Ultralow-temperature ion beam etching workbench for superconducting device

Abstract

The utility model relates to the technical field of etching workbenches, in particular to an ultra-low temperature ion beam etching workbench for a superconducting device, which comprises a workbench body, a bottom plate, a driving groove, a first heat conducting disc, a heat conducting column, a rotating mechanism and a cooling mechanism, the first heat conduction disc is rotationally arranged in the driving groove, the heat conduction column is fixedly arranged on the first heat conduction disc, the rotating mechanism is arranged in the driving groove and used for controlling the first heat conduction disc to rotate, and the cooling mechanism is arranged in the workbench body and used for cooling the first heat conduction disc. The first heat conduction disc can be cooled through heat exchange between liquid nitrogen and the second heat conduction disc, the ultralow-temperature requirement of the workpiece is met through contact between the first heat conduction disc and the workpiece, and therefore the problem that in the prior art, the ultralow-temperature requirement of the workpiece is not conveniently provided in the workpiece etching process is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of etching workbenches, in particular to an ultra-low temperature ion beam etching workbench for superconducting devices. Background Art

[0002] An ion beam etcher is a plasma etcher. Plasma etching is the most common form of dry etching. Its principle is that the gas exposed to the electron area forms plasma. The resulting ionized gas and the gas composed of released high-energy electrons form plasma or ions. When the ionized gas atoms are accelerated by an electric field, they release enough force to tightly bond the material or etch the surface with the surface repelling force. The ion beam etching workbench is a workbench in the ion beam etcher for placing wafer silicon wafers. After the wafer silicon wafer is placed on the workbench, the wafer surface is etched by the ion beam.

[0003] If a workpiece at room temperature is used at a low temperature after ion beam etching, the temperature difference will cause the device performance to deteriorate, so using low-temperature ion beam etching is a solution.

[0004] Most existing low-temperature ion beam etching processes use liquid cooling to cool the workpiece, that is, cooling the workpiece through heat exchange between the coolant and the workpiece. However, the temperature difference of the coolant can only be changed within a certain range, which has certain limitations and cannot meet the ultra-low temperature requirements during workpiece processing. Utility Model Content

[0005] The utility model provides an ultra-low temperature ion beam etching workbench for superconducting devices, which solves the problem in the prior art that it is inconvenient to provide ultra-low temperature requirements for workpieces during the workpiece etching process.

[0006] The technical solution of the utility model is as follows: A workbench for ultra-low temperature ion beam etching of superconducting devices, comprising a workbench body, a bottom plate, a driving slot, a first heat conducting plate, a heat conducting column, a rotating mechanism and a cooling mechanism;

[0007] The bottom plate is fixedly arranged on the workbench body;

[0008] The driving groove is arranged on the workbench;

[0009] The first heat conducting plate is rotatably disposed in the driving slot;

[0010] The heat-conducting column is fixedly arranged on the first heat-conducting plate;

[0011] The rotating mechanism is disposed in the driving slot and is used to control the first heat conducting plate to rotate;

[0012] The cooling mechanism is arranged in the workbench body and is used for cooling the first heat conducting plate.

[0013] Preferably, the rotating mechanism comprises:

[0014] An annular rack, the annular rack being fixedly disposed on the heat conducting column;

[0015] A first gear, the first gear being rotatably disposed at the bottom of the driving groove;

[0016] Wherein, the first gear is meshed with the annular rack;

[0017] A first motor is disposed in the workbench body, and an output end of the first motor is fixedly connected to the first gear.

[0018] Furthermore, the cooling mechanism comprises:

[0019] A first cavity, wherein the first cavity is disposed in the workbench body;

[0020] A heat-insulating shell, wherein the heat-insulating shell is fixedly disposed in the first cavity;

[0021] Wherein, the heat-insulating shell is filled with a first heat-conducting oil;

[0022] A heat exchange shell, wherein the heat exchange shell is fixedly arranged on the inner bottom wall of the heat insulation shell;

[0023] A liquid nitrogen box and a liquid nitrogen pump, wherein the liquid nitrogen box and the liquid nitrogen pump are fixedly arranged on the bottom plate;

[0024] The input end of the liquid nitrogen pump is connected to the liquid nitrogen tank, the output end of the liquid nitrogen pump is connected to the inner bottom wall of the heat exchange shell, and the liquid nitrogen tank is filled with liquid nitrogen;

[0025] A recycling box, the recycling box is fixedly arranged on the bottom plate;

[0026] Wherein, a recovery pipe is provided between the side wall of the heat exchange shell and the recovery box;

[0027] A heat exchange mechanism is used to achieve heat exchange between liquid nitrogen and the first heat conducting disk.

