Bearing platform and bonding machine

Abstract

The utility model provides a bearing platform and a bonding machine, the bearing platform comprises a bearing seat and a fixing seat, and the fixing seat comprises a bottom plate, a first side plate and a second side plate. The first side plate and the second side plate are oppositely arranged at two ends of the bottom plate; the bearing seat is located between the first side plate and the second side plate, the first side wall of the bearing seat is connected to the first side plate through at least one first elastic connecting assembly, and the second side wall of the bearing seat is connected to the second side plate through at least one second elastic connecting assembly. The first elastic connecting assembly and the second elastic connecting assembly are configured to generate elastic deformation in the length direction of the bottom plate after being pressed; the lower end of the damper is fixedly connected to the bottom plate of the fixing seat, and the upper end of the damper is fixedly connected to the bottom of the bearing seat. According to the bearing platform provided by the invention, when the bearing seat vibrates along the length direction of the bottom plate, the damper absorbs the vibration, so that the overall vibration of the bearing platform is reduced, and the bonding precision of the lead frame borne on the bearing seat is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging, and more specifically to a carrier platform and a bonding machine. Background Art

[0002] In the semiconductor wire bonding process, two methods are usually used for bonding. One is to install the conveying mechanism on the carrier platform, and convey the lead frame carrying the chip through the conveying mechanism. During the conveying process of the lead frame, the lead frame and the chip are wire bonded by the bonding mechanism. The other is to fix the lead frame carrying the chip on the carrier platform, and then use the bonding mechanism to bond the lead frame and the chip. Among them, whether it is the lead frame conveying process or the bonding process of the bonding mechanism, the movement of the conveying mechanism or the bonding mechanism will inevitably bring about the overall vibration of the carrier platform. When the vibration reaches a certain amount, it will affect the bonding accuracy and cause the equipment error to become larger. Utility Model Content

[0003] In order to solve the above technical problems existing in the existing bearing platform, the first aspect of the present application provides a bearing platform, which adopts the following technical solutions:

[0004] A bearing platform comprises a bearing seat and a fixing seat, wherein:

[0005] The fixing seat comprises a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are arranged oppositely at two ends of the bottom plate along the length direction of the bottom plate;

[0006] The bearing seat is located between the first side plate and the second side plate, the first side wall of the bearing seat is connected to the first side plate via at least one first elastic connection component, the second side wall of the bearing seat is connected to the second side plate via at least one second elastic connection component, and the first elastic connection component and the second elastic connection component are both configured to generate elastic deformation in the length direction of the bottom plate after being compressed;

[0007] The lower end of the damper is fixedly connected to the bottom plate of the fixing seat, and the upper end of the damper is fixedly connected to the bottom of the bearing seat.

[0008] The bearing platform provided in the present application is used for bearing a bearing seat of a lead frame, and the two sides thereof are connected to the first side plate and the second side plate of the fixing seat via the first elastic connection component and the second elastic connection component, respectively, and a damper is connected between the bottom of the bearing seat and the fixing seat. When the bearing seat vibrates along the length direction of the bottom plate during the conveying or bonding process of the lead frame, the first elastic connection component and the second elastic connection component produce elastic deformation, and the damper absorbs the vibration, thereby reducing the overall vibration of the bearing platform and ultimately improving the bonding accuracy.

[0009] In some embodiments, the first side wall of the bearing seat is connected to the first side plate via two first elastic connection components spaced apart along the width direction of the base plate; the second side wall of the bearing seat is connected to the second side plate via two second elastic connection components spaced apart along the width direction of the base plate.

[0010] The first side wall and the second side wall of the bearing seat are connected to the corresponding side plates of the fixing seat via two first elastic connection components and two second elastic connection components respectively, thereby improving the stability and force uniformity of the bearing seat and further reducing the vibration of the bearing seat.

