High-temperature baking equipment for forming and processing miniature PCB (Printed Circuit Board)

Abstract

The utility model relates to baking equipment, in particular to high-temperature baking equipment for forming and processing a miniature PCB (Printed Circuit Board). The high-temperature baking equipment for forming and processing the miniature PCB comprises a base, a shell I, a partition plate, a feeding frame, a material taking cylinder and the like, a first shell is fixedly welded between the upper portions of the bases, a feeding frame is connected to the front side of the upper portion of the first shell, a partition plate is fixedly connected to the inner side of the first shell and divides the inner space of the first shell up and down, and a material taking air cylinder is installed on the lower right portion of the inner side of the first shell. According to the utility model, through the arrangement of the material placing frame with a small contact area with the PCB, the situation that the clamped part cannot be normally baked due to the large contact area between the clamping assembly and the PCB during baking is reduced.

Description

Technical Field

[0001] The utility model relates to baking equipment, in particular to high-temperature baking equipment for micro PCB board molding processing. Background Art

[0002] In the process of PCB patch processing, baking is an important pretreatment step, which can effectively remove moisture from PCB and ensure the quality of welding. When PCB is in a high temperature environment (such as reflow oven, wave soldering oven, hot air leveling or manual soldering), the previously absorbed moisture will turn into water vapor and expand rapidly, which may cause PCB expansion or delamination. In addition, baking also helps to reduce the deformation of PCB and make it reach a certain thermal stability, thereby ensuring the accuracy of mounting and welding quality. Baking can also remove oxides and contaminants on the surface of PCB, improve the conductivity of conductors, and enhance the electrical performance of PCB.

[0003] The existing baking device uses a flat or clamping fixture to place the PCB board inside the device. When setting the fixture, the fixture and the PCB board may not match. When baking a micro PCB board, the contact area between the clamping or placing component and the PCB board is large. During baking, the large contact area between the clamping component and the PCB board causes the clamped area to fail to be baked normally.

[0004] In view of this, the utility model provides a high-temperature baking device for micro PCB board molding processing, which is equipped with a discharge device that can clamp the micro PCB and has a small contact area with the PCB board, thereby reducing the situation in which the clamped area cannot be baked normally due to the large contact area between the clamping component and the PCB board during baking. Utility Model Content

[0005] In order to overcome the problem that the clamp and the PCB board may not match in the existing equipment, when the micro PCB board is baked, the contact area between the clamping or placing component and the PCB board is large, and the clamped part cannot be baked normally due to the large contact area between the clamping component and the PCB board during baking. The purpose is to provide a high-temperature baking equipment for micro PCB board molding processing, which is equipped with a discharge device that can clamp the micro circuit board and has a small contact area with the PCB board, and reduces the situation that the clamped part cannot be baked normally due to the large contact area between the clamping component and the PCB board during baking.

[0006] The technical scheme of the utility model is: a high-temperature baking equipment for micro PCB board forming processing, including a base, a shell, a partition, a feed frame, a material taking cylinder, a hot air device, a fixed plate, a rotating plate, a connecting block and a material placing rack, a shell is fixedly welded between the upper part of the base, a feed frame is connected to the front side of the upper part of the shell, a partition is fixedly connected to the inner side of the shell, the partition divides the internal space of the shell into upper and lower parts, a material taking cylinder is installed at the lower right part of the inner side of the shell, and a connecting rod is fixedly connected to the upper part of the movable rod of the material taking cylinder Block, a fixed plate is fixedly connected to the right side of the shell, a strip groove is opened on the fixed plate, a rotating plate is rotatably connected to the upper side of the left side of the fixed plate, a material discharge rack is rotatably provided in the connecting block, the left side of the material discharge rack is a U-shaped block, a strip groove is opened in the U-shaped block, and the upper strip of the U-shaped block is shorter than the lower strip, the rotating plate is slidably and rotatably connected to the material discharge rack, and the right side of the material discharge rack slides in the strip groove of the fixed plate, a hot air device is fixedly installed at the lower part of the shell, and the hot air device is connected to the upper space of the inner partition of the shell through a pipeline.

[0007] Furthermore, it also includes a conveying device, a material transfer cylinder and a shell two. The conveying device is installed on the top of the partition, and the conveying device is composed of a frame and a plurality of rotating shaft rollers. Two rollers are fixedly installed on the rotating shaft symmetrically front and back. Shell two is installed on the lower left part of shell one. The lower left part of the conveying device is fixedly connected to shell two. A channel is opened at the installation place of shell one on shell two. A material transfer cylinder is fixedly installed on the rear side of the top of the partition, and a push block is installed on the movable slider on the material transfer cylinder.

