Liquid cooling plate radiator for cooling electronic module or electronic component

Abstract

The utility model discloses a liquid cooling plate radiator for cooling an electronic module or an electronic component, which comprises a substrate, a left plate and a right plate, the left plate and the right plate are arranged on two sides of the substrate, and a rectangular waterway circulation channel is arranged in the substrate. One side wall of the left plate is provided with a water inlet, the right side wall connected with the base plate is provided with a water inlet flow channel and a left flow guide groove, the water inlet flow channel is communicated with the water inlet, one side wall of the right plate is provided with a water outlet, the left side wall connected with the base plate is provided with a water outlet flow channel and a right flow guide groove, and the water outlet flow channel is communicated with the water outlet. Two ends of an upper path of the rectangular waterway circulation channel are respectively communicated with the water inlet runner and the right diversion trench, two ends of a middle path are respectively communicated with the left diversion trench and the right diversion trench, and two ends of a lower path are respectively communicated with the left diversion trench and the water outlet runner. The cooling performance and the heat exchange efficiency of the radiator can be improved, the purpose of rapidly cooling electronic components is achieved, and the radiator can be widely applied to heat dissipation of high-performance and high-power electronic components.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and in particular to a liquid cooling plate radiator used for cooling electronic modules or electronic components. Background Art

[0002] With the rapid development of electronic technology and AI technology, electronic equipment heat dissipation technology is also facing unprecedented challenges. Computer chips, motherboards, and electronic equipment or components (such as transistors, power modules, power modules) have higher and higher requirements for their own heat dissipation. If the heat of electronic equipment cannot be dissipated in time, it will affect the performance, function and life of the equipment. The radiator is the core component in thermal management, and its heat dissipation capacity determines the thermal reliability of the product. High-performance liquid cold plate radiators are widely used in the heat dissipation of electronic equipment. It is a heat dissipation device with coolant as the medium. It introduces the coolant into the electronic equipment through pipes, quickly transfers the heat generated by the equipment to the coolant through heat exchange, and then circulates the coolant out of the equipment through the action of the water pump, so as to achieve the purpose of rapid cooling of the electronic equipment.

[0003] However, at present, the technical status of liquid-cooled plate heat exchangers is uneven. There are problems such as unreasonable product structure design, the internal flow channels of the upper and lower welded structures of the water-cooled plates are mostly machined, resulting in a large amount of product waste, long processing time, unstable quality, high cost, unreasonable layout of the internal flow channels of the products, insufficient cooling capacity and heat exchange efficiency, etc. Utility Model Content

[0004] The purpose of the utility model is to provide a liquid cooling plate radiator for cooling electronic modules or electronic components, which has a low structural cost and high heat exchange efficiency, and solves the above-mentioned problems existing in the prior art.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] The utility model discloses a liquid cooling plate radiator for cooling electronic modules or electronic components, comprising a substrate, a left plate and a right plate, wherein the left plate and the right plate are respectively mounted on both sides of the substrate, and a multi-channel rectangular water flow channel is provided inside the substrate, a water inlet is provided on one side wall of the left plate, and a water inlet flow channel and a left guide groove are provided on the right side wall connected to the substrate, the water inlet flow channel is communicated with the water inlet, a water outlet is provided on one side wall of the right plate, and a water outlet flow channel and a right guide groove are provided on the left side wall connected to the substrate, the water outlet flow channel is communicated with the water outlet, two ends of the upper road of the rectangular water flow channel are respectively communicated with the water inlet flow channel and the right guide groove, two ends of the middle road of the rectangular water flow channel are respectively communicated with the left guide groove and the right guide groove, and two ends of the lower road of the rectangular water flow channel are respectively communicated with the left guide groove and the water outlet flow channel, so as to form an S-shaped cooling water flow loop.

[0007] Furthermore, the upper surface and / or the lower surface of the substrate are respectively provided with a plurality of bolt holes for fixing the heat-generating electronic components.

[0008] Furthermore, the base plate, the left plate and the right plate are all formed by extrusion of aluminum profiles.

[0009] Furthermore, the width of the cross section of the rectangular waterway circulation channel is W, wherein W≥4 mm, and the height of the cross section of the rectangular waterway circulation channel is H, wherein 3.5W≤H≤4.5W.

[0010] Furthermore, the right end surface of the left plate and the left end surface of the base plate, as well as the left end surface of the right plate and the right end surface of the base plate are welded by friction stir welding.