[0011] In some embodiments, the first elastic connection component and the second elastic connection component have the same structure, and the first elastic connection component includes a spring sheet arranged in a vertical direction, wherein the lower end of the spring sheet is fixedly connected to the supporting seat via a first connecting block, and the upper end of the spring sheet is fixedly connected to the first side panel via a second connecting block.

[0012] The upper and lower ends of the spring sheet are connected to the fixing seat and the bearing seat respectively. When the bearing seat vibrates along the length direction of the bottom plate, the spring sheet generates deformation in the length direction of the bottom plate.

[0013] In some embodiments, a fixing groove for fixing the first connecting block is provided at the bottom edge of the supporting seat.

[0014] By arranging the fixing groove at the bottom edge of the bearing seat, sufficient installation space is provided for the first connecting block.

[0015] In some embodiments, the first elastic connection assembly further includes clamping plates disposed on both sides of the spring sheet.

[0016] The clamping plates arranged on both sides of the spring sheet reduce the deflection and deformation of the spring sheet.

[0017] In some embodiments, a receiving space for a supporting frame fixing mechanism is formed on the support seat, and a plurality of supporting columns located on both sides of the receiving space are arranged on the top of the support seat. The frame fixing mechanism is used to load a lead frame, and a chip is placed on the lead frame.

[0018] In some bonding scenarios, it is necessary to fix the frame fixing mechanism loaded with the lead frame on the support seat, and then control the bonding device to bond the chip on the lead frame. By providing the accommodation space and the support column on the support seat, it can be ensured that the frame fixing mechanism can be firmly and stably fixed on the support seat.

[0019] In some embodiments, the damper further comprises a moving part and an energy absorbing part, wherein the moving part is mounted at an upper end of the damper and the energy absorbing part is mounted at a lower end of the damper, and the energy absorbing part is used to absorb kinetic energy of the moving part when the moving part moves.

[0020] By arranging the moving part and the energy absorbing part at the upper and lower ends of the damper respectively, the damper can better absorb the vibration of the bearing seat.

[0021] In some embodiments, mounting seats are disposed at top ends of the first side wall and the second side wall of the bearing seat.

[0022] In some bonding scenarios, the conveying mechanism needs to be fixedly mounted on the support seat, and the lead frame is transported to the bonding station for bonding. By arranging mounting seats at the top of the first side wall and the second side wall of the support seat, it is ensured that the conveying mechanism can be firmly and stably fixed on the top of the support seat.

[0023] The second aspect of the present application provides a bonding machine, which includes a conveying mechanism, a bonding device and a carrying platform as described in any of the above items, wherein: the conveying mechanism is fixedly installed on a carrying seat of the carrying platform, the length direction of the bottom plate of the fixed seat is parallel to the conveying direction of the conveying mechanism, the conveying surface of the conveying mechanism is used to carry a lead frame, and a chip is placed on the lead frame; at least one bonding station is arranged on the conveying path of the conveying mechanism; the bonding device is arranged at the bonding station, and the bonding device is used to bond the chip on the lead frame located at the bonding station.

[0024] The conveying mechanism conveys the lead frame to the bonding station for bonding. Since the conveying mechanism is fixedly mounted on the bearing seat of the bearing platform, the vibration of the bearing seat along the conveying direction generated during the conveying and bonding process of the lead frame is absorbed, thereby reducing the overall vibration of the bearing seat and improving the bonding accuracy.

[0025] The third aspect of the present application provides another bonding machine, which includes a frame fixing mechanism, a bonding device and a carrying platform as described in any of the above items, wherein: the carrying seat of the carrying platform is used to carry the frame fixing mechanism, the frame fixing mechanism is used to load a lead frame, and a chip is placed on the lead frame; the bonding device bonds the chip on the lead frame.

