Active optical cable and photoelectric transmission equipment

Abstract

The utility model provides an active optical cable, which comprises a first connector, an optical fiber cable and a second connector, the first connector and the second connector are respectively provided with an optical transceiver, one end of each optical transceiver is provided with a power interface, and the power interface is connected with an electric connector through a cable. The optical transceiver comprises a PCB, and an optical fiber reflector, an optical fiber array adapter, a linear driving chip, a laser array, a photoelectric detector, a TIA chip, a common chipset and a golden finger which are mounted on the PCB, and the first connector and the second connector are connected through an optical fiber cable. And constructing a target transmission path based on all components in the optical transceiver for transmitting photoelectric data. According to the invention, the corresponding target transmission paths are constructed in different optical transmission stages, and the photoelectric data are transmitted through the target transmission paths, so that the transmission distance and the data rate of the active optical cable are improved, and the power consumption of the optical cable is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of transmission cables, in particular to an active optical cable and optoelectronic transmission equipment. Background Art

[0002] With advancements in fiber optic communication technology, high-performance active optical cables (AOCs) are gradually emerging from data centers into the public eye. With their numerous superior features, AOCs are gaining widespread acclaim within the industry, providing a strong impetus for their application.

[0003] Existing active optical cables often use coaxial cables for connection. However, the transmission distance of coaxial cable MCIO adapters is only 0.5 meters, making them only suitable for interconnection within the host computer. The wires are relatively thick (for example, 30AWG wire has a diameter of 1.8mm, so a 74-pin MCIO requires 24 wires) and have poor bending resistance, making them difficult to manage. Therefore, improving the transmission distance and data rate of active optical cables is a technical challenge that needs to be addressed in the industry. Utility Model Content

[0004] The embodiments of the present invention provide an active optical cable and an optoelectronic transmission device to solve the problem that the prior art cannot improve the transmission distance and data rate of the active optical cable.

[0005] According to a first aspect of an embodiment of the present disclosure, an active optical cable is provided, comprising a first connector, an optical fiber cable, and a second connector. The first connector and the second connector are both provided with an optical transceiver. One end of the optical transceiver is provided with a power interface, and the power interface is connected to the electrical connector via a cable. The optical transceiver includes a PCB board and a fiber reflector mounted on the PCB board, a fiber array adapter, a linear driver chip, a laser array, a photodetector, a TIA chip, a conventional chipset, and a gold finger.

[0006] The first connector and the second connector are connected via the optical fiber cable;

[0007] The optical transceiver is used to respond to the current optical transmission stage and construct a target transmission path based on the optical fiber reflector, the optical fiber array adapter, the linear driver chip, the laser array, the photodetector, the TIA chip, the ordinary chipset and the gold finger in the optical transceiver, and the target transmission path is used to transmit photoelectric data.

[0008] Optionally, one side of the optical transceiver is a light emitting end, and the other side is a light receiving end.

[0009] Optionally, the linear driver chip, the laser array, the photodetector and the TIA chip are all bare chips, and are connected to the PCB board by gold wire bonding.

[0010] Optionally, the common chipset includes a control chip and a power management chip, which are used to control the linear driver chip and the TIA chip and manage power supply.

[0011] Optionally, the circuits of the electrical connector include but are not limited to four wires.

[0012] Optionally, the gold finger adopts a 38-pin, 74-pin, 124-pin or 148-pin gold finger of the MCIO standard.

[0013] Optionally, the laser array and the linear driver chip, as well as the photodetector and the TIA chip are connected respectively by gold wires.

[0014] Optionally, the laser array adopts a multi-mode VCSEL or a single-mode DFB laser array, and the laser array is used to realize electro-optical signal conversion.

[0015] Optionally, the diameter of a single optical fiber of the active optical cable is 0.125 mm.

[0016] According to a second aspect of the embodiments of the present disclosure, there is provided an optoelectronic transmission device, comprising the active optical cable according to the first aspect of the embodiments of the present disclosure.

