High-thermal-conductivity inductance magnetic device and power supply equipment

Abstract

The utility model provides a high-thermal-conductivity inductance magnetic device and power supply equipment. The inductance magnetic device comprises a magnetic core and a heat conductor. The magnetic core comprises a middle column, and the heat conductor penetrates through the middle column in the axial direction of the middle column. In addition, the heat conductivity coefficient of the heat conductor is larger than that of the middle column. According to the inductance magnetic device, the design mode is adopted, heat generated by the magnetic core can be conducted to the outside through the heat conductor with high heat conduction performance, the transmission path of the heat generated by the magnetic core can be shortened, the heat dissipation efficiency of the magnetic core can be improved, the heat dissipation efficiency of the inductance magnetic device can be improved, and the service life of the inductance magnetic device can be prolonged. And the service life of the inductance magnetic device can be prolonged, so that the product performance of the power supply equipment applying the inductance magnetic device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of energy, in particular to an inductive magnetic device with high thermal conductivity and a power supply device. Background Art

[0002] As the power of power supply equipment continues to increase, the heat flux density in power supply equipment is also increasing. Inductors and magnetic devices are the main power devices in power supply equipment. As the power of power supply equipment increases, the heat generated by inductors and magnetic devices is also increasing. If there is no good heat dissipation measure, the application scenarios of inductors and magnetic devices will be limited, and the performance of power supply equipment products will also be limited.

[0003] The main heat-generating components in inductor magnetic devices are the magnetic core and the windings wound around the magnetic core. Since the thermal conductivity of the magnetic core is usually small, its heat dissipation performance is poor; while the windings have better heat dissipation performance because they are mostly made of copper wire or aluminum wire. Therefore, how to achieve effective heat dissipation of the magnetic core is the key to improving the heat dissipation performance of inductor magnetic devices. Utility Model Content

[0004] The utility model provides an inductive magnetic device and a power supply device with high thermal conductivity, which are used to improve the heat dissipation efficiency of the inductive magnetic device and further improve the product performance of the power supply device.

[0005] In the first aspect, the utility model provides an inductive magnetic device with high thermal conductivity, which includes a magnetic core and a heat conductor. The magnetic core includes a middle column, and the heat conductor penetrates the middle column along the axial direction of the middle column. In addition, the thermal conductivity of the heat conductor is greater than the thermal conductivity of the middle column. The inductive magnetic device provided by the utility model adopts the above-mentioned design method, which can make the heat generated by the magnetic core be conducted to the outside through the heat conductor with high thermal conductivity, which is conducive to shortening the transfer path of the heat generated by the magnetic core to improve the heat dissipation efficiency of the magnetic core, thereby facilitating the improvement of the heat dissipation efficiency of the inductive magnetic device and prolonging the service life of the inductive magnetic device.

[0006] In a possible implementation of the utility model, the magnetic core further includes a bottom plate, one end of the middle column is connected to a plate surface of the bottom plate, and the heat conductor runs through the bottom plate. This can increase the contact area between the magnetic core and the heat conductor, and can make the heat generated by the magnetic core be transferred outward through both ends of the heat conductor at the same time, thereby improving the transfer efficiency of the heat generated by the magnetic core.

[0007] In a possible implementation of the utility model, the magnetic core includes 2N sub-magnetic cores, each sub-magnetic core includes a sub-middle column, and 2N sub-middle columns of the 2N sub-magnetic cores form a middle column, and the heat conductor is located between any two adjacent sub-magnetic cores; wherein N is an integer greater than or equal to 1. Such a structural design can be used to increase the size of the heat conductor, thereby increasing the contact area between the heat conductor and the magnetic core, thereby improving the heat dissipation efficiency of the magnetic core.

[0008] The present invention does not specifically limit the thermal conductivity of the heat conductor. For example, the thermal conductivity of the heat conductor may be greater than or equal to 20w / (m*k). In this way, the thermal conductivity of the heat conductor may be significantly greater than the thermal conductivity of the magnetic core, thereby improving the heat conduction efficiency between the magnetic core and the heat conductor.

