Heat dissipation structure for computer memory bank

Abstract

The heat dissipation structure is applied to a memory bank body, a socket is inserted into the bottom of the memory bank body, the heat dissipation structure comprises a first shell and a second shell which are arranged on the memory bank body, a first notch is formed in the inner side wall of the second shell, and a first mounting plate is fixedly mounted in the first notch; a limiting plate is fixedly mounted on the first mounting plate, a rotating shaft is fixedly mounted on the limiting plate, a clamping ring is rotationally connected to the rotating shaft, a connecting plate is integrally formed on the clamping ring, an elastic mechanism is arranged on the first mounting plate, and a heat dissipation mechanism is arranged in the second shell. According to the heat dissipation structure for the computer memory bank, the situation that screws need to be used for installation traditionally is eradicated, the installation mode is simple and rapid, the waistcoat cannot be damaged during disassembly, and use is convenient.

Description

Technical Field

[0001] The utility model relates to the field of memory bars, in particular to a heat dissipation structure for computer memory bars. Background Art

[0002] The memory stick is an electronic component that the CPU can address through the bus and perform read and write operations. The memory stick socket is a connector that connects the memory stick and the circuit board. In order to prevent the memory stick from shaking in the socket and preventing the memory stick from falling off the socket during transportation, the memory stick is usually equipped with a locking structure to limit the position of the memory stick, so that the memory stick and the socket can maintain good contact and ensure the performance of the electronic products they are used in. As the performance of the memory stick continues to improve, its heat generation is also increasing. In order to enable the memory stick to operate normally and stably, a heat dissipation structure is often installed on its surface. If the heat cannot be dissipated for a long time, it will cause the computer memory to read slowly.

[0003] In the prior art, a heat sink is usually added to the outside of the memory stick to dissipate heat. However, when the heat sink is assembled, screws are usually used to fix it. This method is relatively cumbersome, affects work efficiency, and is inconvenient to use.

[0004] Therefore, we made improvements to this and proposed a heat dissipation structure for computer memory sticks. Utility Model Content

[0005] The purpose of the utility model is to solve the existing heat dissipation vest which is usually fixed by screws during assembly, which is cumbersome, affects work efficiency and is inconvenient to use.

[0006] In order to achieve the above-mentioned utility model purpose, the utility model provides the following technical solutions:

[0007] Computer memory modules use a heat dissipation structure to improve the above problems.

[0008] The specific application is as follows:

[0009] Applied to a memory stick body, a socket is inserted at the bottom of the memory stick body, including a first shell and a second shell arranged on the memory stick body, a first slot is opened on the inner wall of the second shell, a first mounting plate is fixedly installed in the first slot, a limit plate is fixedly installed on the first mounting plate, a rotating shaft is fixedly installed on the limit plate, a clamping ring is rotatably connected to the rotating shaft, a connecting plate is integrally formed on the clamping ring, an elastic mechanism is arranged on the first mounting plate, and a heat dissipation mechanism is arranged in the second shell.

[0010] As a preferred technical solution of the present application, the elastic mechanism includes a strong spring fixedly mounted on the first mounting plate, and one end of the strong spring away from the first mounting plate is fixedly connected to the connecting plate.

[0011] As a preferred technical solution of the present application, a second notch is opened on the inner side wall of the first shell, a second mounting plate is fixedly installed in the second notch, a clamping block is fixedly installed on the second mounting plate, and the clamping block cooperates with a clamping ring.

[0012] As a preferred technical solution of the present application, the heat dissipation mechanism includes a heat pipe arranged on the inner wall of the second shell, and the heat pipe is provided with heat dissipation fins.

[0013] As a preferred technical solution of the present application, an elastic clamp ring is fixedly installed on the inner wall of the second shell, and the elastic clamp ring cooperates with the heat-conducting pipe.

[0014] As a preferred technical solution of the present application, through grooves are provided on both the first shell and the second shell, and thermal conductive pads are provided on the inner side walls of the first shell and the second shell.