[0017] The utility model provides an active optical cable and optoelectronic transmission equipment, the active optical cable includes a first connector, an optical fiber cable and a second connector, the first connector and the second connector are both provided with an optical transceiver, one end of the optical transceiver is provided with a power interface, the power interface is connected to the electrical connector through a cable, the optical transceiver includes a PCB board and an optical fiber reflector, an optical fiber array adapter, a linear driver chip, a laser array, a photodetector, a TIA chip, a common chipset and a gold finger installed on the PCB board, the first connector and the second connector are connected through an optical fiber cable, when the optical transceiver is used to respond to the current optical transmission stage, a target transmission path is constructed based on the optical fiber reflector, the optical fiber array adapter, the linear driver chip, the laser array, the photodetector, the TIA chip, the common chipset and the gold finger in the optical transceiver, and the target transmission path is used to transmit optoelectronic data. The present application constructs corresponding target transmission paths in different optical transmission stages, thereby using the target transmission paths to transmit optoelectronic data, thereby improving the transmission distance and data rate of the active optical cable, and the active optical cable has a simpler structure, better stability, and is more convenient to use, reducing the power consumption and cost of the active optical cable itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1 It is a structural schematic diagram of an active optical cable in an embodiment of the utility model.

[0020] Figure 2 It is a structural diagram of the optical transmitting end side of the optical transceiver in the embodiment of the utility model.

[0021] Figure 3-4 It is a detailed schematic diagram of one side of the light emitting end in an embodiment of the present utility model.

[0022] Figure 5 It is a structural diagram of the optical receiving end side of the optical transceiver in the embodiment of the utility model.

[0023] Figure 6 It is a detailed schematic diagram of one side of the light receiving end in an embodiment of the present utility model.

[0024] Figure 7 The figure is a block diagram of an optoelectronic transmission device according to an exemplary embodiment.

[0025] The reference numerals are as follows:

[0026] First connector 1, optical fiber cable 2, second connector 3, optical transceiver 4, cable 5, electrical connector 6, optical fiber reflector 31, optical fiber array adapter 32, ordinary chipset 33, gold finger 34, laser array 35, linear driver chip 36, photodetector 11, TIA chip 12. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] In the description of the present invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0029] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0030] See also Figure 1 An active optical cable according to an embodiment of the present invention is described. The active optical cable includes a first connector 1, an optical fiber cable 2, and a second connector 3, wherein the first connector 1 and the second connector 3 are both provided with an optical transceiver 4, and a power interface is provided at one end of the optical transceiver 4, and the power interface is connected to the electrical connector 6 through a cable 5. The optical transceiver 4 includes a PCB board and an optical fiber reflector 31, an optical fiber array adapter 32, a linear driver chip 36, a laser array 35, a photodetector 11, a TIA chip 12, a common chipset 33, and a gold finger 34 installed on the PCB board. The first connector 1 and the second connector 3 are connected through the optical fiber cable 2. When the optical transceiver 4 is used to respond to the current optical transmission stage, a target transmission path is constructed based on the optical fiber reflector 31, the optical fiber array adapter 32, the linear driver chip 36, the laser array 35, the photodetector 11, the TIA chip 12, the common chipset 33, and the gold finger 34 in the optical transceiver 4, and the target transmission path is used to transmit photoelectric data.

[0031] For example, when the optical fiber cable 2 connects two external devices (such as a power adapter and a mobile phone terminal) through the first connector 1 and the second connector 3, the external devices transmit the optoelectronic data interacting between the two external devices based on the target transmission path constructed between the active optical cable connectors.

