Electronic device

Abstract

There is provided an electronic device including: a display layer displaying an image; and a sensor layer disposed on the display layer. The sensor layer includes: a plurality of first sensing electrodes including a plurality of sensing patterns arranged along a first direction and a plurality of bridge patterns electrically connecting adjacent sensing patterns among the plurality of sensing patterns; a plurality of second sensing electrodes including a plurality of sensing portions arranged along a second direction crossing the first direction and a first connection portion extending from the plurality of sensing portions in the second direction; and a pen sensing electrode disposed on the same layer as the plurality of bridge patterns. The pen sensing electrode is disposed in different layers from the plurality of sensing patterns and the plurality of second sensing electrodes. The electronic device may detect an input through a touch and may also detect an input through a pen.

Description

[0001] This application claims the priority of Korean Patent Application No. 10-2023-0054568 filed on April 26, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure herein relates to an electronic device that detects input through a pen. Background Art

[0003] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles include display devices for displaying images. Electronic devices may include a sensor layer (or input sensor) that provides a touch-based input method, and users can easily input information or commands intuitively and conveniently through the touch-based input method. In addition to typical input methods using buttons, keyboards, mice, etc., touch-based input methods can also be used as input. The sensor layer can detect the touch or pressure of the user's body or the user's approach. However, for users who are accustomed to inputting information by using writing tools or for specific applications (such as applications for sketching, drawing, etc.), the demand for using a pen that can perform fine touch input is growing. Utility Model Content

[0004] The utility model aims to provide an electronic device for detecting input applied by a pen.

[0005] According to an embodiment of the present invention, an electronic device includes: a display layer, which displays an image; and a sensor layer, which is arranged on the display layer. The sensor layer includes: a plurality of first sensing electrodes, including a plurality of sensing patterns arranged along a first direction and a plurality of bridge patterns that electrically connect adjacent sensing patterns in the plurality of sensing patterns; a plurality of second sensing electrodes, including a plurality of sensing portions arranged along a second direction intersecting the first direction and a first connecting portion extending from the plurality of sensing portions in the second direction; and a pen sensing electrode, which is arranged in the same layer as the plurality of bridge patterns. The pen sensing electrode is arranged in a different layer from the plurality of sensing patterns and the plurality of second sensing electrodes.

[0006] In an embodiment, the pen sensing electrode may include a first pen sensing pattern and a second pen sensing pattern. In a plane, the first pen sensing pattern may overlap with boundaries of the plurality of sensing patterns and boundaries of the plurality of sensing portions, and the second pen sensing pattern may be adjacent to boundaries of the plurality of bridge patterns.

[0007] In an embodiment, the plurality of second sensing electrodes may further include a second connection portion extending from the plurality of sensing portions in the first direction.

[0008] In an embodiment, the pen sensing electrode may further include a third pen sensing pattern, and the third pen sensing pattern may overlap a boundary of the second connection portion in a plane.

[0009] In an embodiment, the pen sensing electrode may further include a fourth pen sensing pattern overlapping the plurality of sensing patterns in a plane.

[0010] In an embodiment, the sensor layer may further include a pen bridge pattern electrically connecting the fourth pen sensing pattern. The pen bridge pattern may be disposed on the same layer as the plurality of sensing patterns and the plurality of second sensing electrodes.

[0011] In an embodiment, the pen bridge patterns may extend in the second direction, and may be arranged to be spaced apart from each other in the first direction.

[0012] In an embodiment, each of the fourth pen sensing patterns may have a size smaller than a size of each of the plurality of sensing patterns in a plane.

[0013] In an embodiment, the fourth pen sensing pattern may be arranged to be spaced apart from the first to third pen sensing patterns in a plane.

[0014] In an embodiment, a plurality of bridge patterns and pen sensing electrodes may be directly disposed on the first layer. A plurality of sensing patterns and a plurality of second sensing electrodes may be directly disposed on the second layer. A distance from the display layer to the second layer may be greater than a distance from the display layer to the first layer.

[0015] In an embodiment, a plurality of sensing patterns and a plurality of second sensing electrodes may be directly disposed on the first layer, and a plurality of bridge patterns and pen sensing electrodes may be directly disposed on the second layer. A distance from the display layer to the second layer may be greater than a distance from the display layer to the first layer.

[0016] According to an embodiment of the present invention, an input sensing unit includes: a plurality of first sensing electrodes including a plurality of sensing patterns arranged along a first direction and a plurality of bridge patterns arranged at a different layer from the plurality of sensing patterns; a plurality of second sensing electrodes including a plurality of sensing portions arranged along a second direction crossing the first direction and a first connecting portion extending from the plurality of sensing portions in the second direction; a first pen sensing pattern arranged at the same layer as the plurality of bridge patterns and overlapping with boundaries of the plurality of sensing patterns and boundaries of the plurality of sensing portions in a plane; and a second pen sensing pattern arranged at the same layer as the plurality of bridge patterns. The second pen sensing pattern is adjacent to the boundary of the plurality of bridge patterns.

[0017] In an embodiment, the plurality of second sensing electrodes may further include a second connection portion extending from the plurality of sensing portions in the first direction.

[0018] In an embodiment, the input sensing unit may further include a third pen sensing pattern disposed at the same layer as the plurality of bridge patterns and overlapping a boundary of the second connection portion in a plane.

[0019] In an embodiment, the input sensing unit may further include: a fourth pen sensing pattern disposed at the same layer as the plurality of bridge patterns and overlapping the plurality of sensing patterns in a plane; and a pen bridge pattern disposed at the same layer as the plurality of sensing patterns and the plurality of second sensing electrodes. The pen bridge pattern electrically connects the fourth pen sensing pattern.

[0020] In an embodiment, the pen bridge patterns may extend in the second direction and be arranged to be spaced apart from each other in the first direction.

[0021] In an embodiment, each of the fourth pen sensing patterns may have a size smaller than a size of each of the plurality of sensing patterns in a plane.

[0022] In an embodiment, the fourth pen sensing pattern may be arranged to be spaced apart from the first to third pen sensing patterns in a plane.

[0023] In an embodiment, the plurality of sensing patterns and the plurality of second sensing electrodes may be directly disposed on the first layer, and the plurality of bridge patterns, the first pen sensing patterns, and the second pen sensing patterns may be directly disposed on the second layer. The second layer may be disposed above the first layer.

[0024] In an embodiment, the plurality of bridge patterns, the first pen sensing pattern, and the second pen sensing pattern may be directly disposed on the first layer, and the plurality of sensing patterns and the plurality of second sensing electrodes may be directly disposed on the second layer. The second layer may be disposed above the first layer.