[0028] Furthermore, the heat exchange mechanism includes:

[0029] a second heat-conducting plate, the second heat-conducting plate being rotatably disposed in the heat-insulating shell, the heat-conducting column being fixedly connected to the second heat-conducting plate;

[0030] A heat conducting rod, wherein the heat conducting rod is provided in plurality and the plurality of heat conducting rods are fixedly arranged on the second heat conducting plate;

[0031] Auxiliary mechanism, wherein the auxiliary mechanism further realizes heat exchange between the first heat conducting disk and the liquid nitrogen.

[0032] Furthermore, the auxiliary mechanism includes:

[0033] A jacket, wherein the jacket is disposed in the first heat-conducting plate and the second heat-conducting plate;

[0034] A heat conduction port, the heat conduction port is disposed in the heat conduction column and is communicated with the jacket;

[0035] Wherein, the heat transfer port and the jacket are filled with second heat transfer oil.

[0036] On the basis of the above solution, a spiral rod is further included, and the spiral rod is fixedly arranged in the heat exchange shell.

[0037] The working principle and beneficial effects of the utility model are:

[0038] 1. In the present invention, by setting the cooling mechanism, the liquid nitrogen can be circulated in the heat exchange shell through the operation of the liquid nitrogen pump, and then the heat exchange between the liquid nitrogen and the first heat conducting disk is realized through the heat exchange mechanism, so as to use the ultra-low temperature performance of the liquid nitrogen to improve the ultra-low temperature environment of the workpiece;

[0039] 2. In the present invention, through the arrangement of the heat exchange mechanism, the liquid nitrogen can achieve heat exchange between the liquid nitrogen and the heat conducting rod and the second heat conducting plate through the first heat conducting oil during the flow of the liquid nitrogen in the heat exchange shell, and at the same time, the heat conduction between the first heat conducting plate and the second heat conducting plate is achieved through the second heat conducting oil and the heat conducting rod, and then the temperature of the workpiece is reduced through the contact between the first heat conducting plate and the workpiece;

[0040] 3. In the present invention, through the setting of the rotating mechanism, the operation of the first motor can drive the first gear to rotate, and then the engagement of the first gear with the annular rack drives the heat-conducting column and the second heat-conducting plate to rotate, so as to facilitate the workpiece to rotate during the processing, thereby improving the etching effect. At the same time, the rotation of the heat-conducting column can drive the heat-conducting rod to move around the heat-conducting column, thereby further improving the heat exchange effect between the heat-conducting rod and the liquid nitrogen;

[0041] 4. In the utility model, through the arrangement of the workbench body, the bottom plate, the driving groove, the first heat-conducting disk, the heat-conducting column, the rotating mechanism and the cooling mechanism, it is convenient to cool the first heat-conducting disk by heat exchange with the second heat-conducting disk through liquid nitrogen, and then meet the ultra-low temperature requirement of the workpiece through the contact between the first heat-conducting disk and the workpiece, thereby solving the problem in the prior art that it is not convenient to provide the ultra-low temperature requirement for the workpiece during the etching process of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] Figure 1 It is a schematic diagram of the structure of the utility model;

[0044] Figure 2 This is a schematic diagram of the cross-sectional structure of the utility model;

[0045] Figure 3 This is a schematic cross-sectional view of the heat exchange mechanism of the utility model;

[0046] Figure 4 It is a schematic cross-sectional view of the cooling mechanism of the utility model.

[0047] In the figure: 1. workbench body; 2. bottom plate; 3. first heat-conducting plate; 4. heat-conducting column; 5. annular rack; 6. first gear; 7. insulation shell; 8. heat exchange shell; 9. liquid nitrogen box; 10. liquid nitrogen pump; 11. recovery box; 12. second heat-conducting plate; 13. heat-conducting rod; 14. jacket; 15. screw rod. DETAILED DESCRIPTION

[0048] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0049] like Figure 1 to Figure 4 As shown, this embodiment proposes a superconducting device ultra-low temperature ion beam etching workbench, including a workbench body 1, a base plate 2, a driving groove, a first heat-conducting disk 3, a heat-conducting column 4, a rotating mechanism and a cooling mechanism, the base plate 2 is fixedly arranged on the workbench body 1, the driving groove is opened on the workbench, the first heat-conducting disk 3 is rotatably arranged in the driving groove, the heat-conducting column 4 is fixedly arranged on the first heat-conducting disk 3, the rotating mechanism is arranged in the driving groove, and is used to control the first heat-conducting disk 3 to rotate, and the cooling mechanism is arranged in the workbench body 1, and is used to cool the first heat-conducting disk 3.

