Chip, chip assembly and imaging material box

Abstract

The utility model relates to a chip, a chip assembly with the chip and a developing material box, the chip is used for being detachably installed on imaging equipment along with the imaging material box, and the chip comprises a substrate and five contact parts arranged on the substrate, the five contact parts comprise a front contact part arranged on the first side of the substrate and a back contact part arranged on the second side of the substrate, and the first side is opposite to the second side; the chip further comprises a memory arranged on the same side as the reverse contact part; wherein at least the grounding terminal is arranged to be a reverse contact part; when the imaging material box is installed at a preset position of the imaging equipment, the front contact part is in contact with the contact pin to form electric connection, the back contact part is electrically connected with the imaging equipment through a conductor outside the chip, and the design is beneficial for preventing short circuit of the chip.

Description

[0001] The utility model is a divisional application of the prior application filed by the present applicant with the China Patent Office on June 5, 2023, with application number 202321424910.3 and invention name “Chip, chip assembly and imaging material box”. Technical Field

[0002] The utility model relates to the field of imaging, in particular to an imaging material box which is detachably installed in an imaging device and a chip component installed in the imaging material box. Background Art

[0003] Existing imaging devices include laser printers, copiers, inkjet printers, etc., and boxes containing imaging materials are installed in these imaging devices. The imaging materials are different depending on the type of imaging device. For example, when the imaging device is a laser printer, the imaging material is toner, and when the imaging device is an inkjet printer, the imaging material is ink.

[0004] Typically, in order to establish a communication connection between the box and the imaging device, a chip assembly is mounted on the box. When the box is mounted to a predetermined position of the imaging device, the contact portion of the chip assembly contacts the contact pin of the imaging device. Multiple contact portions of existing chips are arranged on the same side of the same substrate. In the limited surface area of ​​the substrate, the arrangement density of these contact portions is relatively large, and the design of the contact portions will be greatly restricted. At the same time, these closely arranged contact portions are also prone to short circuits. Utility Model Content

[0005] The utility model provides a chip, a chip assembly and an imaging material box having the chip, so as to solve or optimize at least one of the above technical problems. The specific scheme is as follows:

[0006] A chip is used to be detachably installed with an imaging material box to an imaging device provided with multiple contact pins, based on the posture of the imaging material box when the user installs the imaging material box, the left and right direction of the user's line of sight is the y direction of the imaging material box, the surface of the contact portion provided on the substrate extends along the y direction and the d direction, the d direction is perpendicular to the y direction and parallel to the extension direction of the plane of the substrate where the contact portion is provided; the chip includes a substrate and five contact portions provided on the substrate, the five contact portions are respectively a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal; the five contact portions include a front contact portion provided on a first side of the substrate and a back contact portion provided on a second side of the substrate, the first side and the second side are opposite; the chip also includes a memory provided on the same side as the back contact portion; wherein at least the ground terminal is provided as the back contact portion; when the imaging material box is installed to a predetermined position of the imaging device, the front contact portion contacts the contact pin to form an electrical connection, and the back contact portion is electrically connected to the imaging device through a conductor outside the chip.

[0007] The contact points formed by the front contact portion and the contact pin and the contact points formed by the back contact portion and the conductor respectively form projection points on the straight line D parallel to the y direction at the projection points of the surface; along the y direction, among all the contact points, the line connecting the projection points corresponding to the two outermost contact points on the straight line D has a center line L3, and a part of the front contact portion and the back contact portion are respectively located on both sides of the center line L3

[0008] A portion of the front contact portion is located in the -y direction of the center line L3, and the back contact portion is located in the +y direction of the center line L3. The sum of the number of contact points formed by the front contact portion located in the +y direction of the center line L3 and the contact pin and the number of contact points formed by the back contact portion and the contact pin is not greater than the number of contact points formed by the front contact portion located in the -y direction of the center line L3 and the contact pin.

[0009] Two straight lines parallel to the d direction and passing through the outermost side of the substrate define an area, the projection points of the contact points of the two contact portions located at the outermost side in the y direction and the corresponding contact pins on the surface including the y direction and the d direction on the straight line D parallel to the y direction are N1 and N2 respectively, the center line of the line segment N1N2 is L2, and along the y direction, the area is divided into adjacent first area Q1 and second area Q2 by the center line L2, and along the y direction, the number of contact pins located in the first area Q1 is different from the number of contact pins located in the second area Q2; the conductor is made of sheet-like conductive material.

[0010] The present utility model also provides a chip, which is used to be detachably installed with an imaging material box to an imaging device provided with a contact pin mechanism, and the posture of the imaging material box when the user installs the imaging material box is taken as the standard, the left and right direction of the user's line of sight is the y direction of the imaging material box, and the surface of the contact part set on the substrate extends along the y direction and the d direction, and the d direction is perpendicular to the y direction and parallel to the extension direction of the plane of the substrate where the contact part is set; the contact pin mechanism includes a plurality of contact pins, and the chip includes a substrate and five contact parts arranged on the substrate, and the five contact parts are respectively a data terminal, a clock terminal, a reset terminal, a power supply terminal and a ground terminal; it is characterized in that the five contact parts include a front contact part arranged on one side of the substrate and a back contact part arranged on the other side of the substrate; wherein at least the ground terminal is arranged as the back contact part; at least one of the plurality of contact parts does not directly contact with the contact pin.

[0011] The utility model also provides a chip assembly, which comprises the chip as described above and a conductor in contact with a back contact portion of the chip, wherein the chip and the conductor are combined by welding, clamping, bonding or clamping.

[0012] The conductor comprises a front conductive member and a back conductive member which are electrically connected to each other, wherein the front conductive member is used to contact with the contact pin, and the back conductive member is used to contact with the back contact portion.

[0013] The chip assembly further comprises a pushing member, which is used for pushing the reverse conductive member toward the reverse contact portion.

[0014] The conductor includes a first conductive member and a second conductive member electrically connected to each other, one end of the first conductive member contacts the reverse contact portion, and the other end contacts the second conductive member; the second conductive member and the substrate are spaced apart from each other, and a combining space is formed between the two; the combining space is used to allow the main body of the contact pin mechanism to enter, and the multiple contact pins are arranged on the main body.

[0015] Along the thickness direction of the substrate, a portion of the conductor does not overlap with the substrate.

[0016] The utility model also provides an imaging material box, which comprises a shell for accommodating imaging materials and the chip assembly as described above, wherein the chip assembly is mounted on the shell.

[0017] The imaging material cartridge further includes an imaging material discharge portion disposed on the housing. The imaging material discharge portion has a center line L5 along the y direction, and the numbers of contact portions on both sides of the center line L5 are different.

[0018] The imaging material box also includes an imaging material discharge portion arranged on the shell body. Along the y direction, the imaging material discharge portion has a center line L5, and the imaging material box has a center line L1; the projection points of the contact points of the two outermost contact portions located in the y direction with the corresponding contact pins on the surface on the straight line D are N1 and N2 respectively, and the center line of the line segment N1N2 is L2, and the center line L2 does not coincide with the center line L1 and the center line L5. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1A It is a three-dimensional diagram of the imaging material box involved in the utility model.

[0020] Figure 1B It is a stereoscopic diagram of a contact pin assembly arranged in an imaging device to which the imaging material box involved in the utility model is applicable.

[0021] Figure 1C It is a schematic diagram of the relative position between the contact pin and the imaging material box after the imaging material box involved in the utility model is installed on the imaging device.

[0022] Figure 2 It is a side view of the chip assembly involved in the first embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0023] Figure 3It is a three-dimensional diagram of the front side of the chip involved in the second embodiment of the present utility model.

[0024] Figure 4 It is a three-dimensional diagram of the back side of the chip involved in the second embodiment of the present utility model.

[0025] Figure 5 This is a state diagram of the chip assembly involved in the second embodiment of the present utility model after being separated from the shell of the imaging material box.

[0026] Figure 6 It is a side view of the chip assembly involved in the third embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0027] Figure 7 This is a state diagram of the chip assembly involved in the fourth embodiment of the present utility model after being separated from the shell.

[0028] Fig. 8A It is a side view of the chip in the chip assembly involved in the fourth embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0029] Figure 8B It is a side view of the chip assembly involved in the fourth embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0030] Fig. 9 It is a side view of another chip in the chip assembly involved in the fourth embodiment of the present utility model.

[0031] Fig.10 The utility model relates to an imaging material box and an imaging device to which the imaging material box accommodating parts are separated from each other.

[0032] Fig.11 This is a state diagram of the chip assembly involved in the fifth embodiment of the present invention after being separated from the shell of the imaging material box.

[0033] Fig.12 It is a three-dimensional diagram of some components of the chip assembly involved in the fifth embodiment of the present utility model.

[0034] Fig.13 It is a side view observed along the y direction after the imaging material box installed with the chip assembly involved in the fifth embodiment of the present invention is installed in the imaging device.

[0035] Fig.14 It is a plane perpendicular to the y direction and passing through the contact position of a contact part and the corresponding stylus. Fig.13 A cross-sectional view of an imaging material box and an imaging device after being cut away.

[0036] Fig.15It is a three-dimensional view of an imaging material box installed with the chip assembly involved in the sixth embodiment of the present utility model.

[0037] Fig.16 It is a three-dimensional diagram of the chip assembly involved in the eighth embodiment of the present utility model.

[0038] Fig.17 It is a three-dimensional diagram of the chip and the conductor in the chip assembly involved in the eighth embodiment of the present utility model after being separated.

[0039] Fig.18A This is a side view of the chip assembly involved in the eighth embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0040] Fig.18B Yes Fig.18A Schematic diagram showing further explanation of chip components.

[0041] Fig.18C yes Fig.18A A side view of the chip substrate after the position of the middle and back contact portions undergoes the first deformation, as viewed in a direction perpendicular to the chip substrate.

[0042] Fig.19 It is a three-dimensional diagram of the chip assembly involved in the ninth embodiment of the present invention after being decomposed.

[0043] Fig. 20 It is a three-dimensional diagram of the chip assembly involved in the tenth embodiment of the present utility model after being decomposed.