[0015] As a preferred technical solution of the present application, handles are fixedly installed on both the first shell and the second shell.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] In the scheme of this application:

[0018] 1. Through the first mounting plate, the limit plate, the rotating shaft, the clamping ring, the connecting plate, the strong spring, the second notch, the second mounting plate and the clamping block, the installation method is simple and fast, which solves the problem that it is cumbersome to fix it with screws in the prior art, which affects the work efficiency;

[0019] 2. The heat pipe, heat sink and heat pad are provided to dissipate heat for the memory stick, thus solving the problem of poor heat dissipation effect of the memory stick in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of the heat dissipation structure for a computer memory module provided in this application;

[0021] Figure 2 A schematic diagram of the inner side wall structure of the second housing of the heat dissipation structure for a computer memory stick provided in the present application;

[0022] Figure 3 A schematic diagram of the first notch and elastic clamp ring structure of the heat dissipation structure for a computer memory module provided in the present application;

[0023] Figure 4A schematic diagram of the inner side wall structure of the first housing of the heat dissipation structure for a computer memory stick provided in the present application;

[0024] Figure 5 A schematic diagram of the first mounting plate, rotating shaft, clamping ring, connecting plate, strong spring, second mounting plate and clamping block structure of the heat dissipation structure for computer memory stick provided by the present application;

[0025] Figure 6 A schematic diagram of the structure of a limiting plate for a heat dissipation structure for a computer memory module provided in this application;

[0026] Figure 7 This is a schematic diagram of the second mounting plate and card block structure of the heat dissipation structure for a computer memory stick provided in this application.

[0027] Indicated in the figure:

[0028] 1. First shell; 2. Second shell; 3. First notch; 4. First mounting plate; 5. Limit plate; 6. Rotating shaft; 7. Clamp; 8. Connecting plate; 9. Strong spring; 10. Second notch; 11. Second mounting plate; 12. Block; 13. Heat pipe; 14. Heat sink fin; 15. Through slot; 16. Handle; 17. Elastic clamp; 18. Memory stick body; 19. Socket; 20. Thermal pad. DETAILED DESCRIPTION

[0029] To make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments.

[0030] Therefore, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the present invention to be protected, but merely represents some embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "upper", "lower", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invention product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art. Such terms are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0034] Example:

[0035] like Figure 1-7 As shown, the present embodiment proposes a heat dissipation structure for a computer memory stick, which is applied to a memory stick body 18. A socket 19 is inserted at the bottom of the memory stick body 18, and the memory stick body 18 includes a first shell 1 and a second shell 2 arranged on the memory stick body 18. During assembly, the second shell 2 is horizontally placed on the desktop, and then the heat pipe 13 is installed on the elastic clamp ring 17. When the memory stick body 18 is placed in the second shell 2, the first shell 1 is covered. A first notch 3 is provided on the inner wall of the second shell 2. A first mounting plate 4 is fixedly installed in the first notch 3. A limiting plate 5 is fixedly installed on the first mounting plate 4. A rotating shaft 6 is fixedly installed on the limiting plate 5. A snap ring 7 is rotatably connected to the rotating shaft 6. The snap ring 7 rotates around the rotating shaft 6. A connecting plate 8 is integrally formed on the snap ring 7. The snap ring 7 drives the connecting plate 8 to rotate. An elastic mechanism is provided on the first mounting plate 4, and a heat dissipation mechanism is provided in the second shell 2. The heat dissipation structure for a computer memory stick of the present application eliminates the traditional need to use screws for installation. The installation method is simple and quick, and the vest will not be damaged during disassembly, so it is easy to use.

[0036] To facilitate buckling, the elastic mechanism includes a strong spring 9 fixedly mounted on the first mounting plate 4 , and one end of the strong spring 9 away from the first mounting plate 4 is fixedly connected to the connecting plate 8 .

[0037] In order to facilitate the buckling, a second slot 10 is opened on the inner wall of the first shell 1, a second mounting plate 11 is fixedly installed in the second slot 10, a clamping block 12 is fixedly installed on the second mounting plate 11, the clamping block 12 cooperates with the clamping ring 7, and the clamping block 12 is inserted into the clamping ring 7.

[0038] In order to dissipate heat from the memory stick body 18 , the heat dissipation mechanism includes a heat pipe 13 disposed on the inner wall of the second shell 2 , on which heat dissipation fins 14 are disposed. The heat pipe 13 can transfer heat to the heat dissipation fins 14 , thus achieving a good heat dissipation effect.