[0025] In an embodiment, the electronic device may detect an input through a touch and may also detect an input through a pen. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the embodiments of the present invention and are included in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present invention and together with the specification are used to explain the principles of the present invention. In the accompanying drawings:

[0027] Figure 1 is a perspective view of an electronic device according to an embodiment of the present invention;

[0028] Figure 2 is a perspective view of an electronic device according to an embodiment of the present invention;

[0029] Figure 3is a cross-sectional view of an electronic device according to an embodiment of the present utility model;

[0030] Figure 4 is a view for illustrating the operation of an electronic device according to an embodiment of the present invention;

[0031] Figure 5 is a cross-sectional view of an electronic device according to an embodiment of the present utility model;

[0032] Figure 6 is a plan view of a sensor layer according to an embodiment of the present invention;

[0033] Figure 7 According to the embodiment of the present invention, Figure 6 An enlarged view of the area corresponding to AA';

[0034] Figure 8 According to the embodiment of the present invention, Figure 7 A cross-sectional view of the sensor layer taken along line II';

[0035] Fig. 9 According to the embodiment of the present invention, Figure 7 A cross-sectional view of the sensor layer taken along line II';

[0036] Fig.10 According to the embodiment of the present invention, Figure 6 A magnified view of the area corresponding to BB';

[0037] Fig.11 According to the embodiment of the present invention, Fig.10 A cross-sectional view of the sensor layer taken along line II-II';

[0038] Fig.12 is a plan view for illustrating a first mode of embodiment according to the present utility model;

[0039] Fig.13 is a plan view for illustrating a second mode of embodiment according to the concept of the present utility model; and

[0040] Fig.14 It is a plan view for illustrating a third mode of an embodiment according to the concept of the present invention. DETAILED DESCRIPTION

[0041] In this specification, it will be understood that when an element (e.g., a region, a layer, a portion, etc.) is referred to as being "on", "connected to" or "coupled to" another element, the element (e.g., the region, the layer, the portion, etc.) may be directly disposed on / directly connected to / coupled to the other element, or an intervening element may be disposed between the element (e.g., the region, the layer, the portion, etc.) and the other element. When an element (e.g., the region, the layer, the portion, etc.) is referred to as being "directly on", "directly connected to" or "directly coupled to" another element, no intervening element may be disposed between the element (e.g., the region, the layer, the portion, etc.) and the other element.

[0042] The same reference numerals or symbols always refer to the same elements. In the drawings, the thickness, proportion and size of the elements may be exaggerated in order to effectively describe the technical content. The term "and / or" includes all combinations of one or more of the related listed elements.

[0043] Although the terms first, second, etc. can be used to describe various elements, these elements should not be limited by these terms. These terms can only be used to distinguish one element from another element. For example, without departing from the scope of the embodiments of the present invention, the first element can be referred to as the second element, and similarly, the second element can also be referred to as the first element. Unless the context clearly indicates otherwise, the singular form also includes the plural form.

[0044] Terms such as "below", "lower", "above", "upper", etc. may be used herein to describe the relationship of one element to another element shown in the drawings. It will be understood that the terms have relative concepts and are described based on the orientations depicted in the drawings.

[0045] It will be understood that when the terms “include” or “comprising” are used in this specification, it indicates the presence of the stated features, integers, steps, operations, elements, components or combinations thereof, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components or combinations thereof.

[0046] The terms "component" and "unit" mean a software component or a hardware component that performs a specific function. For example, a hardware component may include a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC). A software component may be referred to as data used by executable code and / or executable code in an addressable storage medium. Thus, a software component may be, for example, an object-oriented software component, a class component, and a task component, and may include a process, a function, a property, a program, a subroutine, a program code segment, a driver, firmware, microcode, a circuit, data, a database, a data structure, a table, an array, or a variable.

[0047] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meaning as those generally understood by those skilled in the art to which the embodiments of the present invention are conceived. In addition, terms (such as those defined in general dictionaries) should be interpreted as having the same meaning as that in the context of the relevant technology, and should not be interpreted as being too ideal or too formal unless explicitly defined herein.

[0048] Hereinafter, embodiments of the present inventive concept will be described with reference to the accompanying drawings.

[0049] Figure 1 is a perspective view of an electronic device 1000 according to an embodiment of the present inventive concept.

[0050] Reference Figure 1 , the electronic device 1000 may be a device that is activated in response to an electrical signal. For example, in an embodiment, the electronic device 1000 may be a mobile phone, a foldable mobile phone, a laptop computer, a television, a tablet computer, a car navigation system, a game console, or a wearable device. However, the embodiments of the present invention are not necessarily limited thereto, and the electronic device 1000 may be various other small, medium, or large devices. Figure 1 , the electronic device 1000 is shown as a mobile phone.

[0051] The electronic device 1000 may have an active area 1000A and a peripheral area 1000NA defined therein. The electronic device 1000 may display an image through the active area 1000A. In an embodiment, the active area 1000A may include a surface extending in a plane defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, in an embodiment, the second direction DR2 may be perpendicular to the first direction DR1. However, embodiments of the present invention are not necessarily limited thereto. The peripheral area 1000NA may at least partially surround the active area 1000A. However, embodiments of the present invention are not necessarily limited thereto. For example, in an embodiment of the present invention, the peripheral area 1000NA may be omitted.

[0052] The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. For example, in an embodiment, the third direction DR3 may be perpendicular to the first direction DR1 and the second direction DR2. However, the embodiments of the present invention are not necessarily limited thereto. Therefore, the front surface (e.g., upper surface) and the rear surface (e.g., lower surface) of each member constituting the electronic device 1000 are defined based on the third direction DR3.

[0053] Figure 2is a perspective view of an electronic device 1000 - 1 according to an embodiment of the present inventive concept.

[0054] Reference Figure 2 , the electronic device 1000-1 may include a folding area FA and a plurality of non-folding areas NFA1 and NFA2. The non-folding areas NFA1 and NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. The folding area FA may be disposed between the first non-folding area NFA1 and the second non-folding area NFA2 (e.g., in a first direction DR1). The folding area FA may be referred to as a foldable area, and the first non-folding area NFA1 and the second non-folding area NFA2 may be referred to as a first non-foldable area and a second non-foldable area.

[0055] like Figure 2 As shown in , the folding area FA can be folded relative to the folding axis FX, and the folding axis FX extends parallel to the second direction DR2. In a state in which the electronic device 1000-1 is folded, the folding area FA can have a predetermined curvature and a radius of curvature. When the electronic device 1000-1 is folded, the first non-folding area NFA1 and the second non-folding area NFA2 can face each other. For example, in an embodiment, the electronic device 1000-1 can be folded inwardly so that the display surface DS is not exposed to the outside.

[0056] In an embodiment of the present invention, the electronic device 1000-1 may be folded outward so that the display surface DS is exposed to the outside. In an embodiment of the present invention, the electronic device 1000-1 in the unfolded state may be folded inward or outward. However, the embodiments of the present invention are not necessarily limited thereto.

[0057] Figure 2 It is shown that one folding axis FX is defined in the electronic device 1000-1. However, the embodiments of the present invention are not necessarily limited thereto. For example, in an embodiment, a plurality of folding axes may be defined in the electronic device 1000-1, and the electronic device 1000-1 in the unfolded state may be folded inwardly or outwardly relative to each of the plurality of folding axes.

[0058] Figure 1 and Figure 2 A bar-type electronic device 1000 and a foldable electronic device 1000-1 are shown as examples, respectively. However, embodiments of the present invention are not necessarily limited thereto. For example, the following description may be applied to various electronic devices such as a curved electronic device, a rollable electronic device, or a slidable electronic device.

[0059] Figure 3 is a cross-sectional view of an electronic device 1000 according to an embodiment of the inventive concept.

[0060] Reference Figure 3 In an embodiment, the electronic device 1000 may include a display layer 100 , a sensor layer 200 (eg, an input sensing unit), an anti-reflection layer 300 , and a window 400 .

[0061] The display layer 100 may include a base substrate 110 , a circuit layer 120 , a light emitting element layer 130 , and an encapsulation layer 140 .

[0062] The base substrate 110 may be a member that provides a base surface on which the circuit layer 120 is disposed. In an embodiment, the base substrate 110 may be a glass substrate, a metal substrate, a polymer substrate, etc. However, embodiments of the present invention are not necessarily limited thereto, and the base substrate 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0063] The circuit layer 120 may be disposed on the base substrate 110 (e.g., directly disposed on the base substrate 110 in the third direction DR3). In an embodiment, the circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. In an embodiment, an insulating layer, a semiconductor layer, and a conductive layer are formed on the base substrate 110 by coating, deposition, etc., and then the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by performing a photolithography process multiple times. Thereafter, a semiconductor pattern, a conductive pattern, and a signal line included in the circuit layer 120 may be formed.