[0044] Fig.21 This is a three-dimensional view of the chip assembly involved in the tenth embodiment of the present invention when viewed from the back.

[0045] Fig.22A This is a side view of the chip assembly involved in the tenth embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0046] Fig. 22B yes Fig.22A A side view of the chip substrate after the position of the middle and back contact portions is deformed, as viewed perpendicular to the chip substrate.

[0047] Fig.23 It is a three-dimensional diagram of a second imaging material box installed with the chip assembly involved in the utility model.

[0048] Fig.24 It is a three-dimensional diagram of a third imaging material box installed with the chip assembly involved in the utility model. DETAILED DESCRIPTION

[0049] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0050] [Imaging Material Box]

[0051] Figure 1A It is a three-dimensional diagram of the imaging material box involved in the utility model; Figure 1B It is a three-dimensional diagram of a stylus assembly provided in an imaging device to which the imaging material box involved in the utility model is applicable; Figure 1C It is a schematic diagram of the relative position between the contact pin and the imaging material box after the imaging material box involved in the utility model is installed on the imaging device.

[0052] As described in the background art, the type of imaging material contained in the imaging material box 10 varies depending on the type of imaging device. The imaging material may be toner, in which case the imaging material box is a processing box or a powder cartridge. The imaging material may also be ink, in which case the imaging material box is an ink cartridge. However, regardless of the type of imaging material, the chip assembly 103 described below is applicable.

[0053] To make the following description clearer, based on the posture of the imaging material box when the user installs the imaging material box, the front of the user's line of sight is defined as the +x direction, the back of the user's line of sight is defined as the -x direction, the top of the user's line of sight is defined as the +z direction, the bottom of the user's line of sight is defined as the -z direction, the left of the user's line of sight is defined as the +y direction, and the right of the user's line of sight is defined as the -y direction.

[0054] The following description takes the ink cartridge as an example.

[0055] As shown in the figure, the ink cartridge 10 includes a housing 101 for containing ink, an ink outlet 102 (imaging material outlet) provided on the housing, and a chip assembly 103. The housing has a front side wall 101a facing forward, a rear side wall 101b facing rearward, an upper side wall 101c facing upward, a lower side wall 101d facing downward, a left side wall 101f facing leftward, and a right side wall 101g facing rightward (as shown in FIG. Figure 2 As shown in the figure, the front side wall 101a is opposite to the rear side wall 101b in the x direction, the upper side wall 101c is opposite to the lower side wall 101d in the z direction, the left side wall 101f is opposite to the right side wall 101g in the y direction, and the cavity for containing ink is formed by at least the front side wall 101a, the rear side wall 101b, the upper side wall 101c, the lower side wall 101d, the left side wall 101f and the right side wall 101g.

[0056] The chip component 103 can be set on any side wall of the shell 101, or an inclined side wall 101e inclined relative to the z direction is formed between the front side wall 101a and the lower side wall 101d, and at least a portion of the chip component 103 is opposite to the inclined side wall 101e. Preferably, the chip component 103 is set on the inclined side wall 101e.

[0057] The chip assembly 103 at least includes a chip 104. As shown in the figure, the chip 104 includes a substrate 1041, a memory 1044 (such as Figure 4 As shown) and at least one contact portion 1042 / 1043, commonly, the memory 1044 and the contact portion 1042 are both arranged on the substrate 1041, the memory 1044 is used to store the information of the chip and is electrically connected to the contact portion 1042, the two can be arranged on the same side of the substrate 1041, and can also be located on both sides of the substrate 1041 respectively, or, one of the memory 1044 and the contact portion 1042 is arranged on the substrate 1041, and the other is arranged outside the substrate 1041, but the memory 1044 and the contact portion 1042 are connected by a wire. For ease of understanding and explanation, the chip 104 described below is that the memory 1044 and the contact portion 1042 are arranged on the substrate 1041. Preferably, the chip is mounted on the inclined side wall 101e.

[0058] The stylus assembly 90 in the imaging device includes a plurality of stylus pins 91. Overall, the arrangement of the contact portion 1042 in the chip assembly 103 for contacting the plurality of stylus pins 91 is the same as the arrangement of the plurality of stylus pins 91; Figure 1C As shown, two straight lines along the direction parallel to the d direction and passing through the outermost side of the substrate 1041 define an area, the projection points of the contact points C of the two contact portions located at the outermost side in the y direction and the corresponding contact pins on the plane / surface including the y direction and the d direction on the straight line D parallel to the y direction are N1 and N2 respectively, the center line of the line segment N1N2 is L2, and along the y direction, the area is divided into adjacent first area Q1 and second area Q2 by the center line L2, and along the y direction, the number of contact pins / the number of contact portions in the first area Q1 is different from the number of contact pins / the number of contact portions in the second area Q2, hereinafter, the contact pins located in the first area Q1 are referred to as the first group of contact pins 90a, and the contact pins located in the second area Q2 are referred to as the second group of contact pins 90b, and the number of contact pins in the first group of contact pins 90a is different from the number of contact pins in the second group of contact pins 90b. Each contact pin 91 has a contact end 91a for contacting the chip component 103 and a side surface 91b adjacent to the contact end 91a. The contact end 91a can be formed as any one of a point / line / surface. Preferably, the contact end 91a is formed as a conical tip, the side surface 91b is a surface adjacent to the conical tip, and the distal surface 91c is arranged adjacent to the side surface 91b.

[0059] In some embodiments, along the d direction, a center line L5 passing through the center of the ink outlet portion 102 coincides with a center line L1 of the ink cartridge 10 in the y direction, that is, the ink outlet portion 102 is disposed in the middle position of the shell 101 along the y direction. At this time, the relative position of the stylus assembly 90 and the center line L5 is the same as the relative position of the stylus assembly 90 and the center line L1.

[0060] In other embodiments, the center line L5 does not coincide with the center line L1. Figure 1C As shown, along the y direction, the center line L5 is closer to the left wall 101f or the right wall 101g of the shell 101 than the center line L1. In this way, the number of contact pins / contact parts / contact points of the chip assembly 103 on both sides of the center line L5 are also different. The probability of the contact parts of the contact pins / chip assemblies that are arranged farther away from the center line L5 being contaminated by the ink leaked from the ink outlet part 102 is reduced, and accordingly, the risk of chip short circuit is also reduced.

[0061] Furthermore, the center line L2 of the line segment N1N2 is set to not coincide with the center line L1 or the center line L5. Along the y direction, the number of contact pins on both sides of the center line L2 is different, and the risk of chip short circuit is reduced. Even if the imaging device shakes significantly, the shaking amplitude of the contact pin can be reduced, thereby ensuring that the contact pin maintains good contact with the contact part of the chip component 103.

[0062] [Chip components]

[0063] Embodiment 1

[0064] Figure 2 It is a side view of the chip assembly involved in the first embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0065] As described above, the inclined side wall 101e is inclined relative to the z direction. When observing along the direction perpendicular to the substrate 1041, the up and down direction of the line of sight will no longer be the z direction, but Figure 2 The d direction shown is perpendicular to the y direction and parallel to the extension direction of the plane in which the contact portion of the substrate 1041 is set, and the d direction also intersects with the z direction and the x direction at a non-perpendicular angle; in other embodiments, the shell 101 is not provided with an inclined side wall 101e, or when the chip 104 is set on the front side wall 101a, the d direction will be the same as the z direction, and when the chip 104 is set on the lower side wall 101d, the d direction will be the same as the x direction.

[0066] like Figure 2As shown, the center line L1 is perpendicular to the y direction and divides the shell 101 into two parts that are symmetrical in the y direction, that is, the straight line L1 is the center line of the shell 101 in the y direction; the contact portion 1042 of the chip 104 is set to be multiple, and all the contact portions 1042 are located on the same side of the substrate 1041, each contact portion forms a contact point C with the contact pin of the imaging device, along the y direction, the multiple contact portions 1042 are staggered, along the d direction, the multiple contact portions are arranged in multiple rows, the straight line D is parallel to the y direction, and the projection points of the contact point C at the end of the +y direction and the contact point C at the end of the -y direction on the plane passing through the y direction and the d direction (the surface of the substrate 1041 where the contact portion is set) on the straight line D are B and A respectively, and the center line of the line segment BA is L6.

[0067] In this embodiment, the center line L1 does not coincide with the center line L6. Overall, in the y direction, the multiple contact portions 1042 / contact points C are arranged to be asymmetrical about the center line L1. In other words, all or most of the multiple contact portions 1042 / contact points C are arranged on one side of the center line L1, or the number of contact portions 1042 / contact points C on one side of the center line L1 is greater than the number of contact portions 1042 / contact points C on the other side of the center line L1; the center line L6 does not coincide with the center line L5 either. In this way, along the y direction, at least one contact portion 1042 / contact point C is arranged away from the center line L5 / L6, and the ink leaked from the ink outlet portion 102 is less likely to contaminate the at least one contact portion 1042.

[0068] The chip 104 can bring the following beneficial effects:

[0069] (1) After the ink cartridge 10 with such a chip 104 is installed in an imaging device, even if the device shakes to a large extent, the shaking amplitude of the chip 104 can be reduced, and the shaking amplitude of the stylus is also reduced accordingly, and the superposition value of the shaking amplitudes of the two is also small, which is specifically reflected in that the contact point C and the stylus will still maintain good contact;

[0070] (2) Along the y direction, when the center line of the substrate 1041 coincides with the center line L1, the area used on one side of the chip 104 is smaller than the area used on the other side, with the center line L1 as the boundary. Then, other arrangements can be made on the side with a larger use area according to design requirements. For example, a fixing portion for fixing the chip is provided on the side, or the memory 1044 is provided on the side, etc., thereby greatly improving the design freedom of the chip 104.