[0011] Furthermore, the bends of the water inlet channel, the left guide groove, the water outlet channel and the right guide groove all adopt a guide design that evenly distributes the coolant in the channel.

[0012] Furthermore, both ends of the water inlet channel longitudinally penetrate the left plate and the openings are sealed by welding with plugs.

[0013] Furthermore, welding positioning grooves are symmetrically arranged on the right side wall of the left plate and the left side wall of the right plate.

[0014] Compared with the prior art, the beneficial technical effects of the utility model are:

[0015] The utility model discloses a liquid cooling plate radiator for cooling electronic modules or electronic components. The arrangement structure of the liquid cooling plate radiator is optimized, and a welding design structure is adopted between the left and right plates and the two ends of the substrate. The substrate with an internal rectangular water flow channel and the left and right plates are formed by an aluminum profile extrusion process. Under the condition of ensuring the overall compressive strength of the product, the overall material usage of the product is reduced, and the processing time of the product is reduced, thereby reducing the cost of the product and improving the production efficiency of the product. In addition, by optimizing the design of the internal water flow channel of the radiator, the coolant flows in from the inlet of the left plate, passes through the upper water flow channel, the middle water flow channel and the lower water flow channel of the substrate, and then flows out from the outlet of the right plate. An S-shaped 3-flow parallel flow water flow arrangement is adopted, and a diversion design is performed at the bend of the diversion groove, so that the water distribution is more uniform, the flow resistance of the water channel is reduced, and the flow area of ​​the water channel and the contact area of ​​the coolant are increased at the same time, the water flow resistance is reduced, the refrigeration performance and heat exchange efficiency of the radiator are improved, and the purpose of quickly cooling the electronic components is achieved.

[0016] The liquid cooling plate radiator for cooling electronic modules or electronic components of the utility model has good economic benefits and heat exchange efficiency, and can be widely used in the heat dissipation of high-performance and high-power electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model will be further described below in conjunction with the accompanying drawings.

[0018] Figure 1 It is a schematic cross-sectional structure diagram of a liquid cooling plate radiator for cooling electronic modules or electronic components of the utility model;

[0019] Figure 2 This is a schematic diagram of the external structure of a liquid cooling plate radiator for cooling electronic modules or electronic components of the utility model;

[0020] Figure 3 It is a schematic diagram of the cross-sectional structure of a rectangular flow channel in a liquid cooling plate radiator for cooling electronic modules or electronic components of the utility model;

[0021] Figure 4 It is a three-dimensional structural schematic diagram of the left plate in the liquid cooling plate radiator for cooling electronic modules or electronic components of the utility model;

[0022] Figure 5 It is a schematic diagram of the three-dimensional structure of the right plate in the liquid cooling plate radiator for cooling electronic modules or electronic components of the utility model;

[0023] Figure 6 It is a structural schematic diagram of the flow direction of the cooling water flow circuit in the liquid cooling plate radiator used for cooling electronic modules or electronic components of the utility model.

[0024] Explanation of the accompanying drawings: 1. Base plate; 2. Left plate; 3. Right plate; 4. Rectangular water flow channel; 5. Water inlet; 6. Water inlet channel; 7. Left guide groove; 8. Water outlet; 9. Water outlet channel; 10. Right guide groove; 11. Bolt hole; 12. Plug; 13. Welding positioning groove. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it is necessary to understand that the terms "length", "width", "inside", "outside", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] like Figures 1 to 6As shown, the liquid cooling plate radiator for cooling electronic modules or electronic components of this embodiment includes a substrate 1, a left plate 2 and a right plate 3, the left plate 2 and the right plate 3 are respectively installed on both sides of the substrate 1, and a multi-channel rectangular water flow channel 4 is opened inside the substrate 1, a water inlet 5 is provided on one side wall of the left plate 2, and a water inlet channel 6 and a left guide groove 7 are provided on the right side wall connected to the substrate 1, and the water inlet channel 6 is connected to the water inlet 5, a water outlet 8 is provided on one side wall of the right plate 3, and a water outlet channel 9 and a right guide groove 10 are provided on the left side wall connected to the substrate 1, and the water outlet channel 9 is connected to the water outlet 8, the upper ends of the rectangular water flow channel 4 are respectively connected to the water inlet channel 6 and the right guide groove 10, the middle ends of the rectangular water flow channel 4 are respectively connected to the left guide groove 7 and the right guide groove 10, and the lower ends of the rectangular water flow channel 4 are respectively connected to the left guide groove 7 and the water outlet channel 9, so as to form an S-shaped cooling water flow loop. Preferably, 15 rectangular waterway circulation channels 4 are arranged inside the substrate 1, and the 15 rectangular waterway circulation channels 4 are evenly divided into upper waterway circulation channels, middle waterway circulation channels and lower waterway circulation channels by two thickened partitions.