[0032] In this embodiment, a power interface is set in the optical transceiver 4 in the first connector 1 and the second connector 3. The power interface is connected to the electrical connector 6 from the PCB through a common cable 5. The electrical connector 6 is connected to the motherboard to be connected for power supply and low-frequency signal transmission. In this way, the external power supply is used to power the active optical cable, which is convenient and simple to operate. The first connector 1 and the second connector 3 are both Figure 1 The MCIO interface shown, the two connectors and the optical fiber cable 2 form an MCIO to MCIO active optical cable.

[0033] In the embodiment of the present disclosure, Figure 2 As shown in the figure, it is the light emitting end side of the active optical cable, and its back side is the light receiving end, as shown in the figure. Figure 5 As shown. The light emitting end includes a fiber optic reflector 31 on one side, which is used to reflect the light emitted vertically by the laser on the PCB board to a horizontal direction, and then input it into the optical fiber cable 2 through the optical fiber array adapter 32. That is, the fiber optic reflectors 31 are fixedly installed on both sides of the PCB board. The fiber optic reflectors 31 use high-precision multi-channel lenses, and the fiber optic reflectors 31 on both sides are respectively covered on the corresponding optical fiber array adapters 32. Among them, the ordinary chipset 33 includes passive components such as capacitors and resistors, as well as power chips. The optoelectronic chip is located below the fiber optic reflector 31. When the emitted light passes through the optical fiber cable 2 and is transmitted to the other end of the light receiving end, it also passes through the fiber optic reflector 31 and the optical fiber array adapter 32 and is then transmitted to the photodetector 11. The light receiving end also has the required ordinary chipset 33, and this ordinary chipset 33 includes passive components such as capacitors and resistors, as well as power chips. It should be noted that the components installed at both ends of the first connector 1 and the second connector 3 are exactly the same, thereby realizing bidirectional transmission of optoelectronic data.

[0034] In the embodiment of the present disclosure, Figure 3-4 As shown, there are two schemes for transmitting photoelectric data. One is to directly drive the optical device array 35 with the differential voltage signal received by the gold finger 34 to generate an optical pulse signal. Then, according to the PCIE5.0 standard, the differential voltage signal received by the gold finger 34 can have a maximum amplitude of 1300mV, which is sufficient to drive the optical device array 35 to generate an optical pulse signal. However, under this scheme, a set of constant current sources needs to be provided for the optical device array 35, usually 2 to 20mA per channel, and the constant current source chip is preferably a common multi-channel LED driver chip, mainly located in the ordinary chipset 33. The other is to use a low-power linear driver chip 36 to drive the laser array 35, so that the laser array 35 generates an optical pulse signal and sends it to the optical receiving end through the optical fiber cable 2. Generally, the linear driver chip 36 preferably does not have a nonlinear processing function such as CDR to reduce system power consumption and transmission delay. Compared with the first scheme, the second scheme has a longer transmission distance.

[0035] It should be noted that the embodiments of the present application can select different light emission schemes according to different usage scenarios, and the present application does not impose any limitations on this.

[0036] In the embodiment of the present disclosure, Figure 6 As shown, when the optical receiver receives the signal sent by the optical transmitter, the photodetector 11 in the optical receiver converts the received optical pulse signal into a current signal, which is then converted into a voltage signal recognizable by the system through the TIA chip 12. Typically, the TIA chip 12 can generate a differential voltage signal of 300 to 700 mV. The minimum recognizable differential voltage eye height specified by the PCIE 5.0 standard is 17.5 mV, and the voltage signal output by the TIA can meet the PCIE 5.0 standard. If longer transmission distances are required, a TIA chip 12 with an amplification function can be selected, and this application does not impose any restrictions on this.