[0039] In order to fix the heat-conducting pipe 13 , an elastic clamp ring 17 is fixedly installed on the inner side wall of the second shell 2 , and the elastic clamp ring 17 matches with the heat-conducting pipe 13 .

[0040] In order to discharge the heat, through grooves 15 are provided on the first shell 1 and the second shell 2 , and thermal pads 20 are provided on the inner side walls of the first shell 1 and the second shell 2 .

[0041] In order to facilitate separation of the first housing 1 and the second housing 2 , handles 16 are fixedly mounted on both the first housing 1 and the second housing 2 .

[0042] Specifically, when the heat dissipation structure for computer memory stick is used: during assembly, the second housing 2 is placed horizontally on the desktop, and then the heat pipe 13 is installed on the elastic clamp ring 17, and then the memory stick body 18 is placed in the second housing 2, and then the first housing 1 is covered, so that the thermal pad 20 contacts the memory stick body 18, and the card block 12 is inserted into the clamp ring 7. When the card block 12 contacts the clamp ring 7 during insertion, the clamp ring 7 rotates around the rotating shaft 6, driving the connecting plate 8 to rotate, and the connecting plate 8 squeezes the strong spring 9, and the card block 12 is inserted into the strong spring 9. When the force spring 9 rebounds, it drives the connecting plate 8, and the connecting plate 8 drives the snap ring 7, and the snap ring 7 rotates around the rotating shaft 6 to complete the installation. When disassembling, it is necessary to pull the handle 16 with force to separate the clamping block 12 from the snap ring 7; when the memory stick body 18 is heated, the thermal pad 20 can dissipate heat, and the heat pipe 13 can transfer heat to the heat dissipation fins 14, which has a good heat dissipation effect. The heat dissipation structure of the computer memory stick of the present application eliminates the traditional need to use screws for installation. The installation method is simple and quick, and the vest will not be damaged during disassembly, which is easy to use.

[0043] All technical features in this embodiment can be freely combined according to actual needs.

[0044] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.

Claims

1. A heat dissipation structure for a computer memory stick, applied to a memory stick body (18), wherein a socket (19) is plugged into the bottom of the memory stick body (18), characterized in that: The invention comprises a first shell (1) and a second shell (2) which are arranged on the memory stick body (18); the inner side wall of the second shell (2) is provided with a first notch (3); a first mounting plate (4) is fixedly installed in the first notch (3); a limit plate (5) is fixedly installed on the first mounting plate (4); a rotating shaft (6) is fixedly installed on the limit plate (5); a clamping ring (7) is rotatably connected to the rotating shaft (6); a connecting plate (8) is integrally formed on the clamping ring (7); an elastic mechanism is arranged on the first mounting plate (4); and a heat dissipation mechanism is arranged in the second shell (2).

2. The heat dissipation structure for a computer memory stick according to claim 1, characterized in that: The elastic mechanism comprises a strong spring (9) fixedly mounted on the first mounting plate (4); one end of the strong spring (9) away from the first mounting plate (4) is fixedly connected to the connecting plate (8).

3. The heat dissipation structure for a computer memory stick according to claim 1, characterized in that: A second notch (10) is provided on the inner side wall of the first housing (1), a second mounting plate (11) is fixedly mounted in the second notch (10), a clamping block (12) is fixedly mounted on the second mounting plate (11), and the clamping block (12) cooperates with the clamping ring (7).

4. The heat dissipation structure for a computer memory stick according to claim 1, characterized in that: The heat dissipation mechanism comprises a heat conducting pipe (13) arranged on the inner side wall of the second shell (2), and heat dissipation fins (14) are arranged on the heat conducting pipe (13).

5. The heat dissipation structure for a computer memory stick according to claim 4, characterized in that: An elastic clamp ring (17) is fixedly mounted on the inner side wall of the second outer shell (2), and the elastic clamp ring (17) cooperates with the heat conducting pipe (13).

6. The heat dissipation structure for a computer memory stick according to claim 1, characterized in that: The first shell (1) and the second shell (2) are both provided with through grooves (15), and the inner side walls of the first shell (1) and the second shell (2) are both provided with thermal conductive pads (20).

7. The heat dissipation structure for a computer memory stick according to claim 6, characterized in that: A handle (16) is fixedly mounted on both the first shell (1) and the second shell (2).

Images