pressing plate 4 can be accurately controlled according to Hooke's law (F=kx, F is the spring force, k is the elastic coefficient, and x is the spring deformation). When the pre-pressure needs to be unloaded, the adjusting screw 9 is rotated in the reverse direction, and the first pressing plate 4 and the second pressing plate 6 will automatically rise under the action of the lifting hinge 11, and the power comes from the restoring force of the tension spring 12.

[0026] When the above device is used to bond and assemble the radio frequency circuit board of the microwave product, since it is no longer necessary to fasten the die 3 with screws, the die structure can be effectively simplified. Figure 3 The conventional structure shown is improved to Figure 2 The structure shown in the figure shortens the machining cycle of the die structure and reduces consumables and machining costs.

[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An adjustable crimping device for a radio frequency circuit board with a self-locking function, characterized in that: The invention comprises a base (1), wherein a first pressing plate (4), a second pressing plate (6) and a pre-pressure regulating plate (7) are arranged on the top of the base (1) in order from bottom to top, a gap for placing products is arranged between the base (1) and the first pressing plate (4), a first elastic member is arranged between the first pressing plate (4) and the second pressing plate (6), an adjusting screw (9) is arranged on the pre-pressure regulating plate (7), the adjusting screw (9) is connected to the pre-pressure regulating plate (7) through a threaded pair, the adjusting screw (9) passes through the pre-pressure regulating plate (7) and is connected to the second pressing plate (6); a lifting mechanism for controlling the lifting of the second pressing plate (6) is also arranged.

2. The adjustable crimping device for radio frequency circuit board with self-locking function according to claim 1, characterized in that: The first elastic member is a pressure spring (5), and is also provided with a lifting guide rod (8), wherein the lifting guide rod (8) passes through the pre-pressure adjustment plate (7), the second pressure plate (6) and the pressure spring (5) in sequence from top to bottom.

3. The adjustable crimping device for radio frequency circuit board with self-locking function according to claim 2 is characterized in that: There are four pressure springs (5) and four lifting guide rods (8) which are symmetrically arranged.

4. The adjustable crimping device for radio frequency circuit board with self-locking function according to claim 1, characterized in that: There are two lifting mechanisms, which are symmetrically arranged on the left and right sides of the second pressure plate (6); the lifting mechanism consists of a slide rail (10), a lifting hinge (11), a second elastic member and a slider (13), wherein the slide rail (10) is vertically arranged, and its top end is connected to the bottom surface of the pre-pressure adjustment plate (7); the upper end of the lifting hinge (11) is connected to the second pressure plate (6), and the lower end is horizontally connected to the second elastic member; the middle pivot part of the lifting hinge (11) cooperates with the slide rail (10).

5. The adjustable crimping device for radio frequency circuit board with self-locking function according to claim 4 is characterized in that: The second elastic member is a tension spring (12).

Citation Information

Patent Citations

  • Shear type lifting device

    CN211310736U