[0009] In a possible implementation of the present invention, the material of the heat conductor can be a heat-conducting ceramic such as alumina, which can ensure that the heat conductor has a high thermal conductivity and is also conducive to controlling the cost of the inductive magnetic device.

[0010] In a possible implementation of the utility model, the inductive magnetic device further includes a winding, which is wound around the center column. Since the winding is mostly made of copper wire or aluminum wire with good thermal conductivity, part of the heat generated by the magnetic core can be conducted through the winding.

[0011] In the present invention, the winding can be directly wound on the middle column to simplify the structure of the inductor and magnetic device. Alternatively, in a possible implementation, the inductor and magnetic device also includes an insulating frame, the winding is wound on the insulating frame, and the insulating frame is sleeved on the middle column, which can improve the assembly efficiency of the winding and the magnetic core, thereby facilitating the improvement of the processing efficiency of the inductor and magnetic device.

[0012] In a possible implementation of the utility model, the inductive magnetic device further includes a shell, and the magnetic core and the heat conductor are contained in the shell. In practical applications, the shell can be in thermal contact with the liquid cooling plate, so that the heat conductor can exchange heat with the liquid cooling plate through the shell to achieve efficient heat dissipation of the inductive magnetic device.

[0013] In addition, potting glue can be filled between the heat conductor and the inner wall of the shell. Then the heat conductor and the shell can be in indirect contact through the plastic sealant, but because the plastic sealant also has a high thermal conductivity, it can also achieve efficient heat dissipation of the inductive magnetic device.

[0014] In the second aspect, the utility model further provides a power supply device, which includes a liquid cooling plate and the inductive magnetic device of the first aspect, wherein the inductive magnetic device is in thermal contact with the liquid cooling plate. Since in the power supply device provided by the utility model, the heat generated by the magnetic core of the inductive magnetic device can be transferred to the liquid cooling plate through a high thermal conductivity heat conductor, compared with the prior art, it is conducive to shortening the heat conduction path from the magnetic core to the liquid cooling plate, so as to improve the heat dissipation efficiency of the magnetic core, thereby improving the heat dissipation efficiency of the entire inductive magnetic device, and is conducive to extending the service life of the entire inductive magnetic device, thereby improving the product performance of the power supply device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a charging network provided by an embodiment of the utility model;

[0016] Figure 2 A schematic diagram of a traditional heat dissipation path of an inductive magnetic device provided in an embodiment of the utility model;

[0017] Figure 3 A schematic diagram of the structure of an inductive magnetic device provided in an embodiment of the utility model;

[0018] Figure 4 for Figure 3 A schematic diagram of a combined structure of a magnetic core and a heat conductor of an inductive magnetic device shown in ;

[0019] Figure 5 Another structural schematic diagram of an inductive magnetic device provided in an embodiment of the utility model;

[0020] Figure 6 for Figure 5 Another schematic diagram of the combined structure of the magnetic core and the heat conductor of the inductive magnetic device shown in ;

[0021] Figure 7 A schematic diagram of another combined structure of a magnetic core and a heat conductor provided in an embodiment of the utility model;

[0022] Figure 8 A schematic diagram of the structure of a power supply device provided in an embodiment of the utility model;

[0023] Fig. 9 for Figure 8 AA cross-sectional view of the power supply device shown in .

[0024] Reference numerals:

[0025] 100-charging pile; 1001-rectifier; 1002-connector; 200-energy storage device;

[0026] 1-inductor magnetic device; 11-magnetic core; 111-middle column; 112-bottom plate; 113-side plate; 114-sub-magnetic core structure; 1141-sub-middle column;

[0027] 1142-sub-base plate; 12-winding; 13-potting glue; 14-heat conductor;

[0028] 2-liquid cooling plate; 201-accommodation tank. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same figure marks in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the embodiments of the utility model are all explained with reference to the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of the utility model. The drawings of the embodiments of the utility model are only used to illustrate the relative position relationship, and they do not represent the true proportions.

