Stamping device for power supply chip processing

Abstract

The utility model relates to the field of power supply chip processing, in particular to a stamping device for power supply chip processing, which comprises an upper die, a power mechanism, a pressing plate, a lower die and a power supply chip stamping module. The output end of the power mechanism penetrates through the upper die and is connected with the pressing plate; a stand column is arranged between the upper die and the lower die, and the pressing plate is installed on the stand column in a sliding mode. The power supply chip stamping module is arranged below the pressing plate; the power supply chip stamping module comprises an upper die frame, a lower die frame and a guide column; a punching head is arranged at the bottom of the upper die frame; the lower die frame is arranged on the lower die set, and a power supply chip is installed on the lower die frame. One ends of the guide columns are fixedly arranged at the four corners of the bottom of the upper die frame, and the other ends of the guide columns penetrate through the lower die frame and extend into the lower die. The guide columns are sleeved with springs. The power supply chip stamping die can be used for stamping power supply chips with different sizes, is convenient to mount and dismount, and effectively improves the stamping efficiency.

Description

Technical Field

[0001] The utility model relates to the field of power chip processing, in particular to a punching device used for power chip processing. Background Art

[0002] The power chip is responsible for the conversion, distribution, detection and other power management of electrical energy in electronic equipment systems. At present, during the production and processing of power chips, it is usually necessary to stamp them first to stamp them into a suitable shape to facilitate the later wiring synthesis of the power chips.

[0003] However, the stamping shape set by the existing stamping forming device is relatively fixed, and it is impossible to stamp power chips of different sizes and dimensions. Replacing the overall mold is cumbersome and the replacement cost is high. The application range is small and the stamping efficiency is low. Utility Model Content

[0004] In response to the above problems, a stamping device for power chip processing is provided. Through a unique power chip stamping module, when stamping power chips of different sizes and dimensions, it is only necessary to replace the corresponding stamping die. The installation and disassembly are relatively convenient, and the stamping efficiency of various types of power chips can be effectively improved.

[0005] In order to solve the problems of the prior art, the utility model provides a stamping device for power chip processing, comprising an upper mold, a power mechanism, a pressure plate, a lower mold and a power chip stamping die set; the power mechanism is arranged on the top of the upper mold, and the output end of the power mechanism passes through the upper mold and is connected to the pressure plate; columns are arranged at the four corners of the upper mold and the lower mold, and the pressure plate is slidably installed on the columns; the power chip stamping die set is arranged below the pressure plate; the power chip stamping die set comprises an upper mold frame, a lower mold frame and a guide column; a stamping head is arranged at the bottom of the upper mold frame; the lower mold frame is fixedly arranged on the lower mold set, and a power chip is installed on the lower mold frame; one end of the guide column is fixedly arranged at the four corners of the bottom of the upper mold frame, and the other end passes through the lower mold frame and extends into the lower mold; a spring is sleeved on the guide column.

[0006] Preferably, a mounting groove is provided on the lower mold frame, and a punching hole is provided in the mounting groove; the power chip is arranged in the mounting groove, and the size of the power chip is adapted to the mounting groove.

[0007] Preferably, a positioning groove is provided on the lower mold; a positioning block is provided at the bottom of the lower mold frame; the positioning block is installed in the positioning groove; the size of the positioning block is adapted to the positioning groove; a positioning hole is provided on the lower mold, and the size of the positioning hole is adapted to the guide column.

[0008] Preferably, a cavity is provided at the bottom of the positioning block, and the punching hole is communicated with the cavity; and a collecting device is provided below the positioning block.

[0009] Preferably, the collecting device comprises a collecting box, and sliders are arranged on both sides of the collecting box; a collecting groove is arranged on the side wall of the lower mold; slide grooves are arranged on the side walls of both sides of the collecting groove; and the slider is slidably installed in the slide groove.

[0010] Preferably, the collection box is provided with a handle.

[0011] Preferably, the length of the punching head is greater than the distance from the punching hole to the cavity.

[0012] Preferably, the punch head is fixedly installed by bolts.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. The utility model adopts a unique power chip stamping module. When stamping power chips of different sizes and dimensions, it only needs to replace the corresponding stamping die. It is convenient to install and disassemble, and can effectively improve the stamping processing of various types of power chips.

[0015] 2. The positioning block provided at the bottom of the lower mold frame of the utility model is adapted to the positioning groove, so that the power chip stamping module can be stably installed. At the same time, it is convenient to install and disassemble when replacing different types of power chip stamping modules, thereby improving the efficiency of stamping. Through the provided positioning holes, when the upper mold frame drives the guide column to move downward, the guide column is accommodated, and the stability of the stamping work is improved.

[0016] 3. The utility model is connected with the punching hole through the cavity. During the punching process, the punching head punches the waste material from the punching hole into the cavity. Under the action of gravity, the waste material falls into the collection container, and the waste material is collected and processed centrally through the collection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The present invention is a three-dimensional structural schematic diagram of a stamping device used for power chip processing.