[0008] Furthermore, a circulating fan is also included, and the circulating fan is installed in the upper inner part of the shell.

[0009] Furthermore, it also includes a refrigerator and a connecting pipe. The refrigerator is installed on the left side of the shell one, and the lower part of the refrigerator is fixedly connected and communicated with a connecting pipe. The lower part of the connecting pipe is fixedly connected to the top of the shell two, and the lower part of the connecting pipe is connected and communicated with the inside of the shell two through a pipeline.

[0010] Furthermore, a plurality of ventilation holes are opened on the upper right side of the shell.

[0011] Compared with the prior art, the utility model has the following advantages: 1. The utility model provides a material discharge rack with a smaller contact area with the PCB board, thereby reducing the situation in which the clamped part cannot be baked normally due to the large contact area between the clamping component and the PCB board during baking. At the same time, a turning mechanism is provided to slowly rotate the PCB board during baking to avoid the block-type PCB board blocking the hot air when the hot air device delivers hot air, and the local temperature difference in the shell causes uneven heating, which affects the effect of the baking process.

[0012] 2. The utility model cools the baked PCB board through the cooling device, which can avoid cooling the PCB board by absorbing the ambient air at normal temperature outside the equipment. The water vapor in the atmosphere adheres to the PCB board, and the PCB board is easily damaged by moisture when stored.

[0013] 3. When the PCB board is being baked, the utility model uses a circulating fan to allow the air flow blown out by the hot air device to circulate in the housing, so that the temperature of each area can be maintained consistent, reducing the temperature difference. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0015] Figure 2 It is a cross-sectional view of the utility model.

[0016] Figure 3 It is a cross-sectional view of the heating component and the material taking component of the utility model.

[0017] Figure 4 It is a cross-sectional view of the hot air device and the material taking component of the utility model.

[0018] Figure 5 It is a cross-sectional view of the material taking component of the utility model.

[0019] Figure 6 This is a disassembly diagram of the material taking component parts of the utility model.

[0020] Figure 7 It is a three-dimensional structural schematic diagram of the circulation fan of the utility model.

[0021] Figure numbers: 1. Base, 2. Shell 1, 21. Partition, 3. Feed frame, 4. Material taking cylinder, 41. Hot air device, 5. Fixed plate, 6. Rotating plate, 7. Connecting block, 8. Material placing rack, 9. Conveying device, 91. Material transfer cylinder, 10. Shell 2, 11. Circulating fan, 12. Refrigerator, 121. Connecting pipe. DETAILED DESCRIPTION

[0022] The utility model is described in detail below in conjunction with the accompanying drawings.

[0023] Embodiment 1: A high temperature baking device for micro PCB board forming processing, such as Figure 1-7As shown, it includes a base 1, a shell 2, a partition 21, a feed frame 3, a material taking cylinder 4, a hot air device 41, a fixed plate 5, a rotating plate 6, a connecting block 7 and a material placing rack 8. The shell 2 is fixedly welded between the upper part of the base 1. The shell 2 is made of high temperature resistant material and has good thermal insulation performance. The front side of the upper part of the shell 2 is connected with the feed frame 3 for feeding the plate. The inner side of the shell 2 is fixedly connected with a partition 21. The partition 21 divides the internal space of the shell 2 into a heating area and an equipment placement area. A material taking cylinder 4 for providing power to move the PCB board in the shell is installed at the lower right part of the inner side of the shell 2. The upper part of the movable rod of the material taking cylinder 4 is fixedly connected with a connecting block 7. The right part of the inner side of the shell 2 is fixedly connected with a fixed plate 5. The fixed plate 5 has a strip groove. The upper left side of the fixed plate 5 is rotatably connected with a rotating plate 6. A material discharging rack 8 is rotatably provided in the connecting block 7 for placing the baked PCB board. The right part of the material discharging rack 8 slides in the grooves on the fixed plate 5 and the rotating plate 7. With the cooperation of the two grooves on the fixed plate and the rotating plate, the material discharging rack 8 will flip 180 degrees when it slides downward. The left part of the material discharging rack 8 is a U-shaped block. A strip groove is opened in the U-shaped block, and the upper strip of the U-shaped block is slightly shorter than the lower strip, and the width of the U-shaped block is small. When the PCB board is placed on the material discharging rack 8, the contact area between the material discharging rack and the PCB board is small. The rotating plate 6 is slidably and rotatably connected to the material discharging rack 8, and the right part of the material discharging rack 8 slides in the strip groove of the fixed plate 5. A hot air device 41 is fixedly installed at the lower part of the shell 2. The hot air device 41 is connected to the upper space of the partition 21 in the shell 2 through a pipeline, and the generated high-temperature heat flow is blown into the upper space of the partition 21 in the shell 2 through the pipeline.

