Clamping jaw of wafer bonding clamp
By using oblique block telescopic components and jaw telescopic components in the jaws of the wafer bonding fixture, the independent action of lifting oblique blocks and floating jaws is achieved, and the wafer is prone to wrinkles or biases when clamping in the prior art. The problem of migration has increased the yield rate.
Patent Information
- Application Number
- CN202421288062.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-06-06
AI Technical Summary
In the prior art, when the jaws of the wafer clamp are clamped, the wafer is easily wrinkled or offset, affecting the product yield.
A kind of jaw for wafer bonding fixture is designed, using oblique block telescopic assembly and jaw telescopic assembly. Through the independent action of lifting the oblique block and floating jaw, the expansion and contraction along the wafer radial direction and the vertical direction of the wafer are achieved. The lifting and lowering ensures that no non-vertical force is generated during clamping and protects the wafer position.
Through independent expansion and lifting actions, interference to the wafer position is reduced, wafer wrinkles or offsets are avoided, and yield is improved.
Smart Images
Figure CN222507608U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor device manufacturing, and in particular relates to a clamping claw of a wafer bonding clamp. Background Art
[0002] A wafer refers to the substrate (also called base) for manufacturing semiconductor transistors or integrated circuits. Because it is a crystalline material and its shape is round, it is called a wafer. Before two wafers are temporarily bonded, the wafer alignment needs to be completed. After the alignment is completed, they are transferred to the bonding chamber for bonding. The transfer from alignment to bonding requires a set of fixtures to load the two wafers and fix and maintain the relative position of the two wafers; at the same time, before bonding, during the vacuum pumping of the equipment, after the air between the wafers is extracted, the relative overhead form of the two wafers needs to be switched to a fitted form. During the entire process of the fixture as a carrier, the relative position of the two wafers is not affected.
[0003] In the prior art, the mechanisms for clamping the wafer on the fixture are located on the left and right sides, distributed at an angle of 180°; there are a total of 3 mechanisms on the fixture for isolating the two wafers, distributed on the circumference at an angle of 120°. When the prior art clamps the wafer, the clamps move inward and downward from both sides of the wafer to the center of the wafer at the same time, and the clamps apply an oblique downward force to the wafer. This clamping method is likely to cause the wafer to wrinkle or shift, causing the relative position of the two wafers to change, affecting the product yield.
[0004] To this end, a clamping claw of a wafer bonding fixture is proposed. Utility Model Content
[0005] In order to solve the above technical problems, the utility model proposes a clamping claw of a wafer bonding fixture.
[0006] To achieve the above-mentioned purpose, the utility model provides a clamping jaw of a wafer bonding fixture, comprising: a base, on which a bevel block telescopic assembly and a clamping jaw telescopic assembly are slidably connected; the movable end of the bevel block telescopic assembly is fixedly connected to a lifting bevel block, the lifting bevel block is a rectangular parallelepiped, and the end away from the bevel block telescopic assembly is an inclined surface, the movable end of the clamping jaw telescopic assembly extends to above the lifting bevel block and is penetrated by a lifting column, the top of the lifting column is fixedly connected to a mounting plate, the outer end of the mounting plate is fixedly connected to a floating clamping jaw, the bottom end of the lifting column is fixedly connected to a sliding block, the lifting column is provided with a lifting spring, one end of the lifting spring abuts the sliding block, and the other end abuts the movable end of the clamping jaw telescopic assembly; the bottom end of the sliding block is slidably connected to the lifting bevel block.
[0007] Preferably, a roller is rotatably connected to the bottom end of the sliding block, and the bottom surface of the roller abuts against the lifting inclined block.
[0008] Preferably, the oblique block telescopic assembly includes an oblique block telescopic slide rail, the oblique block telescopic slide rail is fixedly connected to the base, the oblique block telescopic slide rail is slidably connected with an oblique block telescopic slider, the oblique block telescopic slider is fixedly connected with a bending plate, and the bending plate is fixedly connected to the lifting oblique block at one end away from the oblique block telescopic slider.
[0009] Preferably, the jaw telescopic assembly includes a jaw telescopic slide rail, the jaw telescopic slide rail is fixedly connected to the base, the jaw telescopic slide rail is slidably connected with a jaw telescopic slider, the jaw telescopic slider is fixedly connected with an extension block, and the lifting column passes through one end of the extension block away from the jaw telescopic slider and is slidably connected to the extension block.