[0030] It should be noted that specific details are described in the following description to facilitate understanding of the present invention. However, the present invention can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0031] In the present invention, the specific type of inductive magnetic device is not limited. Exemplary magnetic devices include transformers or inductors that use the principle of electromagnetic induction to achieve their functions. In addition, the inductive magnetic device can be used in energy storage systems, photovoltaic power generation systems, photovoltaic storage systems, or charging networks. Exemplary devices include uninterruptible power supply (UPS), photovoltaic inverters, charging piles, or on-board chargers (OBC). Taking the charging network scenario as an example, Figure 1 As shown, Figure 1 An architecture diagram of a charging network provided in an embodiment of the utility model. The charging network includes a charging pile 100 and an energy storage device 200, wherein the charging pile 100 and the energy storage device 200 are electrically connected via a cable, and the energy storage device 200 can provide the AC power stored in itself to the charging pile 100. The charging pile 100 includes a rectifier 1001 and a connector 1002, wherein the rectifier 1001 can convert the AC power into DC power through an inductive magnetic device and output it to the connector 1002, and the connector 1002 can be connected to a powered device (such as a vehicle) to charge the powered device.

[0032] As the power of power devices such as the above-mentioned rectifier increases, the power of the inductor and magnetic devices in the power devices is also getting higher and higher. In addition, as the number of inductor and magnetic devices in the power devices increases, the layout of the inductor and magnetic devices becomes more compact, and the volume of the inductor and magnetic devices becomes smaller, resulting in a higher power density of the inductor and magnetic devices. Since the increase in the power of the inductor and magnetic devices will cause a sharp increase in their temperature, and the high temperature of the inductor and magnetic devices will affect their performance, according to the general rules of the industry, if the temperature of the inductor and magnetic devices increases by 10°C, their life span will be halved. In order to improve the product performance of the power equipment, the inductor and magnetic devices need to be cooled.

[0033] Since the power consumption of air-cooled heat dissipation equipment is several times (e.g. 7.3 times) that of liquid-cooled heat dissipation equipment in order to reduce the temperature of inductive magnetic devices of the same power (e.g. 1KW) by the same amount (e.g. 10°C), liquid cooling plates are currently mostly used in this field to dissipate heat for inductive magnetic devices.

[0034] Inductor magnetic devices mainly include magnetic core and winding, among which the magnetic core is usually used as the magnetic conductive material of the inductor magnetic device; the winding is a coil made of copper wire or aluminum wire. In the inductor magnetic device, the winding is used to conduct current. Therefore, in the inductor magnetic device, the main heat generating parts are the magnetic core and winding. Figure 2 , Figure 2 A schematic diagram of a traditional heat dissipation path of an inductive magnetic device provided in an embodiment of the utility model. Among them, a potting compound 13 is filled between the magnetic core 11 and the winding 12 of the inductive magnetic device and the liquid cooling plate 2. Since the portion of the magnetic core 11 wound by the winding 12 is a region with higher heat generation, and the thermal conductivity of the winding 12 is higher, the heat generated by the magnetic core 11 can be transferred to the winding 12, and transferred to the potting compound 13 together with the heat generated by the winding 12, and then transferred to the liquid cooling plate 2 through the potting compound 13 to achieve heat dissipation of the inductive magnetic device. It can be seen from this that the above Figure 2 The heat dissipation path of the inductive magnetic device shown is relatively long, which will affect the heat dissipation efficiency of the inductive magnetic device.