[0071] (3) The center line L1 does not coincide with the center line L6. Along the y direction, the center line L6 will be closer to one side / one end of the substrate 1041 than the center line L1. This causes the contact portion 1042 / contact point C to be more concentratedly distributed between the side / one end of the substrate 1041 close to the center line L6 and the center line L6 along the y direction, while more structures or components can be arranged between the other side / the other end of the substrate 1041 away from the center line L6 and the center line L6. At the same time, along the y direction, the contact portion 1042 / contact point C away from the center line L6 is less likely to be contaminated by ink.

[0072] Embodiment 2

[0073] Figure 3 It is a three-dimensional diagram of the front side of the chip involved in the second embodiment of the present utility model; Figure 4 It is a three-dimensional diagram of the back side of the chip involved in the second embodiment of the utility model; Figure 5 This is a state diagram of the chip assembly involved in the second embodiment of the present utility model after being separated from the shell of the imaging material box.

[0074] The difference between this embodiment and the first embodiment is that a part of the plurality of contact portions 1042 is arranged on the other side of the substrate, and thus the plurality of contact portions 1042 can be divided into a first group of contact portions 1045 and a second group of contact portions 1046, wherein the first group of contact portions 1045 is located on one side / first side 1048 of the substrate 1041, and the second group of contact portions 1046 is located on the other side / second side 1049 of the substrate 1041; hereinafter, the second group of contact portions 1046 arranged on the other side / second side 1049 of the substrate 1041 includes one or more reverse contact portions 1043, and the first group of contact portions 1045 arranged on one side / first side 1048 of the substrate 1041 includes one or more forward contact portions 1042. Figure 3 and Figure 4 As shown, the memory 1044 is arranged on the other side / second side 1049 of the substrate 1041, a back contact portion 1043 is arranged on the same side as the memory 1044, and a plurality of front contact portions 1042 are arranged on the side opposite to the memory 1044. The front contact portions 1042 and the back contact portions 1043 can be arranged to protrude from the substrate 1041 by a predetermined height, and can also overlap with the surface of the substrate 1041.

[0075] Specifically, the back contact portion 1043 may be any one of a power terminal and a ground terminal. When a plurality of back contact portions 1043 are provided, both the power terminal and the ground terminal may be provided as the back contact portion 1043. Figure 5As shown, the chip assembly 103 also includes a pushing member 106 and a conductor 107, one end of the conductor 107 is used to contact the back contact portion 1043, and the other end is in contact with the pushing member 106. When the ink cartridge 10 is installed in the imaging device, the pushing member 106 pushes the other end of the conductor 107 to contact the component arranged at the corresponding position of the imaging device, that is, the position of the contact pin for contacting the back contact portion 1043 in the imaging device is different from the position of the contact pin for contacting the front contact portion 1042.

[0076] The conductor 107 can be preset to be in contact with the back contact portion 1043 , or can be preset not to be in contact with the back contact portion 1043 , and the conductor 107 is in contact with the back contact portion 1043 during the installation process of the ink cartridge 10 .

[0077] Preferably, the conductor 107 is arranged on the lower side wall 101d, so that the contact between the conductor 107 and the corresponding contact pin will be more stable by utilizing the gravity of the ink cartridge itself and the thrust of the pushing member 106. Further, the housing 101 is also provided with a mounting groove 10e for placing the conductor 107, so that the mounting position of the conductor 107 is accurately positioned, and the contact between the conductor 107 and the reverse contact portion 1043 and the contact pin will be more stable.

[0078] Continue as Figure 2 As shown, along the y direction, the back contact portion 1043 is arranged to be away from the front contact portion 1042, and the projection points of the two outermost contact points C in the y direction on the plane / surface passing through the y direction and the d direction on the straight line D are E and B respectively, and the center line of the line segment EB is L3. In this embodiment, along the y direction, regardless of whether the center line L1 coincides with the center line L3, the back contact portion 1043 is away from the front contact portion 1042, and the back contact portion 1043 is led out through the conductor 107. The beneficial effects brought about are as described in the first embodiment and will not be repeated here. For the first embodiment, when the back contact portion 1043 and the front contact portion 1042 are arranged on the same side of the substrate 1041, the relative position between the center line L3 and the center line L1 and the center line L6 will not change.

[0079] In Example 1 and Example 2, when the center line L5 passing through the ink outlet portion 102 does not coincide with the center line L1, the center line L6 and the center line L3 do not coincide with the center line L5 either. Similarly, the contact portion 1042 / 1043 or the contact point C away from the center line L5 along the y direction is not easily contaminated by the ink leaked from the ink outlet portion 102.

[0080] It can be understood that the back contact portion 1043 should not be limited to the side opposite to the front contact portion 1042, and the back contact portion 1043 can also be arranged on other surfaces of the substrate 1041, as long as it is not arranged on the same side as the front contact portion 1042. This design reduces the contact portion arrangement density on the side where the front contact portion 1042 is located (the first side 1048), and the design freedom on the side where the front contact portion is located can be improved. At the same time, the risk of short circuit between the contact portions is also reduced.

[0081] Embodiment 3

[0082] Figure 6 It is a side view of the chip assembly involved in the third embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0083] Different from the above-mentioned embodiment, the multiple contact portions 1042 in this embodiment are arranged such that at least two contact portions 1042 overlap along the d direction. More specifically, at least two contact points C overlap along the d direction.

[0084] like Figure 6 As shown, the projection points of the two outermost contact portions 1042 / contact points C along the y direction on the plane / surface including the y direction and the d direction on the straight line D are A and B respectively, and the center line of the line segment AB is L7. The center line L1 does not coincide with the center line L7. The beneficial effects brought about are as described in Example 1 and will not be repeated here.

[0085] In this embodiment, along the y direction, the center line L5 passing through the ink outlet portion 102 does not coincide with the center line L7, so that the contact portion 1042 / 1043 or the contact point C away from the center line L5 along the y direction is not easily contaminated by the ink leaked from the ink outlet portion 102.

[0086] Embodiment 4

[0087] Figure 7 This is a state diagram of the chip assembly and the housing after being separated according to the fourth embodiment of the present utility model; Fig. 8A It is a side view of the chip in the chip assembly involved in the fourth embodiment of the present utility model after the chip is installed in the imaging material box, observed along the direction perpendicular to the chip substrate; Figure 8B It is a side view of the chip assembly involved in the fourth embodiment of the present invention after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate.

[0088] In this embodiment, the chip assembly 103 is configured to be at least partially movable, such as Figure 7As shown, the chip assembly 103 includes a chip 104, a pushing member 106 and an adapter 1031, one end of the adapter 1031 is in contact with the chip 104 / contact portion 1042, and the other end is used to contact the contact pin, and the pushing member 106 is used to push the adapter 1031 toward the contact pin; the adapter 1031 includes a movable member 103a and a connecting member 103b combined with each other, and the two can be formed integrally or separately, and the connecting member 103b is made of conductive material, preferably a conductive steel sheet, one end of the connecting member 103b is in contact with the contact portion 1042, and the other end can be exposed to the outside through the movable member 103a.

[0089] For example, when the ink cartridge 10 has not yet been installed to the predetermined position, the connecting piece 103b is retracted into the movable piece 103a, so that the connecting piece 103b can be protected to prevent damage to it by external components. During the process of installing the ink cartridge 10 to the predetermined position, the movable piece 103a is pressed toward the direction of the shell 101, the pushing piece 106 is elastically deformed, and the connecting piece 103b gradually extends out. When the ink cartridge 10 reaches the predetermined position, the connecting piece 103b completes the contact with the contact pin. When the ink cartridge 10 leaves the predetermined position, the pushing piece 106 releases the elastic force, so that the connecting piece 103b returns to the state of being retracted into the movable piece 103a. It can also be that the adapter 1031 is movable as a whole. When the ink cartridge 10 has not yet been installed to the predetermined position, the adapter 1031 does not contact the contact portion 1042. As the ink cartridge 10 moves toward the predetermined position, the adapter 1031 is pressed toward the direction of the shell 101, and the connecting piece 103b gradually begins to contact the contact portion 1042. When the ink cartridge 10 reaches the predetermined position, the connecting piece 103b completes the contact with the contact pin and the contact portion 1042. When the ink cartridge 10 leaves the predetermined position, the pushing piece 106 releases the elastic force, so that the adapter 1031 returns to the state of not contacting the contact portion 1042. For example, when the ink cartridge 10 has not been installed to the predetermined position, a part of the connecting piece 103b is configured to contact the contact portion 1042, and another part of the connecting piece 103b is configured not to contact the contact portion 1042. The cartridge 10 is installed toward the predetermined position, and the other part of the connecting piece 103b gradually moves toward the direction close to the contact portion 1042, and the pushing piece 106 undergoes elastic deformation. When the ink cartridge 10 reaches the predetermined position, the connecting piece 103b completes the contact with the contact portion 1042 and the contact pin. When the ink cartridge 10 leaves the predetermined position, the pushing piece 106 releases the elastic force, and the connecting piece 103b returns to a state in which a part of it contacts the contact portion 1042, and the other part does not contact the contact portion 1042.

[0090] The movement mode of the movable part 103a / adapter 1031 may be sliding or swinging, as long as the above-mentioned movement process of the movable part 103a / adapter 1031 can be achieved.

[0091] When the movable member 103a / adapter 1031 is configured to be movable, the arrangement of the contact portions 1042 of the chip 104 is no longer restricted, such as Fig. 8A As shown, along the y direction, the projection points of the contact points C located at the two outermost contact parts among the multiple contact parts on the plane / surface passing through the y direction and the d direction on the straight line D are A and B respectively, and the center line L8 of the line segment AB coincides with the center line L1, that is, at this time, the contact part 1042 / contact point C is set to be symmetrical along the y direction, but the connecting piece 103b used to connect the contact part 1042 and the contact pin will be changed according to the arrangement of the contact pin, such as Figure 8B As shown, the contact point between the connecting piece 103b and the contact pin is C1. Along the y direction, the projection points of the two outermost contact points C1 on the plane / surface including the y direction and the d direction on the straight line D are F and G respectively. The center line L4 of the line segment FG does not coincide with the center line L1. Similarly, the chip component 103 involved in this embodiment still has the beneficial effects of the first embodiment.