[0010] Preferably, self-locking components are provided between the clamping jaw telescopic slide rail and the clamping jaw telescopic slider, and between the inclined block telescopic slide rail and the inclined block telescopic slider.
[0011] Preferably, the self-locking component includes a steel ball, a blind hole is provided on the clamping jaw telescopic slide rail and the inclined block telescopic slide rail corresponding to the steel ball, the steel ball is slidably connected in the blind hole, the steel ball is fixed with a self-locking spring, and the other end of the self-locking spring is fixed to the bottom end of the blind hole; a limiting groove is provided on the clamping jaw telescopic slide block and the inclined block telescopic slide block corresponding to the steel ball.
[0012] Preferably, an inclined block operating handle is fixedly connected to the bending plate; and a clamping claw operating handle is fixedly connected to the extension block.
[0013] Preferably, the inclined block operating handle and the clamping jaw operating handle are rotatably connected with driven wheels.
[0014] Compared with the prior art, the utility model has the following advantages and technical effects:
[0015] The inclined block telescopic assembly can drive the lifting inclined block to telescope along the wafer diameter direction, and the clamping claw telescopic assembly can drive the floating clamping claw to telescope along the wafer diameter direction; when clamping the wafer, the inclined block is located near the wafer, and the clamping claw telescopic assembly is driven to move to the position close to the wafer. During the whole process, the sliding block keeps sliding on the horizontal plane of the lifting inclined block until the floating clamping claw moves above the wafer; then the inclined block telescopic assembly is driven to drive the lifting inclined block to move away from the wafer. Due to the relative movement between the lifting inclined block and the sliding block, the sliding block gradually moves downward along the inclined surface of the lifting slider, and under the elastic force of the spring, the lifting column slides downward in the clamping claw telescopic assembly, thereby causing the floating clamping claw to move downward and clamp the wafer; the above process can be reversed to release the wafer. In the utility model, the floating clamping claw and the lifting inclined block are realized to move separately, ensuring that the telescopic movement along the wafer diameter direction and the lifting and lowering along the wafer vertical direction are completed independently, thereby reducing and eliminating the interference of non-vertical forces on the wafer position. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0017] Figure 1 It is a schematic diagram of the clamping claw structure of the wafer bonding fixture of the utility model;
[0018] Figure 2 It is a schematic diagram of the front structure of the clamping jaws of the wafer bonding fixture of the utility model;
[0019] Figure 3 It is a front view of the clamping jaws of the wafer bonding fixture of the utility model;
[0020] Figure 4 It is a top view of the clamping jaws of the wafer bonding fixture of the utility model;
[0021] Figure 5 It is a schematic diagram of the structure of the lifting inclined block in the utility model.
[0022] In the figure: 1. floating jaw; 2. jaw operating handle; 3. inclined block operating handle; 4. base; 5. lifting inclined block; 6. roller; 7. lifting spring; 8. lifting column; 9. mounting plate; 10. sliding block; 11. inclined block telescopic slide rail; 12. inclined block telescopic slider; 13. bending plate; 14. jaw telescopic slide rail; 15. jaw telescopic slider; 16. extension block; 17. driven wheel. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0025] Reference Figures 1 to 5As shown, this embodiment provides a clamping jaw of a wafer bonding fixture, including: a base 4, on which a bevel block telescopic assembly and a clamping jaw telescopic assembly are slidably connected; a lifting bevel block 5 is fixedly connected to the movable end of the bevel block telescopic assembly, and the lifting bevel block 5 is a rectangular parallelepiped, and the end away from the bevel block telescopic assembly is an inclined surface, and the movable end of the clamping jaw telescopic assembly extends to the top of the lifting bevel block 5 and is penetrated by a lifting column 8, the top of the lifting column 8 is fixedly connected to a mounting plate 9, and the outer end of the mounting plate 9 is fixedly connected to a floating clamping jaw 1, and the bottom end of the lifting column 8 is fixedly connected to a sliding block 10, and a lifting spring 7 is sleeved on the lifting column 8, one end of the lifting spring 7 abuts against the sliding block 10, and the other end abuts against the movable end of the clamping jaw telescopic assembly; the bottom end of the sliding block 10 is slidably connected to the lifting bevel block 5.