[0035] In view of this, the inductor magnetic device provided by the utility model improves the heat dissipation efficiency of the inductor magnetic device by shortening the transfer path of the heat generated by the magnetic core, which is conducive to extending the service life of the inductor magnetic device, thereby improving the product performance of the power supply equipment using the inductor magnetic device. In order to facilitate the understanding of the inductor magnetic device provided by the utility model, it is described in detail in conjunction with specific embodiments.

[0036] Reference Figure 3 , Figure 3A schematic diagram of the structure of an inductive magnetic device provided in an embodiment of the utility model. The inductive magnetic device 1 includes a magnetic core 11 and a heat conductor 14, wherein the magnetic core 11 includes a middle column 111, and the heat conductor 14 penetrates the middle column 111 along the axial direction of the middle column 111. In addition, the thermal conductivity of the heat conductor 14 is greater than the thermal conductivity of the magnetic core 11. In this way, the heat generated by the magnetic core 11 can be directly transferred to the outside of the magnetic core 11 through the heat conductor 14, which is conducive to shortening the transfer path of the heat generated by the magnetic core 11.

[0037] In the present invention, the material of the heat conductor 14 is not limited, and it can be exemplarily a heat-conducting ceramic such as alumina, or other possible high heat-conducting materials such as graphite or copper. In addition, the thermal conductivity of the heat conductor 14 can be greater than or equal to 20w / (m*k), so that the thermal conductivity of the heat conductor 14 is significantly greater than the thermal conductivity of the magnetic core 11, thereby facilitating the improvement of the thermal conductivity efficiency of the magnetic core 11.

[0038] Reference Figure 4 , Figure 4 for Figure 3 A schematic diagram of a combined structure of a magnetic core and a heat conductor of an inductive magnetic device is shown in FIG. In the embodiment of the utility model, the magnetic core 11 further includes a bottom plate 112, one end of the middle column 111 is connected to a plate surface of the bottom plate 112, and the heat conductor 14 penetrates the bottom plate 112 while penetrating the middle column 111. In this way, the heat generated by the magnetic core 11 can be transferred outward from both ends of the heat conductor 14, thereby improving the transfer efficiency of the heat generated by the magnetic core 11.

[0039] It is worth mentioning that in the embodiment of the utility model, the connection method between the heat conductor 14 and the magnetic core 11 is not limited. For example, the heat conductor 14 and the magnetic core 11 can be a co-fired integral structure to reduce the thermal resistance between the heat conductor 14 and the magnetic core 11, thereby improving the thermal conductivity between the magnetic core 11 and the heat conductor 14, which is beneficial to improving the heat dissipation efficiency of the inductive magnetic device 1.

[0040] exist Figure 4 In the structure shown, the heat conductor 14 is a columnar structure. In addition, in some possible embodiments of the utility model, the axis of the heat conductor 14 with a columnar structure can also coincide or approximately coincide with the axis of the middle column 111, which is conducive to achieving efficient heat dissipation of the local high temperature area of ​​the middle column 111.

[0041] Can refer to Figure 3 and Figure 4 , the inductor magnetic device also includes a winding 12, and the winding 12 is wound around the middle column 111. In the present invention, the winding 12 can be directly wound around the middle column 111, so that the structure of the inductor magnetic device 1 can be simplified. Alternatively, the inductor magnetic device 1 also includes an insulating frame ( Figure 3 and Figure 4(not shown), the winding 12 is sleeved on the insulating frame, and the insulating frame is wound around the middle column 111, which can improve the assembly efficiency of the winding 12 and the magnetic core 11, thereby facilitating the improvement of the processing efficiency of the inductor magnetic device 1.

[0042] in addition, Figure 3 The inductive magnetic device 1 shown includes two magnetic cores 11 , which are arranged opposite to each other and whose middle poles 111 are connected. The winding 12 is wound around the middle poles 111 of the two magnetic cores 11 at the same time.

