Adsorption material taking device for circuit board fine etching pretreatment

Abstract

The utility model discloses an adsorption material-taking device for circuit board fine etching pretreatment, which comprises a machine table, a material-taking device, a material-taking device, a material-taking device, a material-taking device, a material-taking device and a material-taking device, the conveying line is arranged on the machine table, the conveying line is arranged in the length direction of the machine table, and the conveying line is located at one end of the product containing area; the transplanting part is arranged on the machine table, and the transplanting part is located above the conveying line; the material taking assembly comprises a connecting frame, a first air cylinder, a suction cup frame, a plurality of suction cups and at least one second air cylinder, the connecting frame is connected to the transplanting component, the first air cylinder is connected to the connecting frame, the suction cup frame is connected to the first air cylinder, the suction cups are arranged on the connecting frame in two rows, and the second air cylinders are vertically connected to the suction cup frame; a second suction cup is arranged on the second air cylinder. According to the utility model, the problem that the subsequent etching processing of the circuit boards is influenced by taking out a plurality of circuit boards at one time due to the fact that the circuit boards are easily adsorbed together and are stacked can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing equipment, in particular to an adsorption material taking device for circuit board fine etching pre-processing. Background Art

[0002] With the rapid development of electronic and communication products, the amount of signal transmission has increased and the transmission speed has accelerated, making the design of printed circuit boards move towards high frequency, high power and miniaturization. High signal power, large current and high voltage have put forward higher requirements on the surface copper thickness and hole copper thickness of printed circuit boards.

[0003] During the production and processing of circuit boards, the board surface of the circuit boards needs to be drilled according to the situation of installing electronic components, and the etching identification marks on the board surface need to be etched. At present, when the circuit boards are being etched, the stacked circuit boards need to be transferred to the etching station in blocks. However, since the circuit boards are relatively thin, they are easily adsorbed together, resulting in the problem of stacking materials, which leads to the removal of multiple circuit boards at a time, affecting the subsequent etching of the circuit boards. Utility Model Content

[0004] The utility model aims to provide an adsorption and material taking device for pre-processing circuit board fine etching in order to solve the problem that circuit boards are easily adsorbed together, resulting in stacking, which leads to taking out multiple circuit boards at a time and affects the subsequent etching processing of the circuit boards.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an adsorption material taking device for pre-processing of circuit board fine etching, which comprises:

[0006] A machine table, one end of which is provided with a product placement area;

[0007] A conveyor line, the conveyor line is arranged on the machine platform, the conveyor line is arranged along the length direction of the machine platform, and the conveyor line is located at one end of the product placement area;

[0008] A transplanting component, which is arranged on the machine platform, and the transplanting component is located above the conveying line;

[0009] The material picking assembly includes a connecting frame, a first cylinder, a suction cup frame, a plurality of suction cups and at least one second cylinder, wherein the connecting frame is connected to the transplanting component, the first cylinder is connected to the connecting frame, the suction cup frame is connected to the first cylinder, a plurality of suction cups are arranged in two rows on the connecting frame, the second cylinder is vertically connected to the suction cup frame, and a second suction cup is provided on the second cylinder.

[0010] As a further description of the above technical solution:

[0011] The suction cup frame includes a first connecting plate connected to the first cylinder, second connecting plates are respectively provided at both ends of the first connecting plate, and a plurality of the suction cups are mounted on the second connecting plates.

[0012] As a further description of the above technical solution:

[0013] The second cylinder is mounted on the second connecting plate.

[0014] As a further description of the above technical solution:

[0015] Two guide columns are arranged on the connection frame, a guide rod is arranged on the guide column, and one end of the guide rod is connected to the first connection plate.

[0016] As a further description of the above technical solution:

[0017] The transplanting component is a linear module, and the connecting frame is installed on a slider of the linear module.

[0018] As a further description of the above technical solution:

[0019] The conveying line is a roller conveying line.

[0020] To sum up, due to the adoption of the above technical scheme, the beneficial effect of the utility model is: when taking materials, the transplanting component moves the connecting frame to the product placement area, the first cylinder drives the suction cup frame downward, and at the same time the second cylinder moves up a distance, when the suction cup contacts the product, the suction cup sucks the product, and then the first cylinder drives the suction cup frame upward, at this time, the second cylinder reciprocates up and down for many times, knocks the product, so that the product can vibrate, and solves the problem that circuit boards are easily adsorbed together, resulting in stacking, resulting in multiple circuit boards being taken out at one time, affecting the subsequent etching processing of the circuit boards, finally the transplanting component moves the connecting frame above the conveyor line, the first cylinder moves downward, so that the product is placed on the conveyor line, the suction cup is cut off and released from the product, and the product is taken out. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 The present invention is a structural schematic diagram of an adsorption material taking device for pre-processing of circuit board fine etching.

[0023] Figure 2This is a reference diagram of the starting state of a suction material taking device for circuit board fine etching pre-treatment.

[0024] Figure 3 The figure is a top view of a suction cup frame in a suction material removal device for pre-etching of circuit boards.

[0025] Figure 4 The present invention is a structural schematic diagram of a connecting frame in an adsorption material taking device for pre-processing of circuit board fine etching.