[0026] The inclined block telescopic assembly can drive the lifting inclined block 5 to telescope along the wafer diameter direction, and the clamping claw telescopic assembly can drive the floating clamping claw 1 to telescope along the wafer diameter direction; when clamping the wafer, the inclined block is located near the wafer, and the clamping claw telescopic assembly is driven to move to the position close to the wafer. During the whole process, the sliding block 10 keeps sliding on the horizontal plane of the lifting inclined block 5 until the floating clamping claw 1 moves above the wafer; then the inclined block telescopic assembly is driven to drive the lifting inclined block 5 to move away from the wafer. Due to the relative movement between the lifting inclined block 5 and the sliding block 10, the sliding block 10 gradually moves downward along the inclined surface of the lifting slider, and under the elastic force of the spring, the lifting column 8 slides downward in the clamping claw telescopic assembly, thereby causing the floating clamping claw 1 to move downward and clamp the wafer; the above process can be reversed to release the wafer. In the utility model, the floating clamping claw 1 and the lifting inclined block 5 are realized to move separately, ensuring that the telescopic movement along the wafer diameter direction and the lifting and lowering along the wafer vertical direction are completed independently, thereby reducing and eliminating the interference of non-vertical forces on the wafer position.
[0027] According to a further optimized solution, the bottom end of the sliding block 10 is rotatably connected to a roller 6 , and the bottom surface of the roller 6 abuts against the lifting inclined block 5 .
[0028] The roller 6 is arranged under the sliding block 10, which can convert the sliding friction between the lifting inclined block 5 and the sliding block 10 into rolling friction, thereby reducing the friction force and making the movement smoother.
[0029] A further optimized solution is that the inclined block telescopic assembly includes an inclined block telescopic slide rail 11, which is fixedly connected to the base 4, and a inclined block telescopic slider 12 is slidably connected to the inclined block telescopic slide rail 11, and a bending plate 13 is fixedly connected to the inclined block telescopic slider 12, and the bending plate 13 is fixedly connected to the lifting inclined block 5 at one end away from the inclined block telescopic slider 12.
[0030] The inclined block telescopic assembly causes the inclined block 5 to have a relative displacement with the base through the sliding of the inclined block telescopic slider 12 in the inclined block telescopic slide rail 11, so that the inclined block 5 can be telescoped in the diameter direction of the wafer.
[0031] A further optimized solution is that the jaw telescopic assembly includes a jaw telescopic slide rail 14, the jaw telescopic slide rail 14 is fixedly connected to the base 4, the jaw telescopic slide rail 14 is slidably connected with a jaw telescopic slider 15, the jaw telescopic slider 15 is fixedly connected with an extension block 16, and the lifting column 8 passes through the extension block 16 away from the end of the jaw telescopic slider 15 and is slidably connected to the extension block 16.
[0032] The jaw extension and retraction assembly causes the lifting column 8 and the base to have a relative displacement by the sliding of the jaw extension and retraction slider 15 in the jaw extension and retraction slide rail 14 , and the lifting column 8 drives the floating jaw 1 to extend and retract in the wafer diameter direction.
[0033] According to a further optimized solution, self-locking components are provided between the clamping jaw telescopic slide rail 14 and the clamping jaw telescopic slider 15 , and between the inclined block telescopic slide rail 11 and the inclined block telescopic slider 12 .
[0034] The self-locking component is arranged at the starting position of the sliding to limit the sliding position.
[0035] To further optimize the solution, the self-locking component includes a steel ball, a blind hole is opened on the clamping jaw telescopic slide rail 14 and the inclined block telescopic slide rail 11 corresponding to the steel ball, the steel ball is slidably connected in the blind hole, the steel ball is fixed with a self-locking spring, and the other end of the self-locking spring is fixed to the bottom end of the blind hole; a limiting groove is opened on the clamping jaw telescopic slider 15 and the inclined block telescopic slider 12 corresponding to the steel ball.
[0036] Preferably, the limit grooves are respectively opened at the front and rear ends of the clamping jaw telescopic slider 15 and the bevel block telescopic slider 12, and the blind hole and the self-locking spring and the steel ball in the blind hole are arranged on the end of the clamping jaw telescopic slide 14 and the bevel block telescopic slide 11 close to the wafer. When the steel ball is extended by the spring force and enters the limit groove of the clamping jaw telescopic slider 15 and the bevel block telescopic slider 12 close to the wafer, the self-locking of the retracted position is completed; when the steel ball is extended by the spring force and enters the limit groove of the clamping jaw telescopic slider 15 and the bevel block telescopic slider 12 away from the wafer, the self-locking of the extended position is completed.
[0037] According to a further optimized solution, the bend plate 13 is fixedly connected with an inclined block operating handle 3 ; and the extension block 16 is fixedly connected with a clamping claw operating handle 2 .