[0064] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, in an embodiment, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0065] The encapsulation layer 140 may be disposed on (eg, directly on) the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and impurities such as dust particles.

[0066] The sensor layer 200 may be disposed on the display layer 100. For example, in an embodiment, the sensor layer 200 may be formed on the display layer 100 by a continuous process. In this embodiment, this may mean that the sensor layer 200 is directly disposed on the display layer 100. The term “directly disposed” may mean that there is no intervening layer between the sensor layer 200 and the display layer 100. For example, an additional bonding member may not be disposed between the sensor layer 200 and the display layer 100. Alternatively, in an embodiment, the sensor layer 200 may be bonded to the display layer 100 via a bonding member. The bonding member may include a typical bonding agent or adhesive known in the art.

[0067] In an embodiment, the anti-reflection layer 300 may be disposed on the sensor layer 200. The anti-reflection layer 300 may reduce the reflectivity of external light incident from the outside of the electronic device 1000. In an embodiment, the anti-reflection layer 300 may be directly disposed on the sensor layer 200 (for example, directly disposed on the sensor layer 200 in the third direction DR3). However, embodiments of the present inventive concept are not necessarily limited thereto, and in some embodiments, an adhesive member may be disposed between the anti-reflection layer 300 and the sensor layer 200.

[0068] The window 400 may be disposed on the anti-reflection layer 300 (e.g., disposed on the anti-reflection layer 300 in the third direction DR3). In an embodiment, an adhesive member may be disposed between the anti-reflection layer 300 and the window 400. However, embodiments of the present invention are not necessarily limited thereto. The window 400 may include an optically transparent insulating material. For example, in an embodiment, the window 400 may include glass or plastic. The window 400 may have a multilayer structure or a single-layer structure. For example, the window 400 may include a plurality of plastic films bonded via an adhesive, or a glass substrate and a plastic film bonded via an adhesive.

[0069] Figure 4 is a view illustrating the operation of the electronic device 1000 according to an embodiment of the present inventive concept.

[0070] Reference Figure 4 In an embodiment, the electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power circuit 1000P.

[0071] The display layer 100 may be a component that basically forms an image. For example, in an embodiment, the display layer 100 may be a light-emitting display layer, and may be, for example, an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. However, embodiments of the present invention are not necessarily limited thereto.

[0072] The sensor layer 200 may be disposed on the display layer 100 (e.g., directly disposed on the display layer 100). The sensor layer 200 may detect an external input applied from the outside. In an embodiment, the sensor layer 200 may be an integrated sensor continuously formed during the manufacturing process of the display layer 100, and may be an external sensor attached to the display layer 100. The sensor layer 200 may be referred to as a sensor, an input sensing layer, an input sensing panel, or an electronic device for sensing input coordinates.

[0073] The sensor layer 200 may detect a first input 2000 or a second input 3000 applied from the outside. Both the first input 2000 and the second input 3000 may be input methods that may cause a change in the capacitance of the sensor layer 200. For example, in an embodiment, the first input 2000 may be a passive input method such as a body part of a user (e.g., a finger of a user). The second input 3000 may be an input through a pen PN. For example, the pen PN may be a passive pen or an active pen.

[0074] In an embodiment of the present invention, the pen PN may be a device that generates a magnetic field having a predetermined resonant frequency. The pen PN may be configured to transmit an output signal based on electromagnetic resonance. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus pen, or an electromagnetic resonance pen.

[0075] In an embodiment, the pen PN may include an LC resonant circuit. The LC resonant circuit may include an inductor L and a capacitor C. In an embodiment of the present invention, the LC resonant circuit may be a variable resonant circuit in which the resonant frequency varies. In this embodiment, the inductor L may be a variable inductor and / or the capacitor C may be a variable capacitor. However, the embodiments of the present invention are not necessarily limited thereto.

[0076] The inductor L generates a current caused by a magnetic field formed in the sensor layer 200. The generated current is transmitted to the capacitor C. The capacitor C charges the current input from the inductor L and then discharges the charged current into the inductor L. Thereafter, the inductor L may generate a magnetic field having a resonant frequency. The induced current may flow in the sensor layer 200 due to the magnetic field generated by the pen PN, and the induced current may be transmitted to the sensor driver 200C as a reception signal (or a sensing signal).

[0077] The main driver 1000C may control the overall operation of the electronic device 1000. For example, the main driver 1000C may control the operation of the display driver 100C and the sensor driver 200C. In an embodiment, the main driver 1000C may include at least one microprocessor and also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0078] The display driver 100C may drive the display layer 100. The display driver 100C may receive video data and control signals from the main driver 1000C. The control signals may include various signals. For example, in an embodiment, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, a data enable signal, etc.

[0079] The sensor driver 200C may drive the sensor layer 200. The sensor driver 200C may receive a control signal from the main driver 1000C. The control signal may include a clock signal from the sensor driver 200C. In addition, the control signal may further include a mode determination signal that determines a driving mode of each of the sensor driver 200C and the sensor layer 200.

[0080] In an embodiment, the sensor driver 200C and the sensor layer 200 may be driven in a first mode, a second mode, or a third mode. For example, the first mode is a mode in which the first input 2000 is sensed, the second mode is a charging mode in which the second input 3000 is sensed, and the third mode is a mode in which the second input 3000 is sensed. The first mode may be referred to as a touch sensing mode, and the second and third modes may be referred to as pen sensing modes.

[0081] The switching between the touch sensing mode and the pen sensing mode can be variously modified. For example, in an embodiment, the sensor driver 200C and the sensor layer 200 can detect the first input 2000 and the second input 3000 by time-division driving. Optionally, the switching between the touch sensing mode and the pen sensing mode can be performed by the user's selection and / or any one of the touch sensing mode and the pen sensing mode can be activated or switched by the activation of a specific application. In addition, when the sensor driver 200C and the sensor layer 200 operate alternately in the touch sensing mode and the pen sensing mode, the touch sensing mode can be maintained when the first input 2000 is detected, or the pen sensing mode can be maintained when the second input 3000 is detected.

[0082] In an embodiment, the sensor driver 200C may calculate coordinate information about the input based on the signal received from the sensor layer 200, and provide a coordinate signal having the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user input based on the coordinate signal. For example, the main driver 1000C may operate the display driver 100C so that a new application image is displayed on the display layer 100.

[0083] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P may generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, in an embodiment, the plurality of driving voltages may include a gate high voltage, a gate low voltage, an ELVSS voltage, an ELVDD voltage, an initialization voltage, etc. However, the embodiments of the present utility model concept are not necessarily limited thereto.

[0084] Figure 5 is a cross-sectional view of an electronic device 1000 according to an embodiment of the inventive concept.

[0085] Reference Figure 5 In an embodiment, the electronic device 1000 may include a display layer 100, a sensor layer 200, an anti-reflection layer 300, an adhesive layer ADH, and a window 400. The adhesive layer ADH may be disposed between the anti-reflection layer 300 and the window 400 (e.g., disposed between the anti-reflection layer 300 and the window 400 in the third direction DR3). In an embodiment, the adhesive layer ADH may include a typical binder that provides light transmission or an adhesive known in the art.

[0086] At least one inorganic layer is formed on the upper surface of the base substrate 110. In an embodiment, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed as a multilayer. The multilayer inorganic layer may be composed of a barrier layer and / or a buffer layer. Figure 5 In the embodiment shown in FIG. 1 , the display layer 100 is shown to include a buffer layer BFL.