[0037] In the embodiment of the present disclosure, the active optical cable includes a first connector 1, an optical fiber cable 2 and a second connector 3. The first connector 1 and the second connector 3 are both provided with an optical transceiver 4. A power interface is provided at one end of the optical transceiver 4, and the power interface is connected to the electrical connector 6 through a cable 5. The optical transceiver 4 includes a PCB board and an optical fiber reflector 31, an optical fiber array adapter 32, a linear driver chip 36, a laser array 35, a photodetector 11, a TIA chip 12, a normal chipset 33 and a gold finger 34 installed on the PCB board. Since the first connector 1 and the second connector 3 are connected through the optical fiber cable 2, when the optical transceiver 4 is used to respond to the current optical transmission stage, a target transmission path is constructed based on the optical fiber reflector 31, the optical fiber array adapter 32, the linear driver chip 36, the laser array 35, the photodetector 11, the TIA chip 12, the normal chipset 33 and the gold finger 34 in the optical transceiver, so that the target transmission path is used to transmit photoelectric data. The present application constructs corresponding target transmission paths at different optical transmission stages, thereby utilizing the target transmission paths to transmit photoelectric data, thereby improving the transmission distance and data rate of the active optical cable. The active optical cable has a simpler structure, better stability, and is more convenient to use, reducing the power consumption and cost of the active optical cable itself.

[0038] In one embodiment, one side of the optical transceiver 4 is a light emitting end, and the other side is a light receiving end.

[0039] In this embodiment, the first connector 1 of the MCIO active optical cable is connected to the second connector 3 at the other end via a fiber optic cable 2. Both the first connector 1 and the second connector 3 are equipped with an optical transceiver 4, and these optical transceivers are identically configured, with one side being a transmitter and the other being a receiver, to enable the transmission and interaction of optical and electrical data. The transmitter of the first connector 1 transmits optical signals to the receiver of the second connector 3 via the fiber optic cable 2, and the receiver of the first connector 1 receives the optical signal transmitted from the second connector 3 via the fiber optic cable 2. This demonstrates that the current active optical cable is a bidirectional transmission cable, thereby reducing costs and lowering losses in the active optical cable itself.

[0040] In one embodiment, the linear driver chip 36 , the laser array 35 , the photodetector 11 and the TIA chip 12 are all bare chips, and are connected to the PCB board by gold wire bonding.

[0041] In this embodiment, the linear driver chip 36, laser array 35, photodetector 11, and TIA chip 12 are all bare chips, meaning they are unpackaged. High-speed devices are typically packaged in bare chip form, with pads located on the top of the chip. Gold wire bonding is used to connect the linear driver chip 36, laser array 35, photodetector 11, and TIA chip 12 to the PCB. Furthermore, the chip's small size allows it to be placed below the fiber reflector 31, preventing end-face contamination and protecting the gold wires from damage.

[0042] In one embodiment, the general chipset 33 includes a control chip and a power management chip, which are used to control the linear driver chip 36 and the TIA chip 12 and manage power.

[0043] In this embodiment, the general chipset 33 includes a control chip and a power management chip. The general chipset 33 is not only used to control the linear driver chip 36 and the TIA chip 12, but also used to manage the power supply so as to reasonably meet the transmission requirements of the active optical cable and realize the transmission of optical and electrical data.

[0044] In one embodiment, both the fiber reflector 31 and the fiber array adapter 32 have 12 channels.

[0045] In one embodiment, the gold finger 34 adopts a 38-pin, 74-pin, 124-pin or 148-pin gold finger of the MCIO standard.

[0046] In this embodiment, if Figure 1As shown, gold fingers 34 are located at the front end of the PCB board. They use MCIO standard 38-pin, 74-pin, 124-pin, or 148-pin gold fingers, are hot-swappable, and facilitate removal and maintenance. Gold fingers 34 are located on both sides of the front end of the PCB board. These gold fingers 34 represent the MCIO interface, which includes 12×2 differential signal pairs, i.e., 12 pairs of optical transmitters and 12 pairs of optical receivers. The fiber optic reflector 31 and fiber array adapter 32 are typically 12-channel, so a set of fiber optic reflectors 31 and fiber array adapter 32 can be used for both the optical transmitter and the optical receiver. For a 38-pin MCIO interface, i.e., 6 pairs of optical transmitters and 6 pairs of optical receivers, at least one set of fiber optic reflectors 31 and fiber array adapter 32 is required. For a 124-pin MCIO interface, with 20 pairs of optical transmitters and 20 pairs of optical receivers, at least two sets of fiber optic reflectors 31 and fiber array adapter 32 are required. If it is a 148-PIN MCIO interface, including 24 pairs of optical transmitters and 24 pairs of optical receivers, at least two sets of fiber optic reflectors 31 and fiber optic array adapters 32 are also required.