[0026] Legend:

[0027] 1. Machine; 2. Product placement area; 3. Conveyor line; 4. Transplanting component; 5. Connecting frame; 6. First cylinder; 7. Suction cup frame; 71. First connecting plate; 72. Second connecting plate; 8. Suction cup; 9. Second cylinder; 10. Second suction cup; 11. Guide column; 12. Guide rod; 13. Product. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] See also Figure 1-4 The utility model provides a technical solution: an adsorption material taking device for pre-processing of circuit board fine etching, comprising:

[0030] A machine 1, one end of which is provided with a product placement area 2;

[0031] A conveyor line 3, wherein the conveyor line 3 is disposed on the machine platform 1, the conveyor line 3 is arranged along the length direction of the machine platform 1, and the conveyor line 3 is located at one end of the product placement area 2;

[0032] A transplanting component 4, which is arranged on the machine platform 1, and the transplanting component 4 is located above the conveying line 3;

[0033] The material picking assembly includes a connecting frame 5, a first cylinder 6, a suction cup frame 7, a plurality of suction cups 8 and at least one second cylinder 9, wherein the connecting frame 5 is connected to the transplanting component 4, the first cylinder 6 is connected to the connecting frame 5, the suction cup frame 7 is connected to the first cylinder 6, the plurality of suction cups 8 are arranged in two rows on the connecting frame 5, the second cylinder 9 is vertically connected to the suction cup frame 7, and the second cylinder 9 is provided with a second suction cup 10.

[0034] The suction cup frame 7 includes a first connecting plate 71 connected to the first cylinder 6, and second connecting plates 72 are respectively provided at both ends of the first connecting plate 71, and a plurality of suction cups 8 are installed on the second connecting plates 72. In this way, the plurality of suction cups on the two second connecting plates can suck the two ends of the product, so that the product is more firmly adsorbed and not easy to fall off.

[0035] The second cylinder 9 is mounted on the second connecting plate 72. Two guide columns 11 are provided on the connecting frame 5, and a guide rod 12 is provided on the guide column 11, and one end of the guide rod 12 is connected to the first connecting plate 71. The second cylinder is located in the middle of the guide column, which can make the movement of the suction cup frame more stable.

[0036] The transplanting component 4 is a linear module, and the connecting frame is installed on a slider of the linear module.

[0037] The conveyor line 3 is a roller conveyor line, which can reduce the contact area between the product and the conveyor line, avoid scratching the product, and further install multiple rubber sleeves on a single roller at intervals, and the rubber sleeves are in contact with the product, which can further reduce the contact area between the product and the conveyor line.

[0038] Working principle: when taking materials, the transplanting component 4 moves the connecting frame 5 to the product placement area 2, the first cylinder 6 drives the suction cup 8 frame downward, and the second cylinder 9 moves up one end distance. When the suction cup 8 contacts the product, the suction cup 8 realizes negative pressure adsorption of the product by vacuuming, and then the first cylinder 6 drives the suction cup frame 7 upward. At this time, the second cylinder 9 reciprocates up and down for many times to knock the product, so that the product can vibrate, and the suction cup is a corrugated suction cup, and the corrugated pleated structure allows the suction cup to deform. The suction cup can be stretched or compressed to adjust its own length to avoid the second cylinder knocking the product to separate the suction cup from the product; it solves the problem that the circuit boards are easily adsorbed together, stacking materials occurs, and multiple circuit boards are taken out at one time, affecting the subsequent etching processing of the circuit boards. After that, the second suction cup on the second cylinder 9 realizes negative pressure adsorption of the product by vacuuming. Finally, the transplanting component 4 moves the connecting frame 5 above the conveyor line, the first cylinder 6 moves downward, so that the product is placed on the conveyor line 3, and the suction cup 8 is released from the product to complete the product taking.

[0039] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A device for adsorption and material removal for pre-processing of circuit board fine etching, characterized in that: include: A machine table, one end of which is provided with a product placement area; A conveyor line, the conveyor line is arranged on the machine platform, the conveyor line is arranged along the length direction of the machine platform, and the conveyor line is located at one end of the product placement area; A transplanting component, which is arranged on the machine platform, and the transplanting component is located above the conveying line; The material picking assembly includes a connecting frame, a first cylinder, a suction cup frame, a plurality of suction cups and at least one second cylinder, wherein the connecting frame is connected to the transplanting component, the first cylinder is connected to the connecting frame, the suction cup frame is connected to the first cylinder, a plurality of suction cups are arranged in two rows on the connecting frame, the second cylinder is vertically connected to the suction cup frame, and a second suction cup is provided on the second cylinder.

2. The adsorption material removal device for circuit board fine etching pre-treatment according to claim 1 is characterized in that: The suction cup frame includes a first connecting plate connected to the first cylinder, second connecting plates are respectively provided at both ends of the first connecting plate, and a plurality of the suction cups are mounted on the second connecting plates.

3. The adsorption material removal device for circuit board fine etching pre-treatment according to claim 2 is characterized in that: The second cylinder is mounted on the second connecting plate.

4. The adsorption material removal device for circuit board fine etching pre-treatment according to claim 2 is characterized in that: Two guide columns are arranged on the connection frame, a guide rod is arranged on the guide column, and one end of the guide rod is connected to the first connection plate.

5. The adsorption material removal device for circuit board fine etching pre-treatment according to claim 1 is characterized in that: The transplanting component is a linear module, and the connecting frame is installed on a slider of the linear module.

6. The adsorption material removal device for circuit board fine etching pre-treatment according to claim 1 is characterized in that: The conveying line is a roller conveying line.

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