[0087] The buffer layer BFL may increase the bonding force between the base substrate 110 and the semiconductor pattern. In an embodiment, the buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may have a structure in which silicon oxide layers and silicon nitride layers are alternately stacked (e.g., alternately stacked in the third direction DR3).

[0088] The semiconductor pattern may be disposed on the buffer layer BFL (e.g., directly disposed on the buffer layer BFL in the third direction DR3). In an embodiment, the semiconductor pattern may include polysilicon. However, the embodiments of the present invention are not necessarily limited thereto, and in some embodiments, the semiconductor pattern may include amorphous silicon, low temperature polysilicon, or an oxide semiconductor.

[0089] Figure 5 A portion of a semiconductor pattern is shown, but the semiconductor pattern may also be disposed in another region. The semiconductor pattern may be arranged throughout the pixel according to a specific design rule. The semiconductor pattern may have different electrical properties depending on whether it is doped. For example, in an embodiment, the semiconductor pattern may include a first region with high conductivity and a second region with low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region may be an undoped region, or may be a doped region having a concentration lower than that of the first region.

[0090] The first region may have a higher conductivity than the second region and may be substantially used as an electrode or a signal line. The second region may substantially correspond to an active region (e.g., a channel) of a transistor. For example, a portion of the semiconductor pattern may be an active region of a transistor, another portion may be a source or drain of the transistor, and another portion may be a connecting electrode or a connecting signal line.

[0091] In the embodiment, each pixel may have an equivalent circuit including seven transistors, one capacitor, and a light emitting element, and the equivalent circuit diagram of the pixel may be converted into various forms. Figure 5 One transistor 100PC and a light emitting element 100PE included in a pixel are shown as an example.

[0092] The source region SC, the active region AL, and the drain region DR of the transistor 100PC may be formed of a semiconductor pattern. The source region SC and the drain region DR may extend in opposite directions (eg, a first direction DR1) from the active region AL in a cross-section. Figure 5 A portion of a connection signal line SCL formed of a semiconductor pattern is shown. In an embodiment, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC on a plane.

[0093] The first insulating layer 10 may be disposed on the buffer layer BFL (e.g., directly disposed on the buffer layer BFL in the third direction DR3). The first insulating layer 10 may be commonly overlapped with a plurality of pixels and cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and have a single-layer or multi-layer structure. In an embodiment, the first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. Not only the first insulating layer 10 but also the insulating layer in the circuit layer 120 described below may be an inorganic layer and / or an organic layer, and have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above-mentioned materials. However, the embodiments of the utility model concept are not necessarily limited thereto.

[0094] The gate GT of the transistor 100PC may be disposed on the first insulating layer 10 (e.g., directly disposed on the first insulating layer 10 in the third direction DR3). The gate GT may be part of a metal pattern. The gate GT may overlap with the active area AL (e.g., overlap with the active area AL in the third direction DR3). In an embodiment, the gate GT may be used as a mask during a process of doping a semiconductor pattern.

[0095] The second insulating layer 20 may be disposed on the first insulating layer 10 (e.g., directly disposed on the first insulating layer 10 in the third direction DR3) and cover the gate GT. The second insulating layer 20 may be commonly overlapped with the pixel (e.g., commonly overlapped with the pixel in the third direction DR3). The second insulating layer 20 may be an inorganic layer and / or an organic layer and have a single-layer or multi-layer structure. In an embodiment, the second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In the present embodiment, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0096] The third insulating layer 30 may be disposed on the second insulating layer 20 (e.g., directly disposed on the second insulating layer 20 in the third direction DR3). The third insulating layer 30 may have a single layer or a multi-layer structure. For example, in an embodiment in which the third insulating layer 30 may have a multi-layer structure, a silicon oxide layer and a silicon nitride layer may be included. However, embodiments of the present invention are not necessarily limited thereto.

[0097] The first connection electrode CNE1 may be disposed on the third insulating layer 30 (eg, directly disposed on the third insulating layer 30 ). In embodiments, the first connection electrode CNE1 may be connected to the connection signal line SCL via a contact hole CNT- 1 passing through the first, second, and third insulating layers 10 , 20 , and 30 .

[0098] The fourth insulating layer 40 may be disposed on the third insulating layer 30 (e.g., directly disposed on the third insulating layer 30 in the third direction DR3). The fourth insulating layer 40 may be a single silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40 (e.g., directly disposed on the fourth insulating layer 40 in the third direction DR3). The fifth insulating layer 50 may be an organic layer.

[0099] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50 (eg, directly on the fifth insulating layer 50 ). The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a contact hole CNT- 2 passing through the fourth insulating layer 40 and the fifth insulating layer 50 .

[0100] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 (eg, directly on the fifth insulating layer 50 in the third direction DR3 ) and cover the second connection electrode CNE2 . The sixth insulating layer 60 may be an organic layer.

[0101] The light emitting element layer 130 may be disposed on the circuit layer 120 (e.g., disposed on the circuit layer 120 in the third direction DR3). The light emitting element layer 130 may include a light emitting element 100PE. For example, in an embodiment, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. Hereinafter, as an example, it will be shown that the light emitting element 100PE is an organic light emitting element. However, the embodiments of the present invention are not necessarily limited thereto.

[0102] The light emitting element 100PE may include a first electrode AE, a light emitting layer EL, and a second electrode CE.

[0103] The first electrode AE ​​may be disposed on the sixth insulating layer 60 (eg, directly disposed on the sixth insulating layer 60 ). In an embodiment, the first electrode AE ​​may be connected to the second connection electrode CNE2 via a contact hole CNT- 3 passing through the sixth insulating layer 60 .

[0104] The pixel defining film 70 may be disposed on the sixth insulating layer 60 (e.g., directly disposed on the sixth insulating layer 60 in the third direction DR3) and cover a portion of the first electrode AE. The pixel defining film 70 has an opening 70-OP defined therein. The opening 70-OP of the pixel defining film 70 may expose at least a portion of the first electrode AE ​​(such as a central portion of the first electrode AE).

[0105] Effective area 1000A (see Figure 1 ) may include a light emitting region PXA and a non-light emitting region NPXA adjacent to the light emitting region PXA. The non-light emitting region NPXA may surround the light emitting region PXA. In this embodiment, the light emitting region PXA is defined to correspond to a portion of the first electrode AE ​​exposed by the opening 70-OP.

[0106] The light emitting layer EL may be disposed on the first electrode AE ​​(e.g., disposed on the first electrode AE ​​in the third direction DR3). The light emitting layer EL may be disposed on a region corresponding to the opening 70-OP. For example, the light emitting layer EL may be formed separately in each pixel. In an embodiment in which the light emitting layer EL is formed separately in each pixel, the light emitting layer EL may emit light of at least one color of blue, red, and green. However, the embodiments of the utility model concept are not necessarily limited thereto. In an embodiment, the light emitting layer EL may be connected to each of the pixels and included as a common layer. In this embodiment, the light emitting layer EL may provide blue light or white light.

[0107] The second electrode CE may be disposed on the light emitting layer EL (eg, disposed on the light emitting layer EL in the third direction DR3 ). The second electrode CE may have an integral shape and be commonly included in a plurality of pixels.

[0108] In an embodiment, a hole control layer may be disposed between the first electrode AE ​​and the light emitting layer EL. The hole control layer may be commonly disposed in the light emitting region PXA and the non-light emitting region NPXA. The hole control layer may include a hole transport layer and also include a hole injection layer. The electron control layer may be disposed between the light emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and also include an electron injection layer. In an embodiment, the hole control layer and the electron control layer may be commonly formed in a plurality of pixels by using an open mask or by an inkjet process.