[0043] You can continue to refer to Figure 4 The magnetic core 11 further includes two side plates 113, which are arranged opposite to each other, and the middle column 111 is located between the two side plates 113. In addition, the two side plates 113 are connected to the bottom plate 112. Figure 4 The shape of the magnetic core 11 shown in the figure can be understood as an "E" shape. In the present invention, the magnetic core 11 can be an integrally formed structure to improve the structural reliability of the magnetic core 11; or the parts of the magnetic core 11 can be connected by bonding to make the design of the magnetic core 11 more flexible.

[0044] It can be understood that the larger the contact area between the heat conductor 14 and the magnetic core 11, the more conducive it is to improve the thermal conductivity between the magnetic core 11 and the heat conductor 14, thereby helping to improve the heat dissipation efficiency of the magnetic core 11. Figure 5 , Figure 5 Another structural schematic diagram of the inductive magnetic device provided in an embodiment of the utility model. Figure 5 Another possible arrangement of the heat conductor 14 is also shown. Specifically, Figure 5 In the inductive magnetic device shown, the magnetic core 11 includes two sub-magnetic core structures 114 . Each sub-magnetic core structure 114 includes a sub-center column 1141 . The two sub-center columns 1141 of the two sub-magnetic core structures 114 constitute the center column 111 of the magnetic core 11 .

[0045] Reference Figure 6 , Figure 6 for Figure 5 Another schematic diagram of the combined structure of the magnetic core and the heat conductor of the inductive magnetic device shown in . The heat conductor 14 is located between the two sub-center columns 1141, and the heat conductor 14 is connected to the two sub-center columns 1141. In this embodiment, the heat conductor 14 and the two sub-center columns 1141 can also be a co-fired integral structure, which can effectively reduce the thermal resistance between the magnetic core 11 and the heat conductor 14, thereby improving the thermal conductivity efficiency between the magnetic core 11 and the heat conductor 14.

[0046] In addition, Figure 6In the magnetic core 11 shown, each sub-core structure 114 further includes a sub-bottom plate 1142, and the two sub-bottom plates 1142 of the two sub-core structures 114 constitute the sub-bottom plate 1142 of the magnetic core 11. Figure 6 The magnetic core 11 shown can be understood as Figure 4 The magnetic core 11 is divided into two sub-structures at the position of the middle column 111 along the direction intersecting the arrangement direction of the two side plates 113. In addition, the heat conductor 14 is also located between the two sub-bottom plates 1142 of the two sub-magnetic core structures 114. In this embodiment, it can be understood that the heat conductor 14 is located between the two sub-magnetic core structures 114, which is conducive to increasing the contact area between the heat conductor 14 and the magnetic core 11, thereby facilitating the improvement of the heat conduction efficiency between the heat conductor 14 and the magnetic core 11.

[0047] exist Figure 5 and Figure 6 In the illustrated embodiment, the heat conductor 14 is a sheet structure, wherein the heat conductor 14 can be a single sheet or multiple sheets. When the heat conductor 14 is multiple sheets, the multiple sheets of heat conductor 14 can be stacked in sequence along the arrangement direction of the two sub-core structures 114 .

[0048] It is worth mentioning that in Figure 5 and Figure 6 In the illustrated embodiment, each side surface of the heat conductor 14 can be made flush with the outer surface of the same side of the magnetic core 11, which is beneficial to increase the cross-sectional area of ​​the heat conductor 14, thereby increasing the contact area between the heat conductor 14 and the magnetic core 11, so as to improve the thermal conductivity between the heat conductor 14 and the magnetic core 11, thereby improving the heat dissipation efficiency of the magnetic core 11.