[0092] Since the multiple contact portions 1042 of the chip 104 are arranged to be symmetrical along the y direction, the chip 104 can continue to use the existing chip, and the cartridge manufacturer can select the corresponding adapter 1031 according to the arrangement of the contact pins in the imaging device, which not only helps to reduce the cost of the ink cartridge, but also makes the chip more versatile; conversely, when the number of chips 104 with contact portions 1042 asymmetrically arranged in the y direction is large, the adapter can also be installed to make these chips 104 suitable for imaging devices with contact pins symmetrically arranged in the y direction.

[0093] like Fig. 8A and Figure 8B As shown, the center line L5 passing through the ink outlet portion 102 does not coincide with the center line L8, and similarly, the contact portion 1042 / 1043 or the contact point C away from the center line L5 along the y direction is not easily contaminated by the ink leaked from the ink outlet portion 102; further, the center line L5 does not coincide with the center line L4, and similarly, the connecting piece 103b or the contact point C1 away from the center line L5 along the y direction is not easily contaminated by the ink leaked from the ink outlet portion 102.

[0094] It can be seen that the adapter 1031 has a first end that contacts the chip contact portion 1042, and a second end that contacts the contact pin, and multiple contact portions are arranged at the first end and the second end, wherein the contact portion located at the first end and one of the contact portions located at the second end are arranged to be symmetrical along the y direction, and the contact portion at the other end is arranged to be asymmetrical along the y direction; further, according to the design requirements of the chip 104 and / or the arrangement of the contact pins, the contact portion at the first end and the contact portion at the second end can also be arranged to be asymmetrical along the y direction; further, the adapter 1031 and the push member 106 can be separated from the ink cartridge 10 and become an independent component. Before installing the ink cartridge 10, the adapter 1031 is first installed on the imaging device. When the ink in the ink cartridge 10 is consumed, the user only needs to replace the ink cartridge 10, and the adapter 1031 and the push member 106 can continue to be used.

[0095] Fig. 9 It is a side view of another chip in the chip assembly involved in the fourth embodiment of the present utility model.

[0096] Fig. 9 In the chip 104 shown, the multiple contact portions 1042 / contact points C are arranged in a straight line along the d direction. At this time, along the y direction, the multiple contact portions 1042 / contact points C are still symmetrically arranged. Similarly, the adapter 1031 can also be applicable to the chip 104.

[0097] The above embodiment describes a situation where the chip 104 is a whole, wherein the number of contact portions 1042 is at least three, for example, the chip 104 includes a first contact portion (first terminal) and at least one second contact portion (second terminal), the first contact portion is used to detect whether there is a short circuit between the first contact portion and the second contact portion, further, the chip 104 also includes at least one third contact portion (third terminal), the region (Q2) where the at least one second contact portion is located is different from the region (Q1) where the first contact portion is located, and along the y direction, the second contact portion is closer to the third contact portion.

[0098] When the number of the contact portions 1042 is set to three, the three contact portions 1042 are respectively a data terminal, a clock terminal and a ground terminal; when the number of the contact portions 1042 is set to five, Fig. 8A As shown, the five contact portions 1042 are respectively a first terminal 10421 (data terminal cpd), a second terminal 10422 (clock terminal cpc), a third terminal 10423 (reset terminal cpr), a fourth terminal 10424 (power terminal cpvd) and a fifth terminal 10425 (ground terminal cpvs). Of course, the number of contact portions 1042 can be set to be more, for example, seven, nine, etc., and the function of each contact portion 1042 can be set according to design requirements.

[0099] In actual use, the ink cartridge 10 is not in a vacuum environment. Especially for the ink cartridge 10 that has not been used for a long time, it is inevitable that more dust or impurities will adhere to the surface of the chip 104. In addition, the ink leaked from the ink outlet 102 will also adhere to the surface of the chip 104 under the action of the surface tension of the liquid. These problems may cause the chip 104 to short-circuit and be damaged. For this reason, the applicant further proposes a solution of the embodiment described below.

[0100] Embodiment 5

[0101] Fig.10 It is a state diagram of the imaging material box involved in the utility model and the imaging material box accommodating part in an imaging device to which it is applicable being separated from each other; Fig.11 This utility model embodiment five A state diagram of the chip assembly involved after being separated from the housing of the imaging material box; Fig.12 This utility model embodiment five A three-dimensional diagram of some components of the chip assembly involved; Fig.13 The utility model embodiment is installed five A side view of the imaging material box of the chip assembly involved, viewed along the y direction, after being installed in the imaging device; Fig.14 It is a plane perpendicular to the y direction and passing through the contact position of a contact part and the corresponding stylus. Fig.13 A cross-sectional view of an imaging material box and an imaging device after being cut away.

[0102] The following description still uses the imaging material cartridge as an ink cartridge as an example. Before describing the ink cartridge 10 in this embodiment, the ink cartridge accommodating portion 20 in the imaging device to which the ink cartridge 10 is applicable is first described.

[0103] As in the above embodiment, the ink cartridge 10 is defined as having a posture when it is installed in the imaging device. Fig.10 The x direction, y direction and z direction are shown. At the same time, for ease of understanding, the ink cartridge accommodating portion 20 is set to have the same orientation as the ink cartridge 10. Fig.10 The left side of the figure shows the orientation of the ink cartridge accommodating portion 20, and the right side shows the orientation of the ink cartridge 10.

[0104] The ink cartridge accommodating portion 20 includes a frame, a contact pin mechanism 9 disposed on the frame, and a device-side circuit board 25. A slot 26 open toward the +z direction is formed between the contact pin mechanism 9 and the device-side circuit board 25. A plurality of device-side terminals 251 are disposed on the surface of the circuit board 25. A device-side limiting element 23 is disposed on a side plate 21 of the frame. The device-side limiting element 23 is provided with a device-side limiting portion 232 for limiting the ink cartridge 10. As shown in the figure, the device-side limiting portion 232 is a step body protruding from the side plate 21. The contact pin mechanism 9 includes a main body 92 and a contact pin assembly 90 disposed on the main body 92. Each ink cartridge corresponds to a contact pin assembly 90. Each contact pin assembly 90 has a plurality of contact pins 91 arranged at intervals along the y direction. The number of the contact pins 91 is the same as the number of the chip contact portion 1042 and the device-side terminal 251. The structure of each contact pin 91 is the same. To more clearly show the structure of the contact pin 91, Fig.10 A perspective view of one of the contact pins is shown.

[0105] The contact pin 91 includes an external contact 911, an internal contact 913 and a connector 912 connecting the external contact and the internal contact. The contact pin 91 is made of a conductive material. The external contact 911 is used to electrically connect to the chip assembly 103, and the internal contact 912 is used to electrically connect to the device-side terminal 251. The connector 912 matches the shape of the main body 92. Generally, the connector 912 is arranged in a "J" shape as shown in the figure, including a first connecting portion 912a extending along the z direction, a second connecting portion 912a extending along the x direction, and a second connecting portion 912b extending along the z direction. The first connection portion 912a and the third connection portion 912c are arranged in the x direction at intervals, and the first connection portion 912a is also connected to the external contact member 911, and the third connection portion 912c is also connected to the internal contact member 913. When the contact pin 91 is combined with the main body 92, the external contact member 911 and the first connection portion 912a face the -x direction and can be opposite to the ink cartridge 10, and the internal contact member 913 and the third connection portion 912c are located in the slot 26 and face each other. In the +x direction, it is opposite to the circuit board 25; before the ink cartridge 10 is installed in the ink cartridge accommodating portion 20, at least a portion of the external contact member 911 extends out of the main body 92, and the internal contact member 913 abuts against the device-side terminal 251. At this time, the internal contact member 913 and the third connecting portion 912c are retracted toward the inside of the main body 92 with the connection between the second connecting portion 912b and the third connecting portion 912c as the rotation point; when the ink cartridge 10 is installed in the predetermined position of the ink cartridge accommodating portion 20, the external contact member 911 and the first connecting portion 912c are abutted. The connecting part 912a is retracted toward the inside of the main body 92 with the connection between the first connecting part 912a and the first connecting part 912a as the rotation point, and the external contact member 911 is in contact with the chip component 103. Preferably, along the z direction, the external contact member 911 and the internal contact member 912 are staggered. In this way, when the external contact member 911 is also retracted toward the inside of the main body 92, the external contact member 911 and the internal contact member 913 will not interfere with each other, the internal space of the main body 92 can be fully utilized, and the overall size of the main body 92 can be reduced.

[0106] The outer contact 911 / inner contact 913 is configured to have a tapered tip 91a / 913a and a side surface 91b / 913b adjacent to the tapered tip, wherein the side surface 91b connects the tapered tip 91a and the first connection portion 912a, and the side surface 913b connects the tapered tip 913a and the third connection portion 913a.

[0107] The ink cartridge 10 in this embodiment is installed and removed / removed along the z direction. The ink cartridge 10 also includes a first coupling member 11 located in front of the front side wall 101a / in the +x direction. When the ink cartridge 10 is installed in the ink cartridge accommodating portion 20, the coupling surface 11a of the first coupling member 11 abuts against the device side limiting portion 232, so that the movement of the ink cartridge 10 in the z direction is restricted to achieve positioning.

[0108] like Fig.11 As shown, similar to the second embodiment, the chip assembly 103 in this embodiment includes a separately formed chip 104 and a conductor 107, and the conductor 107 is used to lead out at least one contact portion 1042 and contact it with the contact pin mechanism 9 and at least one of the device side terminals 251. That is to say, at least one of the multiple contact portions arranged in the chip 104 is not in direct contact with the contact pin mechanism 9. In this way, the positions of the multiple contact portions on the substrate 1041 do not have to be limited to the same surface, thereby reducing the risk of short circuit of the chip 104; when the contact portion 1042 is set to the above-mentioned five, at least one of the power terminal 10424 and the ground terminal 10425 can be led out by the conductor 107 and contacted with at least one of the contact pin mechanism 9 and the device side terminal 251. Preferably, the ground terminal 10425 is led out by the conductor 107 and contacted with at least one of the contact pin mechanism 9 and the device side terminal 251.