[0109] The encapsulation layer 140 may be disposed on the light emitting element layer 130 (e.g., directly disposed on the light emitting element layer 130 in the third direction DR3). In an embodiment, the encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially (e.g., sequentially stacked in the third direction DR3). However, the layers constituting the encapsulation layer 140 are not necessarily limited thereto. The inorganic layer may protect the light emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light emitting element layer 130 from foreign matter such as dust particles. In an embodiment, the inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, and the like. The organic layer may include an acylate organic layer. However, the embodiments of the utility model concept are not necessarily limited thereto.

[0110] In an embodiment, the sensor layer 200 may include a base layer 201 , a first conductive layer 202 , a sensing insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0111] In an embodiment, the base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 may be an organic layer including epoxy resin, acrylic resin, or imide resin. The base layer 201 may have a single-layer structure or a multi-layer structure in which layers are stacked along the third direction DR3.

[0112] The first conductive layer 202 and the second conductive layer 204 may each have a single-layer structure or a multi-layer structure in which layers are stacked along the third direction DR3 .

[0113] In an embodiment, the conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. For example, in an embodiment, the metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc.

[0114] The conductive layer having a multi-layer structure may include a metal layer. In an embodiment, the metal layer may have a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0115] At least one of the sensing insulating layer 203 and the capping insulating layer 205 may include an inorganic film. In an embodiment, the inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0116] At least one of the sensing insulating layer 203 and the cover insulating layer 205 may include an organic film. In an embodiment, the organic film may include at least one of an acylate-based resin, a methacrylate-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyimide-based resin, a polyamide-based resin, and a perylene-based resin.

[0117] The anti-reflection layer 300 may be disposed on the sensor layer 200 (eg, directly on the sensor layer 200 in the third direction DR3 ). The anti-reflection layer 300 may include a spacer layer 310 , a plurality of color filters 320 , and a planarization layer 330 .

[0118] The separation layer 310 may be disposed to overlap with the conductive pattern of the second conductive layer 204 (e.g., overlap with the conductive pattern of the second conductive layer 204 in the third direction DR3). The cover insulating layer 205 may be disposed between the separation layer 310 and the second conductive layer 204 (e.g., disposed between the separation layer 310 and the second conductive layer 204 in the third direction DR3). However, the embodiments of the present invention are not necessarily limited thereto. For example, in the embodiments of the present invention, the cover insulating layer 205 may be omitted.

[0119] The partition layer 310 can prevent the reflection of external light caused by the second conductive layer 204. The material constituting the partition layer 310 is not necessarily limited as long as it is a light absorbing material. The partition layer 310 can be a layer having a black color, and in an embodiment, the partition layer 310 can include a black colorant. The black colorant can include a black dye and a black pigment. The black colorant can include carbon black, a metal such as chromium, or an oxide thereof.

[0120] The partition layer 310 may have a partition opening 310-OP defined therein. The partition opening 310-OP may overlap the light emitting layer EL (e.g., overlap the light emitting layer EL in the third direction DR3). The color filter 320 may be disposed to correspond to the partition opening 310-OP. The color filter 320 may transmit light provided from the light emitting layer EL overlapped with the color filter 320.

[0121] The planarization layer 330 may cover the partition layer 310 and the color filter 320. The planarization layer 330 may include an organic material and provide a relatively flat upper surface. However, embodiments of the present invention are not necessarily limited thereto. For example, in an embodiment, the planarization layer 330 may be omitted.

[0122] In an embodiment of the present invention, the anti-reflection layer 300 may include a reflection control layer instead of the color filter 320. For example, Figure 5 In the illustration of FIG. 3 , the color filter 320 may be omitted, and a reflection control layer may be added to the position where the color filter 320 is omitted. The reflection control layer may selectively absorb light within a partial wavelength band of light reflected from the inside of the display panel and / or the electronic device or light incident from the outside of the display panel and / or the electronic device.

[0123] For example, in an embodiment, the reflection control layer may absorb light having a first wavelength range of about 490 nm to about 505 nm and a second wavelength range of about 585 nm to about 600 nm. The reflection control layer may be configured to have a transmittance of about 40% or less in the first wavelength range and the second wavelength range. The reflection control layer may absorb light having a wavelength that falls outside the wavelength range of red light, green light, and blue light emitted from the light emitting layer EL. Therefore, the reflection control layer absorbs light having a wavelength that does not fall within the wavelength range of red light, green light, or blue light emitted from the light emitting layer EL, thereby preventing or reducing a decrease in the brightness of the display panel and / or the electronic device. In addition, a decrease in the luminous efficiency of the display panel and / or the electronic device may be prevented or minimized, and visibility may also be improved.

[0124] In an embodiment, the reflection control layer may be provided as an organic material layer including a dye, a pigment or a combination thereof. For example, in an embodiment, the reflection control layer may include a tetraazaporphyrin (TAP) compound, a porphyrin compound, a metal porphyrin compound, an oxazine compound, a squarylium compound, a triarylmethane compound, a polymethine compound, anthraquinone compound, a phthalocyanine compound, an azo compound, a perylene compound, an xanthene compound, a diimmonium-based compound, a dipyrromethene-based compound, a cyanine compound or a combination thereof.

[0125] In an embodiment, the reflection control layer may have a transmittance in a range of about 64% to about 72%.The transmittance of the reflection control layer may be adjusted according to the content of the pigment and / or dye included in the reflection control layer.

[0126] Figure 6 is a plan view of a sensor layer 200 according to an embodiment of the inventive concept. Figure 7 is with Figure 6 Magnified view of the area corresponding to AA'.

[0127] Reference Figure 6 and Figure 7 , a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A may be defined in the sensor layer 200. The sensing region 200A may be adjacent to the active region 1000A (see Figure 1 ) corresponds, and the peripheral area 1000NA (see Figure 1 ) can correspond to the peripheral area 200NA. Figure 6 The sensing region 200A having a quadrilateral frame shape (e.g., having a quadrilateral frame shape in a plane defined in the first direction DR1 and the second direction DR2) and the peripheral region 200NA having a quadrilateral frame shape (e.g., having a quadrilateral frame shape in a plane defined in the first direction DR1 and the second direction DR2) and surrounding the sensing region 200A are shown. However, the shapes and arrangements of the sensing region 200A and the peripheral region 200NA are not necessarily limited thereto.

[0128] In an embodiment, the sensor layer 200 may include a first electrode SE1, a second electrode SE2, and a pen sensing electrode PSP arranged in a sensing area 200A, and a plurality of signal lines TL1 and TL2, a plurality of pen signal lines TL_P1 and TL_P2, a plurality of pads (or referred to as "pads" or "pads") PD1 and PD2, and a plurality of pen pads PD_P1 and PD_P2 arranged in the pen sensing electrode PSP and a peripheral area 200NA. The first electrode SE1 may be referred to as a plurality of first sensing electrodes, and the second electrode SE2 may be referred to as a plurality of second sensing electrodes.

[0129] In an embodiment, the first electrodes SE1 may each extend along the first direction DR1, and the first electrodes SE1 may be arranged to be spaced apart from each other in the second direction DR2. The second electrodes SE2 may each extend along the second direction DR2, and the second electrodes SE2 may be arranged to be spaced apart from each other in the first direction DR1. The first electrodes SE1 and the second electrodes SE2 may extend to cross each other while being insulated from each other. Figure 6 Fifteen first electrodes SE1 and ten second electrodes SE2 are shown as an example. However, the number of first electrodes SE1 and the number of second electrodes SE2 are not necessarily limited thereto and may vary.