[0049] The above is only some exemplary description of the specific configuration of the inductor magnetic device 1 provided by the utility model. On this basis, the structure of the inductor magnetic device 1 can also be adaptively modified according to the actual application scenario requirements. Figure 7 , Figure 7 A schematic diagram of another combined structure of a magnetic core and a heat conductor provided in an embodiment of the utility model. Figure 7 Another possible arrangement of the heat conductor is also shown. Specifically, Figure 7 In the embodiment shown, the magnetic core 11 includes four sub-magnetic core structures 114, each sub-magnetic core structure 114 includes a sub-center column 1141 and a sub-bottom plate 1142, then the four sub-center columns 1141 of the four sub-magnetic core structures 114 constitute the center column 111 of the magnetic core 11, and the four sub-bottom plates 1142 of the four sub-magnetic core structures 114 constitute the bottom plate 112 of the magnetic core 11, then Figure 7 The magnetic core shown can be understood as Figure 4 The magnetic core 11 is divided into four substructures at the position of the middle column 111 along the arrangement direction of the two side plates 113 and the direction intersecting with the arrangement direction of the two side plates 113 .

[0050] In Figure 7 In the structure shown, the heat conductor 14 is located between any two adjacent sub-core structures 114. In this embodiment, the heat conductor 14 may be designed in a cross structure, which is beneficial to increase the contact area between the heat conductor 14 and the magnetic core 11, thereby improving the heat conduction efficiency between the two.

[0051] Based on the above Figure 5 and Figure 7 The design principle of the inductor magnetic device 1 of the illustrated embodiment can also further divide the magnetic core 11 at the middle column 111, so that the magnetic core 11 includes six, eight or more sub-core structures 114, that is, the magnetic core 11 includes 2N sub-core structures 114, where N is an integer greater than or equal to 1. In this way, the heat conductor 14 can be located between any two adjacent sub-core structures 114, thereby increasing the contact area between the heat conductor 14 and the magnetic core 11, so as to improve the heat dissipation efficiency of the magnetic core 11. In the embodiment of the utility model, various possible configurations of the inductor magnetic device 1 are not listed one by one, but they should all be understood to fall within the protection scope of the utility model.

[0052] The inductor magnetic device 1 provided by the utility model can be applied to a power supply device. It is understandable that in order to achieve heat dissipation of the inductor magnetic device 1, the power supply device may include a liquid cooling plate 2. Figure 8 , Figure 8 A schematic diagram of the structure of a power supply device provided in an embodiment of the utility model. Figure 8 China-Israel Inductor Magnetic Devices 1 Figure 3 The structure shown in FIG. 1 is used for explanation. The inductive magnetic device 1 can be in thermal contact with the liquid cooling plate 2, so that the heat generated by the inductive magnetic device 1 can be transferred to the liquid cooling plate 2 to achieve heat exchange between the inductive magnetic device 1 and the liquid cooling plate 2.

[0053] It is worth mentioning that since the magnetic core 11 of the inductive magnetic device 1 provided by the utility model includes a high thermal conductivity heat conductor 14, in actual applications, the heat conductor 14 can be in thermal contact with the liquid cooling plate 2, so that the heat generated by the magnetic core 11 can be transferred to the liquid cooling plate 2 through the heat conductor 14, thereby helping to shorten the heat conduction path from the magnetic core 11 to the liquid cooling plate 2, so as to improve the heat dissipation efficiency of the magnetic core 11, and then improve the heat dissipation efficiency of the entire inductive magnetic device 1, so as to help extend the service life of the entire inductive magnetic device 1 and improve the product performance of the power supply equipment.

[0054] In the present invention, the heat conductor 14 and the liquid cooling plate 2 can be in direct contact. For example, reference can be made to Figure 8 The liquid cooling plate 2 includes a receiving groove 201, in which the inductor and magnetic device 1 can be received, and the heat conductor 14 can be in direct contact with the groove wall of the receiving groove 201 to achieve efficient heat dissipation of the inductor and magnetic device 1. Fig. 9 , Fig. 9 for Figure 8 The AA cross-sectional view of the power supply device shown in FIG. The space between the inductor and magnetic device 1 and the receiving groove 201 can be filled with plastic sealant 13, so that the heat conductor 14 and the groove wall of the receiving groove 201 can be indirectly contacted through the plastic sealant 13. However, since the plastic sealant 13 also has a high thermal conductivity, it can also achieve efficient heat dissipation of the inductor and magnetic device 1.