[0029] Specifically, Figure 2 As shown, the upper surface and / or lower surface of the substrate 1 are respectively provided with a plurality of bolt holes 11 for fixing heat-generating electronic components. In this case, the bolt holes 11 can be provided on the upper surface or the lower surface of the substrate 1 alone, or the bolt holes 11 can be provided on both the upper surface and the lower surface of the substrate 1 to achieve double-sided heat dissipation and improve area utilization. In addition, when the upper surface or the lower surface of the substrate 1 is used as the mounting surface for fixing heat-generating electronic components, fine milling is used to meet the heat dissipation installation requirements of the electronic components.

[0030] In this embodiment, the substrate 1, the left plate 2 and the right plate 3 are all formed by extrusion of aluminum profiles to reduce the use of product materials and achieve the purpose of cost reduction. At the same time, stir friction welding is adopted between the right end face of the left plate 2 and the left end face of the substrate 1, and between the left end face of the right plate 3 and the right end face of the substrate 1, so as to have high pressure resistance and good sealing.

[0031] And, if Figure 3 As shown, the width of the cross section of the rectangular water channel circulation channel 4 is W, where W≥4mm, and the height of the cross section of the rectangular water channel circulation channel 4 is H, where 3.5W≤H≤4.5W. Preferably, the width of the cross section of the rectangular water channel circulation channel 4 is 4mm and the height is 17mm, so as to increase the circulation area of ​​the water channel, increase the contact area of ​​the coolant, and improve the heat exchange efficiency of the radiator.

[0032] In this embodiment, the bends of the water inlet channel 6, the left guide groove 7, the water outlet channel 9 and the right guide groove 10 all adopt a diversion design that makes the coolant in the channel evenly distributed. The shapes of the bends of the water inlet channel 6, the left guide groove 7, the water outlet channel 9 and the right guide groove 10 are all fluid analyzed, and their specific shapes are set as follows Figures 4 to 6 As shown, this is the optimal design for uniform distribution of coolant in the flow channel.

[0033] In addition, both ends of the water inlet channel 6 longitudinally penetrate the left plate 2 and the openings are welded and sealed by plugs 12 .

[0034] Among them, two welding positioning grooves 13 are symmetrically arranged on the right side wall of the left plate 2 and the left side wall of the right plate 3, respectively, which can assist in positioning the welding of the left plate 2 and the right plate 3 to facilitate welding.

[0035] When the liquid cooling plate radiator for cooling electronic modules or electronic components of this embodiment is used, the heat-generating electronic components are first fixed to the mounting surface of the substrate 1 by bolts, and the heating body of the electronic components and the mounting surface of the substrate 1 are heat-conducted to transfer the heat generated by the electronic components to the radiator substrate 1. At this time, Figure 6 As shown, the low-temperature coolant enters from the water inlet 5 of the left plate 2, then flows through the upper water channel of the substrate 1 through the water inlet channel 6 of the left plate 2, and flows into the right guide groove 10 of the right plate 3. Through the guiding effect of the right guide groove 10, the coolant enters the middle water channel of the substrate 1 and flows into the left guide groove 7 of the left plate 2. Through the guiding effect of the left guide groove 7, the coolant enters the lower water channel of the substrate 1 and flows into the outlet channel 9 of the right plate 3, wherein the outlet channel 9 is also a return channel, and finally flows out from the water outlet 8 of the right plate 3, forming an S-shaped cooling water channel circulation loop, and the heat generated by the electronic components is taken away by the low-temperature coolant flowing through the radiator substrate 1. The low-temperature coolant circulates back and forth to achieve the purpose of quickly cooling the electronic components.