[0047] It should be noted that the embodiments of the present application can select different models of gold fingers according to different usage scenarios, and the present application does not impose any limitation on this.

[0048] In one embodiment, the circuits of the electrical connector 6 include but are not limited to four wires.

[0049] In this embodiment, the wiring of the conventional cable 5 and the electrical connector 6 includes, but is not limited to, four wires, but includes at least a power line and a ground line, i.e., at least two wires. The specific number of wires depends on whether the chip used in the optical transceiver includes register read / write functionality. A common method is IC2 communication, a two-wire serial communication bus used to connect the controller and its peripherals, including a clock line SCL and a data line SDA. If both optical transceivers use chips that do not require register read / write functionality, only the power line and the ground line are required. The wire specifications are selected based on system power consumption. For a 38-pin MCIO active optical cable, a 26-36 AWG wire diameter conventional cable is preferred; for a 74-pin MCIO active optical cable, a 23-33 AWG wire diameter conventional cable is preferred; for a 124-pin MCIO active optical cable, a 21-31 AWG wire diameter conventional cable is preferred; and for a 148-pin MCIO active optical cable, a 20-30 AWG wire diameter conventional cable is preferred.

[0050] It should be noted that the embodiments of the present application can select ordinary cables with different wire diameters according to different usage scenarios, and the present application does not impose any restrictions on this.

[0051] In one embodiment, the laser array 35 and the linear driver chip 36 , as well as the photodetector 11 and the TIA chip 12 are connected respectively by gold wires.

[0052] In this embodiment, the laser array 35 and the linear driver chip 36 as well as the photodetector 11 and the TIA chip 12 are connected respectively by gold wires. The connection structure is simple, low-cost, and easy to assemble, so that it can be used in a high-temperature and high-humidity environment with good reliability.

[0053] In one embodiment, the laser array 35 uses a multi-mode VCSEL or a single-mode DFB laser array, and the laser array 35 is used to realize electrical-optical signal conversion.

[0054] In this embodiment, a multi-mode VCSEL or a single-mode DFB laser array can be selected according to the transmission requirements to realize electro-optical signal conversion, that is, to convert weak optical signals into electrical signals. By controlling the driving current and extinction ratio compensation parameters of the linear driver chip 36, stable output of optical power and extinction ratio and a good optical eye diagram within the operating temperature range are guaranteed.

[0055] In one embodiment, the diameter of a single optical fiber of the active optical cable is 0.125 mm.

[0056] In this embodiment, the existing optical fiber cable 2 is secured to the first connector 1 and the second connector 3 via a COB process, thereby ensuring the communication performance of the active optical cable. This active optical cable solution includes an external power interface, which does not affect existing transmission interface standards and is compatible with existing equipment. Furthermore, by converting electrical transmission to optical transmission, the transmission distance can reach tens of meters, and the wire diameter is small. With a single optical fiber diameter of 0.125mm, only 24 fibers are required for a 74-pin MCIO. Therefore, this active optical cable has excellent bending performance and is easy to manage. Furthermore, this optoelectronic conversion solution has low power consumption, with single-channel power consumption below 100mW, which does not significantly increase system power consumption.

[0057] The utility model mainly solves the problems of transmission distance and data rate of active optical cables, can simultaneously meet the transmission of multiple optical and electrical data signals, and realize the functions of converting electrical signals into optical signals and optical signals into electrical signals, supports fast transmission, and is downward compatible. It has the characteristics of small structure, high integration, high reliability, etc., and meets the purpose of long transmission distance of active optical cables, which can transmit tens of meters, and has low power consumption, good bending performance, and easy wiring harness management.