[0130] The first electrode SE1 may include a plurality of sensing patterns SP1 arranged along the first direction DR1 and a plurality of bridge patterns BP electrically connected to the plurality of sensing patterns SP1, respectively. Two sensing patterns SP1 adjacent to each other (e.g., adjacent to each other in the first direction DR1) among the plurality of sensing patterns SP1 may be electrically connected to each other via the bridge pattern BP. For example, in an embodiment, the bridge pattern BP may be disposed between two sensing patterns SP1 adjacent to each other in the first direction DR1, and electrically connect the two sensing patterns SP1. The plurality of bridge patterns BP may be disposed on a different layer from the layer on which the plurality of sensing patterns SP1 and the second electrode SE2 are disposed.

[0131] The second electrode SE2 may include a plurality of sensing parts SP2 arranged along the second direction DR2 and a first connection part CP1 extending from the plurality of sensing parts SP2 in the second direction DR2, respectively. In an embodiment, the plurality of sensing parts SP2 and the first connection part CP1 may be formed integrally. The plurality of sensing parts SP2 and the first connection part CP1 may be disposed on the same layer. The first connection part CP1 may be electrically connected to the plurality of sensing parts SP2. The first connection part CP1 may be disposed between two sensing parts SP2 adjacent to each other in the second direction DR2 so that the two sensing parts SP2 are electrically connected. The first connection part CP1 may be defined as a portion of the second electrode SE2 that intersects with the first electrode SE1. The first connection part CP1 and the plurality of bridge patterns BP may be disposed on different layers, respectively, and intersect with each other while being insulated from each other (for example, intersecting with each other in the third direction DR3).

[0132] In an embodiment, the second electrode SE2 may further include second connection portions CP2 extending from the plurality of sensing portions SP2 in the first direction DR1, respectively. In an embodiment, the plurality of sensing portions SP2 and the second connection portion CP2 may be formed integrally. The plurality of sensing portions SP2 and the second connection portion CP2 may be disposed on the same layer with each other. For example, the plurality of sensing portions SP2, the first connection portion CP1 and the second connection portion CP2 may be formed integrally, and the second electrode SE2 may be disposed on the same layer. In addition, the second electrode SE2 may be disposed on the same layer with the plurality of sensing patterns SP1. The second connection portion CP2 may be electrically connected to the plurality of sensing portions SP2. The second connection portion CP2 may be disposed between two sensing portions SP2 adjacent to each other in the first direction DR1 so that the two sensing portions SP2 are electrically connected to each other. The second connection portion CP2 may be defined as a portion that does not intersect with the plurality of bridge patterns BP. For example, the second connection portion CP2 may not overlap with the bridge pattern BP (for example, not overlap with the bridge pattern BP in the third direction DR3).

[0133] Figure 6 and Figure 7It is shown that the second electrode SE2 includes the second connection portion CP2. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in an embodiment, the second electrode SE2 may include only the first connection portion CP1.

[0134] The pen sensing electrode PSP may include a first pen sensing pattern PSP1 and a second pen sensing pattern PSP2. The first pen sensing pattern PSP1 may overlap with the boundaries of the plurality of sensing patterns SP1 and the boundaries of the plurality of sensing parts SP2 when viewed from the top (such as in a plan view) (e.g., overlap in the third direction DR3). The second pen sensing pattern PSP2 may be adjacent to the boundaries of the plurality of bridge patterns BP. The first pen sensing pattern PSP1 and the second pen sensing pattern PSP2 may be integrally formed.

[0135] In an embodiment in which the second electrode SE2 includes a second connection portion CP2, the pen sensing electrode PSP may further include a third pen sensing pattern PSP3. When viewed from the top, the third pen sensing pattern PSP3 may overlap with a boundary of the second connection portion CP2 (e.g., overlap in a third direction DR3). The third pen sensing pattern PSP3 may be formed integrally with the first pen sensing pattern PSP1 and the second pen sensing pattern PSP2. In an embodiment, the pen sensing electrode PSP may be disposed at the same layer as the plurality of bridge patterns BP of the first electrode SE1.

[0136] The sensor layer 200 may further include a plurality of dummy patterns such as a first dummy pattern DM1 and a second dummy pattern DM2. The plurality of dummy patterns may be disposed in the same layer as the plurality of sensing patterns SP1 and the second electrode SE2. For example, in an embodiment, the plurality of dummy patterns such as the first dummy pattern DM1 and the second dummy pattern DM2 may be disposed in a different layer from the layer on which the pen sensing electrode PSP is disposed. In an embodiment, the plurality of dummy patterns DM1 and DM2 may include a first dummy pattern DM1 and a second dummy pattern DM2. However, the embodiments of the present invention are not necessarily limited thereto, and the number of the plurality of dummy patterns may vary. In an embodiment, the first dummy pattern DM1 may be formed in one sensing pattern SP1 (such as the central portion of one sensing pattern SP1), and the second dummy pattern DM2 may be formed in one sensing portion SP2 (such as the central portion of one sensing portion SP2). However, the embodiments of the present invention are not necessarily limited thereto. For example, in an embodiment, when viewed from the top (e.g., in a plan view), a dummy pattern disposed in a different layer while overlapping the pen sensing electrode PSP may be additionally included.

[0137] In an embodiment, the plurality of signal lines may include a plurality of first signal lines TL1 connected to the first electrode SE1 and a plurality of second signal lines TL2 connected to the second electrode SE2. The plurality of pads PD1 and PD2 may include a first pad PD1 and a second pad PD2. In an embodiment, a driving signal may be applied to the plurality of second electrodes SE2 via the plurality of second signal lines TL2, and a change in capacitance formed between the first electrode SE1 and the second electrode SE2 may be output as a sensing signal via the plurality of first signal lines TL1. Fig.12 Describe its detailed description.

[0138] The first ends of the plurality of first signal lines TL1 may be connected to the first ends of the first electrodes SE1. In an embodiment, the plurality of first signal lines TL1 may extend to the lower side of the peripheral area 200NA (e.g., extend to the lower side of the peripheral area 200NA in the second direction DR2), and the second ends of the plurality of first signal lines TL1 may be connected to the first pad PD1.

[0139] First ends of the plurality of second signal lines TL2 may be connected to the first end of the second electrode SE2. The plurality of second signal lines TL2 may extend to the peripheral area 200NA, and second ends of the plurality of second signal lines TL2 may be connected to the second pads PD2, respectively.

[0140] In an embodiment, the plurality of first signal lines TL1 connected to the first electrode SE1 may all be receiving lines, and the plurality of second signal lines TL2 connected to the second electrode SE2 may all be transmission lines. However, the embodiments of the present invention are not necessarily limited thereto, and in some embodiments, the plurality of first signal lines TL1 may all be transmission lines, and the plurality of second signal lines TL2 may all be receiving lines.

[0141] In an embodiment, the first and second pads PD1 and PD2 and the plurality of pen pads PD_P1 and PD_P2 may be arranged in a peripheral area 200NA adjacent to a lower side of the sensing area 200A on a plane (eg, in the second direction DR2 ). Figure 6 It is shown that the first and second pads PD1 and PD2 and the plurality of pen pads PD_P1 and PD_P2 are arranged in a row with the data driver DDC. However, embodiments of the present inventive concept are not necessarily limited thereto.

[0142] In an embodiment, the plurality of pen signal lines TL_P1 and TL_P2 may include a first pen signal line TL_P1 and a second pen signal line TL_P2. The plurality of pen pads PD_P1 and PD_P2 may include a first pen pad PD_P1 and a second pen pad PD_P2.