[0109] Similar to the second embodiment, in this embodiment, the multiple contact portions 1042 are divided into a first group of contact portions 1045 arranged on one side / first side of the substrate 1041 and a second group of contact portions 1046 arranged on the other side / second side of the substrate 1041. The following takes the example of the second group of contact portions 1046 only having one reverse contact portion 1043. The position of the reverse contact portion 1043 on the other side / second side of the substrate 1041 does not need to be limited. For example, when observed along the x direction, the reverse contact portion 1043 can be located in the above-mentioned first area Q1 or in the above-mentioned second area Q2. Because the first group of contact portions 1045 and the second group of contact portions 1046 are respectively located on both sides of the substrate 1041, no matter where the reverse contact portion 1043 is arranged on the other side of the substrate, the risk of short circuit of the chip 104 can be reduced.

[0110] The conductor 107 is used to lead out the back contact portion 1043 and contact the corresponding contact pin 91. As shown in the figure, the conductor 107 includes a first conductive member 1071 and a second conductive member 1072 electrically connected to each other. The two can be formed in one piece or in a separate piece. The second conductive member 1072 is located in front of the substrate 1041. Along the x direction, the second conductive member 1072 and the substrate 1041 are spaced apart from each other, and a combined space S is formed between the two. One end of the first conductive member 1071 contacts the back contact portion 1043, and the other end contacts the second conductive member 1072. In this way, the back contact portion 1043 is connected to the substrate 1041. When being arranged on the second conductive member 1072, preferably, the back contact portion 1043 is a ground terminal and is arranged in the first area Q1; further, the chip component 103 also includes a support member 1032 for supporting the second conductive member 1072, and the end 10721 of the second conductive member 1072 protrudes from the support member 1032; further, the back contact portion 1043 can also be arranged on the same side of the substrate as the front contact portion 1042, as long as the conductor 107 can lead out the back contact portion 1043 and contact with at least one of the contact pin structure 9 and the device side terminal 251.

[0111] When the ink cartridge 10 is installed, the main body 92 of the stylus mechanism 9 enters the coupling space S, the outer contact member 911 abuts against the first group of contact portions 1045 of the contact portion, the support member 1032 brings the second conductive member 1072 into the slot 26, and the second conductive member 1072 contacts at least one of the inner contact member 913 and the device-side terminal 251. Fig.14 As shown, the support member 1032 is inserted between the inner contact member 913 and the device side terminal 251. At this time, the support member 1032 / the second conductive member 1072 abuts against the conical tip 913a of the inner contact member 913, and the inner contact member 913 and the third connecting portion 912c are retracted toward the main body 92. At the same time, the second conductive member 1072 contacts the device side terminal 251. Finally, the multiple contact portions 1042 of the chip 104 are directly or indirectly electrically connected to the device side terminal 251. The first group of contact portions 1045 are electrically connected to the device side terminal 251 through the contact pins 91, and the second group of contact portions 1046 are electrically connected to the device side terminal 251 through the conductor 107.

[0112] Furthermore, when the ink cartridge 10 reaches a predetermined position, the external contact member 911 and the internal contact member 912 are both retracted toward the inside of the main body 91. Along the x direction, the external contact member 911 will apply a force toward the -x direction to the ink cartridge 10, and the internal contact member 912 will apply a force toward the +x direction to the ink cartridge 10. These two forces in opposite directions will enable the ink cartridge 10 to be more stably positioned in the ink cartridge accommodating portion 20. At the same time, the multiple contact portions of the chip 104 are no longer arranged on the same surface of the substrate 1041, and the risk of short circuit of the chip 104 can be effectively reduced.

[0113] As a variation of this embodiment, the support member 1032 can also be made of conductive material as a whole. In this case, the support member 1032 as a whole is the second conductive member 1072. Similarly, when the ink cartridge 10 is installed, the second conductive member 1072 is electrically connected to the device side terminal 251.

[0114] As another variation of this embodiment, the second conductive member 1072 can also contact a component other than the external contact member 911 of the contact pin 91, thereby realizing electrical connection between the second conductive member 1072 and the device side terminal 251. For example, when the ink cartridge 10 is installed to a predetermined position, the second conductive member 1072 does not enter between the internal contact member 913 and the device side terminal 251, but reaches above the conical tip 913a in the +z direction. At this time, the second conductive member 1072 can contact at least any one of the side surface 913b of the internal contact member, the third connecting portion 912c and the second connecting portion 912b. Since the conical tip 913a of the internal contact member still maintains contact with the device side terminal 251, the second conductive member 1072 can form an electrical connection with the device side terminal 251.

[0115] Furthermore, when all the contact portions 1042 of the chip 104 are led out through the conductor 107 without contacting the external contact 911, that is, all the contact portions 1042 of the chip 104 enter the slot 26 through the conductor 107 and contact at least one of the internal contact 911, the second connection portion 912b, the third connection portion 912c, and the device-side terminal 251, since the ink outlet portion 102 is still located on the side of the main body 92 facing the ink cartridge, along the x direction, each second conductive member 1072 is connected to the internal contact 911, the second connection portion 912c, and the device-side terminal 251. The contact position of at least one of 912b, the third connecting portion 912c, and the device-side terminal 251 is separated from the ink outlet portion 102 by the main body 92, which is also beneficial to reducing the risk of short circuit of the chip 104; according to this deformation method, the multiple contact portions 1042 do not have to be limited to whether they are arranged on the same surface, that is, all the contact portions 1042 can be arranged on the same surface, at least one contact portion is led out through the conductor 107, and the conductor 107 does not contact the external contact 911, but contacts with components other than the external contact 911.

[0116] Embodiment 6

[0117] Fig.15 It is a three-dimensional view of an imaging material box installed with the chip assembly involved in the sixth embodiment of the present utility model.

[0118] Different from the fifth embodiment, the chip 104 in this embodiment is configured to have a structure similar to that of the fifth embodiment, that is, the chip 104 includes a plurality of separate components combined together. As shown in the figure, the chip 104 in this embodiment includes a first sub-chip 104a and a second sub-chip 104b. Similar to the fifth embodiment, the first sub-chip 104a and the second sub-chip 104b can be two independent chips or two components that can establish a communication connection. The two can share a memory 1044 or have separate memories.

[0119] like Fig.15 As shown, the first sub-chip 104a includes a first sub-substrate 1041a and at least one first sub-contact portion 1042a arranged on the first sub-substrate 1041a, and the second sub-chip 104b includes a second sub-substrate 1041b and a second sub-contact portion 1042b arranged on the second sub-substrate 1041b. Along the x direction, a coupling space S is formed between the first sub-substrate 1041a and the second sub-substrate 1041b, and the conductive member 1072 is connected to the second sub-contact portion 1042a. When the ink cartridge 10 is installed to the predetermined position, the conductive member 1072 contacts at least any one of the device side terminal 251, the side surface 913b of the inner contact, the third connection portion 912c and the second connection portion 912b, and the first sub-contact portion 1042a contacts its corresponding contact pin outer contact 911.

[0120] The chip assembly 103 in this embodiment still has the beneficial effects of the fifth embodiment, which will not be described in detail here.

[0121] Embodiment 7

[0122] For the ink cartridge 10 described in the fifth and sixth embodiments, since a portion of the ink cartridge (the support member 1032 / the second conductive member 1072) needs to enter the slot 26, when the ink cartridge 10 needs to be taken out, the side where the support member 1032 is located (the +x direction side of the ink cartridge) will be subjected to a large friction force in the -z direction, thereby causing the ink cartridge 10 to be tilted. Fig.13 At this time, the -x direction side of the ink cartridge 10 will be tilted upward, or in other words, with the upper side wall 101c as a reference, along the z direction, the -x direction end of the upper side wall 101c will be higher than the +x direction end of the upper side wall 101c. When the ink cartridge 10 continues to be pulled up toward the +z direction, the portion below the first coupling member 11 (-z direction) may contact the device side limiting portion 232, causing the ink cartridge 10 to be stuck and unable to be removed, or to be removed unsuccessfully.

[0123] To this end, the ink cartridge 10 involved in the utility model also includes an avoidance surface 10i arranged on the side below the first joint surface 11a (-z direction). On the one hand, the avoidance surface 10i is used to prevent the ink cartridge 10 from interfering with the device side restriction portion 232. On the other hand, when the ink cartridge 10 interferes with the device side restriction portion 232, the ink cartridge 10 is guided so that the ink cartridge 10 can be smoothly taken out.

[0124] Preferably, the avoidance surface 10i is arranged to be inclined relative to the z direction. Fig.13 When the ink cartridge 10 shown is in a predetermined position, the avoidance surface 10i faces the +z direction and the +x direction, and the avoidance surface 10i can be set on at least any one of the positioning plate 105 for positioning the chip substrate in the chip assembly, the side wall of the shell 101 or the first coupling member 11.

[0125] Embodiment 8

[0126] Fig.16 This utility model embodiment eight A perspective view of the chip assembly involved; Fig.17 This utility model embodiment eight A three-dimensional diagram of the chip assembly involved after the chip and the conductor are separated; Fig.18A This utility model embodiment eight A side view of the chip assembly after being installed in an imaging material box, viewed in a direction perpendicular to the chip substrate; Fig.18B Yes Fig.18A A schematic diagram showing further explanation of the chip components shown; Fig.18C yes Fig.18A A side view of the chip substrate after the position of the middle and back contact portions undergoes the first deformation, as viewed in a direction perpendicular to the chip substrate.