[0050] Wherein, the rotating mechanism includes an annular rack 5, a first gear 6 and a first motor, the annular rack 5 is fixedly arranged on the heat-conducting column 4, the first gear 6 is rotatably arranged at the bottom of the driving groove, wherein the first gear 6 is meshed with the annular rack 5, the first motor is arranged in the workbench body 1, and the output end of the first motor is fixedly connected to the first gear 6.

[0051] Specifically, the operation of the first motor can drive the first gear 6 to rotate, and then drive the heat conducting column 4 and the second heat conducting plate 12 to rotate through the engagement of the first gear 6 with the annular rack 5, thereby facilitating the workpiece to rotate during the processing, thereby improving the etching effect.

[0052] The cooling mechanism includes a first cavity, an insulation shell 7, a heat exchange shell 8, a liquid nitrogen box 9, a liquid nitrogen pump 10, a recovery box 11 and a heat exchange mechanism. The first cavity is opened in the workbench body 1, and the insulation shell 7 is fixedly arranged in the first cavity. The insulation shell 7 is filled with a first heat transfer oil, and the heat exchange shell 8 is fixedly arranged on the inner bottom wall of the insulation shell 7. The liquid nitrogen box 9 and the liquid nitrogen pump 10 are fixedly arranged on the bottom plate 2, wherein the input end of the liquid nitrogen pump 10 is connected to the liquid nitrogen box 9, and the output end of the liquid nitrogen pump 10 is connected to the inner bottom wall of the heat exchange shell 8. The liquid nitrogen box 9 is filled with liquid nitrogen, and the recovery box 11 is fixedly arranged on the bottom plate 2. A recovery pipe is connected between the side wall of the heat exchange shell 8 and the recovery box 11. The heat exchange mechanism is used to realize heat exchange between liquid nitrogen and the first heat conducting disk 3, and also includes a screw rod 15, which is fixedly arranged in the heat exchange shell 8.

[0053] Specifically, the operator controls the operation of the liquid nitrogen pump 10, and the operation of the liquid nitrogen pump 10 can make the liquid nitrogen circulate in the heat exchange shell 8, and then realize the heat exchange between the liquid nitrogen and the first heat conducting disk 3 through the heat exchange mechanism, so as to utilize the ultra-low temperature performance of the liquid nitrogen to enhance the ultra-low temperature environment of the workpiece.

[0054] Among them, the heat exchange mechanism includes a second heat conducting plate 12, a heat conducting rod 13 and an auxiliary mechanism. The second heat conducting plate 12 is rotatably arranged in the heat insulation shell 7. The heat conducting column 4 is fixedly connected to the second heat conducting plate 12. The heat conducting rod 13 is provided in plurality, and the plurality of heat conducting rods 13 are fixedly arranged on the second heat conducting plate 12. The auxiliary mechanism further realizes the heat exchange between the first heat conducting plate 3 and the liquid nitrogen. The auxiliary mechanism includes a jacket 14 and a heat conducting port. The jacket 14 is opened in the first heat conducting plate 3 and the second heat conducting plate 12. The heat conducting port is opened in the heat conducting column 4. The heat conducting port is connected to the jacket 14. The heat conducting port and the jacket 14 are filled with the second heat conducting oil.

[0055] Specifically, during the flow of liquid nitrogen in the heat exchange shell 8, heat exchange between the liquid nitrogen and the heat conducting rod 13 and the second heat conducting plate 12 can be achieved through the first heat conducting oil, and heat conduction between the first heat conducting plate 3 and the second heat conducting plate 12 can be achieved through the second heat conducting oil and the heat conducting rod 13, thereby cooling the workpiece through the contact between the first heat conducting plate 3 and the workpiece.