[0024] Initially, the movable rod of the material taking cylinder 4 is in an extended state, the right part of the material discharging rack 8 is located at the highest limit in the groove opened by the fixed plate 5 and the rotating plate 6, the bottom surface of the U-shaped block groove on the left part of the material discharging rack 8 is at the same horizontal position as the lower side of the feed frame 3, the hot air device 41 is in an open state, and the temperature of the space above the partition 21 in the shell 2 reaches the required baking temperature. When the circuit board that needs high-temperature baking is pushed into the shell 2 from the lower side of the feed frame 3, the PCB board will be removed from the feed frame 3. The PCB board is placed on the unloading rack 8, and the high-temperature airflow in the shell 2 contacts the PCB board to bake it. During the baking process, the movable rod of the material-taking cylinder 4 is controlled to retract, driving the connecting block 7 to slide downward, and the unloading rack 8 in the connecting block 7 slides downward accordingly. During this process, the right part of the unloading rack 8 is in the strip groove of the fixed plate 5 and the rotating plate 5. The unloading rack 8 slides downward in the arc groove on the plate 6. When the unloading rack 8 slides to the arc of the arc groove, its right part is restricted by the strip groove on the fixed plate 5 and can only slide up and down. There is a certain friction force at the hinge between the rotating plate 6 and the fixed plate 5. At this time, under the guiding action of the arc of the arc groove, the right part of the unloading rack 8 and the arc groove rub against each other, so that the unloading rack 8 begins to flip backward under the action of the arc groove, and the rotating plate 6 rotates backward on the fixed plate 5 to a certain angle. When the unloading rack 8 completely passes through the curved part of the arc groove, the unloading The rack 8 has completed a 180-degree flip, and the rotating plate 6 rotates to reset. At this time, the shorter strip block originally located at the top of the U-shaped block is flipped and located at the bottom. It should be noted that the movable rod of the material-taking cylinder 4 moves at a slow speed, thereby realizing a slow flipping of the PCB board on the material-discharging rack 8. By slowly rotating the PCB board during baking, it is avoided that the hot air device 41 is blocked by the plate-type PCB board when delivering hot air, and the local temperature difference in the shell 2 causes uneven heating, which affects the effect of the baking process.

[0025] Embodiment 2: Based on embodiment 1, Figure 2As shown, it also includes a conveying device 9, a material transfer cylinder 91 and a shell 2 10. The conveying device 9 is installed on the top of the partition 21. The conveying device 9 is composed of a frame and a plurality of rotating shaft rollers. Two rollers are fixedly installed on the rotating shaft symmetrically front and back. The conveying device 9 is used to push the unloading after the PCB board is baked. The shell 2 10 is installed on the lower left part of the shell 1 2. The shell 2 10 is a box structure. The same size openings are opened on the left and right sides at the same horizontal height. The openings are used for the PCB board to pass through. The lower left part of the conveying device 9 is fixedly connected to the shell 2 10. A channel is opened at the installation position of the shell 2 10 on the shell 1 2. The PCB board transported on the conveying transfer 9 can be moved from the shell 1 2 to the shell 2 10 without hindrance. A material transfer cylinder 91 is fixedly provided on the rear side of the top of the partition 21. The movable slider on the material transfer cylinder 91 is installed with a push block that pushes the PCB board from the material rack 8 and pushes it into the shell 2 10.

[0026] like Figure 3 and Figure 7 As shown, a circulating fan 11 is also included. The upper part of the shell 2 is installed with the fan 11 to enable the wind flow blown out by the hot air device 41 to circulate in the shell 2.

[0027] like Figure 1-2 As shown, it also includes a refrigerator 12 and a connecting pipe 121. The refrigerator 12 for blowing out refrigerant gas is installed on the left side of the shell 1 2. The lower part of the refrigerator 12 is fixedly connected and communicated with a connecting pipe 121 for conveying refrigerant airflow. The lower part of the connecting pipe 121 is fixedly connected to the top of the shell 2 10, and the lower part of the connecting pipe 121 is connected and communicated with the inside of the shell 2 10 through a pipeline. The low-temperature airflow generated by the refrigerator 12 will be blown into the shell 2 10 through the connecting pipe 121.