[0127] Similar to the above-mentioned second embodiment, the chip assembly 103 involved in this embodiment includes a chip 104 and a conductor 107. The chip 104 includes a substrate 1041 and a plurality of contact portions 1042 arranged on the substrate 1041. The substrate 1041 has a first side 1048 and a second side 1049 opposite to each other along a direction perpendicular to both the y direction and the d direction. When the chip 104 / chip assembly 103 is installed to a predetermined position of the imaging device along with the ink cartridge 100, the first side 1048 is opposite to the contact pin 91, and the first side 1048 of the plurality of contact portions 1042 is opposite to the contact pin 91. A group of contact portions 1045 is arranged on the first side 1048, and a second group of contact portions 1046 among the multiple contact portions 1042 is arranged on the second side 1049, wherein the first group of contact portions 1045 includes one or more contact portions 1042, and the second group of contact portions 1046 includes one or more contact portions 1042. For ease of explanation, one or more contact portions 1042 in the first group of contact portions 1045 are also referred to as front contact portions, and one or more contact portions 1042 in the second group of contact portions 1046 are also referred to as back contact portions 1043.

[0128] When the imaging material box 10 equipped with the chip component 103 is installed in the imaging device, the front contact portion 1042 directly contacts the contact pin 91, and the back contact portion 1043 contacts the contact pin 91 through the conductor 107; in the chip component 103, the conductor 107 contacts the back contact portion 1043. In addition, whether other parts of the chip 104 and other parts of the conductor 107 are combined with each other is not limited here. When other parts of the chip 104 and other parts of the conductor 107 need to be combined with each other, the combination method of the two is various and should not be limited here. For example, the conductor 107 and the chip 104 are combined by snapping, or by welding, or by bonding, or by the chip 104 being clamped by the conductor 107, etc.

[0129] Continue as Fig.16 and Fig.17 As shown, the conductor 107 includes a front conductive member 1074 and a back conductive member 1075 which are electrically connected to each other, wherein the front conductive member 1074 is used to contact the contact pin 91, and the back conductive member 1075 is used to contact the back contact portion 1043, so that the back contact portion 1043 and the contact pin 91 can form an electrical connection, and the front conductive member 1074 and the back conductive member 1075 are preferably formed integrally by conductive members, for example, by bending a metal sheet according to design requirements, and optionally, the front conductive member 1074 and the back conductive member 1075 can also be two independent conductive components, which are electrically connected to each other through a conductive material.

[0130] Furthermore, the conductor 107 also includes an abutment portion 1076 arranged on the reverse conductive member 1075, and the abutment portion 1076 is used to contact the reverse contact portion 1043. It can be realized that the abutment portion 1076 and the reverse contact portion 1043 can form any one of point contact / line contact / surface contact. When line contact or surface contact is formed between the two, the center of the contact line or contact surface can be used as the contact point. When multiple point contacts, multiple line contacts, and multiple surface contacts are formed between the two, the contact point can be determined by one of the multiple point contacts, multiple line contacts, and multiple surface contacts, or the contact point can be determined by one of the area / space formed by the multiple point contacts, the area / space formed by the multiple line contacts, and the area / space formed by the multiple surface contacts.

[0131] The chip assembly 103 can be fixedly mounted on the housing 101 by means of clamping, bonding, riveting, welding, etc. As shown in the figure, the substrate 1041 is provided with a substrate coupling groove 1047, and the conductor 107 is provided with a conductor coupling groove 1073. Accordingly, the housing 101 or the positioning plate 105 is provided with a coupling column 1051 (such as Fig.23 shown).

[0132] In this embodiment, multiple contact portions 1042 are respectively arranged on the first side 1048 and the second side 1049 of the substrate, so that the contact portions arranged on the second side 1049 can be more comprehensively protected. In addition, the surface area of ​​the first side 1048 where the multiple contact portions 1042 are originally arranged can be reduced. Correspondingly, the plane / surface projection area of ​​the substrate 1041 including the d direction and the y direction is reduced, that is, the overall size of the chip 104 is reduced. Although the chip component 103 including the chip 104 still needs to be provided with a conductor 107, the conductor 107 can be set according to the position and size of the contact pin 91. On the whole, the chip component 103 can still be controlled in the direction of a small size. Furthermore, when the conductor 107 is made of a flexible material, the overall size of the chip component 103 can be made smaller.

[0133] Generally, the chip 104 also needs to be provided with the memory 1044. Based on the inventive concept of the present utility model, the memory 1044 can be provided together with the back contact portion 1043 on the second side 1049, so that the surface area of ​​the second side 1049 can be fully utilized. In some embodiments, the memory 1044 can also be provided together with the front contact portion 1042 on the first side 1048, and the first side 1048 will face the contact pin 91, and the second side 1049 will face the housing 101. Through such a configuration, the memory 1044 does not need to be provided from the second side 1 049 protrudes, and in the direction perpendicular to the d direction and the y direction (the thickness direction of the chip 104), the size of the chip 104 from the substrate 1041 toward the shell 101 can be reduced. Accordingly, the space on the shell 101 for accommodating the chip 104 / chip assembly 103 can be reduced, especially when the conductor 107 is made of a thin material (such as a sheet-like conductive material). Even if at least a portion of the reverse conductive member 1075 is opposite to the second side 1049, the size of the chip assembly 103 from the substrate 1041 toward the shell 101 in the thickness direction can still be reduced.

[0134] In order to enhance or improve the overall performance of chip 104, there is a method of providing a power source in chip 104 to directly power the circuit board of the chip. Generally, a battery is used as the power source. When part of the contact portion is arranged on the second side 1049 of the substrate, the battery can also be arranged on the first side 1048. In this way, in the thickness direction, the size of chip 104 / chip assembly 103 from substrate 1041 toward housing 101 can also be reduced. At the same time, this design is also conducive to the rapid installation and removal of the battery.

[0135] When the contact portion 1042 is set to five, as described above, the five contact portions 1042 are respectively the first terminal 10421 (data terminal cpd), the second terminal 10422 (clock terminal cpc), the third terminal 10423 (reset terminal cpr), the fourth terminal 10424 (power terminal cpvd) and the fifth terminal 10425 (ground terminal cpvs). In some embodiments, the first terminal 10421 (data terminal cpd), the second terminal 10422 (clock terminal cpc), the third terminal 10423 (reset terminal cpr) and the fourth terminal 10424 (power terminal cpvd) form a first group of contact portions 1045, and the fifth terminal 10425 (ground terminal cpvs) forms a second group of contact portions 1046. The fifth terminal 10425 (ground terminal cpvs) is arranged on the second side 1049 to become a reverse contact portion 1043. There are multiple positions of the reverse contact portion 1043 on the second side 1049, which are described below by observing along the thickness direction.

[0136] exist Fig.18AIn the embodiment, the contact pin 91 forms a contact point C with each front contact portion 1042, the contact pin 91 forms a contact point C1 with the conductor 107 / front conductive member 1074, and the back conductive member 1075 forms a contact point C with the back contact portion 1043. Specifically, the contact point formed by the contact pin 91 and the first terminal 10421 is Cd, the contact point formed by the contact pin 91 and the second terminal 10422 is Cc, the contact point formed by the contact pin 91 and the third terminal 10423 is Cr, the contact point formed by the contact pin 91 and the fourth terminal 10424 is Cvd, and the contact point formed by the conductor 107 and the fifth terminal 10425 is Cv s, the projection points of the contact points Cd, Cc, Cr, Cvd and Cvs on the plane including the y direction and the d direction on the straight line D parallel to the y direction each form a different projection point (final projection point) position, wherein, along the y direction, the final projection point of the contact point Cc and the final projection point of the contact point Cvs are respectively located at the outermost sides of all the contact points, and the final projection point of the contact point Cr is located in the middle of the final projection points of all the contact points; the contact points formed on the substrate 1041 may be collectively referred to as contact points C, and the contact points formed on the conductor 107 may be collectively referred to as contact points C2.

[0137] Along the y direction, in the first group of contact portions 1045, the contact point Cc is located on the -y side of the other three contact points, the contact point Cd is located on the +y side of the other three contact points, and the contact point Cvs is located on the +y side of the contact point Cd. Thus, among all the contact points located on the substrate 1041, along the y direction, the contact point Cc and the contact point Cvs are respectively located on the outermost sides of all (five) contact points, and the projection points of the contact point Cc and the contact point Cvs on the plane / surface including the y direction and the d direction are on a straight line parallel to the y direction. The projection points of D are E and B respectively, the center line of the line segment EB is L3a, and along the y direction, the substrate 1041 forms a third area Q3a in the -y direction of the center line L3a, and forms a fourth area Q4a in the +y direction of the center line L3a. The contact point Cvd, contact point Cc and contact point Cr are located in the third area Q3a, and the contact point Cd and contact point Cvs are located in the fourth area Q4a. That is to say, the number of contact points / contact pins on both sides of the center line L3a is different. This design is beneficial to reducing the risk of chip short circuit.

[0138] like Fig.18BAs shown, the back contact portion 1043 is hidden on the other side of the substrate 1041 and cannot be observed, and only the front contact portion 1042 can be observed. Specifically, the first terminal 10421 (data terminal cpd), the second terminal 10422 (clock terminal cpc), the third terminal 10423 (reset terminal cpr) and the fourth terminal 10424 (power terminal cpvd) can be observed. When only considering the four terminals located on the first side 1048 of the substrate, along the y direction, the contact point Cc and the contact point Cd are respectively located at the outermost sides of all (four) contact points. At this time, the contact point Cc and the contact point Cd are located in the y direction and the d direction. The projection points of the plane / surface in the y direction on the straight line D parallel to the y direction are E and B respectively, and the center line of the line segment EB is L3b. Along the y direction, the substrate 1041 forms a third area Q3b in the -y direction of the center line L3b, and forms a fourth area Q4b in the +y direction of the center line L3b. The contact point Cvd and the contact point Cc are located in the third area Q3b, and the contact point Cd and the contact point Cr are located in the fourth area Q4b. That is to say, the number of contact points / contact pins on both sides of the center line L3b is the same. In this way, when the contact part contacts the contact pin 91, the force on both sides of the center line L3b is balanced, which is conducive to ensuring that the front contact part forms a stable electrical contact with the contact pin 91.