[0036] The utility model discloses a liquid cooling plate radiator for cooling electronic modules or electronic components. The arrangement structure of the liquid cooling plate radiator is optimized, and a welding design structure is adopted between the left and right plates and the two ends of the substrate. The substrate with an internal rectangular water flow channel and the left and right plates are formed by an aluminum profile extrusion process. Under the condition of ensuring the overall compressive strength of the product, the overall material usage of the product is reduced, and the processing time of the product is reduced, thereby reducing the product cost and improving the production efficiency of the product. In addition, by optimizing the design of the internal water flow channel of the radiator, the coolant flows in from the inlet of the left plate, passes through the upper water flow channel, the middle water flow channel and the lower water flow channel of the substrate, and then flows out from the outlet of the right plate. An S-shaped 3-flow parallel flow water flow arrangement is adopted, and a diversion design is performed at the bend of the diversion groove, so that the water distribution is more uniform, the flow resistance of the water channel is reduced, and the flow area of ​​the water channel and the contact area of ​​the coolant are increased at the same time, the water flow resistance is reduced, the refrigeration performance and heat exchange efficiency of the radiator are improved, and the purpose of quickly cooling the electronic components is achieved.

[0037] The liquid cooling plate radiator for cooling electronic modules or electronic components of the utility model has good economic benefits and heat exchange efficiency, and can be widely used in the heat dissipation of high-performance and high-power electronic components.

[0038] The embodiments described above are only descriptions of the preferred methods of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the protection scope determined by the claims of the present invention.

Claims

1. A liquid cooling plate radiator for cooling electronic modules or electronic components, characterized in that: The invention comprises a base plate (1), a left plate (2) and a right plate (3), wherein the left plate (2) and the right plate (3) are respectively mounted on two sides of the base plate (1), wherein a multi-channel rectangular water flow channel (4) is provided inside the base plate (1), wherein a water inlet (5) is provided on one side wall of the left plate (2), and a water inlet channel (6) and a left guide groove (7) are provided on the right side wall connected to the base plate (1), wherein the water inlet channel (6) is connected to the water inlet (5), and a water outlet (8) is provided on one side wall of the right plate (3), and the left side wall connected to the base plate (1) is provided with a water outlet (8). A water outlet channel (9) and a right guide groove (10) are provided on the upper side, the water outlet channel (9) is connected to the water outlet (8), the upper ends of the rectangular water circulation channel (4) are respectively connected to the water inlet channel (6) and the right guide groove (10), the middle ends of the rectangular water circulation channel (4) are respectively connected to the left guide groove (7) and the right guide groove (10), and the lower ends of the rectangular water circulation channel (4) are respectively connected to the left guide groove (7) and the water outlet channel (9), so as to form an S-shaped cooling water circulation loop.

2. A liquid cooling plate radiator for cooling electronic modules or electronic components according to claim 1, characterized in that: The upper surface and / or lower surface of the substrate (1) are respectively provided with a plurality of bolt holes (11) for fixing heat-generating electronic components.

3. The liquid cooling plate radiator for cooling electronic modules or electronic components according to claim 1, characterized in that: The base plate (1), the left plate (2) and the right plate (3) are all formed by extrusion of aluminum profiles.

4. The liquid cooling plate radiator for cooling electronic modules or electronic components according to claim 1, characterized in that: The width of the cross section of the rectangular waterway circulation channel (4) is W, wherein W≥4 mm, and the height of the cross section of the rectangular waterway circulation channel (4) is H, wherein 3.5W≤H≤4.5W.

5. The liquid cooling plate radiator for cooling electronic modules or electronic components according to claim 1, characterized in that: The right end surface of the left plate (2) and the left end surface of the base plate (1), as well as the left end surface of the right plate (3) and the right end surface of the base plate (1) are welded by friction stir welding.

6. The liquid cooling plate radiator for cooling electronic modules or electronic components according to claim 1, characterized in that: The bends of the water inlet channel (6), the left guide groove (7), the water outlet channel (9) and the right guide groove (10) all adopt a guide design that allows the coolant in the channel to be evenly distributed.

7. The liquid cooling plate radiator for cooling electronic modules or electronic components according to claim 1, characterized in that: Both ends of the water inlet channel (6) penetrate the left plate (2) longitudinally, and the opening is sealed by welding via a plug (12).

8. A liquid cooling plate radiator for cooling electronic modules or electronic components according to any one of claims 1 to 7, characterized in that: Welding positioning grooves (13) are symmetrically arranged on the right side wall of the left plate (2) and the left side wall of the right plate (3).

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