[0026] Since the frame fixing mechanism is installed and fixed on the bearing seat of the bearing platform, the vibration generated by the bearing seat during the bonding process is absorbed, thereby reducing the overall vibration of the bearing seat and improving the bonding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic structural diagram of the carrying platform in the embodiment of the present application at a first viewing angle;

[0028] Figure 2 is a schematic structural diagram of the carrying platform in the embodiment of the present application at a second viewing angle;

[0029] Figure 3 is a schematic structural diagram of the carrying platform in the embodiment of the present application at a third viewing angle;

[0030] Figure 4 This is a schematic diagram of the structure of the load-bearing platform without the fixing seat in an embodiment of the present application at one viewing angle;

[0031] Figure 5 This is a schematic structural diagram of a load-bearing platform without a fixing seat in an embodiment of the present application from another perspective;

[0032] Figure 6 It is a schematic structural diagram of the first elastic connection component in an embodiment of the present application at one viewing angle;

[0033] Figure 7 is a schematic structural diagram of the first elastic connection component in the embodiment of the present application from another perspective;

[0034] Figures 1 to 7 It includes: a bearing seat 1, a first side wall 11, a second side wall 12, an accommodating space 13, a support column 14, a fixing seat 2, a bottom plate 21, a first side plate 22, a second side plate 23, a damper 3, a first elastic connection component 4, a spring sheet 41, a first connection block 42, a second connection block 43, a clamping plate 44, and a second elastic connection component 5. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0036] like Figures 1 to 5 As shown, the bearing platform in the embodiment of the present application includes a bearing seat 1 and a fixed seat 2, wherein: the fixed seat 2 includes a bottom plate 21, a first side plate 22 and a second side plate 23, wherein the first side plate 22 and the second side plate 23 are relatively arranged at both ends of the bottom plate 21 along the length direction of the bottom plate 21 (such as the X-axis direction in the figure). The bearing seat 1 is located between the first side plate 22 and the second side plate 23, the first side wall 11 of the bearing seat 1 is connected to the first side plate 22 through at least one first elastic connection component 4, and the second side wall 12 of the bearing seat 1 is connected to the second side plate 23 through at least one second elastic connection component 5, and the first elastic connection component 4 and the second elastic connection component 5 are both configured to generate elastic deformation in the length direction of the bottom plate after being compressed. The lower end of the damper 3 is fixedly connected to the bottom plate 21 of the fixed seat 2, and the upper end of the damper 3 is fixedly connected to the bottom of the bearing seat 1.

[0037] The supporting platform in the embodiment of the present application is used to support the supporting seat 1 of the lead frame, and the two sides are connected to the first side plate 22 and the second side plate 23 of the fixing seat 2 through the first elastic connection component 4 and the second elastic connection component 5 respectively, and a damper 3 is connected between the bottom of the supporting seat 1 and the fixing seat 2.

[0038] When the lead frame is being transported or bonded, the movement of the transport mechanism or the bonding device will cause the support base 1 to vibrate along the length direction of the base plate 21. The first elastic connection component 4 and the second elastic connection component 5 will generate elastic deformation under the pressure of the support base 1, and the damper 3 will absorb the vibration, thereby reducing the overall vibration of the support platform and ultimately improving the bonding accuracy.

[0039] It is a mature technology in this field to absorb and reduce the vibration of mechanical components by dampers. The damper 3 in the embodiment of the present application can adopt various types of existing dampers, such as friction dampers, magnetic dampers, air dampers, liquid dampers, etc.

[0040] In order to further improve the vibration absorption effect of the damper 3, optionally, the damper 3 further includes a moving part and an energy absorbing part, wherein the moving part is installed at the upper end of the damper 3, and when the bearing seat 1 vibrates, it moves synchronously with the bearing seat 1. The energy absorbing part is installed at the lower end of the damper, and the energy absorbing part is used to absorb the kinetic energy of the moving part when the moving part moves.

[0041] In order to improve the stability and force uniformity of the bearing seat 1, the vibration of the bearing seat 1 is further reduced. Figure 3 and Figure 5 As shown, optionally, the first side wall 11 of the bearing seat 1 is connected to the first side plate 22 via two first elastic connection components 4 spaced apart along the width direction (such as the Y-axis direction in the figure) of the bottom plate 21. Similarly, the second side wall 12 of the bearing seat 1 is connected to the second side plate 23 via two second elastic connection components 5 spaced apart along the width direction of the bottom plate.