[0018] Figure 2 The present invention is a front view of a stamping device used for processing power chips.

[0019] Figure 3 The invention discloses a schematic diagram of installation of a power chip stamping module of a stamping device used for power chip processing.

[0020] Figure 4 The invention discloses a three-dimensional structural diagram of a power chip stamping module of a stamping device used for power chip processing.

[0021] Figure 5 The present invention is a schematic diagram of the bottom of a power chip stamping module of a stamping device used for power chip processing.

[0022] Figure 6 The present invention is a schematic diagram of the installation of a collection box of a punching device used for power chip processing.

[0023] The numbers in the figure are: 1. upper mold; 11. column; 2. lower mold; 21. positioning groove; 22. positioning hole; 23. collecting groove; 231. slide groove; 3. power mechanism; 31. pressure plate; 4. upper mold frame; 41. punch head; 5. lower mold frame; 51. power chip; 52. mounting groove; 521. punching hole; 53. positioning block; 531. cavity; 6. guide column; 61. spring; 7. collecting box; 71. slider; 72. handle. DETAILED DESCRIPTION

[0024] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0025] Reference Figures 1 to 6 As shown: a stamping device for power chip processing, including an upper mold 1, a power mechanism 3, a pressure plate 31, a lower mold 2 and a power chip stamping die set; the power mechanism 3 is arranged on the top of the upper mold 1, and the output end of the power mechanism 3 passes through the upper mold 1 and is connected to the pressure plate 31; columns 11 are arranged at the four corners of the upper mold 1 and the lower mold 2, and the pressure plate 31 is slidably installed on the columns 11; the power chip stamping die set is arranged below the pressure plate 31; the power chip stamping die set includes an upper mold frame 4, a lower mold frame 5 and a guide column 6; a punching head 41 is arranged at the bottom of the upper mold frame 4; the lower mold frame 5 is fixedly arranged on the lower mold set, and a power chip 51 is installed on the lower mold frame 5; one end of the guide column 6 is fixedly arranged at the four corners at the bottom of the upper mold frame 4, and the other end passes through the lower mold frame 5 and extends into the lower mold 2; a spring 61 is sleeved on the guide column 6.

[0026] In the actual operation of the punching device for power chip processing, the entire power chip punching die set is fixedly installed on the lower die 2, the power chip 51 to be punched is fixedly placed on the lower die frame 5, and the punch head 41 is fixedly set at the bottom of the upper die frame 4, wherein the shape of the punch head 41 is matched with the shape of the power chip 51 actually punched, and after the punch head 41 is positioned to the position where punching is required, the pressing plate 31 is driven to move downward by the power mechanism 3, wherein the power mechanism 3 is preferably a hydraulic press. When the pressing plate 31 moves downward, the downward impact force drives the upper die frame 4 to move downward, and the downward impact force acts on the position to be punched of the power chip 51 through the punch head 41 to complete the punching work. The upper die frame 4 moves downward together with the guide column 6, and the upper die frame 4 and the lower die frame 5 are installed and matched, so that the upper die frame 4 is more stable during the punching movement process. At the same time, when the upper mold frame 4 moves downward, the compression spring 61 can play a certain buffering role on the power chip 51 during the stamping process, effectively preventing chip damage, and improving processing accuracy and product quality. When the power chip 51 is stamped, a new power chip 51 to be processed is placed, which can effectively improve the efficiency of stamping the same power chip 51. At the same time, through the unique power chip stamping module, when stamping power chips 51 of different sizes and dimensions, only the corresponding stamping die needs to be replaced, which is convenient to install and disassemble, and can effectively improve the stamping processing of various types of power chips 51.

[0027] Reference Figure 4 As shown: the lower mold frame 5 is provided with a mounting groove 52 , and a punching hole 521 is provided in the mounting groove 52 ; the power chip 51 is arranged in the mounting groove 52 , and the size of the power chip 51 is adapted to the mounting groove 52 .

[0028] When the power chip 51 is stamped, the mounting groove 52 is adapted to the size of the power chip 51, so that the stability of the power chip 51 during stamping can be improved. At the same time, according to the actual stamping position and shape, a matching stamping hole 521 is designed in the mounting groove 52 to realize the discharge of waste.

[0029] Reference Figure 3 As shown: a positioning groove 21 is provided on the lower mold 2; a positioning block 53 is provided at the bottom of the lower mold frame 5; the positioning block 53 is installed in the positioning groove 21; the size of the positioning block 53 is adapted to the positioning groove 21; a positioning hole 22 is provided on the lower mold 2, and the size of the positioning hole 22 is adapted to the guide column 6.