[0056] In this embodiment, when in use, the operator places the workpiece on the first heat-conducting disk 3, and then the operator controls the liquid nitrogen pump 10 to work. The operation of the liquid nitrogen pump 10 can make the liquid nitrogen circulate in the heat exchange shell 8. At the same time, during the flow of liquid nitrogen in the heat exchange shell 8, the first heat-conducting oil can be used to realize heat exchange between the liquid nitrogen and the heat-conducting rod 13 and the second heat-conducting disk 12. At the same time, the second heat-conducting oil and the heat-conducting rod 13 are used to realize heat conduction between the first heat-conducting disk 3 and the second heat-conducting disk 12, and then the contact between the first heat-conducting disk 3 and the workpiece is realized to cool the workpiece. In this process, the operator controls the first motor to work, and the operation of the first motor can drive the first gear 6 to rotate, and then the engagement of the first gear 6 with the annular rack 5 drives the heat-conducting column 4 and the second heat-conducting disk 12 to rotate, so as to facilitate the workpiece to rotate during the processing, thereby improving the etching effect. At the same time, the rotation of the heat-conducting column 4 can drive the heat-conducting rod 13 to move around the heat-conducting column 4, thereby further improving the heat exchange effect between the heat-conducting rod 13 and the liquid nitrogen.

[0057] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A super-low temperature ion beam etching workbench for superconducting devices, characterized in that: include: Workbench body (1); A bottom plate (2), the bottom plate (2) being fixedly arranged on the workbench body (1); A driving groove, the driving groove is arranged on the workbench; A first heat-conducting plate (3), the first heat-conducting plate (3) being rotatably disposed in the driving groove; A heat-conducting column (4), wherein the heat-conducting column (4) is fixedly arranged on the first heat-conducting plate (3); A rotating mechanism, the rotating mechanism being arranged in the driving groove and being used for controlling the first heat conducting plate (3) to rotate; A cooling mechanism is arranged in the workbench body (1) and is used to cool the first heat conducting plate (3).

2. The ultra-low temperature ion beam etching workbench for superconducting devices according to claim 1, characterized in that: The rotating mechanism comprises: an annular rack (5), the annular rack (5) being fixedly arranged on the heat-conducting column (4); A first gear (6), the first gear (6) being rotatably disposed at the bottom of the driving groove; Wherein, the first gear (6) is meshed with the annular rack (5); A first motor, wherein the first motor is arranged in the workbench body (1), and an output end of the first motor is fixedly connected to the first gear (6).

3. The ultra-low temperature ion beam etching workbench for superconducting devices according to claim 2, characterized in that: The cooling mechanism comprises: A first cavity, the first cavity being disposed in the workbench body (1); A heat-insulating shell (7), wherein the heat-insulating shell (7) is fixedly arranged in the first cavity; Wherein, the heat-insulating shell (7) is filled with a first heat-conducting oil; A heat exchange shell (8), the heat exchange shell (8) being fixedly arranged on the inner bottom wall of the heat insulation shell (7); A liquid nitrogen box (9) and a liquid nitrogen pump (10), wherein the liquid nitrogen box (9) and the liquid nitrogen pump (10) are fixedly arranged on the bottom plate (2); The input end of the liquid nitrogen pump (10) is in communication with the liquid nitrogen tank (9), the output end of the liquid nitrogen pump (10) is in communication with the inner bottom wall of the heat exchange shell (8), and the liquid nitrogen tank (9) is filled with liquid nitrogen; A recovery box (11), the recovery box (11) being fixedly arranged on the bottom plate (2); Wherein, a recovery pipe is provided between the side wall of the heat exchange shell (8) and the recovery box (11); A heat exchange mechanism, the heat exchange mechanism is used to achieve heat exchange between liquid nitrogen and the first heat conducting plate (3).

4. The ultra-low temperature ion beam etching workbench for superconducting devices according to claim 3, characterized in that: The heat exchange mechanism comprises: A second heat-conducting plate (12), the second heat-conducting plate (12) being rotatably disposed in the heat-insulating shell (7), and the heat-conducting column (4) being fixedly connected to the second heat-conducting plate (12); A heat conducting rod (13), wherein the heat conducting rod (13) is provided in plurality, and the plurality of heat conducting rods (13) are fixedly arranged on the second heat conducting plate (12); An auxiliary mechanism, wherein the auxiliary mechanism further realizes heat exchange between the first heat conducting plate (3) and the liquid nitrogen.

5. The ultra-low temperature ion beam etching workbench for superconducting devices according to claim 4, characterized in that: The auxiliary mechanism includes: A jacket (14), wherein the jacket (14) is disposed inside the first heat conducting plate (3) and the second heat conducting plate (12); A heat conduction port, the heat conduction port being disposed in the heat conduction column (4) and being in communication with the jacket (14); The heat transfer port and the jacket (14) are filled with second heat transfer oil.

6. The ultra-low temperature ion beam etching workbench for superconducting devices according to claim 5, characterized in that: It also includes a spiral rod (15), which is fixedly arranged in the heat exchange shell (8).

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