[0042] Optionally, the first elastic connection component 4 and the second elastic connection component 5 have the same structure. Taking the first elastic connection component 4 as an example, Figure 6 to Figure 7 As shown, it includes a spring sheet 41 arranged in the vertical direction, wherein the lower end of the spring sheet 41 is fixedly connected to the bearing seat 1 via a first connecting block 42, and the upper end of the spring sheet 41 is fixedly connected to the first side plate 22 via a second connecting block 43. When the bearing seat 2 vibrates along the length direction of the bottom plate 21, the spring sheet 41 generates deformation in the length direction of the bottom plate 21.

[0043] To facilitate the installation of the first connection block 42, optionally, a fixing groove for fixing the first connection block 42 is provided at the bottom edge of the bearing seat 1. To reduce the deflection and deformation of the spring sheet 41, optionally, the first elastic connection component 4 also includes clamping plates 44 provided on both sides of the spring sheet.

[0044] In some bonding scenarios, it is necessary to fix the frame fixing mechanism loaded with the lead frame on the carrier 1, and then control the bonding device to bond the chip on the lead frame.

[0045] In order to ensure that the frame fixing mechanism can be firmly and stably fixed on the bearing seat, Figures 1 to 4 As shown, optionally, a receiving space 13 for supporting the frame fixing mechanism is formed on the bearing seat 1 of the adopted bearing platform, and a plurality of (four in the figure) support columns 14 located on both sides of the receiving space 13 are arranged on the top of the bearing seat 1. The frame fixing mechanism is received in the receiving space 13 and fixedly supported on the support columns 14 on both sides of the receiving space 13.

[0046] The present application also provides a bonding machine in an embodiment, which includes a frame fixing mechanism, a bonding device and a carrier platform in any of the above embodiments, wherein: the carrier seat 1 of the carrier platform is used to carry the frame fixing mechanism, the frame fixing mechanism is used to load a lead frame, and a chip is placed on the lead frame. The bonding device bonds the chip on the lead frame.

[0047] Since the frame fixing mechanism is installed and fixed on the bearing seat 1 of the bearing platform, the vibration generated by the bearing seat during the bonding process is absorbed, thereby reducing the overall vibration of the bearing seat 1 and improving the bonding accuracy.

[0048] In other bonding scenarios, the conveying mechanism needs to be fixedly mounted on the carrier 1, wherein the conveying direction of the conveying mechanism is parallel to the length direction of the base plate 21. The lead frame is carried on the conveying surface of the conveying mechanism, and the conveying mechanism moves the lead frame to the bonding station, and the bonding device arranged at the bonding station bonds the chip on the lead frame.

[0049] In order to ensure that the conveying mechanism can be firmly and stably fixed on the bearing seat, optionally, mounting seats are provided at the top ends of the first side wall 11 and the second side wall 12 of the bearing seat 1. The conveying mechanism is fixed on the top of the bearing seat 1 via the mounting seats.

[0050] The embodiment of the present application also provides another bonding machine, which includes a conveying mechanism, a bonding device and a carrying platform in any of the above embodiments, wherein: the conveying mechanism is fixedly mounted on a carrying seat 1 of the carrying platform, the length direction of the bottom plate of the fixed seat 2 is parallel to the conveying direction of the conveying mechanism, and the conveying surface of the conveying mechanism is used to carry a lead frame, on which a chip is placed. At least a bonding station is provided on the conveying path of the conveying mechanism. The bonding device is provided at the bonding station, and the bonding device is used to bond the chip on the lead frame located at the bonding station.

[0051] The conveying mechanism conveys the lead frame to the bonding station for bonding. Since the conveying mechanism is fixedly mounted on the support base 1 of the support platform, the vibration of the support base along the conveying direction generated during the conveying and bonding process of the lead frame is absorbed, thereby reducing the overall vibration of the support base 1 and improving the bonding accuracy.