[0139] exist Fig.18B In a modified embodiment, the contact points / contact pins on both sides of the center line L3b can also be symmetrically arranged, such as Fig.18B As shown, the projection points of contact point Cr and contact point Cvd on the plane / surface including the y direction and the d direction on the straight line D parallel to the y direction are M and N respectively, wherein projection point M and projection point B are located on the +y side of the center line L3b, and projection point N and projection point E are located on the -y side of the center line L3b, and projection point M and projection point N are symmetrical about the center line L3b, and projection point N and projection point E are symmetrical about the center line L3b. For chip 104, this arrangement of contact parts / contact points is more conducive to maintaining force balance on both sides of the center line L3b.

[0140] like Fig.18C As shown, in the first deformation mode, along the y direction, the contact point Cvs is arranged closer to the contact point Cd. At this time, among all the (five) contact points located on the substrate 1041, along the y direction, the contact point Cc and the contact point Cvs are still respectively located at the outermost sides of all the (five) contact points. The projection points of the contact point Cc and the contact point Cvs on the plane / surface including the y direction and the d direction on the straight line D parallel to the y direction are E and B respectively. The center line of the line segment EB is L3c. Along the y direction, the substrate 1041 forms a third area Q3c in the -y direction of the center line L3b, and forms a fourth area Q4c in the +y direction of the center line L3c. Fig.18AWhat is different from the structure shown is that, in this deformation mode, the center line L3c passes through the contact point Cr, the contact point Cvd and the contact point Cc are located in the third area Q3c, and the contact point Cd and the contact point Cvs are located in the fourth area Q4c. It can be seen that in this deformation mode, the number of contact points on both sides of the center line L3c is the same. Since the contact point Cvs is closer to the contact point Cd, the size of the substrate 1041 will become smaller along the y direction.

[0141] same Fig.18B The deformation mode, in Fig.18C In the deformation mode, the contact points on both sides of the center line L3c can also be symmetrically arranged. This design can also reduce the size of the substrate 1041 in the y direction.

[0142] Embodiment 9

[0143] Fig.19 It is a three-dimensional diagram of the chip assembly involved in the ninth embodiment of the present invention after being decomposed.

[0144] On the basis of the eighth embodiment, the chip assembly 103 in this embodiment also includes a pushing member 106 for abutting against the conductor 107. When the chip assembly 103 is installed to the housing 101, or when the conductor 107 is combined with the chip 104, the pushing member 106 pushes the reverse conductive member 1075 toward the reverse contact portion 1043, so that the contact between the abutting portion 1076 and the reverse contact portion 1043 is more stable.

[0145] Specifically, the pushing member 106 is configured as an elastic member. For example, the pushing member 106 is a sponge / compression spring, one end of which abuts against the conductor 107 and the other end abuts against the shell 101 / positioning plate 105. In some embodiments, the pushing member 106 can also force the chip 104 and / or the conductor 107 to form a stable contact by applying magnetic attraction to the two. For example, when the conductor 107 is made of a metal sheet, a magnetic member is installed on the substrate 104. As the conductor 107 is combined with the chip 104, the magnetic member adsorbs the conductor 107 at a predetermined position, or a magnetic member is installed on the substrate 104 and the conductor 107 at the same time.

[0146] In other embodiments, the pushing member 106 can also force the chip 104 and the conductor 107 to form a stable contact by applying a magnetic repulsion force to the conductor 107. For example, when the conductor 107 is made of a metal sheet, a magnetic member is installed on the housing 101 / positioning plate 105. As the conductor 107 is combined with the chip 104, or as the chip assembly 103 is installed, the magnetic member pushes the conductor 107 toward the chip 104.

[0147] Embodiment 10

[0148] Fig. 20is a disassembled stereoscopic view of the chip assembly involved in the tenth embodiment of the present utility model; Fig.21 is a three-dimensional view of the chip assembly according to the tenth embodiment of the present invention when viewed from the reverse side; Fig.22A It is a side view of the chip assembly involved in the tenth embodiment of the present utility model after being installed in the imaging material box, observed along the direction perpendicular to the chip substrate; Fig. 22B yes Fig.22A A side view of the chip substrate after the position of the middle and back contact portions is deformed, as viewed perpendicular to the chip substrate.

[0149] When the back contact portion 1043 and the memory 1044 are disposed together on the second side 1049, Fig.16 and Fig.17 Compared with the chip assembly shown in FIG. 1 , the back contact portion 1043 in this embodiment is located at the -y side of the memory 1044. Similarly, there are many variations in the location of the back contact portion 1043. Fig.22A and Fig. 22B Give a description.

[0150] like Fig.22A As shown, along the y direction, among all the (five) contact points located on the substrate 1041, contact point Cc and contact point Cd are respectively located at the outermost sides of all the (five) contact points, contact point Cvs is located between contact point Cc and contact point Cd, the projection points of contact point Cc and contact point Cd on the plane / surface including the y direction and the d direction on the straight line D parallel to the y direction are E and B respectively, the center line of line segment EB is L3d, and along the y direction, the substrate 1041 forms a third region Q3d in the -y direction of the center line L3d, and forms a fourth region Q4d in the +y direction of the center line L3d.

[0151] exist Fig.22A In the embodiment, when the back contact portion 1043 is not considered, the contact point Cc and the contact point Cvd are located in the third area Q3c, and the contact point Cr and the contact point Cd are located in the fourth area Q4c. That is to say, the forces on both sides of the center line L3d are balanced, which is conducive to ensuring that the front contact portion and the contact pin 91 form a stable electrical contact; when the back contact portion 1043 is considered, the contact point Cc, the contact point Cvd and the contact point Cvs are located in the third area Q3c, and the contact point Cr and the contact point Cd are located in the fourth area Q4c. The number of contact points / the number of contact pins on both sides of the center line L3d are different, which is conducive to reducing the risk of chip short circuit. At the same time, the contact point Cvs located between the contact point Cc and the contact point Cd along the y direction will not affect the forces on both sides of the center line L3d. Therefore, in this embodiment, regardless of whether the back contact portion 1043 is considered, the forces on both sides of the center line L3d can be kept balanced, and the chip 104 and the contact pin 91 can form a stable electrical contact.

[0152] like Fig. 22B As shown, after another deformation is made at the position of the reverse contact portion, along the y direction, the contact point Cvs is Fig.22A On the basis of , it continues to move in the -y direction and reaches the -y side of the contact point Cc, therefore, the contact point Cvs and the contact point Cd are respectively located at the outermost sides of all (five) contact points in the y direction, the projection points of the contact point Cvs and the contact point Cd on the plane / surface including the y direction and the d direction on the straight line D parallel to the y direction are E and B respectively, the center line of the line segment EB is L3e, along the y direction, the substrate 1041 forms a third area Q3e in the -y direction of the center line L3e, and forms a fourth area Q4e in the +y direction of the center line L3e; in this embodiment, the final projection point of the contact point Cvd is located in the middle of the final projection points of all the contact points, and the center line L3e passes through the contact point Cvd.

[0153] and Fig.22A compared to, Fig. 22B The position of the front contact portion in the embodiment does not change, therefore, without considering the back contact portion 1043, Fig. 22B The stress condition of the front contact part Fig.22A The same is not repeated here.

[0154] exist Fig. 22B When considering the back contact portion 1043, the contact point Cvs and the contact point Cc are located in the third region Q3e, and the contact point Cr and the contact point Cd are located in the fourth region Q4e. Fig.18C As shown, the number of contact points on both sides of the center line L3e is the same, and the size of the substrate 1041 will become smaller along the y direction.

[0155] Combination Fig.18A , Fig.18C , Fig.22A and Fig. 22B It can be seen that the back contact portion 1043 can be set at different positions on the second side 1049. Along the y direction, the position of the back contact portion 1043 on the second side 1049 can change from the +y direction side of the substrate 1041 to the -y direction side. Therefore, the back contact portion 1043 can have different positions on the second side 1049, and the two contact points of all contact portions at the outermost sides in the y direction (i.e., the -y side and the +y side) are also different, and the center lines formed by the two contact points are also different. Fig.22A The position of the middle and back contact parts can be regarded as Fig.18A The second deformation of the position of the middle and reverse contact parts, Fig. 22B The position of the middle and back contact parts can be regarded as Fig.18AThe third deformation of the position of the back contact part; in a further deformation method, the back contact part 1043 can also be set to that the final projection point of at least one back contact part 1043 coincides with the final projection point of at least one front contact part 1042, and when the back contact part 1043 is set to be multiple, the final projection points of at least two of the multiple back contact parts coincide.

[0156] Regardless of how the center line changes, the reverse contact portion 1043 disposed on the second side 1049 will be able to achieve the following beneficial effects:

[0157] 1. When the chip 104 / chip assembly 103 is mounted to the housing 101 , the back contact portion 1043 will face the housing 101 , and thus the back contact portion 1043 can be more effectively protected.

[0158] 2. The above embodiment describes setting the fifth terminal 10425 (ground terminal cpvs) as the reverse contact portion 1043. In practice, any one or more of the first terminal 10421 (data terminal cpd), the second terminal 10422 (clock terminal cpc), the third terminal 10423 (reset terminal cpr), the fourth terminal 10424 (power terminal cpvd) and the fifth terminal 10425 (ground terminal cpvs) can be set as the reverse contact portion 1043. Therefore, the chip 104 / chip assembly 103 can obtain a higher degree of design freedom, and the degree of design freedom of the arrangement of the contact portions is also improved.

[0159] 3. Among the multiple contact portions, at least one contact portion is arranged on the second side 1049 to become a reverse contact portion. Then, the side surface area of ​​the substrate originally provided with the reverse contact portion can be reduced. Overall, the size of the entire chip substrate 1041 can also be reduced, which is conducive to miniaturization of the chip 104, thereby realizing the miniaturization of the chip assembly 103 and / or the miniaturization of the imaging material box 100.

[0160] 4. After at least one contact portion is set on the second side 1049 to become a reverse contact portion, when the size of the chip substrate 1041 remains unchanged, this design is also conducive to miniaturization of the imaging material box 100. The implementation method is, for example, to use the position of the reverse contact portion originally set in the first side 1048 to place the memory 1044 originally set on the second side 1049, that is, to interchange the positions of one or more contact portions and the memory 1044, or to set the battery on the first side 1048. In this way, the size of the entire chip 104 protruding from the substrate 1041 toward the shell 101 can be reduced, and accordingly, the space in the shell 101 for accommodating the chip 104 / chip assembly 103 can be reduced.