[0055] In some other possible embodiments of the utility model, the inductor magnetic device 1 may also include a shell, and the magnetic core 11 and the heat conductor 14 are accommodated in the shell. In addition, at least part of the winding 12 may also be accommodated in the shell. In this way, the shell of the inductor magnetic device 1 can be in thermal contact with the liquid cooling plate 2, and the heat conductor 14 can exchange heat with the liquid cooling plate 2 through the shell, thereby achieving efficient heat dissipation of the inductor magnetic device 1. In addition, in this embodiment, the space between the heat conductor 14 and the inner side wall of the shell can also be filled with plastic sealant 13, and the heat conductor 14 and the shell can be indirectly in contact through the plastic sealant 13. However, since the plastic sealant 13 also has a high thermal conductivity, it can also achieve efficient heat dissipation of the inductor magnetic device 1.

[0056] The above is only some exemplary description of the heat dissipation of the inductive magnetic device 1 in practical applications. On this basis, the specific implementation method of the thermal contact between the inductive magnetic device 1 and the liquid cooling plate 2 can also be adjusted according to the structural design of the inductive magnetic device 1 and the liquid cooling plate 2 in the specific application scenario. However, since the heat generated by the magnetic core 11 of the inductive magnetic device 1 provided in the embodiment of the utility model can be transferred to the liquid cooling plate 2 through the high thermal conductivity heat conductor 14, compared with the prior art, it is conducive to shortening the heat conduction path from the magnetic core 11 to the liquid cooling plate 2, so as to improve the heat dissipation efficiency of the magnetic core 11, thereby improving the heat dissipation efficiency of the entire inductive magnetic device 1, and is conducive to extending the service life of the entire inductive magnetic device 1, thereby improving the product performance of the power supply equipment.

[0057] The above are only specific implementations of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A high thermal conductivity inductive magnetic device, characterized in that: It includes a magnetic core and a heat conductor, wherein: The magnetic core comprises a middle column, the heat conductor penetrates the middle column along the axial direction of the middle column, and the thermal conductivity of the heat conductor is greater than the thermal conductivity of the middle column.

2. The inductive magnetic device according to claim 1, characterized in that: The magnetic core also includes a bottom plate, one end of the middle column is connected to a plate surface of the bottom plate, and the heat conductor passes through the bottom plate.

3. The inductive magnetic device according to claim 1 or 2, characterized in that: The magnetic core includes 2N sub-cores, each of which includes a sub-center column, and 2N sub-center columns of the 2N sub-cores constitute the center column, and the heat conductor is located between any two adjacent sub-cores; wherein N is an integer greater than or equal to 1.

4. The inductive magnetic device according to claim 1 or 2, characterized in that: The thermal conductivity of the heat conductor is greater than or equal to 20w / (m*k).

5. The inductive magnetic device according to claim 1 or 2, characterized in that: The material of the heat conductor is aluminum oxide.

6. The inductive magnetic device according to claim 1 or 2, characterized in that: The inductive magnetic device further comprises a winding, and the winding is wound around the middle column.

7. The inductive magnetic device according to claim 6, characterized in that: The inductive magnetic device also includes an insulating frame, the winding is wound around the insulating frame, and the insulating frame is sleeved on the middle column.

8. The inductive magnetic device according to claim 1 or 2, characterized in that: The inductive magnetic device further comprises a shell, wherein the magnetic core and the heat conductor are accommodated in the shell.

9. The inductive magnetic device according to claim 8, characterized in that: The space between the heat conductor and the inner wall of the shell is filled with potting glue.

10. A power supply device, characterized in that: It comprises a liquid cooling plate and the inductive magnetic device according to any one of claims 1 to 9, wherein the inductive magnetic device is in thermal contact with the liquid cooling plate.

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