[0038] The inclined block operating handle 3 and the clamping jaw operating handle 2 are for facilitating the telescopic movement of the lifting inclined block 5 and the floating clamping jaw 1 .
[0039] According to a further optimized solution, the inclined block operating handle 3 and the clamping jaw operating handle 2 are rotatably connected with a driven wheel 17 .
[0040] The driven wheel 17 facilitates the mechanical control of the inclined block operating handle 3 or the clamp operating handle 2, and can convert the driving force that the inclined block operating handle 3 or the clamp operating handle 2 must use in the moving direction into a driving force that can be used in the vertical moving direction for driving through the inclined block and other structures.
[0041] The parts not described in detail in the present invention are all conventional technical means known to those skilled in the art.
[0042] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0043] The embodiments described above are only descriptions of the preferred methods of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the protection scope determined by the claims of the present invention.
Claims
1. A wafer bonding fixture jaw, characterized in that: include: A base (4) is provided on which a bevel block telescopic assembly and a clamping claw telescopic assembly are slidably connected; a lifting bevel block (5) is fixedly connected to the movable end of the bevel block telescopic assembly; the lifting bevel block (5) is a rectangular parallelepiped, and one end away from the bevel block telescopic assembly is an inclined surface; the movable end of the clamping claw telescopic assembly extends to the top of the lifting bevel block (5) and is penetrated by a lifting column (8); a mounting plate (9) is fixedly connected to the top of the lifting column (8); a floating clamping claw (1) is fixedly connected to the outer end of the mounting plate (9); a sliding block (10) is fixedly connected to the bottom end of the lifting column (8); a lifting spring (7) is sleeved on the lifting column (8); one end of the lifting spring (7) abuts against the sliding block (10) and the other end abuts against the movable end of the clamping claw telescopic assembly; the bottom end of the sliding block (10) is slidably connected to the lifting bevel block (5).
2. The wafer bonding fixture clamp according to claim 1, characterized in that: The bottom end of the sliding block (10) is rotatably connected to a roller (6), and the bottom surface of the roller (6) abuts against the lifting inclined block (5).
3. The wafer bonding fixture jaw according to claim 1, characterized in that: The inclined block telescopic assembly comprises an inclined block telescopic slide rail (11), the inclined block telescopic slide rail (11) is fixedly connected to the base (4), an inclined block telescopic slider (12) is slidably connected to the inclined block telescopic slide rail (11), a bending plate (13) is fixedly connected to the inclined block telescopic slider (12), and one end of the bending plate (13) away from the inclined block telescopic slider (12) is fixedly connected to the lifting inclined block (5).
4. The wafer bonding fixture clamp according to claim 3, characterized in that: The clamping jaw telescopic assembly comprises a clamping jaw telescopic slide rail (14), the clamping jaw telescopic slide rail (14) is fixedly connected to the base (4), a clamping jaw telescopic slider (15) is slidably connected to the clamping jaw telescopic slider (14), an extension block (16) is fixedly connected to the clamping jaw telescopic slider (15), and the lifting column (8) passes through one end of the extension block (16) away from the clamping jaw telescopic slider (15) and is slidably connected to the extension block (16).
5. The wafer bonding fixture jaw according to claim 4, characterized in that: Self-locking components are provided between the clamping jaw telescopic slide rail (14) and the clamping jaw telescopic slider (15), and between the inclined block telescopic slide rail (11) and the inclined block telescopic slider (12).
6. The wafer bonding fixture clamp according to claim 5, characterized in that: The self-locking component comprises a steel ball, a blind hole is provided on the clamping jaw telescopic slide rail (14) and the inclined block telescopic slide rail (11) corresponding to the steel ball, the steel ball is slidably connected in the blind hole, a self-locking spring is fixedly connected to the steel ball, and the other end of the self-locking spring is fixedly connected to the bottom end of the blind hole; and a limiting groove is provided on the clamping jaw telescopic slide block (15) and the inclined block telescopic slide block (12) corresponding to the steel ball.
7. The wafer bonding fixture jaw according to claim 4, characterized in that: The bending plate (13) is fixedly connected to an inclined block operating handle (3); and the extending block (16) is fixedly connected to a clamping claw operating handle (2).
8. The wafer bonding fixture clamp according to claim 7, characterized in that: The inclined block operating handle (3) and the clamping jaw operating handle (2) are rotatably connected to a driven wheel (17).