[0161] 5. As described in 4, when the battery is arranged on the first side 1048, the replacement and maintenance of the battery will become simpler and more convenient.

[0162] 6. When the number of contact points on both sides of the center line L3a / L3b / L3c / L3d / L3e is different, the arrangement density of the contact points can be reduced, thereby helping to reduce the risk of chip short circuit; when the number of contact points on both sides of the center line L3a / L3b / L3c / L3d / L3e is the same, the force on both sides of the center line is balanced, which helps to ensure that the front contact part forms a stable electrical contact with the contact pin 91.

[0163] Other notes

[0164] Fig.23 It is a three-dimensional diagram of a second imaging material box installed with the chip assembly involved in the utility model.

[0165] As described above, the imaging material box 100 applicable to the chip 104 / chip assembly 103 described in the embodiment of the utility model has various forms. The imaging material box 100 can be a processing box or powder cartridge containing toner, or an ink cartridge containing ink.

[0166] Fig.23 It is a stereoscopic view of a second ink cartridge 100a suitable for the chip 104 / chip assembly 103, the second ink cartridge 100a also has a shell 101 for containing ink and an ink outlet portion 102 arranged on the shell 101, along the x direction, the shell 101 has a front side wall 101a facing the +x direction and a rear side wall 101b facing the -x direction, the lower side wall 101d is located between the front side wall 101a and the rear side wall 101b, the first combining member 11 is arranged on the front side wall 101a, the second combining member 12 is arranged on the rear side wall 101b, the ink outlet portion 102 is arranged on the lower side wall 101d, and compared with the front side wall 101a, the ink outlet portion 102 is closer to the rear side wall 101b, the first combining member 11 is used to guide the installation of the ink cartridge 100a, in some embodiments, the first combining member 11 is also used to confine the ink cartridge 100 in the imaging device, and the second combining member 12 is used to combine with the imaging device to confine the ink cartridge 100a in the imaging device.

[0167] Furthermore, the ink cartridge 100a also has the above-mentioned inclined side wall 101e, and the chip 104 / chip assembly 103 is arranged on the inclined side wall 101e. Specifically, the chip 104 / chip assembly 103 is arranged on the positioning plate 105 located on the inclined side wall 101e.

[0168] Furthermore, the ink cartridge 100a also includes an operating device 17 that is movable relative to the shell 101, and the operating device 17 includes a locking portion 17c and an unlocking portion 17a. Along the x direction, relative to the second coupling member 12, the locking portion 17c is closer to the first coupling member 11. Therefore, the locking portion 17c and the second coupling member 12 can respectively limit the ink cartridge 100a from the +x direction side and the -x direction side of the shell 101, and the unlocking portion 17a is used to release the locking portion 17c from the ink cartridge 100a.

[0169] Along the x direction, the chip 104 / chip assembly 103 is disposed adjacent to the locking portion 17 c , so that the chip 104 / chip assembly 103 and the contact pin 91 can form a more stable contact through the locking of the locking portion 17 c .

[0170] Fig.24 It is a three-dimensional diagram of a third imaging material box installed with the chip assembly involved in the utility model.

[0171] Fig.24 The third imaging material box shown in the figure is ink cartridge 100b. Different from ink cartridge 100a, in ink cartridge 100b, along the x direction, the ink outlet portion 102 is closer to the front side wall 101a than the rear side wall 101b, and the first coupling member 11 arranged on the front side wall 101a is movable / swingable relative to the shell 101, and the first coupling member 11 is provided with a snap-fitting protrusion 11a. The ink cartridge 100b is confined in the imaging device by the snap-fitting protrusion 11a, and the restriction of the ink cartridge 100b by the snap-fitting protrusion 11a is released by the deformation movement / swinging movement of the first coupling member 11 relative to the shell 101.

[0172] As described above, at least one of the multiple contact parts in the chip involved in the utility model is arranged on the second side 1049 of the chip substrate 1041. At the same time, the contact part arranged on the second side 1049 contacts the contact pin through the conductor 107 outside the chip 104. This structural design is not only conducive to improving the design freedom of the arrangement of the contact part, but also conducive to the miniaturization of the chip 104. Furthermore, the miniaturization of the chip component 103 including the chip 104 and the imaging material box 100 / 100a / 100b equipped with the chip 104 or the chip component 103 also becomes easy to achieve.

Claims

1. A chip, which is used to be detachably mounted with an imaging material box to an imaging device provided with a plurality of contact pins, wherein the posture of the imaging material box when the user is installing the imaging material box is taken as the standard, the left and right direction of the user's sight is the y direction of the imaging material box, and the surface of the substrate provided with the contact portion extends along the y direction and the d direction, wherein the d direction is perpendicular to the y direction and parallel to the extension direction of the plane provided with the contact portion of the substrate; The chip includes a substrate and five contact portions arranged on the substrate, wherein the five contact portions are respectively a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal; It is characterized in that The five contact portions include a front contact portion disposed on a first side of the substrate and a back contact portion disposed on a second side of the substrate, the first side and the second side being opposite to each other; The chip also includes a memory disposed on the same side as the reverse contact portion; wherein at least the ground terminal is provided as a reverse contact portion; When the imaging material cartridge is installed at a predetermined position of an imaging device, the front contact portion contacts the contact pin to form an electrical connection, and the back contact portion is electrically connected to the imaging device through a conductor outside the chip.

2. The chip according to claim 1, characterized in that: The contact points formed by the front contact portion and the contact pin and the contact points formed by the back contact portion and the conductor respectively form projection points on the straight line D parallel to the y direction at the projection points of the surface; Along the y direction, among all the contact points, the line connecting the projection points corresponding to the two outermost contact points on the straight line D has a center line L3, where Two contact points among all the contact points formed by the front contact portion and the contact pin, and the contact point formed by the back contact portion and the conductor are located on both sides of the center line L3 respectively; or, Three contact points among all the contact points formed between the front contact portion and the contact pin, and the contact point formed between the back contact portion and the conductor are located on both sides of the center line L3, respectively.

3. The chip according to claim 1, characterized in that: Two straight lines in a direction parallel to the d direction and passing through the outermost side of the substrate define an area, the projection points of the contact points of the two contact portions located in the outermost side of the y direction with the corresponding contact pins on the surface including the y direction and the d direction on the straight line D parallel to the y direction are respectively N1 and N2, the center line of the line segment N1N2 formed by the line connecting the point N1 and the point N2 is L2, along the y direction, the area is divided into adjacent first area Q1 and second area Q2 by the center line L2, along the y direction, the number of contact pins located in the first area Q1 is different from the number of contact pins located in the second area Q2; The conductor is made of a sheet of conductive material.

4. A chip, which is used to be detachably mounted with an imaging material box to an imaging device provided with a stylus mechanism, with the posture of the imaging material box when the user installs the imaging material box as the standard, the left and right direction of the user's sight is the y direction of the imaging material box, and the surface of the substrate provided with the contact portion extends along the y direction and the d direction, and the d direction is perpendicular to the y direction and parallel to the extension direction of the plane of the substrate provided with the contact portion; The contact pin mechanism includes a plurality of contact pins, the chip includes a substrate and five contact parts arranged on the substrate, and the five contact parts are respectively a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal; characterized in that: The five contact portions include a front contact portion arranged on one side of the substrate and a back contact portion arranged on the other side of the substrate; wherein at least the ground terminal is provided as a reverse contact portion; At least one of the plurality of contact portions is not in direct contact with the stylus; When the imaging material cartridge is installed at a predetermined position of an imaging device, the front contact portion contacts the contact pin to form an electrical connection, and the back contact portion is electrically connected to the imaging device through a conductor outside the chip.

5. A chip assembly, characterized in that: The chip assembly comprises the chip according to any one of claims 1 to 4 and a conductor in contact with a back contact portion of the chip, wherein the chip and the conductor are combined by welding, clamping, bonding or clamping.

6. The chip assembly according to claim 5, characterized in that: The conductor comprises a front conductive member and a back conductive member which are electrically connected to each other, wherein the front conductive member is used to contact with the contact pin, and the back conductive member is used to contact with the back contact portion.

7. The chip assembly according to claim 6, characterized in that: The chip assembly further comprises a pushing member, which is used for pushing the reverse conductive member toward the reverse contact portion.

8. The chip assembly according to claim 5, characterized in that: The conductor includes a first conductive member and a second conductive member electrically connected to each other, one end of the first conductive member contacts the reverse contact portion, and the other end contacts the second conductive member; the second conductive member and the substrate are spaced apart from each other, and a bonding space is formed between the two; The combining space is used to allow a main body of the stylus mechanism to enter, and the plurality of styluses are arranged on the main body.

9. The chip assembly according to any one of claims 5 to 8, characterized in that: Along the thickness direction of the substrate, a portion of the conductor does not overlap with the substrate.

10. An imaging material box, characterized in that: The imaging material box includes a shell for accommodating the imaging material and a chip assembly as claimed in claim 5, 6, 7, 8 or 9, wherein the chip assembly is mounted on the shell.

11. The imaging material cartridge according to claim 10, characterized in that: The imaging material cartridge further includes an imaging material discharge portion disposed on the housing. The imaging material discharge portion has a center line L5 along the y direction, and the numbers of contact portions on both sides of the center line L5 are different.

12. The imaging material cartridge according to claim 10, wherein: The imaging material box further comprises an imaging material discharge portion disposed on the housing, and along the y direction, the imaging material discharge portion has a center line L5, and the imaging material box has a center line L1; The projection points of the contact points of the two outermost contact parts on the y direction with the corresponding contact pins on the surface on the straight line D are respectively N1 and N2, and the center line of the line segment N1N2 formed by the line connecting the point N1 and the point N2 is L2, and the center line L2 does not coincide with the center line L1 and the center line L5.

Images