[0028] When the unloading rack 8 is at the lowest limit position in the strip groove of the fixed plate 5, at this time, one side of the bottom of the PCB board will contact the roller on the right part of the conveying device 9 and be supported by the roller, and the movable slider on the material shifting cylinder 91 is located on the right side of the PCB board, and the push block on the movable slider is at the same height as the PCB board. When the push block moves to the left with the movable slider on the material shifting cylinder 91, the movable slider will push the PCB board to the left, and the PCB board will be out of contact with the unloading rack 8 and move to the left on the conveying device 9 under the push of the push block. When the movable slider on the material shifting cylinder 91 moves to the leftmost limit position of the material shifting cylinder 91, the PCB board will be pushed into the shell 2 10, and the left end of the PCB board will pass through the inside of the shell 2 10. Before the PCB board enters the shell 2 10, the refrigerator 12 is started to pass the cold air through The connecting pipe 121 is transported to the shell 10. When the PCB board enters the shell 10, the cold air will cool the PCB board after baking, so that the temperature of the PCB board can be rapidly reduced, which is beneficial to reducing the cooling waiting time and speeding up the processing flow. At the same time, the PCB board after baking is cooled by the cooling device, which can avoid cooling by absorbing the external normal temperature atmosphere outside the equipment. The water vapor in the atmosphere adheres to the PCB board. When the PCB board is stored, it is easy to be damaged by moisture. After the PCB board is placed in the shell 10 for a period of time, the cooling machine and the hot air device 41 are turned off, and the PCB board is taken away to complete the baking and cooling work. During baking, by starting the circulating fan 11, the wind flow blown out by the hot air device 41 can circulate in the shell 2, the temperature of each area can be maintained consistent, and the temperature difference can be reduced.

[0029] In a preferred embodiment: a plurality of ventilation holes are opened on the upper right side of the shell 2, which facilitates the discharge of the hot air accumulated in the shell 2 during baking, and avoids the accumulation of heat flow in the shell 2 causing local overheating and affecting the heating effect.

[0030] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A high-temperature baking device for micro PCB board forming processing, comprising a base (1); Its characteristics are: The utility model also comprises a shell (2), a partition (21), a feed frame (3) and a material taking cylinder (4); the shell (2) is fixedly welded between the upper part of the base (1); the feed frame (3) is connected to the front side of the upper part of the shell (2); the partition (21) is fixedly connected to the inner side of the shell (2); the partition (21) divides the internal space of the shell (2) into upper and lower parts; the material taking cylinder (4), a hot air device (41), a fixed plate (5), a rotating plate (6), a connecting block (7) and a material placing rack (8) are installed at the lower right part of the inner side of the shell (2); the upper part of the movable rod of the material taking cylinder (4) is fixedly connected to the connecting block (7); the right part of the inner side of the shell (2) A fixed plate (5) is fixedly connected, a strip groove is formed on the fixed plate (5), a rotating plate (6) is rotatably connected to the upper left side of the fixed plate (5), a material discharging rack (8) is rotatably arranged in the connecting block (7), the left part of the material discharging rack (8) is a U-shaped block, a strip groove is formed in the U-shaped block, and the upper strip of the U-shaped block is shorter than the lower strip, the rotating plate (6) is slidably and rotatably connected to the material discharging rack (8), and the right part of the material discharging rack (8) slides in the strip groove of the fixed plate (5), a hot air device (41) is fixedly installed in the lower part of the shell body (2), and the hot air device (41) is connected to the upper space of the inner partition (21) of the shell body (2) through a pipeline.

2. A high temperature baking device for micro PCB board forming processing as claimed in claim 1, characterized in that: The utility model also comprises a conveying device (9), a material transfer cylinder (91) and a second shell (10). The conveying device (9) is installed on the top of the partition (21). The conveying device (9) is composed of a frame and a plurality of rotating shaft rollers. Two rollers are fixedly installed on the rotating shaft symmetrically in the front and rear directions. The second shell (10) is installed on the lower left part of the first shell (2). The lower left part of the conveying device (9) is fixedly connected with the second shell (10). A passage is opened at the installation position of the second shell (10) on the first shell (2). The material transfer cylinder (91) is fixedly installed on the rear side of the top of the partition (21). A push block is installed on the movable slide block on the material transfer cylinder (91).

3. A high temperature baking device for micro PCB board forming processing as claimed in claim 2, characterized in that: It also includes a circulating fan (11), which is installed in the upper part of the housing (2).

4. A high temperature baking device for micro PCB board forming processing as claimed in claim 3, characterized in that: It also includes a refrigerator (12) and a connecting pipe (121). The refrigerator (12) is installed on the left side of the shell one (2). The lower part of the refrigerator (12) is fixedly connected to and communicated with the connecting pipe (121). The lower part of the connecting pipe (121) is fixedly connected to the top of the shell two (10), and the lower part of the connecting pipe (121) is connected to and communicated with the inside of the shell two (10) through a pipeline.

5. A high temperature baking device for micro PCB board forming processing as claimed in claim 4, characterized in that: The upper right side of the shell (2) is provided with a plurality of ventilation holes.

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