[0143] The first pen signal line TL_P1 may extend to the peripheral area 200NA, and the first end and the second end of the first pen signal line TL_P1 may be connected to the first pen pad PD_P1. The first pen signal line TL_P1 may be electrically connected to all the pen sensing electrodes PSP. Any one of the first pen signal line TL_P1 and the pen sensing electrode PSP may form a coil. Therefore, the pen disposed in the area adjacent to the peripheral area 200NA may also be fully charged by the portion of the first pen signal line TL_P1 formed on the left and right sides of the sensor layer 200.

[0144] In an embodiment, the second pen signal line TL_P2 may be connected to the pen sensing electrode PSP in a one-to-one correspondence. In addition, the second pen signal line TL_P2 may extend to the peripheral area 200NA to be connected to the second pen pad PD_P2. For example, the second pen signal line TL_P2 may be connected to the second pen pad PD_P2 in a one-to-one correspondence. For example, the first end of the second pen signal line TL_P2 may be connected to the pen sensing electrode PSP, and the second end of the second pen signal line TL_P2 may be connected to the second pen pad PD_P2.

[0145] Figure 8 It is along Figure 7 FIG. 2 is a cross-sectional view of the sensor layer 200 taken along the cutting line II′.

[0146] Reference Figure 5 , Figure 7 and Figure 8 In an embodiment, the plurality of bridge patterns BP may be electrically connected to the plurality of sensing patterns SP1 via contact holes passing through the sensing insulating layer 203. The plurality of bridge patterns BP may be disposed on the same layer as the pen sensing electrode PSP, and the plurality of bridge patterns BP may be disposed on a different layer from the layer on which the plurality of sensing patterns SP1 and the second electrode SE2 are disposed. Figure 8 A plurality of sensing patterns SP1 , a second pen sensing pattern PSP2 among the pen sensing electrodes PSP, and a first connection portion CP1 of the second electrode SE2 are shown.

[0147] In an embodiment, a plurality of bridge patterns BP and pen sensing electrodes PSP may be disposed on the first layer (or base layer) 201 (e.g., directly disposed on the first layer (or base layer) 201 in the third direction DR3), and a plurality of sensing patterns SP1 and second electrodes SE2 may be disposed on the second layer (or sensing insulating layer) 203 (e.g., directly disposed on the second layer (or sensing insulating layer) 203 in the third direction DR3). For example, the first conductive layer 202 of the sensor layer 200 may include a plurality of bridge patterns BP and pen sensing electrodes PSP, and the second conductive layer 204 of the sensor layer 200 may include a plurality of sensing patterns SP1 and second electrodes SE2. The second layer 203 may be disposed on the first layer 201 (e.g., disposed on the first layer 201 in the third direction DR3). The distance from the display layer 100 to the second layer 203 may be greater than the distance from the display layer 100 to the first layer 201. For example, a distance from the base substrate 110 to the second layer 203 in the third direction DR3 may be greater than a distance from the base substrate 110 to the first layer 201 .

[0148] Fig. 9 It is along Figure 7 FIG. 2 is a cross-sectional view of the sensor layer 200 a taken along the cutting line II′.

[0149] Reference Figure 5 , Figure 7 and Fig. 9 In an embodiment, the plurality of bridge patterns BP may be electrically connected to the plurality of sensing patterns SP1 via contact holes passing through the sensing insulating layer 203. The plurality of bridge patterns BP may be disposed on the same layer as the pen sensing electrode PSP, and the plurality of bridge patterns BP may be disposed on a different layer from the layer on which the plurality of sensing patterns SP1 and the second electrode SE2 are disposed. Fig. 9 A plurality of sensing patterns SP1 , a second pen sensing pattern PSP2 among the pen sensing electrodes PSP, and a first connection portion CP1 of the second electrode SE2 are shown.

[0150] In an embodiment, a plurality of sensing patterns SP1 and a second electrode SE2 may be disposed on the first layer 201 (e.g., directly disposed on the first layer 201 in the third direction DR3), and a plurality of bridge patterns BP and a pen sensing electrode PSP may be disposed on the second layer 203 (e.g., directly disposed on the second layer 203 in the third direction DR3). For example, the first conductive layer 202 of the sensor layer 200 may include a plurality of sensing patterns SP1 and a second electrode SE2, and the second conductive layer 204 of the sensor layer 200 may include a plurality of bridge patterns BP and a pen sensing electrode PSP. The second layer 203 may be disposed on the first layer 201 (e.g., disposed on the first layer 201 in the third direction DR3). The distance from the display layer 100 to the second layer 203 may be greater than the distance from the display layer 100 to the first layer 201. For example, the distance from the base substrate 110 to the second layer 203 in the third direction DR3 may be greater than the distance from the base substrate 110 to the first layer 201.

[0151] Fig.10 is with Figure 6 Magnified view of the area corresponding to BB'. Fig.11 It is along Fig.10 The cross-sectional view of the sensor layer 200b is taken along the cutting line II-II'. Figures 1 to 8 describe Fig.10 and Fig.11 , and in order to save description, the description of the same figure numerals or symbols previously described may be omitted.

[0152] Reference Fig.10 , when viewed from the top, the pen sensing electrode PSPa may further include a fourth pen sensing pattern PSP4 overlapping with the plurality of sensing patterns SP1 (e.g., overlapping with the plurality of sensing patterns SP1 in the third direction DR3). When viewed from the top, the fourth pen sensing pattern PSP4 may be arranged to be spaced apart from the first pen sensing pattern PSP1, the second pen sensing pattern PSP2, and the third pen sensing pattern PSP3 (e.g., spaced apart in the first direction DR1 and / or the second direction DR2). When viewed from the top, the fourth pen sensing pattern PSP4 may have a smaller size (e.g., an area in a plane defined in the first direction DR1 and the second direction DR2) than the plurality of sensing patterns SP1. The pen sensing electrode PSPa may be disposed in the same layer as the plurality of bridge patterns BP. For example, the fourth pen sensing pattern PSP4 may be disposed in the same layer as the plurality of bridge patterns BP. The pen sensing electrode PSPa further includes the fourth pen sensing pattern PSP4, and thus, the pen sensing area may be increased. Therefore, the sensing sensitivity for pen sensing may be increased.

[0153] The sensor layer 200b may further include a pen bridge pattern P_BP electrically connecting the fourth pen sensing pattern PSP4. In an embodiment, the pen bridge pattern P_BP may extend in the second direction DR2 and be arranged to be spaced apart from each other in the first direction DR1. The pen bridge pattern P_BP may be disposed in the same layer as the plurality of sensing patterns SP1 and the second electrode SE2. For example, the pen bridge pattern P_BP may be disposed in a different layer from the layer on which the fourth pen sensing pattern PSP4 is disposed and electrically connected to the fourth pen sensing pattern PSP4.

[0154] Reference Figure 5 , Fig.10 and Fig.11 In an embodiment, the plurality of bridge patterns BP may be electrically connected to the plurality of sensing patterns SP1 via contact holes passing through the sensing insulating layer 203. The plurality of bridge patterns BP may be disposed on the same layer as the pen sensing electrode PSPa, and the plurality of bridge patterns BP may be disposed on a different layer from the layer on which the plurality of sensing patterns SP1 and the second electrode SE2 are disposed. Fig.11 The plurality of sensing patterns SP1 , a fourth pen sensing pattern PSP4 among the pen sensing electrodes PSPa, and a first connection portion CP1 of the second electrode SE2 are shown.