[0030] When the power chip stamping module is installed as a whole, the positioning block 53 provided at the bottom of the lower mold frame 5 is adapted to the positioning groove 21, so that the power chip stamping module can be stably installed, and it is convenient to install and disassemble when replacing different types of power chip stamping modules, thereby improving the efficiency of stamping. Through the positioning hole 22, when the upper mold frame 4 drives the guide column 6 to move downward, the guide column 6 is given a receiving function, and the stability of the stamping work is improved.

[0031] Reference Figure 5 As shown, a cavity 531 is provided at the bottom of the positioning block 53 , and the punching hole 521 is connected to the cavity 531 ; a collecting device is provided below the positioning block 53 .

[0032] The cavity 531 is connected to the punching hole 521. During the punching process, the punching head 41 punches the waste out of the punching hole 521 into the cavity 531. Under the action of gravity, the waste falls into the collection container, and the waste is collected and processed by the collection device.

[0033] Reference Figure 6 As shown: the collecting device includes a collecting box 7, and sliders 71 are arranged on both sides of the collecting box 7; a collecting groove 23 is arranged on the side wall of the lower mold 2; slide grooves 231 are arranged on the side walls of both sides of the collecting groove 23; the slider 71 is slidably installed in the slide groove 231.

[0034] The collecting box 7 is arranged to be slidable, so that waste can be cleaned up quickly and conveniently.

[0035] Reference Figure 6 As shown: the collecting box 7 is provided with a handle 72 .

[0036] The handle 72 is designed to facilitate taking out the collection box 7, thereby improving the efficiency of waste cleaning and avoiding blockage caused by accumulation of ingredients.

[0037] The length of the punch head 41 is greater than the distance from the punch hole 521 to the cavity 531 .

[0038] By making the length of the punching head 41 greater than the distance from the punching hole 521 to the cavity 531 , during the actual punching process, it is possible to avoid blockage of the punching hole 521 by waste materials, thereby improving the quality and efficiency of the punching work.

[0039] The punch head 41 is fixedly installed by bolts.

[0040] The punching head 41 is fixedly installed by bolts, which facilitates installation and removal of multiple pairs of punching heads 41 . The punching heads 41 can be replaced independently according to the shapes required for punching, thereby improving the punching efficiency of the power chip 51 .

[0041] The above embodiments only express one or several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the attached claims.

Claims

1. A punching device for processing a power chip, comprising an upper mold (1), a power mechanism (3), a pressing plate (31), a lower mold (2) and a power chip punching die set; the power mechanism (3) is arranged on the top of the upper mold (1), and the output end of the power mechanism (3) passes through the upper mold (1) and is connected to the pressing plate (31); columns (11) are arranged at the four corners of the upper mold (1) and the lower mold (2), and the pressing plate (31) is slidably mounted on the columns (11); It is characterized in that The power chip stamping die set is arranged below the pressing plate (31); The power chip stamping die set comprises an upper die frame (4), a lower die frame (5) and a guide column (6); A punch head (41) is provided at the bottom of the upper die frame (4); The lower mold frame (5) is fixedly arranged on the lower mold assembly, and a power chip (51) is installed on the lower mold frame (5); One end of the guide column (6) is fixedly arranged at the four corners of the bottom of the upper mold frame (4), and the other end passes through the lower mold frame (5) and extends into the lower mold (2); The guide column (6) is sleeved with a spring (61).

2. A punching device for power chip processing according to claim 1, characterized in that: The lower mold frame (5) is provided with a mounting groove (52), and a punching hole (521) is provided in the mounting groove (52); The power chip (51) is arranged in the installation groove (52), and the size of the power chip (51) is adapted to the installation groove (52).

3. A punching device for power chip processing according to claim 2, characterized in that: The lower mold (2) is provided with a positioning groove (21); the bottom of the lower mold frame (5) is provided with a positioning block (53); the positioning block (53) is installed in the positioning groove (21); The size of the positioning block (53) is adapted to the positioning groove (21); The lower mold (2) is provided with a positioning hole (22), and the size of the positioning hole (22) is adapted to the guide column (6).

4. A punching device for power chip processing according to claim 3, characterized in that: A cavity (531) is provided at the bottom of the positioning block (53), and the punching hole (521) is in communication with the cavity (531); A collecting device is arranged below the positioning block (53).

5. A punching device for power chip processing according to claim 4, characterized in that: The collecting device comprises a collecting box (7), and sliders (71) are arranged on both sides of the collecting box (7); A collecting groove (23) is provided on the side wall of the lower mold (2); The side walls of both sides of the collecting trough (23) are provided with sliding grooves (231); The sliding block (71) is slidably mounted in the sliding groove (231).

6. A punching device for power chip processing according to claim 5, characterized in that: The collection box (7) is provided with a handle (72).

7. A punching device for power chip processing according to claim 4, characterized in that: The length of the punching head (41) is greater than the distance from the punching hole (521) to the cavity (531).

8. A punching device for power chip processing according to claim 1, characterized in that: The punch head (41) is fixedly installed by means of bolts.

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