[0052] As described in the above embodiments, in order to ensure that the conveying mechanism can be firmly and stably fixed on the bearing seat, preferably, the top ends of the first side wall 11 and the second side wall 12 of the adopted bearing platform are provided with mounting seats. The conveying mechanism is fixedly mounted on the top of the bearing platform via the mounting seats.

[0053] The above description of the present application is sufficiently detailed and has certain particularities. Those skilled in the art should understand that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, not by the above description in the embodiments. Moreover, the embodiments mentioned in the present application are not limited to being implemented individually, and some embodiments can also be implemented in combination.

Claims

1. A bearing platform, characterized in that: The bearing platform comprises a bearing seat, a fixing seat and a damper, wherein: The fixing seat comprises a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are arranged oppositely at two ends of the bottom plate along the length direction of the bottom plate; The bearing seat is located between the first side plate and the second side plate, the first side wall of the bearing seat is connected to the first side plate via at least one first elastic connection component, the second side wall of the bearing seat is connected to the second side plate via at least one second elastic connection component, and the first elastic connection component and the second elastic connection component are both configured to generate elastic deformation in the length direction of the bottom plate after being compressed; The lower end of the damper is fixedly connected to the bottom plate of the fixing seat, and the upper end of the damper is fixedly connected to the bottom of the bearing seat.

2. The carrying platform according to claim 1, characterized in that: The first side wall of the bearing seat is connected to the first side plate via two first elastic connection components spaced apart along the width direction of the bottom plate; The second side wall of the bearing seat is connected to the second side plate via two second elastic connection components which are arranged at intervals along the width direction of the bottom plate.

3. The carrying platform according to claim 1, characterized in that: The first elastic connection component and the second elastic connection component have the same structure. The first elastic connection component includes a spring sheet arranged in a vertical direction, wherein the lower end of the spring sheet is fixedly connected to the bearing seat via a first connecting block, and the upper end of the spring sheet is fixedly connected to the first side plate via a second connecting block.

4. The carrying platform according to claim 3, characterized in that: A fixing groove for fixing the first connecting block is arranged at the bottom edge of the bearing seat.

5. The carrying platform according to claim 3, characterized in that: The first elastic connection assembly also includes clamping plates arranged on both sides of the spring sheet.

6. The carrying platform according to claim 1, characterized in that: The support seat is formed with a receiving space for supporting a frame fixing mechanism, and a plurality of supporting columns located on both sides of the receiving space are arranged on the top of the support seat. The frame fixing mechanism is used to load a lead frame, and a chip is placed on the lead frame.

7. The carrying platform according to claim 1, characterized in that: The damper further comprises a moving part and an energy absorbing part, wherein the moving part is mounted at an upper end of the damper and the energy absorbing part is mounted at a lower end of the damper, and the energy absorbing part is used to absorb kinetic energy of the moving part when the moving part moves.

8. The carrying platform according to claim 1, characterized in that: The top ends of the first side wall and the second side wall of the bearing seat are both provided with mounting seats.

9. A bonding machine, characterized in that: The bonding machine comprises a conveying mechanism, a bonding device and a carrying platform according to any one of claims 1 to 8, wherein: The conveying mechanism is fixedly mounted on the bearing seat of the bearing platform, the length direction of the bottom plate of the fixed seat is parallel to the conveying direction of the conveying mechanism, the conveying surface of the conveying mechanism is used to carry the lead frame, and the chip is placed on the lead frame; At least a bonding station is arranged on the conveying path of the conveying mechanism; The bonding device is arranged at the bonding station, and is used for bonding the chip on the lead frame at the bonding station.

10. A bonding machine, characterized in that: The bonding machine comprises a frame fixing mechanism, a bonding device and a carrying platform according to any one of claims 1 to 8, wherein: The bearing seat of the bearing platform is used to bear the frame fixing mechanism, and the frame fixing mechanism is used to load the lead frame, and the chip is placed on the lead frame; The bonding device bonds the chip on the lead frame.

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