[0155] The plurality of pen bridge patterns P_BP may be electrically connected to the fourth pen sensing pattern PSP4 via contact holes passing through the sensing insulating layer 203. The plurality of pen bridge patterns P_BP may be disposed on the same layer as the plurality of sensing patterns SP1 and the second electrode SE2, and on a different layer from the layer on which the pen sensing electrode PSPa is disposed. For example, the first conductive layer 202 of the sensor layer 200 may include the pen sensing electrode PSPa and the plurality of pen bridge patterns P_BP, and the second conductive layer 204 of the sensor layer 200 may include the plurality of sensing patterns SP1, the second electrode SE2, and the plurality of pen bridge patterns P_BP.

[0156] Fig.12 It is a view for illustrating a first mode of an embodiment according to the inventive concept.

[0157] Reference Figure 4 and Fig.12 In the first mode, the sensor driver 200C may sequentially provide a transmission signal TX to the second electrode SE2 and detect the coordinates of the first input 2000 by using a reception signal RX detected by the first electrode SE1. In an embodiment, in the first mode, the pen sensing electrode PSP may be grounded via a ground line, have a constant voltage applied thereto, or be electrically floating.

[0158] Fig.12 It is shown that the transmission signal TX is provided to a second electrode SE2, and the reception signal RX is output from the first electrode SE1. For ease of understanding, Fig.12 It is shown that only one second electrode SE2 to which the transmission signal TX is provided is indicated by hatching. The sensor driver 200C may sense a capacitance change between the first electrode SE1 and the second electrode SE2, thereby detecting the input coordinates of the first input 2000.

[0159] Fig.13 It is a view for illustrating a second mode of an embodiment according to the inventive concept.

[0160] Reference Figure 4 and Fig.13 , the second mode may be a charging part. In an embodiment, the sensor driver 200C may apply a current RFS to one of the first pen pad PD_P1 and the second pen pad PD_P2, and receive the current RFS through the other pad. For example, a ground voltage may be applied to the other pad. In an embodiment, one of the first pen pad PD_P1 and the second pen pad PD_P2 and the other pad may be continuously modified. Therefore, the annular coil patterns in various positions and various shapes may form a magnetic field.

[0161] Fig.13 An embodiment in which a current RFS is provided to a first pen pad PD_P1 and received by a second pen pad PD_P2 is shown. In this embodiment, a current path in the form of a coil may be defined by a portion of the first pen signal line TL_P1 connected to the first pen pad PD_P1, a portion of the second pen signal line TL_P2 connected to the second pen pad PD_P2, and a pen sensing electrode PSP connected to the second pen signal line TL_P2. In the second mode, the resonant circuit of the pen PN may be charged through the current path.

[0162] According to an embodiment of the inventive concept, a current path having a loop coil pattern may be formed by components included in the sensor layer 200. Therefore, even when a digital converter is not included, the electronic device 1000 (see Figure 1 ) can detect input through the pen PN. Therefore, since there is no need to add a digitizer for sensing the pen PN, the increase in thickness and weight of the electronic device 1000 and the decrease in flexibility due to the addition of the digitizer do not occur, and the production cost of the electronic device can be reduced.

[0163] Fig.14 It is a view for illustrating a third mode of an embodiment according to the inventive concept.

[0164] Reference Figure 4 and Fig.14, the third mode may be a mode of sensing the pen PN. In the third mode, the sensor driver 200C may receive a first reception signal PRX1 from the first electrode SE1 and a second reception signal PRX2 from the second electrode SE2. In an embodiment, the pen sensing electrode PSP may be grounded via a ground line or may be applied with a constant voltage.

[0165] The LC resonant circuit of the pen PN may generate a magnetic field having a resonant frequency while discharging. Due to the magnetic field provided from the pen PN, an induced current may be generated in the pen sensing electrode PSP. The sensor driver 200C may receive a first reception signal PRX1 based on the induced current from the first electrode SE1, and receive a second reception signal PRX2 based on the induced current from the second electrode SE2. The sensor driver 200C may detect the input coordinates of the pen PN based on the first reception signal PRX1 and the second reception signal PRX2.

[0166] According to the above description, the sensor layer may include a pen sensing electrode, which is arranged on a different layer from a layer on which a plurality of sensing patterns and a plurality of second sensing electrodes are arranged. A current path in the form of a coil may be formed by a component included in the sensor layer of the electronic device. The electronic device can detect input through the pen even when a digitizer is not included. For example, the sensor layer according to an embodiment of the present invention can detect input through touch and can also detect input through the pen. Therefore, since there is no need to add a digitizer for pen sensing, an increase in thickness and weight of the electronic device and a decrease in flexibility due to the addition of a digitizer do not occur, and thus the production cost of the electronic device can be reduced.

[0167] Although the embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these embodiments, but a person skilled in the art can make various changes and modifications within the spirit and scope of the present invention.

Claims

1. An electronic device, characterized in that: The electronic device comprises: A display layer that displays images; and A sensor layer is disposed on the display layer, The sensor layer includes: a plurality of first sensing electrodes, including a plurality of sensing patterns arranged along a first direction and a plurality of bridge patterns electrically connecting adjacent sensing patterns among the plurality of sensing patterns; a plurality of second sensing electrodes, including a plurality of sensing portions arranged along a second direction crossing the first direction and a first connecting portion extending from the plurality of sensing portions in the second direction; and a pen sensing electrode, which is disposed in the same layer as the plurality of bridge patterns, and The pen sensing electrode is disposed at a different layer from the plurality of sensing patterns and the plurality of second sensing electrodes.

2. The electronic device according to claim 1, wherein: The pen sensing electrode includes a first pen sensing pattern and a second pen sensing pattern; and In a plane, the first pen sensing pattern overlaps boundaries of the plurality of sensing patterns and boundaries of the plurality of sensing parts, and the second pen sensing pattern is adjacent to boundaries of the plurality of bridge patterns.

3. The electronic device according to claim 2, characterized in that: The plurality of second sensing electrodes further include second connection portions extending from the plurality of sensing portions in the first direction, The pen sensing electrode further includes a third pen sensing pattern, and In the plane, the third pen sensing pattern overlaps a boundary of the second connecting portion.

4. The electronic device according to claim 3, characterized in that: The pen sensing electrode further includes a fourth pen sensing pattern overlapping the plurality of sensing patterns in the plane.

5. The electronic device according to claim 4, characterized in that: The sensor layer further includes a pen bridge pattern electrically connecting the fourth pen sensing pattern; and The pen bridge pattern is disposed on the same layer as the plurality of sensing patterns and the plurality of second sensing electrodes.

6. The electronic device according to claim 5, characterized in that: The pen bridge patterns extend in the second direction and are arranged to be spaced apart from each other in the first direction.

7. The electronic device according to claim 5, characterized in that: In the plane, each of the fourth pen sensing patterns has a size smaller than a size of each of the plurality of sensing patterns.

8. The electronic device according to claim 5, characterized in that: The fourth pen sensing pattern is arranged to be spaced apart from the first to third pen sensing patterns in the plane.

9. The electronic device according to claim 1, characterized in that: The plurality of bridge patterns and the pen sensing electrodes are directly disposed on the first layer; and The plurality of sensing patterns and the plurality of second sensing electrodes are directly disposed on the second layer, The distance from the display layer to the second layer is greater than the distance from the display layer to the first layer.

10. The electronic device according to claim 1, characterized in that: The plurality of sensing patterns and the plurality of second sensing electrodes are directly disposed on the first layer, and the plurality of bridge patterns and the pen sensing electrodes are directly disposed on the second layer, The distance from the display layer to the second layer is greater than the distance from the display layer to the first layer.

Images