[0058] To implement the above embodiment, the present disclosure further proposes an optoelectronic transmission device, Figure 7 The figure is a block diagram of an optoelectronic transmission device according to an exemplary embodiment.

[0059] like Figure 7 As shown, the optoelectronic transmission device 700 includes the active optical cable described in the above embodiment.

[0060] The optoelectronic transmission device of the embodiment of the present disclosure includes a first connector, an optical fiber cable, and a second connector. The first connector and the second connector are both provided with an optical transceiver. One end of the optical transceiver is provided with a power interface, and the power interface is connected to the electrical connector via a cable. The optical transceiver includes a PCB board and an optical fiber reflector, an optical fiber array adapter, a linear driver chip, a laser array, a photodetector, a TIA chip, a common chipset, and a gold finger mounted on the PCB board. The first connector and the second connector are connected by an optical fiber cable. When the optical transceiver is used to respond to the current optical transmission stage, a target transmission path is constructed based on the optical fiber reflector, the optical fiber array adapter, the linear driver chip, the laser array, the photodetector, the TIA chip, the common chipset, and the gold finger in the optical transceiver. The target transmission path is used to transmit optoelectronic data. By constructing corresponding target transmission paths in different optical transmission stages, the target transmission path is used to transmit optoelectronic data, thereby improving the transmission distance and data rate of the active optical cable. The active optical cable has a simpler structure, better stability, and is more convenient to use, reducing the power consumption and cost of the active optical cable itself.

[0061] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0062] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An active optical cable, characterized in that: The active optical cable comprises a first connector, an optical fiber cable and a second connector, the first connector and the second connector are both provided with an optical transceiver, one end of the optical transceiver is provided with a power interface, the power interface is connected to the electrical connector through a cable, and the optical transceiver comprises a PCB board and an optical fiber reflector mounted on the PCB board, an optical fiber array adapter, a linear driver chip, a laser array, a photodetector, a TIA chip, a common chipset and a gold finger; The first connector and the second connector are connected via the optical fiber cable; The optical transceiver is used to respond to the current optical transmission stage, and to construct a target transmission path based on the optical fiber reflector, the optical fiber array adapter, the linear driver chip, the laser array, the photodetector, the TIA chip, the ordinary chipset and the gold finger in the optical transceiver, and the target transmission path is used to transmit optoelectronic data.

2. The active optical cable according to claim 1, characterized in that One side of the optical transceiver is a light transmitting end, and the other side is a light receiving end.

3. The active optical cable according to claim 1, wherein: The linear drive chip, the laser array, the photodetector and the TIA chip are all bare chips, and are connected to the PCB board by gold wire bonding.

4. The active optical cable according to claim 1, wherein: The common chipset includes a control chip and a power management chip, which are used to control the linear drive chip and the TIA chip and manage power supply.

5. The active optical cable according to claim 1, wherein: The lines of the electrical connector include but are not limited to four lines.

6. The active optical cable according to claim 1, wherein: The gold finger adopts 38PIN, 74PIN, 124PIN or 148PIN gold finger of MCIO standard.

7. The active optical cable according to claim 1, wherein: The laser array and the linear driving chip as well as the photodetector and the TIA chip are connected respectively by gold wires.

8. The active optical cable according to claim 1, wherein: The laser array adopts a multi-mode VCSEL or a single-mode DFB laser array, and the laser array is used to realize electro-optical signal conversion.

9. The active optical cable according to any one of claims 1 to 8, characterized in that: The diameter of a single optical fiber of the active optical cable is 0.125 mm.

10. An optoelectronic transmission device, characterized in that: The invention comprises an active optical cable as claimed in any one of claims 1 to 9.

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